CL2016002995A1 - Cámara de vapor integrada para manejo térmico de dispositivos de cómputo - Google Patents

Cámara de vapor integrada para manejo térmico de dispositivos de cómputo

Info

Publication number
CL2016002995A1
CL2016002995A1 CL2016002995A CL2016002995A CL2016002995A1 CL 2016002995 A1 CL2016002995 A1 CL 2016002995A1 CL 2016002995 A CL2016002995 A CL 2016002995A CL 2016002995 A CL2016002995 A CL 2016002995A CL 2016002995 A1 CL2016002995 A1 CL 2016002995A1
Authority
CL
Chile
Prior art keywords
computing devices
thermal management
steam chamber
integrated steam
camera
Prior art date
Application number
CL2016002995A
Other languages
English (en)
Inventor
Andrew Delano
Taylor Stellman
Original Assignee
Microsoft Technology Licensing Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microsoft Technology Licensing Llc filed Critical Microsoft Technology Licensing Llc
Publication of CL2016002995A1 publication Critical patent/CL2016002995A1/es

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0216—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having particular orientation, e.g. slanted, or being orientation-independent
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Control Of Temperature (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)

Abstract

<p>UNA CAMARA DE VAPOR PUEDE INTEGRARSE CON UNO O MAS COMPONENTES DE UN DISPOSITIVO DE COMPUTO PARA PROPORCIONAR MANEJO TERMICO. LA CAMARA DE VAPOR PUEDE INCLUIR PORCIONES SUPERIOR E INFERIOR QUE FORMAN LA CAMARA DE VAPOR Y UN ESPACIO ANULAR ENTRE LAS PORCIONES SUPERIOR E INFERIOR QUE INCLUYE UN FLUIDO. LA CAMARA DE VAPOR SE PUEDE CONFIGURAR PARA ABSORBER CALOR A PARTIR DE UNA FUENTE DE CALOR DEL DISPOSITIVO DE COMPUTO.</p>
CL2016002995A 2014-06-02 2016-11-22 Cámara de vapor integrada para manejo térmico de dispositivos de cómputo CL2016002995A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/294,040 US10698458B2 (en) 2014-06-02 2014-06-02 Integrated vapor chamber for thermal management of computing devices

Publications (1)

Publication Number Publication Date
CL2016002995A1 true CL2016002995A1 (es) 2017-06-16

Family

ID=53404895

Family Applications (1)

Application Number Title Priority Date Filing Date
CL2016002995A CL2016002995A1 (es) 2014-06-02 2016-11-22 Cámara de vapor integrada para manejo térmico de dispositivos de cómputo

Country Status (15)

Country Link
US (1) US10698458B2 (es)
EP (1) EP3149425B1 (es)
JP (1) JP2017518476A (es)
KR (1) KR20170016391A (es)
CN (1) CN106462205A (es)
AU (1) AU2015271054B2 (es)
CA (1) CA2948383A1 (es)
CL (1) CL2016002995A1 (es)
HK (1) HK1232318A1 (es)
IL (1) IL248815A0 (es)
MX (1) MX2016015726A (es)
PH (1) PH12016502202A1 (es)
RU (1) RU2691215C2 (es)
SG (1) SG11201609816WA (es)
WO (1) WO2015187475A1 (es)

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Also Published As

Publication number Publication date
JP2017518476A (ja) 2017-07-06
RU2016147187A3 (es) 2018-12-14
CA2948383A1 (en) 2015-12-10
RU2016147187A (ru) 2018-06-01
RU2691215C2 (ru) 2019-06-11
SG11201609816WA (en) 2016-12-29
WO2015187475A1 (en) 2015-12-10
EP3149425B1 (en) 2019-12-04
AU2015271054B2 (en) 2019-07-04
AU2015271054A1 (en) 2016-11-17
MX2016015726A (es) 2017-03-16
CN106462205A (zh) 2017-02-22
KR20170016391A (ko) 2017-02-13
IL248815A0 (en) 2017-01-31
PH12016502202A1 (en) 2017-01-09
EP3149425A1 (en) 2017-04-05
US20150346784A1 (en) 2015-12-03
HK1232318A1 (zh) 2018-01-05
US10698458B2 (en) 2020-06-30

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