CN101442012B - Small window mould sealing cutting method and formed packaging structure - Google Patents

Abstract

The invention relates to a small window die sealing cutting method and a formed packaging structure. The plurality of wafers are arranged on the substrate strip, and a plurality of electric connection elements are formed in the small windows. And finally, forming a sealing colloid on the window molding sealing areas and in the small windows of the substrate strip so as to seal the electric connecting elements and further extend to the cutting channels. And cutting the part of the sealing colloid at the window molding areas during monomer separation. Therefore, the problem of glue overflow at the periphery of the small windows can be effectively reduced, and the circuit of the substrate unit and the solder mask layer can be prevented from being stripped by increasing the combination area of the sealing glue body to the substrate strip.

Description

Small window molding and cutting method and the resulting package structure

technical field

The invention relates to a singulation cutting technology in the manufacturing technology of a window-type semiconductor packaging structure, in particular to a small window molding and cutting method and the formed packaging structure.

Background technique

Window BGA packaging structure (Window BGA) or fine-pitch ball grid array (FBGA) packaging structure has become the mainstream of semiconductor chip packaging products in recent years. It is carried by a circuit substrate with a window. chip, and a plurality of metal bonding wires pass through the window to electrically connect the circuit substrate and the chip. Provide protection for semiconductor chips and bonding wires with an encapulant. However, a partial molding area surrounding the window must be formed on the lower surface of the substrate. If not handled properly, the problem of molding flash may easily occur. However, in the conventional window-type BGA package structure, the window set on the substrate is only a single and narrow central slot, and there is still a gap between the molding area and the external pads, and the mold flash can still be controlled. However, in the new generation of window-type semiconductor package structures, multiple small windows will be provided on the sides and corners of the substrate to increase the electrical density and meet the needs of fine pitch terminals, but this will make the problem of mold flashing easier Occurs, and the distance between the molding area and the external pad is smaller, and the molding flash will affect the quality of the electrical connection.

As shown in FIG. 1 , an existing semiconductor package structure 100 with a small window mainly includes a substrate unit 110 , a chip 120 , a plurality of electrical connection elements 130 and a sealing body 140 . The substrate unit 110 is formed by cutting a substrate strip. The substrate unit 110 has a die-bonding surface 111 , an external surface 112 and a plurality of small windows 113 penetrating the substrate unit 110 . As shown in FIG. 2, the small windows 113 are formed on the sides or corners of the substrate unit 110, and the external surface 112 includes a plurality of window molding areas 114, which surround the small windows 113 but do not extend to the substrate. The corresponding sides and corners of the unit 110 . The substrate unit 110 further has a central slot 115 formed in the central area of the substrate unit 110 , and the outer surface 112 includes a lower molding area 117 surrounding the central slot 115 . In addition, as shown in FIG. 1 , the substrate unit 110 further has a plurality of external connection pads 116 formed on the external surface 112 for disposing a plurality of external terminals 150 , usually solder balls.

As shown in FIG. 1 , by sticking a die-attach adhesive 160 , the chip 120 is disposed on the die-attach surface 111 of the substrate unit 110 and has a plurality of solder pads 121 on the active surface. The existing electrical connection elements 130 formed by wire bonding are formed in the small windows 113 and the central slot 115, and the electrical connection elements 130 pass through the small windows 113 and the central slot 115 to connect The pads 121 of the chip 120 are electrically connected to the substrate unit 110 . The encapsulant 140 is formed on the die-bonding surface 111 and the external surface 112 of the substrate unit 110 to seal the chip 120 and the electrical connection elements 130 . The molding area on the outer surface 112 must be controlled within the window molding areas 114 and the lower molding area 117 as much as possible. Conventionally, due to the large number of these small windows 113, the molding overflow beyond the window molding area 114 is very easy to contaminate the external pads 116, resulting in that the external terminals 150 cannot be smoothly connected to all of the external pads 116. External pad 116 . In addition, it is easy to cause peeling and delamination of the circuit and solder resist layer on the side or corner of the substrate unit during the substrate strip cutting operation, which affects the quality and reliability of the packaged product.

