CN101334591A - Leveling and focusing mechanism with large stroke adjustment function - Google Patents
Leveling and focusing mechanism with large stroke adjustment function Download PDFInfo
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Abstract
一种具有大行程调节功能的调平调焦机构,包含小行程调平调焦机构和设置在该小行程调平调焦机构下部的大行程调节机构,Z向大行程由独立的楔形块机构实现,Z向微量调节由楔形块机构驱动,簧片导向来实现。本发明提供的一种具有大行程调节功能的调平调焦机构,可以实现Z向大行程调节和Z向微量调节,提高了动态性能和调节精度,适应不同的应用场合和不同的硅片厚度规格。
A leveling and focusing mechanism with a large stroke adjustment function, including a small stroke leveling and focusing mechanism and a large stroke adjusting mechanism arranged at the lower part of the small stroke leveling and focusing mechanism, the large stroke in the Z direction is controlled by an independent wedge block mechanism Realize, the micro-adjustment in Z direction is driven by the wedge block mechanism and realized by the reed guide. A leveling and focusing mechanism with a large stroke adjustment function provided by the present invention can realize Z-direction large-stroke adjustment and Z-direction micro-adjustment, improve dynamic performance and adjustment accuracy, and adapt to different application occasions and different thicknesses of silicon wafers Specification.
Description
技术领域 technical field
本发明涉及一种具有大行程调节功能的调平调焦机构,尤其涉及一种具有大行程调节功能的硅片台调平调焦机构。The invention relates to a leveling and focusing mechanism with a large stroke adjustment function, in particular to a silicon wafer stage leveling and focusing mechanism with a large stroke adjustment function.
背景技术 Background technique
整场调焦调平一般是在硅片表面3个或3个以上不同位置处进行离焦量测量,来计算并校正整个硅片表面的离焦量和倾斜量,实质就是在坐标系中调节θx,θy和Z向三个自由度,(其中θx是绕X轴的转动,θy是绕Y轴的转动),达到硅片调焦调平的目的。Focusing and leveling of the whole field is generally carried out by measuring the defocus amount at 3 or more different positions on the surface of the silicon wafer to calculate and correct the defocus amount and tilt of the entire silicon wafer surface. The essence is to adjust in the coordinate system θx, θy and Z-axis three degrees of freedom (where θx is the rotation around the X-axis, θy is the rotation around the Y-axis), to achieve the purpose of focusing and leveling the silicon wafer.
专利US005204712A公开了一个3自由度的微动台。该台的基本原理是通过三组凸轮机构,分布在三个点上,三个驱动点通过一个柔性机构连接到承片台上,并用簧片导向,共同驱动承片台,从而实现调平和调焦功能。该台的3个自由度调节量不大,尤其是Z向自由度不能实现大行程调节。Patent US005204712A discloses a micro-motion table with 3 degrees of freedom. The basic principle of the table is that it is distributed on three points through three sets of cam mechanisms, and the three driving points are connected to the film support table through a flexible mechanism, and are guided by reeds to drive the film support table together to achieve leveling and adjustment. focus function. The 3 degrees of freedom adjustment of this table is not large, especially the Z-direction degree of freedom cannot realize large stroke adjustment.
中国专利CN2580470公开了一种三自由度超精密定位平台。该台体内部呈等边三角形固定有三组各自独立的压电陶瓷预紧机构。该台结构紧凑,精度较高,但是调节范围小,压电陶瓷易发热,也不易进行恒温控制。Chinese patent CN2580470 discloses a three-degree-of-freedom ultra-precise positioning platform. Three groups of independent piezoelectric ceramic preloading mechanisms are fixed inside the table body in the form of an equilateral triangle. The table has a compact structure and high precision, but the adjustment range is small, and the piezoelectric ceramics are easy to generate heat, and it is not easy to carry out constant temperature control.
