CN100596256C - Apparatus and method for continuously depositing a pattern of material on a substrate - Google Patents
Apparatus and method for continuously depositing a pattern of material on a substrate Download PDFInfo
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- CN100596256C CN100596256C CN200680025659A CN200680025659A CN100596256C CN 100596256 C CN100596256 C CN 100596256C CN 200680025659 A CN200680025659 A CN 200680025659A CN 200680025659 A CN200680025659 A CN 200680025659A CN 100596256 C CN100596256 C CN 100596256C
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/143—Masks therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0831—Machines for printing webs
- B41F15/0836—Machines for printing webs by means of cylindrical screens or screens in the form of endless belts
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2215/00—Screen printing machines
- B41P2215/10—Screen printing machines characterised by their constructional features
- B41P2215/12—Screens
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0134—Drum, e.g. rotary drum or dispenser with a plurality of openings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
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Abstract
Description
技术领域 technical field
本发明涉及将材料图样沉积到基底上。更具体地说,本发明涉及借助于连续移动基底和定义图样的掩模穿过沉积区来沉积材料图样。The present invention relates to depositing patterns of material onto substrates. More specifically, the present invention relates to depositing patterns of material by means of continuously moving a substrate and a mask defining the pattern across a deposition zone.
背景技术 Background technique
通过从沉积源沿着向基底的方向放出材料,可以在基底上形成材料图样。通过在沉积源和基底之间设置掩模,将材料以特定的图样沉积在基底上。掩模包括定义图样的孔,并且只有穿过该孔的沉积材料到达基底,以便该材料以图样的形式沉积。A pattern of material can be formed on a substrate by discharging material from a deposition source in a direction towards the substrate. By placing a mask between the deposition source and the substrate, the material is deposited on the substrate in a specific pattern. The mask includes holes defining a pattern, and only deposition material passing through the holes reaches the substrate so that the material is deposited in the pattern.
这样的图样可以因为各种目的沉积在基底上。作为一个例子,通过以各种图样的方式沉积材料可以在基底上形成电路图。例如,像金属化图样的导电径迹可以形成在柔性电介质上以用于各种用途,包括用于在安装在热油墨喷头上的柔性制表电路上编码信息。Such patterns can be deposited on the substrate for various purposes. As an example, a circuit pattern can be formed on a substrate by depositing material in various patterns. For example, conductive traces like metallization patterns can be formed on flexible dielectrics for various purposes, including for encoding information on flexible tabulation circuits mounted on thermal ink jets.
常规的穿过掩模到基底上的材料图样沉积以分步重复的方式进行。基底向前移动预定的量并且停止,而掩模位于固定且已知的相对于基底的位置上。然后沉积源放出材料穿过掩模以形成图样。该基底然后再移动预定的量并且停止,并且再一次发生沉积。重复这个过程,以在一卷基底材料上形成给定图样的多个实例。基底上的每个材料图样可以暴露给另一个下游掩模和沉积源以形成另外的图样材料层。Conventional pattern deposition of material through a mask onto a substrate is performed in a step-and-repeat fashion. The substrate is moved forward a predetermined amount and stopped while the mask is in a fixed and known position relative to the substrate. The deposition source then discharges material through the mask to form a pattern. The substrate is then moved a predetermined amount and stopped, and deposition occurs again. This process is repeated to form multiple instances of a given pattern on a roll of base material. Each pattern of material on the substrate can be exposed to another downstream mask and deposition source to form additional layers of patterned material.
该分步重复过程虽然在精确地制造具有比较精细的特征尺寸的图样的多个实例方面是有效的,但是具有相对效率低的缺点。移动基底和精确地对准掩模和基底所花费的时间(相对于沉积该层的总的时间而言,这个时间量相当大)是不沉积材料所花费的时间。因此该分步重复过程不能实现所希望的生产率。This step-and-repeat process, while effective in accurately fabricating multiple instances of a pattern with relatively finer feature sizes, has the disadvantage of being relatively inefficient. The time it takes to move the substrate and precisely align the mask and substrate (a considerable amount of time relative to the total time to deposit the layer) is the time spent not depositing material. The step-and-repeat process therefore cannot achieve the desired productivity.
发明内容 Contents of the invention
本发明的实施例通过提供设备和方法解决这些和其他问题,所述设备和方法连续地向基底沉积材料,而不是按照分步重复的例程来沉积材料。由于在基底处于移动的同时,材料被连续地沉积,因此没有浪费花费在移动基底上的时间。Embodiments of the present invention address these and other problems by providing apparatus and methods that deposit material to a substrate continuously, rather than depositing material in a step-by-step, repetitive routine. Since material is continuously deposited while the substrate is in motion, no time spent moving the substrate is wasted.
一个实施例是用于在基底上连续地沉积材料图样的设备。该设备包括递送基底的基底递送辊和在其上接收基底的第一基底接收辊,使得基底从该基底递送辊向基底接收辊延伸,并且基底从该基底递送辊向基底接收辊连续地通过。该设备还包括包含定义第一图样的孔的第一掩模,其中一个或多个孔具有至少100微米或更小的尺寸。该设备还包括从其递送第一掩模的第一掩模递送辊和其上接收该第一掩模的第一掩模接收辊,使得该掩模从该掩模递送辊向掩模接收辊延伸,并且该第一掩模从该第一掩模递送辊向第一掩模接收辊连续地通过。第一圆筒被包括,在其上,基底和第一掩模在从所述基底和掩模递送辊被递送与在所述基底和掩模接收辊上被接收之间,在所述第一圆筒的圆周的部分上方接触,并且该第一圆筒连续地旋转。第一沉积源被定位成朝着该第一圆筒圆周部分上的第一掩模的部分连续地引导第一沉积材料,使得该第一沉积材料的至少一部分通过该第一掩模的孔,以在该基底上连续地沉积该第一材料的第一图样。One embodiment is an apparatus for continuously depositing a pattern of material on a substrate. The apparatus includes a substrate delivery roll delivering the substrate and a first substrate receiving roll receiving the substrate thereon such that the substrate extends from the substrate delivery roll to the substrate receiving roll and the substrate passes continuously from the substrate delivery roll to the substrate receiving roll. The apparatus also includes a first mask including holes defining a first pattern, wherein the one or more holes have a size of at least 100 microns or less. The apparatus also includes a first mask delivery roll from which the first mask is delivered and a first mask receiver roll on which the first mask is received such that the mask passes from the mask delivery roll to the mask receiver roll extending, and the first mask passes continuously from the first mask delivery roll to the first mask receiving roll. A first cylinder is included on which the substrate and first mask between being delivered from the substrate and mask delivery roll and received on the substrate and mask receiving roll, between the first parts of the circumference of the cylinders are in contact above, and the first cylinder rotates continuously. the first deposition source is positioned to continuously direct the first deposition material towards the portion of the first mask on the first cylinder circumferential portion such that at least a portion of the first deposition material passes through the holes of the first mask, A first pattern of the first material is continuously deposited on the substrate.