Furthermore, after the die-bonding and wire-bonding operations have been completed in the existing window-type semiconductor packaging process, the lower mold must be designed according to the positions of the central slot 115 and the small windows 113 of the substrate unit 110 during the molding process. And there are corresponding lower mold cavities. Therefore, when the number of small windows of the substrate unit 110 increases, the design of the lower mold will be more complicated, the cost will be higher, and the problem of mold overflow will be more serious.

Contents of the invention

The main purpose of the present invention is to overcome the defects in the prior art, and provide a small window molding and cutting method and the formed packaging structure. The probability of mold overflow in the small window can be reduced, and the peeling and delamination of the circuit and solder mask layer of the substrate unit can be reduced when the substrate strip is cut, thereby improving the quality and reliability of the packaged product. Very practical.

Another object of the present invention is to overcome the defects in the prior art, and provide a new small window molding and cutting method and the formed packaging structure. The technical problem to be solved is to simplify the design of the mold under the die , to reduce the cost of packaging fixtures, so that it is more suitable for practical use.

Another object of the present invention is to overcome the defects in the prior art and provide a method for molding and cutting small windows. The technical problem to be solved is to make it possible to control and change the distance between the area of possible mold overflow and the substrate strip. The dicing line is used to improve the yield rate of the process, so that it is more suitable for practical use.

The purpose of the present invention and the solution to its technical problems are achieved by adopting the following technical solutions. A small window molding and cutting method proposed according to the present invention, which includes: providing a substrate strip, including a plurality of substrate units and a plurality of dicing lines formed between the substrate units, the substrate strip has a die-bonding surface, an external surface and a plurality of small windows through the substrate strip, the small windows are formed on the sides or corners of the substrate units, and the external surface includes a plurality of window molding areas surrounding the small windows And extend to the side or corner of these substrate units, wherein a glue overflow channel is formed on the outer surface of the substrate strip, which is aligned in the cutting line and passes through the above-mentioned window molding area; a plurality of chips are arranged on the substrate On the sticking surface of the strip, the above-mentioned chip is located in the above-mentioned substrate unit and does not cover the above-mentioned dicing line; a plurality of electrical connection elements are formed in the above-mentioned small window to electrically connect the above-mentioned chip to the substrate strip; form a colloid In the above-mentioned window molding area of the substrate strip, to seal the above-mentioned electrical connection element and further extend to the above-mentioned cutting line; and cutting the substrate strip and the part of the sealant in the above-mentioned window molding area along the above-mentioned cutting line, so that The above-mentioned substrate unit is separated.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

In the aforementioned small window molding and cutting method, each window molding area surrounds at least two small windows adjacent to the sides and includes a cutting line between the small windows.

In the aforementioned small window molding and cutting method, each window molding area surrounds at least four small windows adjacent to the corners and includes intersections of cutting lines between the small windows.

In the aforementioned small window molding and cutting method, the small windows in adjacent substrate units and in the same window molding area are connected.

In the aforementioned small window molding and cutting method, wherein the wafer has a plurality of pads aligned in the small window for connection of the electrical connection elements.

In the aforementioned small window molding and cutting method, the area of the chip on the substrate strip is not less than 70% of the bonding surface area of the corresponding substrate unit, so as to form a chip size package structure.

In the aforementioned small window molding and cutting method, wherein the electrical connection element includes a plurality of welding wires.

In the aforementioned small window molding and cutting method, the substrate strip further has a plurality of central slots passing through the substrate strip, which are formed in the central area of the substrate unit.

In the aforementioned small window molding and cutting method, wherein the encapsulant is further formed in the central slot of the substrate strip.

In the aforementioned small window molding and cutting method, the encapsulant is further formed on the die-bonding surface of the substrate strip to seal at least a part of the chip.

In the aforementioned small window molding and cutting method, the substrate strip further has a plurality of external pads formed on the external surface.

The aforementioned small window molding and cutting method includes the steps of: arranging a plurality of external terminals on the above-mentioned external pads.

