CN100559273C - 光刻装置和测量系统 - Google Patents
光刻装置和测量系统 Download PDFInfo
- Publication number
- CN100559273C CN100559273C CNB031648614A CN03164861A CN100559273C CN 100559273 C CN100559273 C CN 100559273C CN B031648614 A CNB031648614 A CN B031648614A CN 03164861 A CN03164861 A CN 03164861A CN 100559273 C CN100559273 C CN 100559273C
- Authority
- CN
- China
- Prior art keywords
- projection
- projection system
- radiation
- pupil
- rays
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005259 measurement Methods 0.000 title claims abstract description 16
- 238000001459 lithography Methods 0.000 title description 2
- 230000004075 alteration Effects 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 210000001747 pupil Anatomy 0.000 claims abstract description 35
- 230000005855 radiation Effects 0.000 claims abstract description 17
- 238000000059 patterning Methods 0.000 claims abstract 3
- 230000005540 biological transmission Effects 0.000 claims description 13
- 230000000694 effects Effects 0.000 claims description 9
- 238000005286 illumination Methods 0.000 claims description 7
- 230000006870 function Effects 0.000 claims description 6
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- 230000003287 optical effect Effects 0.000 description 49
- 238000009792 diffusion process Methods 0.000 description 18
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
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- 229910052710 silicon Inorganic materials 0.000 description 3
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- 239000004065 semiconductor Substances 0.000 description 2
- 241000656145 Thyrsites atun Species 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 201000009310 astigmatism Diseases 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 238000005520 cutting process Methods 0.000 description 1
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- 230000005684 electric field Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
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- 210000003128 head Anatomy 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000005381 magnetic domain Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
- G03F7/706—Aberration measurement
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Testing Of Optical Devices Or Fibers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP02256794 | 2002-09-30 | ||
| EP02256794.5 | 2002-09-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1497350A CN1497350A (zh) | 2004-05-19 |
| CN100559273C true CN100559273C (zh) | 2009-11-11 |
Family
ID=32479813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031648614A Expired - Fee Related CN100559273C (zh) | 2002-09-30 | 2003-09-26 | 光刻装置和测量系统 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6940587B2 (fr) |
| EP (1) | EP1403714B1 (fr) |
| JP (1) | JP3998627B2 (fr) |
| KR (1) | KR100565105B1 (fr) |
| CN (1) | CN100559273C (fr) |
| DE (1) | DE60332697D1 (fr) |
| SG (1) | SG134991A1 (fr) |
| TW (1) | TWI255970B (fr) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050275841A1 (en) * | 2004-06-09 | 2005-12-15 | Asml Netherlands B.V. | Alignment marker and lithographic apparatus and device manufacturing method using the same |
| US7528931B2 (en) | 2004-12-20 | 2009-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7834975B2 (en) | 2004-12-27 | 2010-11-16 | Asml Netherlands B.V. | Method and exposure apparatus for performing a tilted focus and a device manufactured accordingly |
| JP2006332586A (ja) * | 2005-04-25 | 2006-12-07 | Canon Inc | 測定装置、露光装置及び方法、並びに、デバイス製造方法 |
| JP2006339448A (ja) * | 2005-06-02 | 2006-12-14 | Canon Inc | 受光ユニットを有する露光装置 |
| US20070081138A1 (en) * | 2005-10-11 | 2007-04-12 | Asml Netherlands B.V. | Lithographic projection apparatus, device manufacturing methods and mask for use in a device manufacturing method |
| JP2007234685A (ja) * | 2006-02-28 | 2007-09-13 | Canon Inc | 測定装置、当該測定装置を有する露光装置及びデバイス製造方法 |
| US7580113B2 (en) * | 2006-06-23 | 2009-08-25 | Asml Netherlands B.V. | Method of reducing a wave front aberration, and computer program product |
| US20080259458A1 (en) * | 2007-04-18 | 2008-10-23 | Advanced Micro Devices, Inc. | EUV diffractive optical element for semiconductor wafer lithography and method for making same |