另一个实施例是用于在基底上连续地沉积材料图样的设备,该设备包括递送基底的基底递送辊和在其上接收基底的第一基底接收辊,使得基底从该基底递送辊向基底接收辊延伸,其中基底从该基底递送辊向基底接收辊连续地通过。该设备还包括包含定义第一图样的孔的第一掩模,递送第一掩模的第一掩模递送辊,和其上接收该第一掩模的第一掩模接收辊,使得该掩模从该掩模递送辊向掩模接收辊延伸,其中该第一掩模从该第一掩模递送辊向第一掩模接收辊连续地通过。该设备还包括第一圆筒,在其上,该基底和该第一聚合物掩模在来自该基底和掩模递送辊的递送与基底和掩模接收辊上的接收之间、在所述第一圆筒的圆周表面部分上接触,其中该第一圆筒连续地旋转。此外,该设备还包括第一沉积源,其被定位成:朝着该第一圆筒圆周部分上的第一掩模的部分连续地引导第一沉积材料,使得该第一沉积材料的至少一部分通过该第一掩模的孔,以在该基底上连续地沉积该第一材料的第一图样。当基底在第一圆筒的圆周部分上进入接触时,第一基底伸长控制系统沿着从基底递送辊向第一圆筒的递送方向保持该基底预定的伸长,而当第一掩模在第一圆筒的圆周部分上进入接触时,第一掩模伸长控制系统沿着从第一掩模递送辊向第一圆筒的方向保持第一掩模的预定的伸长。第一基底横向位置控制系统包括将基底的横向位置调节到在该第一圆筒上的预定横向地点的卷材引导装置,并且第一掩模横向位置控制系统包括将第一掩模的横向位置调节到在该第一圆筒上的预定横向地点的卷材引导装置。Another embodiment is an apparatus for continuously depositing a pattern of material on a substrate, the apparatus comprising a substrate delivery roll delivering the substrate and a first substrate receiving roll receiving the substrate thereon such that the substrate is received from the substrate delivery roll toward the substrate. The rollers are extended in which the substrate passes continuously from the substrate delivery roller to the substrate receiving roller. The apparatus also includes a first mask comprising apertures defining a first pattern, a first mask delivery roll delivering the first mask, and a first mask receiving roll receiving the first mask thereon such that the mask A mold extends from the mask delivery roll to a mask receiver roll, wherein the first mask passes continuously from the first mask delivery roll to the first mask receiver roll. The apparatus also includes a first cylinder on which the substrate and the first polymer mask are between delivery from the substrate and mask delivery roll and reception on the substrate and mask receiver roll, between the The circumferential surface of the first cylinder is partially in contact, wherein the first cylinder rotates continuously. Additionally, the apparatus includes a first deposition source positioned to continuously direct a first deposition material towards a portion of the first mask on the first cylinder circumferential portion such that at least a portion of the first deposition material passing through the holes of the first mask to continuously deposit a first pattern of the first material on the substrate. When the substrate comes into contact on the circumferential portion of the first cylinder, the first substrate elongation control system maintains the substrate at a predetermined elongation along the delivery direction from the substrate delivery rollers to the first cylinder, while the first mask The first mask elongation control system maintains a predetermined elongation of the first mask in a direction from the first mask delivery roller to the first cylinder upon coming into contact on the circumferential portion of the first cylinder. The first substrate lateral position control system includes a web guide that adjusts the lateral position of the substrate to a predetermined lateral position on the first cylinder, and the first mask lateral position control system includes adjusting the lateral position of the first mask to A web guide adjusted to a predetermined transverse location on the first cylinder.
又一个实施例是连续地沉积材料的方法,其包括从基底递送辊连续地基底,同时在基底接收辊上连续地接收该基底,其中当在该基底递送辊和基底接收辊之间时,基底从上方通过第一圆筒的圆周部分。该方法还包括在连续地递送和接收基底的同时,连续地从第一掩模递送辊递送掩模、同时在第一掩模接收辊上连续地接收该第一掩模,其中当在第一掩模递送辊和第一掩模接收辊之间时,该第一掩模通过第一圆筒的圆周部分,并且其中该第一掩模具有形成第一图样的多个孔,并且至少一部分所述孔具有至少100微米或更小的尺寸。此外,该方法包括在连续递送和接收该基底和第一掩模的同时,从第一沉积源向在该第一圆筒圆周部分上的该第一掩模部分连续地引导第一沉积材料,使得该第一材料的第一图样沉积在基底上。Yet another embodiment is a method of continuously depositing material comprising continuously delivering a substrate from a substrate delivery roll while continuously receiving the substrate on a substrate receiving roll, wherein while between the substrate delivery roll and the substrate receiving roll, the substrate Pass the circumferential portion of the first cylinder from above. The method further includes continuously delivering the mask from the first mask delivery roll while continuously receiving the first mask on the first mask receiving roll while continuously delivering and receiving the substrate, wherein when the first When between the mask delivery roller and the first mask receiving roller, the first mask passes through the circumferential portion of the first cylinder, and wherein the first mask has a plurality of holes forming a first pattern, and at least a part of the The pores have a size of at least 100 microns or less. Furthermore, the method includes continuously directing a first deposition material from a first deposition source to the first mask portion on the first cylinder circumferential portion while continuously delivering and receiving the substrate and the first mask, A first pattern of the first material is caused to be deposited on a substrate.
附图说明 Description of drawings
图1示出设备的实施例,所述设备利用内部圆筒沉积和辊到辊的掩模提供沉积工艺的第一阶段,而不使用预先形成图样的基准元件;Figure 1 shows an embodiment of an apparatus that utilizes internal cylinder deposition and roll-to-roll masking to provide the first stage of the deposition process without the use of pre-patterned fiducial elements;
图2示出设备的实施例,所述设备利用内部圆筒沉积和连续循环回路掩模提供沉积工艺的第一阶段,而不使用预先形成图样的基准元件;Figure 2 shows an embodiment of an apparatus that utilizes internal cylinder deposition and a continuous loop mask to provide the first stage of the deposition process without the use of pre-patterned fiducial elements;
图3示出设备的实施例,所述设备利用外部圆筒沉积和辊到辊的掩模提供沉积工艺的第一阶段,而不使用预先形成图样的基准元件;Figure 3 shows an embodiment of an apparatus that utilizes external cylinder deposition and roll-to-roll masking to provide the first stage of the deposition process without the use of pre-patterned fiducial elements;
图4示出设备的实施例,所述设备利用内部圆筒沉积、使用预先形成图样的基准元件,并且利用辊到辊的掩模提供沉积工艺的第一阶段;Figure 4 shows an embodiment of an apparatus utilizing internal cylinder deposition, using pre-patterned fiducial elements, and utilizing a roll-to-roll mask to provide the first stage of the deposition process;
图5示出设备的实施例,所述设备利用外部圆筒沉积、不使用预先形成图样的基准元件,而是用在该外部圆筒沉积之前产生的基准图样,和辊到辊的掩模提供沉积工艺的第一阶段;Figure 5 shows an embodiment of an apparatus that utilizes external cylinder deposition, does not use pre-patterned fiducial elements, but instead uses a fiducial pattern generated prior to the external cylinder deposition, and a roll-to-roll mask to provide The first stage of the deposition process;
图6示出设备的实施例,所述设备利用内部沉积和辊到辊的掩模提供沉积工艺的第二阶段;Figure 6 shows an embodiment of an apparatus that provides a second stage of the deposition process using internal deposition and roll-to-roll masking;
图7示出用于控制各种实施例的纵向卷材位置的说明性的旋转马达和速度/位置控制系统的示意图;7 shows a schematic diagram of an illustrative rotary motor and speed/position control system for controlling the longitudinal web position of various embodiments;
图8示出用于控制各种实施例的横向卷材位置的说明性的引导马达控制系统的示意图;Figure 8 shows a schematic diagram of an illustrative guide motor control system for controlling the transverse web position of various embodiments;
图9示出卷材基准对准控制系统的示意图,用于保持各种实施例的两种卷材的正确对准;Figure 9 shows a schematic diagram of a web fiducial alignment control system for maintaining proper alignment of two webs of various embodiments;
图10示出说明性的控制系统接口,用于设备实施例的基准对准传感器,所述设备实施例提供沉积工艺的第二阶段;Figure 10 shows an illustrative control system interface for a fiducial alignment sensor of an apparatus embodiment providing a second stage of a deposition process;
图11示出图10的说明性的控制系统接口所用的控制回路;Figure 11 shows a control loop for the illustrative control system interface of Figure 10;
图12示出在掩模和/或基底上使用的基准元件的说明性图样,用于同时感测各个掩模和/或基底的相对横向和纵向位置;Figure 12 shows an illustrative pattern of reference elements used on masks and/or substrates for simultaneous sensing of relative lateral and longitudinal positions of respective masks and/or substrates;
图13示出用于同时感测横向和纵向卷材位置的说明性的感测系统的视图;Figure 13 shows a view of an illustrative sensing system for simultaneously sensing transverse and longitudinal web position;
图14示出用于同时感测横向和纵向卷材位置的说明性的感测系统的视图。Fig. 14 shows a view of an illustrative sensing system for simultaneously sensing transverse and longitudinal web position.
具体实施方式Detailed ways
本发明的实施例以由掩模定义图样的方式在基底上提供连续的材料沉积。该连续的沉积通过连续地移动基底和掩模穿过由沉积源和圆筒提供的沉积区来提供。Embodiments of the present invention provide continuous material deposition on a substrate in a pattern defined by a mask. The continuous deposition is provided by continuously moving the substrate and mask through the deposition zone provided by the deposition sources and cylinders.
图1示出设备的一个说明性实施例和得到的方法,其形成用于在基底上连续地沉积材料图样的一个阶段。在这个特定的实施例中,这个第一阶段被用于在基底100上沉积称为基准的图样元件,其中这些基准然后可以用于随后的阶段,以将基底与随后阶段的掩模正确地对准,其中正如下面参考图4所讨论的,这种对准精度在微米级。这种基准借助于穿过掩模101沉积材料而被应用,该掩模101包括提供基准的图样的孔。除了基准之外,也可以沉积电路图的第一层,其中该第一层的材料与用于沉积该基准的材料是相同的。Figure 1 shows an illustrative embodiment of an apparatus and resulting method forming one stage for successively depositing a pattern of material on a substrate. In this particular embodiment, this first stage is used to deposit pattern elements called fiducials on the substrate 100, where these fiducials can then be used in subsequent stages to correctly align the substrate with subsequent stage masks. Alignment, where as discussed below with reference to Figure 4, this alignment accuracy is on the order of microns. Such fiducials are applied by means of depositing material through a mask 101 comprising holes providing a pattern of fiducials. In addition to the fiducial, it is also possible to deposit a first layer of the circuit pattern, wherein the material of the first layer is the same as that used to deposit the fiducial.
该基底100在用作为基底100的递送辊的一卷基底展开卷筒102上开始,到这个第一沉积阶段的设备的其余部分。由精确驱动辊108从卷筒102连续地拉动该基底100通过调节辊104、从张力载荷传感装置106上经过。基底100紧紧地从旋转的圆筒124的圆周部分上拉过,并且到基底100的另一个接收辊110。该基底100离开该接收辊110,或者被拉入到在下面参考图6所讨论的、随后的沉积状态中,或者重新卷绕在基底重卷卷筒上。The substrate 100 starts on a roll of substrate unwinding roll 102 that acts as a delivery roll for the substrate 100, to the remainder of the apparatus for this first deposition stage. The substrate 100 is continuously pulled from mandrel 102 by precision driven rollers 108 , through regulating rollers 104 , over tension load sensing device 106 . The substrate 100 is pulled tightly over the circumferential portion of the rotating cylinder 124 and to another receiving roller 110 of the substrate 100 . The substrate 100 exits the take-up roll 110 and is either pulled into a subsequent deposition state, discussed below with reference to FIG. 6, or rewound on a substrate rewind spool.
该调节辊104和张力载荷传感装置106用于实现该基底100的、在以给定的基底100的速度递送到圆筒124的方向上的、预定的并且被控制的伸长,或拉伸。基底100的速度由精确驱动辊108的速度支配,该精确驱动辊108的速度与圆筒124的速度精密地同步,该圆筒124本身具有精确驱动。速度的选取是设计选择的问题,其基于是否可以实现预定的伸长和正确的沉积厚度。The conditioning rollers 104 and tension load sensing device 106 are used to achieve a predetermined and controlled elongation, or stretching, of the substrate 100 in a direction delivered to the cylinder 124 at a given substrate 100 speed. . The speed of the substrate 100 is governed by the speed of the precision driven roller 108 which is precisely synchronized with the speed of the cylinder 124 which itself has a precision drive. The choice of speed is a matter of design choice based on whether the desired elongation and correct deposition thickness can be achieved.
正如本领域所熟知的,当张力通过调节辊104的执行机构施加于基底100时,调节辊104利用旋转传感器提供反馈以控制该展开卷筒102的速度。该张力载荷传感装置106提供力读出,其能够用于修整通过调节辊104的执行机构施加的力。控制系统根据来自张力载荷传感装置106的读出和圆筒124的速度施加逻辑控制,以使驱动辊108的速度稍稍改变,从而按照希望控制基底100的伸长。As is well known in the art, the regulating roller 104 utilizes rotational sensors to provide feedback to control the speed of the unwinding roll 102 when tension is applied to the substrate 100 by the actuator of the regulating roller 104 . The tension load sensing device 106 provides a force readout that can be used to trim the force applied by the actuator of the adjustment roll 104 . The control system applies logic control based on the readout from the tension load sensing device 106 and the speed of the cylinder 124 to vary the speed of the drive roller 108 slightly to control the elongation of the substrate 100 as desired.
掩模101在掩模展开卷筒112的卷上开始,该卷筒112用作为将掩模101递送到这个第一沉积阶段的设备的其余部分的递送辊。该掩模101由精确驱动辊118从卷筒112、通过调节辊114、经过张力载荷传感装置116连续地拉动。掩模101紧紧地从旋转的圆筒124的圆周部分上拉过,在那里该基底也拉过,因而使掩模101与基底100接触,并且进一步拉到掩模101的接收辊120上。该掩模101离开该接收辊120,并且重新卷绕在基底重卷卷筒上122上。The mask 101 starts on a roll of a mask unwinding mandrel 112 which acts as a delivery roller for delivering the mask 101 to the rest of the apparatus for this first deposition stage. The mask 101 is continuously pulled by precision driven rollers 118 from mandrel 112 , through regulating rollers 114 , past tension load sensing device 116 . The mask 101 is pulled tightly over the circumferential portion of the rotating cylinder 124 where the substrate is also drawn, thereby bringing the mask 101 into contact with the substrate 100 and further onto the take-up roll 120 of the mask 101 . The mask 101 exits the take-up roll 120 and is rewound on a substrate rewind mandrel 122 .
正如基底100一样,调节辊114和张力载荷传感装置116用于实现该掩模101的、在以给定的掩模101速度递送到圆筒124方向上的、预定的并且被控制的伸长,或拉伸。掩模101的速度进一步由精确驱动辊118的速度支配,该精确驱动辊118的速度也与圆筒124的速度精密地同步。正如上面的关于基底100的讨论一样,速度的选取是设计选择的问题,其基于是否可以实现预定的伸长和正确的沉积厚度。As with the substrate 100, the conditioning rollers 114 and tension load sensing device 116 are used to achieve a predetermined and controlled elongation of the mask 101 in the direction of delivery to the cylinder 124 at a given mask 101 speed. , or Stretch. The speed of the mask 101 is further governed by the speed of the precision drive roller 118 which is also closely synchronized with the speed of the cylinder 124 . As discussed above with respect to substrate 100, the choice of speed is a matter of design choice based on whether a predetermined elongation and the correct deposition thickness can be achieved.
正如调节辊104一样,当张力通过调节辊114的执行机构施加于该掩模101时,调节辊114利用旋转传感器提供反馈到展开卷筒112。张力载荷传感装置116提供力读出,其能够用于修整通过调节辊114的执行机构施加的力。控制系统根据来自张力测力传感器116的读出和圆筒124的速度施加逻辑控制,以使驱动辊118的速度稍稍改变,从而根据希望控制基底的伸长。As with the regulating roller 104, the regulating roller 114 provides feedback to the unwinding drum 112 using a rotation sensor when tension is applied to the mask 101 by the actuator of the regulating roller 114. The tension load sensing device 116 provides a force readout that can be used to trim the force applied by the actuator of the adjustment roller 114 . The control system applies logic control based on the readout from the tension load cell 116 and the speed of the cylinder 124 to vary the speed of the drive roller 118 slightly to control the elongation of the substrate as desired.
这个具体的实施例包括设置在圆筒124里面的沉积源126。因此,需要使掩模101直接与圆筒124接触,而基底100直接与掩模101接触、并且被掩模101与圆筒124分开。该圆筒124具有构造在滚筒上的大孔130,以几乎没有限制地向掩模供应材料流量,并且所述大孔围绕着圆筒圆周间隔开,以使从沉积源126放出的沉积材料128能够通过圆筒124并且到达掩模101。于是掩模中的孔使该沉积材料128能够到达基底100,因而在基底100上形成图样。This particular embodiment includes a deposition source 126 disposed within a cylinder 124 . Therefore, it is necessary to bring the mask 101 in direct contact with the cylinder 124 , while the substrate 100 directly contacts the mask 101 and is separated from the cylinder 124 by the mask 101 . The cylinder 124 has large holes 130 configured on the cylinder to supply a virtually unlimited flow of material to the mask and spaced around the circumference of the cylinder to allow deposition material 128 emitted from the deposition source 126 Can pass through cylinder 124 and reach mask 101 . The holes in the mask then allow this deposited material 128 to reach the substrate 100 and thus form a pattern on the substrate 100 .
根据希望的沉积类型和沉积材料类型,沉积源126可以是各种类型沉积源之一。例如,沉积源126可以是用于以沉积金属或导电金属氧化材料为目的的溅射阴极或磁控管溅射阴极。作为另一个例子,沉积源126可以是用于以沉积金属或导电金属氧化材料为目的的蒸发源。Deposition source 126 may be one of various types of deposition sources, depending on the type of deposition desired and the type of deposition material. For example, deposition source 126 may be a sputter cathode or a magnetron sputter cathode for the purpose of depositing metal or conductive metal oxide material. As another example, deposition source 126 may be an evaporation source for the purpose of depositing metal or conductive metal oxide material.