The purpose of the present invention and the solution to its technical problem also adopt the following technical solutions to achieve. According to the packaging structure formed by a small window molding and cutting method proposed in the present invention, it includes: a substrate unit, which is formed by cutting a substrate strip, and the substrate unit has a die-bonding surface, an external surface, and a plurality of The small window of the substrate unit, the above-mentioned small window is formed on the side or corner of the substrate unit, and the external surface includes a plurality of window molding areas, which surround the above-mentioned small window and extend to the side or corner of the substrate unit Corner; a chip is arranged on the bonding surface, and the chip is located in the substrate unit and does not cover the side or corner of the substrate unit; a plurality of electrical connection elements are formed in the above-mentioned small window to electrically connecting the above-mentioned chip to the substrate unit; and an encapsulation body formed on the above-mentioned window molding area of the substrate unit to seal the above-mentioned electrical connection element, the encapsulation body has a first cutting side protruding from the outer surface, and The edge or corner of the substrate unit is aligned, wherein a glue overflow channel is formed on the outer surface of the substrate strip, which is aligned in the cutting line and passes through the above-mentioned window molding area.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

In the packaging structure formed by the aforementioned small window molding and cutting method, the small window is connected to the side or corner of the substrate unit.

In the packaging structure formed by the aforementioned small window molding and cutting method, the chip has a plurality of pads aligned in the small window for the connection of the electrical connection elements.

The packaging structure formed by the aforementioned small window molding and cutting method, wherein the area where the chip is placed on the substrate unit is not less than 70% of the bonding surface area of the substrate unit, so as to form a chip size packaging structure .

In the packaging structure formed by the aforementioned small window molding and cutting method, the electrical connection elements include a plurality of welding wires.

In the packaging structure formed by the aforementioned small window molding and cutting method, the substrate unit further has a central slot formed in the central area of the substrate unit.

In the packaging structure formed by the aforementioned small window molding and cutting method, the encapsulant is further formed in the central slot of the substrate unit.

In the package structure formed by the aforementioned small window molding and cutting method, the encapsulant is further formed on the die-bonding surface of the substrate unit to seal at least a part of the chip.

In the packaging structure formed by the aforementioned small window molding and cutting method, the encapsulant has a second cutting side connected to the die-bonding surface, which is aligned with the side or corner of the substrate unit.

In the packaging structure formed by the aforementioned small window molding and cutting method, the substrate unit further has a plurality of external pads formed on the external surface.

The packaging structure formed by the aforementioned small window molding and cutting method further includes a plurality of external terminals disposed on the external pads.

Compared with the prior art, the present invention has obvious advantages and beneficial effects. As can be seen from above technical scheme, main technical content of the present invention is as follows:

A method for molding and cutting a small window according to the present invention includes providing a substrate strip comprising a plurality of substrate units and a plurality of dicing lines formed between the substrate units, the substrate strip has a die-bonding surface, a The external surface and a plurality of small windows passing through the substrate strip, the small windows are formed on the sides or corners of the substrate units, and the external surface includes a plurality of window molding areas, which surround the small windows and extend to The cuts. Afterwards, a plurality of wafers are arranged on the die-bonding surface of the substrate strip, and the wafers are located in the substrate units without covering the dicing lines. Then, forming a plurality of electrical connection elements in the small windows to electrically connect the chips to the substrate strip. Then, an encapsulant is formed on the window molding areas of the substrate strip to seal the electrical connection elements extending to the cutting lines. Finally, the substrate strip and the portion of the encapsulant at the window molding regions are cut along the cutting lines to separate the substrate units. Also disclosed is the packaging structure formed according to the aforementioned method.

With the above technical solution, the small window molding and cutting method and the formed packaging structure of the present invention have at least the following advantages and beneficial effects:

1. The present invention can not only reduce the probability of mold glue spillage in the small window located on the side or corner of the substrate unit, but also reduce the peeling and separation of the circuit and solder mask layer of the substrate unit during the substrate strip cutting operation. Layer phenomenon, thereby improving the quality and reliability of packaged products.

2. The present invention can simplify the design of the lower mold of the compression mold and reduce the cost of packaging fixtures.

3. The present invention can control and change the cutting line from the area where the molding glue may overflow to the substrate strip, so as to improve the process yield.