| US8692974B2 (en) * | 2007-06-14 | 2014-04-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method using pupil filling by telecentricity control |
| US8189172B2 (en) * | 2007-06-14 | 2012-05-29 | Asml Netherlands B.V. | Lithographic apparatus and method |
| NL1036695A1 (nl) * | 2008-05-15 | 2009-11-17 | Asml Netherlands Bv | Lithographic apparatus. |
| DE102012204704A1 (de) * | 2012-03-23 | 2013-09-26 | Carl Zeiss Smt Gmbh | Messvorrichtung zum Vermessen einer Abbildungsgüte eines EUV-Objektives |
| DE102012207865B3 (de) * | 2012-05-11 | 2013-07-11 | Carl Zeiss Smt Gmbh | Optische Baugruppe für die EUV-Lithographie |
| US9335206B2 (en) * | 2012-08-30 | 2016-05-10 | Kla-Tencor Corporation | Wave front aberration metrology of optics of EUV mask inspection system |
| WO2017207512A2 (fr) | 2016-06-03 | 2017-12-07 | Asml Netherlands B.V. | Dispositif de formation de motifs |
| DE102014221313A1 (de) | 2014-10-21 | 2016-04-21 | Carl Zeiss Smt Gmbh | Beleuchtung für die EUV-Projektionslithografie |
| US10168621B2 (en) * | 2014-11-24 | 2019-01-01 | Asml Netherlands B.V. | Radiation beam apparatus |
| CN106324995B (zh) * | 2015-05-12 | 2017-12-12 | 中国科学院上海光学精密机械研究所 | 光刻机原位快速高空间分辨率波像差检测装置及方法 |
| CN106323981B (zh) * | 2015-06-23 | 2017-11-14 | 南京理工大学 | 基于偏轴型位相波带片干涉显微检测装置 |
| DE102016200847A1 (de) * | 2016-01-21 | 2017-07-27 | Dr. Johannes Heidenhain Gesellschaft Mit Beschränkter Haftung | Optische Positionsmesseinrichtung |
| DE102017200428B3 (de) | 2017-01-12 | 2018-06-21 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage sowie Verfahren zum Vermessen eines Abbildungsfehlers |
| DE102017203376B3 (de) | 2017-03-02 | 2018-05-24 | Carl Zeiss Smt Gmbh | Messvorrichtung und Verfahren zur Vermessung eines Wellenfrontfehlers eines abbildenden optischen Systems sowie Projektionsbelichtungsanlage für die Mikrolithographie |
| DE102018204626A1 (de) | 2018-03-27 | 2019-04-04 | Carl Zeiss Smt Gmbh | Beleuchtungsmaske sowie Verfahren zu deren Herstellung |
| EP4350440A1 (fr) * | 2022-10-06 | 2024-04-10 | ASML Netherlands B.V. | Procédés et système pour déterminer des aberrations d'un système de projection |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5296891A (en) * | 1990-05-02 | 1994-03-22 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Illumination device |
| DE19824030A1 (de) | 1998-05-29 | 1999-12-02 | Zeiss Carl Fa | Katadioptrisches Projektionsobjektiv mit adaptivem Spiegel und Projektionsbelichtungsverfahren |
| US6118577A (en) * | 1998-08-06 | 2000-09-12 | Euv, L.L.C | Diffractive element in extreme-UV lithography condenser |
| TW550377B (en) | 2000-02-23 | 2003-09-01 | Zeiss Stiftung | Apparatus for wave-front detection |
| EP1231514A1 (fr) | 2001-02-13 | 2002-08-14 | Asm Lithography B.V. | Mesure des abérrations du front d' onde dans un appareil de projection lithographique |
-
2003
- 2003-09-26 TW TW092126668A patent/TWI255970B/zh not_active IP Right Cessation
- 2003-09-26 EP EP03256068A patent/EP1403714B1/fr not_active Expired - Lifetime
- 2003-09-26 JP JP2003373442A patent/JP3998627B2/ja not_active Expired - Fee Related
- 2003-09-26 SG SG200305709-8A patent/SG134991A1/en unknown
- 2003-09-26 CN CNB031648614A patent/CN100559273C/zh not_active Expired - Fee Related
- 2003-09-26 US US10/670,801 patent/US6940587B2/en not_active Expired - Lifetime
- 2003-09-26 DE DE60332697T patent/DE60332697D1/de not_active Expired - Lifetime
- 2003-09-29 KR KR1020030067498A patent/KR100565105B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1403714A3 (fr) | 2007-01-10 |
| EP1403714B1 (fr) | 2010-05-26 |
| JP2004289116A (ja) | 2004-10-14 |
| EP1403714A2 (fr) | 2004-03-31 |
| SG134991A1 (en) | 2007-09-28 |
| TWI255970B (en) | 2006-06-01 |
| KR20040030322A (ko) | 2004-04-09 |
| KR100565105B1 (ko) | 2006-03-30 |
| DE60332697D1 (de) | 2010-07-08 |
| US6940587B2 (en) | 2005-09-06 |
| US20040114119A1 (en) | 2004-06-17 |
| TW200413861A (en) | 2004-08-01 |
| CN1497350A (zh) | 2004-05-19 |
| JP3998627B2 (ja) | 2007-10-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091111 Termination date: 20200926 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |