CN100339985C - 成形弹簧以及制造和使用成形弹簧的方法 - Google Patents

成形弹簧以及制造和使用成形弹簧的方法 Download PDF

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Publication number
CN100339985C
CN100339985C CNB018110053A CN01811005A CN100339985C CN 100339985 C CN100339985 C CN 100339985C CN B018110053 A CNB018110053 A CN B018110053A CN 01811005 A CN01811005 A CN 01811005A CN 100339985 C CN100339985 C CN 100339985C
Authority
CN
China
Prior art keywords
element material
cross tie
tie part
interconnect
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB018110053A
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English (en)
Chinese (zh)
Other versions
CN1451179A (zh
Inventor
G·L·马蒂厄
B·N·埃尔德里奇
S·W·文策尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/547,561 external-priority patent/US7458816B1/en
Priority claimed from US09/547,560 external-priority patent/US6640432B1/en
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of CN1451179A publication Critical patent/CN1451179A/zh
Application granted granted Critical
Publication of CN100339985C publication Critical patent/CN100339985C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Battery Mounting, Suspending (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connecting Device With Holders (AREA)
CNB018110053A 2000-04-12 2001-03-28 成形弹簧以及制造和使用成形弹簧的方法 Expired - Fee Related CN100339985C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/547,561 US7458816B1 (en) 2000-04-12 2000-04-12 Shaped spring
US09/547,560 US6640432B1 (en) 2000-04-12 2000-04-12 Method of fabricating shaped springs
US09/547,560 2000-04-12
US09/547,561 2000-04-12

Publications (2)

Publication Number Publication Date
CN1451179A CN1451179A (zh) 2003-10-22
CN100339985C true CN100339985C (zh) 2007-09-26

Family

ID=27068579

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB018110053A Expired - Fee Related CN100339985C (zh) 2000-04-12 2001-03-28 成形弹簧以及制造和使用成形弹簧的方法

Country Status (7)

Country Link
EP (1) EP1275150A2 (fr)
JP (1) JP2003531495A (fr)
KR (2) KR100835027B1 (fr)
CN (1) CN100339985C (fr)
AU (1) AU2001249567A1 (fr)
TW (1) TW546803B (fr)
WO (1) WO2001080315A2 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE311604T1 (de) * 2000-06-20 2005-12-15 Nanonexus Inc Testsystem von integrierten schaltungen
KR100941360B1 (ko) * 2006-07-21 2010-02-11 가부시키가이샤후지쿠라 집적 회로 소켓, 집적 회로 소켓 조립체, 및 집적 회로 소켓의 제조 방법
EP2177646B1 (fr) * 2008-10-17 2011-03-23 ATOTECH Deutschland GmbH multicouche de Ni-P/Pd à contrainte réduite pour revêtement de surfaces de connections electriques sur wafers
US8476749B2 (en) * 2009-07-22 2013-07-02 Oracle America, Inc. High-bandwidth ramp-stack chip package
US8441808B2 (en) * 2010-09-22 2013-05-14 Palo Alto Research Center Incorporated Interposer with microspring contacts
TWI449280B (zh) * 2011-01-17 2014-08-11 Hon Hai Prec Ind Co Ltd 測試連接器
KR101738421B1 (ko) 2015-11-10 2017-05-23 광주과학기술원 자가변형 플렉서블 필름 및 이의 제조 방법
KR102042052B1 (ko) * 2017-03-23 2019-11-08 광주과학기술원 자가변형 플렉서블 필름 및 이의 제조 방법
KR102114210B1 (ko) * 2018-12-17 2020-05-25 주식회사 코리아 인스트루먼트 프로브 빔 및 프로브 모듈
CN114108041A (zh) * 2021-12-20 2022-03-01 太仓市惠得利弹簧有限公司 一种弹簧表面抗氧化处理工艺

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61136437U (fr) * 1985-02-15 1986-08-25
JPH09213813A (ja) * 1996-02-06 1997-08-15 Sony Corp 半導体装置及び半導体装置製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216631A (en) * 1990-11-02 1993-06-01 Sliwa Jr John W Microvibratory memory device
JPH06181301A (ja) * 1992-12-14 1994-06-28 Fujitsu Ltd 固体撮像素子
US5810609A (en) * 1995-08-28 1998-09-22 Tessera, Inc. Socket for engaging bump leads on a microelectronic device and methods therefor
JPH09213183A (ja) * 1996-02-05 1997-08-15 Eiko Takahashi 小型サーモスタット
EP1482314B1 (fr) * 1996-05-17 2009-11-11 FormFactor, Inc. Elément de contact à ressort micro-électronique
AU7491598A (en) * 1997-05-15 1998-12-08 Formfactor, Inc. Lithographically defined microelectronic contact structures
AU7959298A (en) * 1997-09-17 1999-04-05 Formfactor, Inc. Method of making a structure with improved material properties by moderate heat treatment of a metal deposit
US6827584B2 (en) * 1999-12-28 2004-12-07 Formfactor, Inc. Interconnect for microelectronic structures with enhanced spring characteristics

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61136437U (fr) * 1985-02-15 1986-08-25
JPH09213813A (ja) * 1996-02-06 1997-08-15 Sony Corp 半導体装置及び半導体装置製造方法

Also Published As

Publication number Publication date
TW546803B (en) 2003-08-11
KR100801353B1 (ko) 2008-02-05
EP1275150A2 (fr) 2003-01-15
KR20070093456A (ko) 2007-09-18
WO2001080315A2 (fr) 2001-10-25
KR20020090234A (ko) 2002-11-30
AU2001249567A1 (en) 2001-10-30
KR100835027B1 (ko) 2008-06-03
WO2001080315A3 (fr) 2002-03-28
CN1451179A (zh) 2003-10-22
JP2003531495A (ja) 2003-10-21

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070926

Termination date: 20110328