4. The present invention can reduce the exposed area of the cutting side of the substrate, so as to improve the moisture resistance of the side of the semiconductor packaging structure.

To sum up, the present invention discloses a small window molding and cutting method and the formed packaging structure. According to the method, a substrate strip has a plurality of small windows on the sides or corners, and an outer surface of the substrate strip includes a plurality of window molding areas surrounding the small windows and extending to the scribe line. A plurality of chips are arranged on the substrate strip, and a plurality of electrical connection elements are formed in the small windows. Afterwards, an encapsulant is formed on the window molding areas of the substrate strip and in the small windows to seal the electrical connection elements and extend to the cutting lines. When singulating and separating, the part of the sealant at the window molding areas is cut at the same time. Therefore, the problem of glue overflowing around the small windows can be effectively reduced, and the peeling of the circuit and the solder resist layer of the substrate unit can be prevented by increasing the bonding area of the sealant to the substrate strip. The present invention has the above-mentioned many advantages and practical value, and it has great improvement no matter in product structure, method or function, has significant progress in technology, and has produced easy-to-use and practical effects, and is superior to the prior art It has enhanced outstanding efficacy, and thus is more suitable for practical use.

The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following preferred embodiments are specifically cited below, and are described in detail as follows in conjunction with the accompanying drawings.

Description of drawings

Figure 1: A schematic cross-sectional view of a conventional BGA package structure.

Figure 2: Schematic diagram of the external surface of the substrate unit of the conventional ball grid array package structure.

FIG. 3 is a partially enlarged schematic view of the external surface of a substrate strip and one of the substrate units used in a semiconductor package structure according to the first embodiment of the present invention.

4A to 4F : according to the first embodiment of the present invention, the partial cross-sectional views of the substrate bar in the manufacturing method of the semiconductor package structure.

Fig. 5: A schematic diagram of the external surface of the substrate unit after molding according to the first embodiment of the present invention.

FIG. 6 is a schematic cross-sectional view of the semiconductor package structure according to the first embodiment of the present invention.

FIG. 7 is a schematic diagram of an external surface of a substrate unit used in another semiconductor package structure according to the second embodiment of the present invention.

FIG. 8 is a schematic cross-sectional view of the semiconductor package structure according to the second embodiment of the present invention.

20: Substrate strip 21: Cutting lane

30: Substrate Strip 31: Cutting Road

32: Glue overflow channel 40: Cutting tool

100: Semiconductor package structure 110: Substrate unit

111: sticky crystal surface 112: external surface

113: Small window 114: Window molding area

115: central slot 116: outer pad

117: Lower mold sealing area 120: Wafer

121: Welding pad 130: Electrical connection components

140: Sealing body 150: External terminal

160: Crystal adhesive 200: Semiconductor packaging structure

210: substrate unit 211: sticky crystal surface

212: external surface 213: small window

214: Window molding area 215: Central slot

216: External pad 217: Lower mold sealing area

220: Chip 221: Welding pad

230: Electrical connection components 240: Sealant

241: Window molding part 242: First cutting side

243: Second cut side 250: External terminal

260: Crystal adhesive 300: Semiconductor packaging structure

310: substrate unit 311: sticky crystal surface

312: external surface 313: small window

314: Window molding area 315: Central slot

316: External pad 317: Lower mold sealing area

320: Chip 321: Welding pad

330: Electrical connection components 340: Sealant

341: Window molding part 342: First cutting side

343: Second cut side 350: External terminal

Detailed ways

In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation of the small window molding and cutting method and the packaging structure formed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. , structure, method, step, feature and effect thereof, detailed description is as follows.

According to the first embodiment of the present invention, a small window molding and cutting method and the resulting packaging structure are provided.

FIG. 3 is a partially enlarged schematic view of an external surface of a substrate strip used in a semiconductor package structure and a substrate unit. 4A to 4F are partial cross-sectional schematic views of the substrate strip in the manufacturing method of the semiconductor package structure. First, as shown in FIG. 3 and FIG. 4A , the small window molding and cutting method includes providing a substrate strip 20 including a plurality of substrate units 210 and a plurality of cutting lines 21 formed between the substrate units 210 . Usually, the substrate units 210 can be memory cards, ball grid array (BGA) or land array (LGA) chip carriers. The substrate strip 20 has a die-bonding surface 211 , an external surface 212 and a plurality of small windows 213 penetrating through the substrate strip 20 . The small windows 213 are formed on the sides or corners of the substrate units 210, and are connected from the bonding surface 211 to the external surface 212, and the external surface 212 includes a plurality of window molding regions 214, which surround the external surface 212. The small windows 213 extend to the cutting lines 21 .

In addition, the substrate strip 20 may further have a plurality of external pads 216 formed on the external surface 212 for connecting the external terminals 250 (as shown in FIG. 6 ). In this embodiment, the substrate strip 20 may further have a plurality of central slots 215 penetrating through the substrate strip 20 , which are formed in the central regions of the substrate units 210 . And the outer surface 212 includes a plurality of lower molding areas 217 surrounding the central slots 215 . In this embodiment, the lower molding regions 217 of adjacent substrate units 210 may be connected to each other.

Afterwards, as shown in FIG. 4B, a plurality of wafers 220 are arranged on the bonding surface 211 of the substrate strip 20, the wafers 220 are located in the substrate units 210 without covering the dicing lines 21, and have a plurality of The welding pads 221 on the active surface are usually arranged around the active surface of the chip, and can also be arranged at the periphery and the center of the active surface of the chip at the same time. For example, the active surface of the chip 220 can be attached to the substrate strip 20 by using a B-stage (B-stage) printing adhesive layer or a PI (polyimide, polyimide) adhesive tape of the crystal adhesive 260. The die-bonding surface 211 . Wherein, the welding pads 221 are aligned with the small windows 214 and the central slot 215 for subsequent electrical connection. Moreover, preferably, the disposition area of the chips 220 on the substrate bar 20 is no less than 70% of the area of the die-bonding surface 211 of the corresponding substrate unit 210, so as to form a chip size package structure.

After that, as shown in FIG. 4C , a plurality of electrical connection elements 230 are formed in the small windows 213 , and even a part of the electrical connection elements 230 can be formed in the central slots 215 . The electrical connection elements 230 pass through the small windows 213 and the central slots 215 to electrically connect the pads 221 of the chips 220 to the substrate strip 20 . In this example, the electrical connection elements 230 are bonding wires formed by bonding wires.

Afterwards, as shown in FIG. 4D , an encapsulant 240 is formed in the window molding regions 214 of the substrate strip 20 (as shown in FIG. 3 ) to seal the electrical connection elements 230 . In this embodiment, the encapsulant 240 is further formed in the lower molding regions 217 and covers the backsides of the chips 220 to seal the remaining electrical connection elements 230 and the chips 220 . Therefore, as shown in FIG. 5 , the encapsulant 240 further extends through the cutting lines 21 . As shown in FIG. 3 , at the side of the substrate unit 210 , each window molding area 214 can surround at least two small windows 213 adjacent to the sides and include a cut between the small windows 213 Road 21 site. At the corner position of the substrate unit 210 , each window molding area 214 can surround at least four small windows 213 adjacent to the corner and include the intersection of the cutting lines 21 between the small windows 213 . In this embodiment, the sealing body 240 is an epoxy molding compound (Epoxy Molding Compound, EMC), by clamping the substrate strip 20 with the upper and lower molds during compression molding, the preheated resin is extruded into the mold, After the resin is filled and hardened, the sealing body 240 can be formed, and then the mold is opened to take out the finished product.

As shown in FIG. 4E , in the above-mentioned small window molding and cutting method, an additional step may be included: disposing a plurality of external terminals 250 on the external pads 216 . The external terminals 250 may include a plurality of metal balls, solder paste, contact pads or contact pins, and the like. In this implementation, the external terminals 250 are solder balls, so as to form a small window type ball grid array package, and make the chips 220 mounted on the substrate strip 20 to be electrically connected to the external terminals 250 , for surface bonding to an external printed circuit board (printed circuit board, PCB).

Finally, as shown in FIG. 4F , the substrate strip 20 is cut along the cutting lines 21 with a cutting tool 40 to singulate and separate a plurality of semiconductor package structures 200 (as shown in FIG. 6 ). In addition to cutting the substrate strip 20 , the sealing body 240 passes through the cutting lines 21 in the window molding regions 214 during the cutting process. During the substrate strip cutting operation, that is, the process of separating the substrate units 210, the sealant 240 can function as a cutting protection gasket at the parts of the window molding areas 214 that pass through the cutting lines 21 , can reduce the peeling and delamination of the circuits and solder resist layers of the substrate units 210, thereby improving the quality and reliability of the packaged products. In addition, the encapsulation body 240 further includes a cutting line 21 in the area where the encapsulation may overflow on the outer surface 212, which can reduce the area and risk of the encapsulation encapsulation in the substrate units 210, and greatly reduce the pollution caused by the encapsulation encapsulation. These external pads 216 are possible.

In addition, the present invention discloses a packaging structure formed by the above small window molding and cutting method. As shown in FIG. 6 , the package structure 200 mainly includes a substrate unit 210 , a chip 220 , a plurality of electrical connection elements 230 and an encapsulant 240 . The substrate unit 210 is formed by cutting the strip 20 (as shown in FIG. 3 ), and the substrate unit 210 has a plurality of small windows 213 passing through the die-bonding surface 211 to the external surface 212 . The small windows 213 are formed on the sides or corners of the substrate unit 210 . In this embodiment, the small windows 213 are adjacent to but not connected to the side or corner of the substrate unit 210 . And as shown in FIG. 3 , the outer surface 212 includes a plurality of window molding areas 214 , which surround the small windows 213 and extend to the sides or corners of the substrate unit 210 . The chip 220 is disposed on the die-bonding surface 211 . The electrical connection elements 230 are formed in the small windows 213 to electrically connect the chip 220 and the substrate unit 210 .

In addition, the sealant 240 is formed on the window molding regions 214 of the substrate unit 210 to seal the electrical connection elements 230. The sealant 240 has a first cutting side 242 connected to the external surface 212, which When the substrate unit 210 is singulated and separated, it is formed at the same time, and is cut at the side or corner of the substrate unit 210. The first cutting side 242 has a protective thickness protruding from the outer surface 212, so that the substrate unit 210 lines and solder resist will not peel off and delaminate. In addition, the encapsulant 240 has a second cutting side 243 connected to the die-bonding surface 211 , which is aligned with the side or corner of the substrate unit 210 . Therefore, the molding compound 240 has a plurality of window molding portions 241 formed in the window molding regions 214 and having the first cutting side 242 .

Therefore, the present invention discloses a small window molding and cutting method and its structure. The window molding parts 241 of the sealing body 240 extend and cover the cutting lines 21 on the outer surface 212 of the substrate strip 20, solving the problem of The small windows 213 on the sides or corners of the substrate units 210 are prone to glue overflow. In addition, when performing the singulation operation of the substrate strip 20, the first cutting side 242 protruding from the outer surface 212 is provided by the window molding parts 241, so as to protect the circuit and the solder resist layer of the substrate unit 210 from The phenomenon of peeling and delamination can improve the bonding strength of the sides or corners of the substrate units 210 and maintain the strength of the substrate structure, so as to improve the quality and reliability of packaged products.

In the second specific embodiment of the present invention, another packaging structure formed by a small window molding and cutting method is disclosed. Please refer to FIG. 7 and FIG. 8 . FIG. 7 is a schematic diagram of an external surface of a substrate unit of another semiconductor package structure. 8 is a schematic cross-sectional view of a semiconductor package structure. The semiconductor package structure 300 mainly includes a substrate unit 310 , a chip 320 , a plurality of electrical connection elements 330 and an encapsulant 340 . The substrate unit 310 has a die-bonding surface 311 , an external surface 312 and a plurality of small windows 313 penetrating through the substrate unit 310 . The substrate unit 310 is formed by cutting a substrate strip 30 (as shown in FIG. 7 ), and a cutting line 31 is provided between the outer surfaces 312 of adjacent substrate units 310 . The chip 320 is disposed on the die-bonding surface 311′. The electrical connection elements 330 are formed in the small windows 313 to electrically connect the chips 320 to the substrate unit 310 .

As shown in FIG. 7, the small windows 313 are formed on the sides or corners of the substrate unit 310, and the outer surface 312 includes a plurality of window molding areas 314, which surround the small windows 313 and extend to the substrate unit. 310 side or corner. In this embodiment, the small windows 313 in the adjacent substrate unit 310 and the same window molding area 314 are connected, so as to reduce the area of the cut side of the substrate strip 30 and prevent peeling of the substrate units 310 during cutting. The benefit of layering and the effect of improving the product's moisture resistance. In addition, the substrate unit 310 can further have a plurality of central slots 315 through the substrate unit 310, which are formed in the central area of the substrate units 310, and the outer surface 312 includes a lower molding area 317, which surrounds the substrate unit 310. The central slots 315 may not extend to the cutting lines 31. In addition, the substrate strip 30 can further have a plurality of external connection pads 316 formed on the external surface 312, which can be used to set a plurality of external connection terminals 350, and the chip 320 is electrically connected to the external connection terminals 350 through the substrate unit 310, so as to The semiconductor package structure 300 can be surface bonded to an external printed circuit board (not shown).

The encapsulant 340 is formed on the window molding areas 314 of the substrate unit 310 to seal the electrical connection elements 330 . The encapsulant 340 has a first cutting side 342 protruding from the outer surface 312 , which is aligned with the side or corner of the substrate unit 310 . In addition, the encapsulant 340 has a second cutting side 343 protruding and connected to the die-bonding surface 311 , which is aligned with the side or corner of the substrate unit 310 . Since the small windows 313 are connected to the corresponding sides or corners of the substrate unit 310, the first cutting side 342 and the second cutting side 343 are integrally connected at the small windows 313, and the remaining parts are connected with the substrate unit 310. The sides separate it. After sealing, the sealing body 340 can form a window molding part 341 in each window molding area 314 .

Since the small windows 313 are connected to the sides or corners of the substrate unit 310 after cutting, forming a notch in the shape of a side or an L shape, the design of the lower mold can be simplified, and the processing time in the packaging process can be further saved. tool cost.

Preferably, as shown in FIG. 7, the substrate strip 30 can reserve a glue overflow channel 32 on the outer surface 312, which is aligned in the cutting lines 31 and passes through the window molding areas 314, so that The dicing line 314 that can be cut off is used as a predetermined area for overfilling, so as to avoid overmold overfilling that may pollute the external pads 316 in the substrate unit 310 .

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form. The scope of the technical solution of the present invention should be based on the scope of the attached patent application. Any skilled person familiar with this profession can use the technical content disclosed above to make some changes or modify the equivalent embodiments of equivalent changes, but all the content that does not deviate from the technical solution of the present invention, the above embodiments are modified according to the technical essence of the present invention Any simple modifications, equivalent changes and modifications still fall within the scope of the technical solution of the present invention.

Claims (23)

1. A small window molding and cutting method, characterized in that it comprises: A substrate strip is provided, comprising a plurality of substrate units and a plurality of dicing lines formed between the substrate units, the substrate strip has a die-bonding surface, an external surface and a plurality of small windows penetrating the substrate strip, the substrate strip The small windows are formed on the sides or corners of the substrate units, and the outer surface includes a plurality of window molding areas, which surround the small windows and extend to the sides or corners of the substrate units, wherein the substrate The outer surface of the strip is formed with a glue overflow channel, which is aligned in the cutting line and passes through the above-mentioned window molding area; disposing a plurality of wafers on the die-bonding surface of the substrate strip, the wafers being located in the substrate unit and not covering the dicing lines; forming a plurality of electrical connection elements in the small window to electrically connect the chip to the substrate strip; forming an encapsulation on the window molding area of the substrate strip to seal the electrical connection elements extending to the dicing line; and The substrate strip and the part of the encapsulant in the window molding area are cut along the cutting line to separate the substrate unit. 2. The small window molding and cutting method according to claim 1, wherein each window molding area surrounds at least two small windows adjacent to the sides and includes a cutting line between the small windows parts. 3. The small window molding and cutting method according to claim 1, wherein each window molding area surrounds at least four small windows adjacent to corners and includes cutting lines between the small windows Staggered parts. 4. The method for molding and cutting small windows according to claim 1, wherein the small windows in adjacent substrate units and in the same window molding area are connected. 5 . The method of molding and cutting a small window according to claim 1 , wherein the chip has a plurality of pads aligned in the small window for connecting the electrical connection elements. 6 . 6. The small window molding and cutting method according to claim 1, wherein the area where the above-mentioned wafer is placed on the substrate strip is not less than 70% of the bonding surface area of the corresponding substrate unit, for making Chip size package configuration. 7. The method for molding and cutting a small window according to claim 1, wherein the electrical connection elements include a plurality of welding wires. 8 . The molding and cutting method for a small window according to claim 1 , wherein the substrate strip further has a plurality of central slots passing through the substrate strip, which are formed in the central area of the substrate unit. 9. The molding and cutting method for a small window according to claim 8, wherein the encapsulant is further formed in the central slot of the substrate strip. 10. The small window molding and cutting method according to claim 1 or 9, wherein the encapsulant is further formed on the die-bonding surface of the substrate strip to seal at least a part of the chip. 11. The molding and cutting method for a small window according to claim 1, wherein the substrate strip further has a plurality of external pads formed on the external surface. 12. The molding and cutting method for small window according to claim 11, characterized in that it includes the step of: arranging a plurality of external terminals on the external pads. 13. A packaging structure formed by a small window molding and cutting method, characterized in that it comprises: a substrate unit formed by cutting a substrate strip, the substrate unit has a die-bonding surface, a circumscribing surface and a plurality of small windows penetrating the substrate unit, the above-mentioned small windows are formed on the sides or corners of the substrate unit, and The external surface includes a plurality of window molding areas, which surround the small window and extend to the sides or corners of the substrate unit; a chip disposed on the die-bonding surface, the chip being located within the substrate unit and not covering the sides or corners of the substrate unit; a plurality of electrical connection elements formed in the small window to electrically connect the chip to the substrate unit; and An encapsulant is formed on the above-mentioned window molding area of the substrate unit to seal the above-mentioned electrical connection element, and the encapsulant has a first cutting side protruding from the external surface, which is cut flush with the side of the substrate unit Or a corner, wherein a glue overflow channel is formed on the outer surface of the substrate strip, which is aligned in the cutting line and passes through the above-mentioned window molding area. 14. The packaging structure formed by the small window molding and cutting method according to claim 13, wherein the small window is connected to the side or corner of the substrate unit. 15. The packaging structure formed by the small window molding and cutting method according to claim 13, wherein the chip has a plurality of solder pads, which are aligned in the small window for the electrical connection of the components connect. 16. The packaging structure formed by the small window molding and cutting method according to claim 13, wherein the area where the chip is placed on the substrate unit is not less than 70% of the bonding surface area of the substrate unit , to form a chip size package structure. 17. The packaging structure formed by the method of molding and cutting the small window according to claim 13, wherein the electrical connection elements include a plurality of bonding wires. 18. The packaging structure formed by the small window molding and cutting method according to claim 13, wherein the substrate unit further has a central slot formed in the central area of the substrate unit. 19. The packaging structure formed by the small window molding and cutting method according to claim 18, wherein the encapsulant is further formed in the central slot of the substrate unit. 20. The package structure formed by the small window molding and cutting method according to claim 13 or 19, wherein the encapsulant is further formed on the die-bonding surface of the substrate unit to seal at least a part of the chip. 21. The packaging structure formed by the small window molding and cutting method according to claim 20, wherein the encapsulant has a second cutting side connected to the die-bonding surface, which is cut flush with the side of the substrate unit edge or corner. 22. The packaging structure formed by the small window molding and cutting method according to claim 13, wherein the substrate unit further has a plurality of external pads formed on the external surface. 23. The packaging structure formed by the method of molding and cutting the small window according to claim 22, further comprising a plurality of external terminals disposed on the external pads.

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