圆筒124、沉积源126、掩模101和基底100的布局可以是这样的,使得掩模101和基底100在圆筒的底部通过,而沉积源126向下放出沉积材料。但是,可以理解,该掩模101和基底100可以用另一种方法设置,以便在该沉积源126向上放出沉积材料时,经过该圆筒124的顶部。这种选择方案特别适于使用蒸发源的情况。The arrangement of cylinder 124, deposition source 126, mask 101 and substrate 100 may be such that mask 101 and substrate 100 pass at the bottom of the cylinder while deposition source 126 discharges deposition material downward. However, it will be appreciated that the mask 101 and substrate 100 may alternatively be positioned so that the deposition source 126 passes over the top of the cylinder 124 as it discharges deposition material upward. This option is particularly suitable when an evaporation source is used.
基底100和掩模101也可以是各种类型材料中的一种。例子包括诸如聚酯(PET和PEN两者)、聚酰亚胺、聚碳酸酯、或聚苯乙烯之类的聚合物材料,诸如不锈钢、其他钢、铝、铜之类的金属箔材料,或者纸或纺织的或无纺的纤维材料,上述所有的材料具有或不具有涂覆的表面。但是,利用诸如聚合物材料的具有高弹性的材料用于基底和掩模,考虑到精确控制伸长和精确对准,正如在下面参考图4所讨论的,使得特征尺寸能够做成非常小。在聚合物掩模中的孔的最小尺寸可以在微米的量级上,在从100微米下至10微米的范围。因此,沉积在基底上的相应的特征可以具有也在微米的量级上的最小的尺寸,也在从100微米下至10微米的范围。因此,例如,考虑到高分辨率、小的覆盖区导电径迹,电路图的密度可以做成很高,通过这种连续的沉积工艺以高生产率生成。应当理解,如果径迹的长宽比很大,由于要在影响聚合物掩模中的孔的尺寸稳定性之前、在开口的长度上限制掩模孔的长宽比,因此可能有必要使该卷材通过两个或更多个沉积操作台以沉积该径迹,该沉积操作台具有经过偏移阴影掩模的两个或更多个连续的沉积。与这个实施例相关的、关于制造聚合物孔掩模的另外的细节进一步在美国专利No.6,879,164(Baude等人)中被描述。The substrate 100 and the mask 101 may also be one of various types of materials. Examples include polymer materials such as polyester (both PET and PEN), polyimide, polycarbonate, or polystyrene, metal foil materials such as stainless steel, other steel, aluminum, copper, or Paper or woven or nonwoven fibrous materials, all of which may or may not have a coated surface. However, the use of highly elastic materials such as polymeric materials for the substrate and mask allows for precise control of elongation and precise alignment, as discussed below with reference to Figure 4, enabling feature sizes to be made very small. The minimum size of the pores in the polymer mask can be on the order of microns, ranging from 100 microns down to 10 microns. Accordingly, corresponding features deposited on the substrate may have the smallest dimensions also on the order of microns, also ranging from 100 microns down to 10 microns. Thus, for example, the density of circuit patterns can be made very high, allowing for high resolution, small footprint conductive traces, produced with high throughput by this sequential deposition process. It should be understood that if the aspect ratio of the track is large, it may be necessary to make the aspect ratio of the mask hole limited over the length of the opening before affecting the dimensional stability of the hole in the polymer mask. The web is passed through two or more deposition stations having two or more successive depositions through the offset shadow mask to deposit the track. Additional details related to this embodiment regarding the fabrication of polymer aperture masks are further described in US Patent No. 6,879,164 (Baude et al.).
图2示出和图1同类的实施例,除了掩模不是辊对辊布局而是代之以连续循环回路之外。在这里,基底200从卷筒202展开,通过调节辊204,经过载荷传感装置206并且被驱动辊208拉动。基底200在圆筒224的圆周部分上通过并且拉过接收辊210,并且然后行进到下一个沉积阶段或重新卷绕在重卷卷筒上。因此,基底200的伸长和速度如图1中那样被控制。此外,如在图1发生的一样,沉积源226放出材料228穿过圆筒224的孔240,并且该材料到达掩模201并且穿过该掩模201上的孔到达基底200。Figure 2 shows the same embodiment as Figure 1, except that instead of a roll-to-roll arrangement the mask is in a continuous loop. Here,
但是,掩模201是从作为卷材引导装置232的辊的张力载荷传感装置234上通过的连续循环回路,并且当它通过传感器238时被驱动辊218拉动。掩模201在圆筒224的圆周部分上通过,并且从接收辊220上被拉离。该掩模201然后到达作为张紧装置223的辊的另一个接收辊222,并且把掩模201引送到随后的接收辊230,该接收辊230接着把掩模201引送回到卷材引导装置232的的辊236。在这种布局中,掩模201的伸长和速度连续地通过,调节由张紧装置223的执行机构施加的力、和驱动辊218的速度,根据来自张力载荷传感装置234的读出,而被控制,并且掩模201的横向校正也被卷材引导装置232控制,其中这种卷材引导装置在下面结合图4更详细地讨论。但是,掩模201连续循环以便再使用。最终,由于沉积材料228堆集在掩模上,掩模201必需更换。However, the
除了连续循环的掩模201之外,图2示出和图1相同的布局,可以理解,如图2所示连续循环的掩模201同样可以应用于下面在图3至图6中所讨论的其他布局。Figure 2 shows the same layout as in Figure 1 except for the continuously looping
图3示出和图1同类的实施例,除了沉积源326设置在圆筒324的外面之外。在这里,基底300从卷筒302展开,通过调节辊304,经过载荷传感装置306并且被驱动辊308拉动。基底300在圆筒324的圆周部分上通过并且被进一步引向接收辊310,并且然后行进到下一个沉积阶段或重新卷绕在重卷卷筒上。因此,基底300的伸长和速度如在图1中一样被控制。此外,如在图1发生的一样,掩模301从卷筒312展开,通过调节辊314,并经过载荷传感装置316,并且被驱动辊318拉动。掩模301在圆筒324的圆周部分上通过,并且进一步引导经过另一个接收辊320,并且然后重新卷绕在重卷卷筒322上。因此,掩模301的伸长和速度也如图1中一样被控制。FIG. 3 shows the same embodiment as FIG. 1 , except that the
但是,该沉积源326设置在圆筒324的外面,使得沉积材料328在到达掩模301和基底300之前不需要穿过圆筒324。因此,圆筒324不必包括孔。此外,基底300直接与圆筒324接触,而掩模301直接与基底300接触,而基底300设置在掩模301和圆筒324之间。However, the
虽然除了沉积源326设置在圆筒324外面之外,图3示出与图1相同的布局,但是应当理解,如图3所示的该沉积源326的外部位置同样可以应用于包括图2、以及图4至图6的其他结构。Although FIG. 3 shows the same layout as FIG. 1 except that the
除了基底400已经具有在其上已沉积的或以其它方式已形成的图样元件之外,图4示出和图1类似的实施例。由于图样元件已经就位,如下面讨论的精确对准可以保持在基底400和掩模401之间,并且在这个阶段可以沉积电路图的特征而不需要同时沉积相同材料的基准。FIG. 4 shows an embodiment similar to FIG. 1 , except that the substrate 400 already has pattern elements deposited or otherwise formed thereon. Since the pattern elements are already in place, precise alignment as discussed below can be maintained between the substrate 400 and the mask 401, and the features of the circuit pattern can be deposited at this stage without fiducials of the same material being deposited simultaneously.
该图样元件可以以各种方式之一预先形成在基底上,这些方式也可以用于将这些图样沉积在掩模上,如在图1至图6的这些例子的任何中的那样。图样元件如何预先形成在基底和掩模上的例子包括溅射、汽相沉积、激光烧蚀、激光标刻、化学铣刻、化学蚀刻、压纹、刻痕以及打印。The pattern elements can be pre-formed on the substrate in one of various ways that can also be used to deposit the patterns on the mask, as in any of the examples of FIGS. 1-6 . Examples of how pattern elements are pre-formed on substrates and masks include sputtering, vapor deposition, laser ablation, laser marking, chemical milling, chemical etching, embossing, scoring, and printing.
在图4的实施例中,基底400从卷筒402展开,通过调节辊404并经过载荷传感装置406并且被驱动辊408拉动。该基底400在圆筒424的圆周部分上经过、并且进一步被引向接收辊410、并且然后行进到下一个沉积阶段或者重新卷绕在重卷卷筒上。因此,基底400的伸长和速度如图1中一样被控制。此外,正如图1中发生的一样,掩模401从卷筒412展开,通过调节辊414、经过载荷传感装置416并且被驱动辊418拉动。该掩模401在圆筒424的圆周部分上经过并且进一步引导到接收辊420上,并且然后重新卷绕在重卷卷筒422上。因此,掩模401的伸长和速度也如图1中一样被控制。In the embodiment of FIG. 4 , a substrate 400 is unwound from a mandrel 402 , passed by a regulating roller 404 and past a load sensing device 406 and pulled by a drive roller 408 . The substrate 400 passes over the circumferential portion of the cylinder 424 and is further directed towards the take-
但是,还有根据感测基底400和掩模401两者的基准的附加的控制,以沿着到圆筒424的递送方向、在最小特征尺寸(小于100微米,小于50微米,或甚至小于25微米)的1/2容差内,保持基底400和掩模401的正确的对准。传感器438感测在基底400上的基准,而传感448感测在掩模401上的基准。基底400和掩模401之间的相对速度可以分别经由驱动辊408和418调节,以补偿基底400朝前或滞后于掩模401。However, there is additional control based on the benchmarks of both the sensing substrate 400 and the mask 401 to follow the direction of delivery to the cylinder 424 at the smallest feature size (less than 100 microns, less than 50 microns, or even less than 25 microns). The correct alignment of the substrate 400 and the mask 401 is maintained within a tolerance of 1/2 of the micron). Sensor 438 senses fiducials on substrate 400 , while sensor 448 senses fiducials on mask 401 . The relative speed between substrate 400 and mask 401 can be adjusted via drive rollers 408 and 418, respectively, to compensate for substrate 400 being forward or lagging behind mask 401 .
而且,在用于基底400的载荷传感装置406和驱动辊408之间,精确卷材引导装置430接收基底400并且根据感测所述基准以确定横向位置的传感器438来控制基底的横向位置。移动的卷材具有在辊上横向移动的趋势,但是在大多数情况下,在圆筒424处的横向位置必需保持在最小特征尺寸(小于100微米,小于50微米,或甚至小于25微米)的1/2精确容差内,因此卷材引导装置430调节基底400的横向位置。该卷材引导装置430包括第一辊432、框架434和第二辊436。该框架434在第一辊432边缘的枢转点处,可以如所示的那样、转动地进出纸面,以便引导基底400并改变其在驱动辊408上的横向位置,并且因此改变其在圆筒424上的横向位置。更多的关于适合于这种目的的精确卷材引导装置的细节可以在美国专利申请公开NO.2005/0109811(Swanson等人)中找到。Also, between the load sensing device 406 for the substrate 400 and the drive rollers 408, a precision web guide 430 receives the substrate 400 and controls the lateral position of the substrate based on a sensor 438 which senses the reference to determine the lateral position. A moving web has a tendency to move laterally on the rollers, but in most cases the lateral position at the cylinder 424 must be maintained within the minimum feature size (less than 100 microns, less than 50 microns, or even less than 25 microns). The web guide 430 adjusts the lateral position of the substrate 400 to within a 1/2 exact tolerance. The web guiding device 430 includes a first roller 432 , a frame 434 and a second roller 436 . The frame 434, at a pivot point at the edge of the first roller 432, can be pivoted in and out of the page as shown to guide the substrate 400 and change its lateral position on the drive roller 408, and thus change its position in a circle. Lateral position on barrel 424 . More details on precision web guides suitable for this purpose can be found in US Patent Application Publication No. 2005/0109811 (Swanson et al.).
类似地,对于掩模401,在载荷传感装置416和驱动辊418之间,精确卷材引导装置440接收掩模401,并且根据感测所述基准以确定横向位置的传感器448来控制该掩模401的横向位置。掩模401在圆筒424上的横向位置也必需在精确的容差内,因此卷材引导装置440调节掩模401的横向位置。卷材引导装置440包括第一辊442、框架444和第二辊446。该框架444可以在第一辊442边缘的枢转点处,如所示的那样,转动地进出纸面,以便引导掩模401并改变其在驱动辊418上的横向位置,并且因此改变其在圆筒424上的横向位置。Similarly, for mask 401, between load sensing device 416 and drive roller 418, precision web guide device 440 receives mask 401 and controls the mask in accordance with sensor 448 that senses the reference to determine lateral position. The lateral position of the mold 401. The lateral position of the mask 401 on the cylinder 424 must also be within precise tolerances, so the web guide 440 adjusts the lateral position of the mask 401 . The web guide 440 includes a first roller 442 , a frame 444 and a second roller 446 . The frame 444 can be pivoted in and out of the page, as shown, at a pivot point at the edge of the first roller 442 to guide the mask 401 and change its lateral position on the drive roller 418, and thus change its position on the drive roller 418. Lateral position on cylinder 424 .
横向位置控制系统可以与伸长控制系统一起使用、或者独立于伸长控制系统地使用。类似地,伸长控制系统可以与横向位置控制系统一起使用,或者独立于横向位置控制系统地使用。The lateral position control system may be used with the elongation control system, or independently of the elongation control system. Similarly, the elongation control system may be used with the lateral position control system, or independently of the lateral position control system.
如图1所示,在圆筒424内的沉积源426放出沉积材料428,穿过圆筒424上的孔450以到达在圆筒424的圆周部分上的掩模401和基底400。虽然图4与图1在用作为初始沉积阶段的布局上有关系,但是应当理解,图4的布局也可以用作这种情况的随后的阶段,即基底400不直接从前面的沉积阶段向前行进,而是代之以从前面的阶段被重新卷绕、并且然后从展开卷筒402引向随后的阶段。As shown in FIG. 1 , deposition source 426 within cylinder 424 discharges deposition material 428 through aperture 450 in cylinder 424 to reach mask 401 and substrate 400 on a peripheral portion of cylinder 424 . Although FIG. 4 is related to FIG. 1 in the layout used as an initial deposition stage, it should be understood that the layout of FIG. 4 can also be used as a subsequent stage in cases where the substrate 400 does not proceed directly from a preceding deposition stage. Instead, it is rewound from the previous stage and then led from the unwinding reel 402 to the subsequent stage.
图5示出与图3实施例相似的实施例,除了基底500具有图样元件、或利用基准沉积工艺540的基准之外。该基准沉积工艺540在基底500已经与圆筒524的圆周接触的点处、但在掩模501到达该圆筒的点之前,将基准施加到基底500。由于图样元件已经在圆筒524上就位,在基底500和掩模501之间可以保持精确对准,并且在这个阶段可以沉积电路图特征而不需要同时沉积相同材料的基准。如何通过基准沉积工艺540将图样元件预先形成在基底上的例子包括溅射、汽相沉积、激光烧蚀、激光标刻、化学铣刻、化学蚀刻、压纹、刻痕以及打印。FIG. 5 shows an embodiment similar to that of FIG. 3 , except that the
在图5的实施例中,基底500从卷筒502展开,通过调节辊504并经过载荷传感装置506并且被驱动辊508拉动。基底500在包括基准工艺540所瞄准的部分的圆筒524的圆周部分上通过,并进一步引导到接收辊510上,然后行进到下一个沉积阶段,或重新卷绕在重卷卷筒上。因此,基底500的伸长和速度如图3中一样被控制。此外正如在图3中所发生的一样,掩模501从卷筒512展开,通过调节辊514,并经过载荷传感装置516,并且被驱动辊518拉动。掩模501在圆筒524的圆周部分上通过,并且进一步引导经过接收辊520,并且然后重新卷绕在重卷卷筒上522上。因此,掩模501的伸长和速度也如图3中一样被控制。In the embodiment of FIG. 5 , a
但是,还有根据利用传感器538感测掩模501的基准的、伸长和速度的附加的控制,以沿着到具有基准图样形成工艺540的圆筒524的递送方向、将掩模501保持在正确的对准中。掩模501的相对速度可以经由驱动辊518进行调节,以补偿掩模501朝前或滞后于该基准图样形成工艺540However, there is additional control based on sensing the fiducial, elongation and velocity of the
而且,在载荷传感装置516和驱动辊518之间,精确卷材引导装置530根据感测掩模501上的基准以确定横向位置的传感器538,将掩模501的横向位置控制在精确容差内。该卷材引导装置530包括第一辊532、框架534和第二辊536。该框架534在第一辊532边缘的枢转点处,可以如所示那样,转动地进出纸面,以便引导该掩模501并改变其在驱动辊518上的横向位置,并且因此改变其在圆筒524上的横向位置。Furthermore, between the
如图3所示,设置在圆筒524外面的沉积源526放出沉积材料528以到达在该圆筒524的圆周部分上的该掩模501和基底500。As shown in FIG. 3 , a
图6示出与图4的实施例相似的实施例,除了与从展开卷筒递送相反、基底600直接从前面的阶段被递送之外。如图4所示,由于基准图样元件已经就位,在该基底600和掩模601之间能够保持精确对准,并且在这个阶段能够沉积电路特征而不需要同时沉积相同材料的基准。Figure 6 shows an embodiment similar to that of Figure 4, except that the substrate 600 is delivered directly from a previous stage as opposed to being delivered from an unrolled roll. As shown in FIG. 4 , since the fiducial pattern elements are already in place, precise alignment can be maintained between the substrate 600 and mask 601 , and circuit features can be deposited at this stage without the simultaneous deposition of fiducials of the same material.
在图6的实施例中,基底600从前面的阶段直接接收在张力载荷传感装置602上并且被驱动辊608拉动。该基底600通过圆筒624的圆周部分,并且被进一步引导经过接收辊610、并且然后行进到下一个沉积阶段或重新卷绕在重卷卷筒上。没有用于这个阶段的基底600的调节辊,所以基底600的伸长和速度通过在载荷传感装置602处感测基底600的张力、并稍稍改变驱动辊608和圆筒624的速度来控制。而且对基底600的伸长的微小调节能够通过调节该驱动辊608和圆筒624之间的相对速度来进行。此外,正如在图4中所发生的,掩模601从卷筒612展开,通过调节辊614,并经过载荷传感装置616,并且被驱动辊618拉动。该掩模601在圆筒624的圆周部分上通过,并且进一步引导经过接收辊620,并且然后重新卷绕在重卷卷筒上622上。因此,掩模601的伸长和速度也如图4中一样被控制。In the embodiment of FIG. 6 , the substrate 600 is received directly on the tension load sensing device 602 from the previous stage and pulled by the drive roller 608 . The substrate 600 passes the circumferential portion of the cylinder 624 and is further directed past the take-up roll 610 and then proceeds to the next deposition stage or is rewound on a rewind roll. There are no regulating rollers for substrate 600 at this stage, so the elongation and speed of substrate 600 is controlled by sensing the tension of substrate 600 at load sensing device 602 and varying the speed of drive roller 608 and cylinder 624 slightly. Also minor adjustments to the elongation of the substrate 600 can be made by adjusting the relative speed between the drive roller 608 and the cylinder 624 . In addition, as occurs in FIG. 4 , mask 601 is unwound from roll 612 , passed over adjustment roller 614 , past load sensing device 616 , and pulled by drive roller 618 . The mask 601 passes over a circumferential portion of a cylinder 624 and is guided further past a take-up roll 620 and is then rewound on a rewind mandrel 622 . Therefore, the elongation and speed of the mask 601 are also controlled as in FIG. 4 .
还有根据感测基底600和掩模601两者的基准的伸长和速度的附加的控制,以沿着到圆筒624的递送方向、将基底600和掩模601保持在正确的对准中。传感器638感测基底600上的基准,而传感器648感测在掩模601上的基准。基底600和掩模601之间的相对速度可以经由驱动辊608和618分别进行调节,以补偿基底600超前或滞后于掩模601。There is additional control based on sensing the elongation and velocity of both the fiducials of the substrate 600 and mask 601 to maintain the substrate 600 and mask 601 in the correct alignment along the direction of delivery to the cylinder 624 . Sensor 638 senses fiducials on substrate 600 , while sensor 648 senses fiducials on mask 601 . The relative speed between substrate 600 and mask 601 can be adjusted via drive rollers 608 and 618 respectively to compensate for substrate 600 leading or lagging mask 601 .
而且,在用于基底600的载荷传感装置602和驱动辊608之间,精确卷材引导装置630接收基底600并根据感测基准以确定横向位置的传感器638控制该基底的横向位置。该卷材引导装置630包括第一辊632、框架634和第二辊636。该框架634在第一辊632边缘的枢转点处,可以如所示的那样,转动地进出纸面,以便引导该基底600并改变其在驱动辊608上的横向位置,并且因此改变其在圆筒624上的横向位置。Also, between the load sensing device 602 for the substrate 600 and the drive rollers 608, a precision web guide 630 receives the substrate 600 and controls the lateral position of the substrate based on a sensor 638 that senses a reference to determine the lateral position. The web guiding device 630 includes a first roller 632 , a frame 634 and a second roller 636 . The frame 634, at a pivot point at the edge of the first roller 632, can be pivoted in and out of the page as shown to guide the substrate 600 and change its lateral position on the drive roller 608, and thus change its position on the drive roller 608. Lateral position on cylinder 624 .
类似地,对于掩模601,在载荷传感装置616和驱动辊618之间,精确卷材引导装置640接收掩模601并且根据感测基准以确定横向位置的传感器648控制该掩模601的横向位置。卷材引导装置640包括第一辊642、框架644和第二辊646。该框架644可以在第一辊642边缘的枢转点处,如所示的那样,转动地进出纸面,以便引导该掩模601并改变其在驱动辊618上的横向位置,并且因此改变其在圆筒624上的横向位置。Similarly, for the mask 601, between the load sensing device 616 and the drive roller 618, the precision web guide 640 receives the mask 601 and controls the lateral direction of the mask 601 based on a sensor 648 which senses a reference to determine the lateral position. Location. The web guide 640 includes a first roller 642 , a frame 644 and a second roller 646 . The frame 644 can be rotated in and out of the page at a pivot point at the edge of the first roller 642, as shown, to guide the mask 601 and change its lateral position on the drive roller 618, and thus change its Lateral position on cylinder 624 .
如在图4中一样,在圆筒624内的沉积源626放出沉积材料628,穿过圆筒624上的孔650以到达在该圆筒624的圆周部分上的掩模601和基底600。As in FIG. 4 , deposition source 626 within cylinder 624 emits deposition material 628 through aperture 650 in cylinder 624 to reach mask 601 and substrate 600 on a circumferential portion of the cylinder 624 .
图7示出说明性的旋转马达位置和速度控制系统700,其中系统700之一可以用于控制位置、速度和施加在每个驱动辊和圆筒上的转矩。该控制系统700接收位置指令701作为输入,并且该指令源自运动控制领域的技术人员能够理解的轨迹发生器。这个指令被提供给位置前馈运算702,其然后输出位置前馈信号给前馈增益控制运算712。FIG. 7 shows illustrative rotary motor position and
位置指令701与基于载荷位置反馈信号703的另一个信号相加,该反馈信号703被提供给低通滤波器运算704。载荷位置反馈信号703根据直接安装在驱动辊或圆筒上的高精度旋转传感器接收。低通滤波器运算704提供输出给观察器706,所述观察器706使用其他内部信号以生成输出,该输出被施加给反馈滤波运算708、以提供信号,该信号与位置指令701负相加。这个信号然后输送给位置控制器710,该位置控制器710输出与两个附加信号相加的信号。The
在前馈增益控制运算712处的前馈增益信号输出,与与电机位置前馈反馈信号一起的位置控制器710的输出信号相加,所述电机位置前馈反馈信号由位置前馈微分运算714输出、并且通过低通滤波器715,并且所述电机位置前馈反馈信号基于接收的电机位置反馈信号705。这个信号705从安装在驱动驱动辊或圆筒的电机的电枢上的高精度旋转传感器处被接收。这个和的输出然后提供给低通滤波器720,然后它的输出提供给速度控制器722。The feedforward gain signal output at the feedforward
在前馈增益运算712处的前馈增益信号输出然后提供给速度前馈运算716,其提供输出给前馈增益运算718,以产生第二前馈增益信号。这个第二前馈增益信号提供给电流前馈运算724,其将输出提供给前馈增益运算726。此外,该第二前馈增益信号与速度控制器722的输出相加并且形成指示卷材的速度前馈信号707,其来自轨迹发生器。该轨迹发生器生成用于每个辊子的控制系统的位置基准,包括以合适的单位表示的位置和速度。将速度前馈信号707和速度控制器722的输出相加的结果通过陷波和其他滤波器728,并且与被前馈增益运算726输出的前馈增益信号相加,并且与实际电机电流测量值709相加,以向电流控制器730提供输入。然后,该电流控制器730向驱动驱动辊或圆筒的电机输出电流。The feedforward gain signal output at
图8示出说明性的引导电机位置和速度控制系统800,其中该系统800之一可以用于控制基底的横向位置,而该系统800的第二个其中之一可以用于控制掩模的横向位置。控制系统800接收位置指令801作为输入,并且这个指令源自检测表示卷材横向位置的基准的感测系统。这个指令提供给位置前馈运算802,其然后向前馈增益控制运算810输出位置前馈信号。FIG. 8 shows illustrative guide motor position and
该位置指令801还与提供给低通滤波运算804的、基于载荷位置反馈信号803的另一个信号相加。该载荷位置反馈信号803根据直接安装于卷材引导框架上的高精度线性传感器接收。该前馈运算804提供输出给观察器806,该观察器利用其他内部信号生成输出,该输出被施加于反馈滤波运算808以提供与位置指令801负相加的信号。然后,这个信号被馈送给位置控制器812,其输出与在下面讨论的两个附加信号相加的信号。This
在前馈增益控制运算810处的前馈增益信号输出,与与电机位置前馈反馈信号一起的位置控制器输出信号812相加,该电机位置前馈反馈信号由位置前馈微分运算809输出、并且通过低通滤波器811,并且该电机位置前馈反馈信号基于接收的电机位置反馈信号805。这个信号805根据直接安装于驱动该卷材引导框架的电机的电枢上的高精度旋转传感器接收。然后这个和的输出被提供给低通滤波器818,它的输出然后提供给速度控制器820。The feedforward gain signal output at the feedforward
在前馈增益控制运算810处的前馈增益信号输出然后被提供给速度前馈运算814,其提供输出给前馈增益运算816以产生第二前馈增益信号。该第二前馈增益信号提供给电流前馈运算822,该电流前馈运算822提供输出给前馈增益运算824。此外,第二前馈增益信号与速度控制器820的输出相加。结果通过陷波和其它滤波器826,并且与被前馈增益运算824输出的前馈增益信号和实际电机电流测量值807相加,以向电流控制器828提供输入。然后,该电流控制器828向移动卷材引导框架的电机输出电流。The feedforward gain signal output at the feedforward
图9示出说明性的卷材基准对准控制系统900,该系统在基准已经存在于两种卷材之上的沉积阶段(例如如图6所示)中,保持掩模基准与基底基准之间的正确对准。该控制系统900接收卷材位置指令901作为输入,并且这个指令源自轨迹发生器。这个指令被提供给位置前馈运算902,其然后输出位置前馈信号给前馈增益控制运算908。FIG. 9 shows an illustrative web fiducial
位置指令901与基于卷材位置反馈信号903的另一个信号相加,该卷材位置反馈信号903根据纵向卷材位置接收。这个信号能够表示基底或掩模的位置,或它们之间的差。该卷材位置反馈信号903提供给增强由传感器产生的位置信号的观察器904,并且它的输出施加于反馈滤波运算905以提供与位置指令901相加的信号。从这个相加得到的信号然后被馈送给位置控制器910,其输出与另外两另外信号相加的信号,这两个另外的信号在下一段说明。The
在前馈增益控制运算908处的前馈增益信号输出,与与卷材前馈开环位置补偿信号912一起的、位置控制器910输出的信号相加,所述位置补偿信号912来自轨迹发生器。该和的输出是引导位置指令,其然后提供给图7所示的卷材位置控制器。电机位置和速度从电机916获得,并且相应的反馈信号918被提供给电机位置和速度控制器914。该电机位置和速度控制器914包括具有线速度控制的传感器位置偏移补偿。The feedforward gain signal output at the feedforward
图10示出示出一个说明性实施例的一部分,其中考虑到100微米或更小的所希望的特征尺寸,和小于100微米、小于50微米或者甚至小于25微米的对准容差,在掩模和基底之间保持基准对准。基底1000通过递送辊1002,然后通过具有安装在框架1044上的辊子1042和1046的卷材引导装置1040。然后基底通过检测卷材纵向/横向位置的传感器1048。当基底经过圆筒1024的圆周部分上时,驱动辊1018对该基底1000的伸长和速度进行最后校正,然后出口棍子1020引导基底1000到下一个目的地。FIG. 10 shows a portion of an illustrative embodiment in which, considering a desired feature size of 100 microns or less, and an alignment tolerance of less than 100 microns, less than 50 microns, or even less than 25 microns, the Maintain fiducial alignment with the substrate.
掩模1001进入具有安装在框架1034上的辊子1032和1036的卷材引导装置1030。该掩模1001通过检测纵向/横向卷材位置的传感器1038,并且当掩模1001在圆筒1024的圆周部分上经过时,驱动辊1008对掩模1001的伸长和速度进行最终校正,同时出口辊1010引导掩模1001离开该圆筒1024。Mask 1001 enters
在运行期间,基底传感器1048和掩模传感器1038输出卷材位置反馈信号给应力控制器1052。该应力控制器接着生成输出信号给虚拟张力观察器1054。虚拟张力观察器是一种控制系统技术,其中一种变量的值根据其他变量的已知值确定。观察器通过减少变量的测量滞后、提高其精度,或提供很难或不可能直接测量的变量的值来提高控制系统的性能。然后虚拟张力观察器1054根据提供给应力控制器1052的位置反馈和用于基底及掩模的材料参数来计算卷材的张力,并且对上游控制器生成正确的张力设置点,以及可以加给任何驱动辊的附加的修正位置指令偏移。虚拟张力观察器能够实时估算变化的参数。这个实施例的虚拟张力观察器的其他细节可以在公用的美国专利申请公开2005/0137738A1中找到。然后虚拟张力观察器1054为驱动辊1008的电机提供驱动信号。During operation,
图11示出由应力控制器1052与虚拟张力观察器1054一起使用的控制回路。基底的位置在位置运算1102处从传感器输出读出,而掩模的位置在位置运算1112处从传感器输出读出。基底的目标无拉伸长度在计算运算1104处被计算,而掩模目标无拉伸长度在计算运算1114处被计算。基底的目标时间在计算运算1106处为基底进行计算,而掩模的目标时间在计算运算1116处被计算。目标时间,新的ε1值在计算运算1108处被计算,其中这个值代表在卷材中的所希望的应力。根据新的ε1,在计算运算1110处计算需要的时间TSP,其中这个值表示为了建立应力级所需要的张力。FIG. 11 shows the control loop used by the
图12示出可以定位在基底和掩模上的、用于控制卷材横向和纵向位置并保持两个卷材之间的正确的对准的目的的基准标记或图样元件的例子。正如上面所讨论的,这些基准标记可以预先形成图样,或可以在沉积工艺的第一阶段期间添加到卷材上。Figure 12 shows examples of fiducial marks or pattern elements that can be positioned on the substrate and mask for the purpose of controlling web transverse and longitudinal position and maintaining proper alignment between the two webs. As discussed above, these fiducial marks can be pre-patterned, or can be added to the web during the first stage of the deposition process.
正如这个例子所示,横向或交叉卷材基准可以是将被定位在基底或掩模1200上的、到沉积图样为固定距离的直线1202。卷材1200的边缘1201可以不被定位在与该交叉卷材基准线或卷材1200上的任何沉积图样有精确的关系处。从横向地感测直线1202的地点,能够确定该卷材1200是否处于正确的地点、或为了将卷材在横向上对准是否需要卷材引导调节。As shown in this example, the transverse or cross-web fiducial may be a
正如这个例子还显示的,纵向或机器方向基准可以是沿着机器方向相互间隔开固定距离的一系列标记1204。从在该系列中感测标记1204的位置,能够确定该卷材1200在给定的时间点上,是否位于相对于该卷材1200上的沉积图样正确的纵向位置。As this example also shows, the machine direction or machine direction reference may be a series of
图13示出用于卷材的感测系统的说明性的实施例。在这个实施例中,信号传感器被用于横向和纵向两个方向上。卷材1302具有纵向基准标记1304和横向基准标记1306。当卷材1302在辊子1308和辊子1310之间通过时,传感器1312感测该纵向基准标记1304和横向基准标记1306两者。传感器1312可以是线扫描或面积摄像机。Figure 13 shows an illustrative embodiment of a sensing system for a web. In this embodiment, signal sensors are used in both landscape and portrait orientations.