发明内容 Contents of the invention
本发明提供的一种具有大行程调节功能的调平调焦机构,可以实现Z向大行程调节和Z向微量调节,提高了动态性能和调节精度,适应不同的应用场合和不同的硅片厚度规格。A leveling and focusing mechanism with a large stroke adjustment function provided by the present invention can realize Z-direction large-stroke adjustment and Z-direction micro-adjustment, improve dynamic performance and adjustment accuracy, and adapt to different application occasions and different thicknesses of silicon wafers Specification.
为了达到上述目的,本发明提供了一种具有大行程调节功能的调平调焦机构,包含:In order to achieve the above purpose, the present invention provides a leveling and focusing mechanism with a large stroke adjustment function, including:
小行程调平调焦机构和设置在该小行程调平调焦机构下部的大行程调节机构;A small-stroke leveling and focusing mechanism and a large-stroke adjusting mechanism arranged at the lower part of the small-stroke leveling and focusing mechanism;
所述的小行程调平调焦机构包含:The small-stroke leveling and focusing mechanism includes:
调平调焦底板;Leveling the focusing bottom plate;
中心设置在调平调焦底板上的簧片,该簧片具有若干自由端;A reed centrally arranged on the leveling and focusing base plate, the reed has several free ends;
上平板;upper plate;
连接所述簧片自由端和上平板的若干小行程楔形机构;Several small-stroke wedge-shaped mechanisms connecting the free ends of the reeds and the upper plate;
连接所述小行程楔形机构的若干小行程驱动机构;Several small-stroke drive mechanisms connected to the small-stroke wedge mechanism;
所述的小行程楔形机构包含:The small-stroke wedge mechanism includes:
连接所述簧片的三角板,该三角板通过一个柔性连接块连接所述的上平板;connecting the triangular plate of the reed, the triangular plate is connected to the upper plate through a flexible connecting block;
设置在所述三角板下部的调平调焦滚子;A leveling and focusing roller arranged at the lower part of the triangular plate;
固定在所述调平调焦底板上的导轨;Guide rails fixed on the leveling and focusing bottom plate;
设置在所述导轨上的楔形块,该楔形块的上表面具有坡度,该楔形块可以沿导轨滑动;A wedge-shaped block arranged on the guide rail, the upper surface of the wedge-shaped block has a slope, and the wedge-shaped block can slide along the guide rail;
所述的小行程驱动机构包含:The small-stroke driving mechanism includes:
连接所述楔形块的转接板;an adapter plate connected to the wedge;
设置在所述转接板另一侧上的螺杆,该螺杆通过螺母带动转接板产生水平位移;A screw provided on the other side of the adapter plate, the screw drives the adapter plate to generate horizontal displacement through the nut;
连接所述螺杆的驱动电机;a drive motor connected to the screw;
连接所述转接板和驱动电机的若干消隙拉簧,消除螺杆的回程间隙,提高定位精度;A number of anti-backlash tension springs connecting the adapter plate and the drive motor eliminate the backlash of the screw and improve positioning accuracy;
所述的小行程调平调焦机构还包含若干与小行程楔形机构对应设置的测量反馈模块;以及连接所述测量反馈模块和驱动电机的控制驱动模块;The small-stroke leveling and focusing mechanism also includes several measurement feedback modules corresponding to the small-stroke wedge mechanism; and a control drive module connecting the measurement feedback modules and the drive motor;
所述的小行程调平调焦机构还包含若干连接所述调平调焦底板和簧片的弹簧;The small-stroke leveling and focusing mechanism also includes several springs connecting the leveling and focusing bottom plate and the reed;
所述的大行程调节机构包含:The large stroke adjustment mechanism includes:
底板;floor;
设置在底板上的若干圆弧导轨;Several arc guide rails set on the bottom plate;
设置在所述圆弧导轨上的楔形块驱动板,该驱动板具有若干自由端,该自由端可以沿所述的圆弧导轨滑动;a wedge drive plate arranged on the arc guide rail, the drive plate has several free ends, and the free ends can slide along the arc guide rail;
设置在所述楔形驱动板自由端上的若干大行程楔形机构;Several large stroke wedge mechanisms arranged on the free end of the wedge drive plate;
连接所述楔形驱动板的大行程驱动机构;a large-stroke driving mechanism connected to the wedge-shaped driving plate;
设置在所述底板上的若干调平调焦底板导向机构,该导向机构限制了调平调焦底板只能在Z向运动;A plurality of leveling and focusing base plate guide mechanisms arranged on the base plate, which limit the leveling and focusing base plate to move only in the Z direction;
所述的大行程楔形机构包含:The described large-stroke wedge mechanism includes:
设置在所述调平调焦底板下侧面的滚子;Rollers arranged on the lower side of the leveling and focusing bottom plate;
设置在所述楔形驱动板自由端上的大行程楔形块;a large stroke wedge block arranged on the free end of the wedge drive plate;
还包含连接所述大行程楔形块的楔形块调节机构,在装配时,可以通过该楔形块调节机构调节大行程楔形块的初装位置,从而调节调平调焦台的装配平行度;It also includes a wedge adjustment mechanism connected to the large-stroke wedge. During assembly, the initial installation position of the large-stroke wedge can be adjusted through the wedge adjustment mechanism, thereby adjusting the assembly parallelism of the leveling and focusing platform;
所述的大行程驱动机构包含:The described large-stroke driving mechanism includes:
连接所述楔形驱动板的转接件;an adapter for connecting the wedge drive plate;
设置在所述转接件上的螺杆,该螺杆通过螺母带动转接件产生位移;a screw provided on the adapter, the screw drives the adapter to generate displacement through the nut;
连接所述螺杆的大行程驱动电机;A large-stroke drive motor connected to the screw;
连接所述转接板和大行程驱动电机的若干消隙拉簧,消除螺杆的回程间隙,提高定位精度;Several anti-backlash tension springs connecting the adapter plate and the large-stroke drive motor eliminate the backlash of the screw and improve positioning accuracy;
所述的调平调焦底板导向机构包含:The leveling and focusing bottom plate guide mechanism includes:
设置在所述底板上的垂直导轨,通过导轨安装块安装在底板上;The vertical guide rail arranged on the base plate is installed on the base plate through the guide rail mounting block;
设置在所述垂直导轨上的滑块转接件,该滑块转接件的上端连接所述的调平调焦底板的下部,可以沿垂直导轨滑动;A slider adapter set on the vertical guide rail, the upper end of the slider adapter is connected to the lower part of the leveling and focusing base plate, and can slide along the vertical guide rail;
连接所述底板和调平调焦底板的若干拉簧,使调平调焦底板紧紧的和大行程楔形机构结合在一起;A number of tension springs connecting the base plate and the leveling and focusing base plate, so that the leveling and focusing base plate is tightly combined with the large stroke wedge mechanism;
所述的大行程调节机构还包含连接所述大行程楔形机构和大行程驱动机构的控制模块。The large-stroke adjusting mechanism also includes a control module connecting the large-stroke wedge mechanism and the large-stroke driving mechanism.
本发明的工作原理如下:The working principle of the present invention is as follows:
Z向大行程调节:控制模块控制电机转动,带动螺杆转动,经过螺母和转接件,把螺杆的转动转换成楔形驱动板沿圆弧导轨的转动,从而使大行程楔形块做直线运动,滚子在大行程楔形块的推动下,带动调平调焦底板做Z向直线运动,实现硅片厚度补偿;Large stroke adjustment in the Z direction: the control module controls the rotation of the motor to drive the screw to rotate. Through the nut and the adapter, the rotation of the screw is converted into the rotation of the wedge-shaped drive plate along the arc guide rail, so that the large-stroke wedge moves in a straight line. Driven by the wedge-shaped block with large stroke, it drives the leveling and focusing bottom plate to move linearly in the Z direction to realize silicon wafer thickness compensation;
Z向小行程调节:根据测量反馈模块反馈的数据,控制驱动模块驱动电机把转动传递给螺杆,经过螺母和转接板,最后把电机的转动转换成楔形块的直线运动,在楔形块的推动下,调平调焦滚子带动三角板沿着Z向作直线运动,从而带动上平板实现垂直方向的三自由度运动补偿。Small stroke adjustment in the Z direction: According to the data fed back by the measurement feedback module, the drive module is controlled to drive the motor to transmit the rotation to the screw, through the nut and the adapter plate, and finally convert the rotation of the motor into the linear motion of the wedge, which is driven by the wedge Down, the leveling and focusing roller drives the triangular plate to move linearly along the Z direction, thereby driving the upper plate to realize three-degree-of-freedom motion compensation in the vertical direction.
本发明提供的一种具有大行程调节功能的调平调焦机构,实现Z向大行程调节和Z向微量调节,提高了动态性能和调节精度,Z向大行程调节的定位精度可以达到微米级,运动轨迹线性好,控制逻辑简单,Z向小行程调节的定位精度能达到数十纳米,适应不同的应用场合和不同的硅片厚度规格。A leveling and focusing mechanism with a large stroke adjustment function provided by the present invention realizes Z-direction large-stroke adjustment and Z-direction micro-adjustment, improves dynamic performance and adjustment accuracy, and the positioning accuracy of Z-direction large-stroke adjustment can reach micron level , the motion track is linear, the control logic is simple, and the positioning accuracy of Z-direction small stroke adjustment can reach tens of nanometers, which is suitable for different applications and different thickness specifications of silicon wafers.
附图说明 Description of drawings
图1是本发明提供的具有大行程调节功能的调平调焦机构的结构示意图;Fig. 1 is a structural schematic diagram of a leveling and focusing mechanism with a large stroke adjustment function provided by the present invention;
图2是本发明提供的具有大行程调节功能的调平调焦机构的小行程调平调焦机构的结构示意图;Fig. 2 is a structural schematic diagram of a small stroke leveling and focusing mechanism of a leveling and focusing mechanism with a large stroke adjustment function provided by the present invention;
图3是图2中小行程调平调焦机构的俯视图;Fig. 3 is a top view of the small stroke leveling and focusing mechanism in Fig. 2;
图4是本发明提供的具有大行程调节功能的调平调焦机构的小行程楔形机构和小行程驱动机构的结构示意图;Fig. 4 is a structural schematic diagram of a small-stroke wedge mechanism and a small-stroke driving mechanism of a leveling and focusing mechanism with a large stroke adjustment function provided by the present invention;
图5是图4中小行程楔形机构和小行程驱动机构的俯视图;Fig. 5 is the top view of small-stroke wedge mechanism and small-stroke driving mechanism in Fig. 4;
图6是本发明提供的具有大行程调节功能的调平调焦机构的大行程调节机构的结构示意图;Fig. 6 is a structural schematic diagram of a large-stroke adjustment mechanism of a leveling and focusing mechanism with a large-stroke adjustment function provided by the present invention;
图7是图6中大行程调节机构的立体图。Fig. 7 is a perspective view of the large stroke adjustment mechanism in Fig. 6 .
具体实施方式 Detailed ways
以下根据图1~图7,具体说明本发明的较佳实施方式:Below according to Fig. 1~Fig. 7, the preferred embodiment of the present invention is described in detail:
如图1所示,本发明提供了一种具有大行程调节功能的调平调焦机构,包含:As shown in Figure 1, the present invention provides a leveling and focusing mechanism with a large stroke adjustment function, including:
小行程调平调焦机构和设置在该小行程调平调焦机构下部的大行程调节机构;A small-stroke leveling and focusing mechanism and a large-stroke adjusting mechanism arranged at the lower part of the small-stroke leveling and focusing mechanism;
如图2和图3所示,所述的小行程调平调焦机构包含:As shown in Figures 2 and 3, the small stroke leveling and focusing mechanism includes:
调平调焦底板7;Leveling and focusing
中心设置在调平调焦底板7上的簧片2,该簧片2具有若干自由端;The center is arranged on the
上平板1;
连接所述簧片2自由端和上平板1的若干小行程楔形机构;Several small-stroke wedge-shaped mechanisms connecting the free ends of the
连接所述小行程楔形机构的若干小行程驱动机构;Several small-stroke drive mechanisms connected to the small-stroke wedge mechanism;
如图4和图5所示,所述的小行程楔形机构包含:As shown in Figure 4 and Figure 5, the described small stroke wedge mechanism includes:
连接所述簧片2的三角板3,该三角板3通过一个柔性连接块14连接所述的上平板1;The
设置在所述三角板3下部的调平调焦滚子4;The leveling and focusing
固定在所述调平调焦底板7上的导轨6;The
设置在所述导轨6上的楔形块5,该楔形块5的上表面具有坡度,该楔形块可以沿导轨6滑动;The
如图4和图5所示,所述的小行程驱动机构包含:As shown in Figure 4 and Figure 5, the described small stroke drive mechanism includes:
连接所述楔形块5的转接板10;connecting the
设置在所述转接板10另一侧上的螺杆9,该螺杆9通过螺母12带动转接板10产生水平位移;The
连接所述螺杆9的驱动电机8;Connect the driving
连接所述转接板10和驱动电机8的若干消隙拉簧11,消除螺杆9的回程间隙,提高定位精度;Several anti-backlash extension springs 11 connecting the
所述的小行程调平调焦机构还包含若干与小行程楔形机构对应设置的测量反馈模块;以及连接所述测量反馈模块和驱动电机的控制驱动模块;The small-stroke leveling and focusing mechanism also includes several measurement feedback modules corresponding to the small-stroke wedge mechanism; and a control drive module connecting the measurement feedback modules and the drive motor;
所述的小行程调平调焦机构还包含若干连接所述调平调焦底板7和簧片2的弹簧15;The small-stroke leveling and focusing mechanism also includes
如图6和图7所示,所述的大行程调节机构包含:As shown in Figures 6 and 7, the large stroke adjustment mechanism includes:
底板106;
设置在底板106上的若干圆弧导轨113;Several
设置在所述圆弧导轨113上的楔形块驱动板107,该驱动板107具有若干自由端,该自由端可以沿所述的圆弧导轨113滑动;The wedge
设置在所述楔形驱动板107自由端上的若干大行程楔形机构;Several large stroke wedge mechanisms arranged on the free end of the
连接所述楔形驱动板的大行程驱动机构;a large-stroke driving mechanism connected to the wedge-shaped driving plate;
设置在所述底板106上的若干调平调焦底板导向机构,该导向机构限制了调平调焦底板7只能在Z向运动;A number of leveling and focusing base plate guide mechanisms arranged on the
所述的大行程楔形机构包含:The described large-stroke wedge mechanism includes:
设置在所述调平调焦底板7下侧面的滚子100;The
设置在所述楔形驱动板107自由端上的大行程楔形块101;The large
还包含连接所述大行程楔形块101的楔形块调节机构102,在装配时,可以通过该楔形块调节机构102调节大行程楔形块101的初装位置,从而调节调平调焦台的装配平行度;It also includes a
所述的大行程驱动机构包含:The described large-stroke driving mechanism includes:
连接所述楔形驱动板107的转接件111;connecting the
设置在所述转接件111上的螺杆112,该螺杆112通过螺母110带动转接件111产生位移;The
连接所述螺杆112的大行程驱动电机108;A large
连接所述转接件111和大行程驱动电机108的若干消隙拉簧109,消除螺杆的回程间隙,提高定位精度;A plurality of anti-backlash extension springs 109 connecting the
所述的调平调焦底板导向机构包含:The leveling and focusing bottom plate guide mechanism includes:
设置在所述底板106上的垂直导轨104,通过导轨安装块105安装在底板106上;The
设置在所述垂直导轨104上的滑块转接件103,该滑块转接件103的上端连接所述的调平调焦底板7的下部,可以沿垂直导轨104滑动;The
连接所述底板106和调平调焦底板7的若干拉簧114,使调平调焦底板7紧紧的和大行程楔形机构结合在一起;A plurality of tension springs 114 connecting the
所述的大行程调节机构还包含连接所述大行程楔形机构和大行程驱动机构的控制模块。The large-stroke adjusting mechanism also includes a control module connecting the large-stroke wedge mechanism and the large-stroke driving mechanism.
本实施例中,进行Z向大行程调节,分别设置三套大行程楔形机构和调平调焦底板导向机构,大行程运动由旋转编码器测量控制,首先控制电机108转动,带动螺杆112转动,经过螺母110和转接件111,把螺杆112的转动转换成楔形驱动板107沿圆弧导轨113的转动,从而使大行程楔形块101做直线运动,滚子100在大行程楔形块101的推动下,带动调平调焦底板7做Z向直线运动,实现硅片厚度补偿。In this embodiment, Z-direction large-stroke adjustment is performed, and three sets of large-stroke wedge-shaped mechanisms and leveling and focusing base plate guiding mechanisms are respectively provided. The large-stroke movement is measured and controlled by a rotary encoder. First, the rotation of the
进行Z向小行程调节时,三套相同的小行程楔形机构和小行程驱动机构实现调平调焦的三自由度控制,小行程楔形机构分别位于图3中的A1、A2和A3处,三点决定一个平面,根据位于16a,16b,16c处的三个位移传感器(或者电涡流传感器等)反馈的数据,控制驱动模块驱动电机8把转动传递给螺杆9,经过螺母12和转接板10,最后把电机的转动转换成楔形块5的直线运动,在楔形块5的推动下,调平调焦滚子4带动三角板3沿着Z向作直线运动,从而带动上平板1实现垂直方向的三自由度运动补偿。When adjusting the Z-direction small stroke, three sets of the same small-stroke wedge mechanism and small-stroke driving mechanism realize the three-degree-of-freedom control of leveling and focusing. The small-stroke wedge mechanism is respectively located at A1, A2 and A3 in Figure 3. The point determines a plane. According to the data fed back by the three displacement sensors (or eddy current sensors, etc.) located at 16a, 16b, and 16c, the drive module is controlled to drive the
本发明提供的一种具有大行程调节功能的调平调焦机构,实现Z向大行程调节和Z向微量调节,提高了动态性能和调节精度,Z向大行程调节的定位精度可以达到微米级,运动轨迹线性好,控制逻辑简单,Z向小行程调节的定位精度能达到数十纳米,适应不同的应用场合和不同的硅片厚度规格。A leveling and focusing mechanism with a large stroke adjustment function provided by the present invention realizes Z-direction large-stroke adjustment and Z-direction micro-adjustment, improves dynamic performance and adjustment accuracy, and the positioning accuracy of Z-direction large-stroke adjustment can reach micron level , the motion track is linear, the control logic is simple, and the positioning accuracy of Z-direction small stroke adjustment can reach tens of nanometers, which is suitable for different applications and different thickness specifications of silicon wafers.
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| CN108680093A (en) * | 2018-06-20 | 2018-10-19 | 中国科学院西安光学精密机械研究所 | Focusing distance measuring device and method in optical focusing mechanism |
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| CN114509923B (en) * | 2022-01-28 | 2023-11-24 | 复旦大学 | Focusing and leveling device in deep ultraviolet objective lens design and application thereof |
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