传感器1312输出被引向实时图像数据采集处理1314。除了接收传感器输出之外,这个实施例的实时图像数据采集处理1314还从被感测的卷材的纵向控制系统接收位置参考1311,这同步基准标记图像的位置的获取。该实时图像数据采集处理将数字图像的输出引向数字图像处理系统1316。该数字图像处理系统1316分析该图像以确定该横向或纵向标记距其期望的地点有多远。纵向或机器方向的位置误差1318被输出到被感测的卷材的纵向控制系统,而横向或交叉卷材方向的位置误差1320被输出给卷材引导控制系统。The
图14示出卷材感测系统的另一个说明性的实施例。在这个实施例中,一个传感器用于横向,而另一个传感器用于纵向。卷材1402具有纵向基准标记1404和横向基准标记1406。当卷材1402在辊子1408和辊子1410之间通过时,一个传感器1412感测纵向基准标记1404,而另一个传感器1414感测横向基准标记1406。用于纵向感测的传感器1412可以是标准发光二极管(LED)/具有有快速响应时间的光检测电路的光电二极管。用于横向感测的传感器1414可以是摄像机,例如具有内置式高速处理的Keyence LS-7500系列CCD摄像机。Figure 14 shows another illustrative embodiment of a web sensing system. In this embodiment, one sensor is used for landscape and the other sensor is used for portrait.
来自传感器1412的输出提供给光检测电路1416,其中基准可以被观察,并且其中可以确定该纵向基准标记的实际地点距离期望的地点有多远。纵向或机器方向的位置误差1418输出给被感测的卷材的纵向控制系统。The output from
来自传感器1414的输出被提供给摄像机的图像处理1420,其中可以确定该横向基准标记的实际地点距期望的地点有多远。横向或交叉卷材方向位置误差被输出给卷材引导控制系统。The output from the
另一方面,提供一种利用上述设备的连续沉积材料的方法。该方法包括:从基底递送辊连续递送基底,同时在第一基底接收辊上连续地接收基底,其中,当基底在基底递送辊和第一基底接收辊之间递送时,该基底在第一圆筒的圆周部分上通过。该方法还包括:在连续递送和接收该基底的同时,从第一掩模递送辊连续地递送第一掩模,同时在第一掩模接收辊上连续地接收该第一掩模,其中,当掩模在第一掩模递送辊和第一掩模接收辊之间递送时,该第一掩模在第一圆筒的圆周部分上通过,并且其中该掩模具有形成第一图样的多个孔,并且所述孔的至少一部分具有100微米或更小的最小尺寸。此外,该方法包括:在连续递送和接收基底及第一掩模的同时,朝着经过该第一圆筒的圆周部分上的第一掩模部分连续地引导来自第一沉积源的第一沉积材料,使得第一材料的第一图样沉积在基底上。In another aspect, there is provided a method of continuously depositing material using the apparatus described above. The method includes continuously delivering a substrate from a substrate delivery roll while continuously receiving a substrate on a first substrate receiving roll, wherein the substrate is positioned within a first circle as it is delivered between the substrate delivery roll and the first substrate receiving roll. through the circumference of the barrel. The method further includes continuously delivering a first mask from a first mask delivery roll while continuously delivering and receiving the substrate while continuously receiving the first mask on a first mask receiving roll, wherein, When the mask is delivered between the first mask delivery roller and the first mask receiving roller, the first mask passes on the circumferential portion of the first cylinder, and wherein the mask has multiple layers forming the first pattern pores, and at least a portion of the pores have a minimum dimension of 100 microns or less. In addition, the method includes continuously directing the first deposition from the first deposition source toward the first mask portion passing on the circumferential portion of the first cylinder while continuously delivering and receiving the substrate and the first mask. material such that a first pattern of the first material is deposited on the substrate.
该方法还可以包括:从第一基底接收辊连续地递送基底,同时连续地将该基底接收在第二接收辊上,其中该基底在该第一基底接收辊和第二基底接收辊之间时,从第二圆筒的圆周部分上通过。该方法还包括:从第二掩模递送辊连续地递送第二掩模,同时在第二掩模接收辊上连续地接收该第二掩模,其中该第二掩模在该第二掩模递送辊和第二掩模接收辊之间,从第二圆筒的圆周部分上通过,并且其中该第二掩模具有形成第二图样的多个孔。此外,该方法还包括在连续递送和接收该基底及该第二掩模的同时,朝着在第二圆筒的圆周部分上通过的第二掩模连续地引导来自第二沉积源的第二沉积材料,使得第二沉积材料的第二图样沉积在该基底上。The method may also include continuously delivering the substrate from a first substrate receiving roll while continuously receiving the substrate on a second substrate receiving roll, wherein the substrate is between the first substrate receiving roll and the second substrate receiving roll , passing over the circumferential portion of the second cylinder. The method also includes continuously delivering a second mask from a second mask delivery roll while continuously receiving the second mask on a second mask receiving roll, wherein the second mask is on the second mask The delivery roller and the second mask receiving roller pass over the peripheral portion of the second cylinder, and wherein the second mask has a plurality of holes forming a second pattern. In addition, the method further includes continuously directing the second mask from the second deposition source toward the second mask passing over the circumferential portion of the second cylinder while continuously delivering and receiving the substrate and the second mask. A material is deposited such that a second pattern of a second deposited material is deposited on the substrate.
虽然已经参考本发明的各种实施例实践性地示出并描述了本发明,但是本领域的技术人员应当理解,在不脱离本发明的精神实质和范围的情况下,在形式和细节上可以进行各种其它变化。While the invention has been shown and described practically with reference to various embodiments thereof, it will be understood by those skilled in the art that changes may be made in form and detail without departing from the spirit and scope of the invention. Make various other changes.
Claims (10)
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| US11/179,418 | 2005-07-12 | ||
| PCT/US2006/027063 WO2007008992A2 (en) | 2005-07-12 | 2006-07-11 | Apparatus and methods for continuously depositing a pattern of material onto a substrate |
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| US20080171422A1 (en) * | 2007-01-11 | 2008-07-17 | Tokie Jeffrey H | Apparatus and methods for fabrication of thin film electronic devices and circuits |
| JP5467531B2 (en) * | 2008-06-26 | 2014-04-09 | 株式会社ニコン | Display element manufacturing method and manufacturing apparatus |
| US8339573B2 (en) | 2009-05-27 | 2012-12-25 | 3M Innovative Properties Company | Method and apparatus for photoimaging a substrate |
| US20110065282A1 (en) * | 2009-09-11 | 2011-03-17 | General Electric Company | Apparatus and methods to form a patterned coating on an oled substrate |
| KR101201755B1 (en) * | 2010-11-02 | 2012-11-15 | 삼성에스디아이 주식회사 | Vaccum evaporator and vaccum evaporating method using the same |
| JP5736857B2 (en) * | 2011-03-09 | 2015-06-17 | 凸版印刷株式会社 | Deposition equipment |
| JP5733507B2 (en) * | 2011-03-17 | 2015-06-10 | 凸版印刷株式会社 | Deposition method |
| JP5937876B2 (en) * | 2012-04-18 | 2016-06-22 | 名古屋メッキ工業株式会社 | Plated fiber manufacturing apparatus and method |
| CN103668047A (en) * | 2012-09-03 | 2014-03-26 | 香港纺织及成衣研发中心有限公司 | Vacuum coating pattern generation device and method |
| EP3184140B1 (en) * | 2015-12-21 | 2021-10-06 | Dentsply IH AB | Catheters with bevelled drainage holes as well as method and device for forming such holes |
| CN112226730A (en) * | 2020-09-30 | 2021-01-15 | 广州国显科技有限公司 | Flexible mask and evaporation device |
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| US5395643A (en) * | 1991-09-18 | 1995-03-07 | International Business Machines Corporation | Method of and apparatus for depositing solder on a printed circuit board |
| WO2001035703A1 (en) * | 1999-11-08 | 2001-05-17 | Speedline Technologies, Inc. | Improvements in solder printers |
| US20050109811A1 (en) * | 2003-11-21 | 2005-05-26 | Swanson Ronald P. | Method and apparatus for controlling a moving web |
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| US5395643A (en) * | 1991-09-18 | 1995-03-07 | International Business Machines Corporation | Method of and apparatus for depositing solder on a printed circuit board |
| WO2001035703A1 (en) * | 1999-11-08 | 2001-05-17 | Speedline Technologies, Inc. | Improvements in solder printers |
| US20050109811A1 (en) * | 2003-11-21 | 2005-05-26 | Swanson Ronald P. | Method and apparatus for controlling a moving web |
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