CN101459101B - Flip-type wafer automatic transfer device - Google Patents

Abstract

A flip-type wafer automatic transfer device, which overcomes the shortcomings of the existing technology that it cannot perform complex actions in the narrow space of the process, including racks, loading platforms, bellows and arm mechanisms. The technical points are: arm mechanism The lower arm is connected to the grabbing mechanism through the turning mechanism, the fixing plate of the grabbing mechanism is hinged on the turning base through the turning shaft, and the grabbing motor of the grabbing mechanism drives the grabbing link through the worm gear to drive the gripper along the grabbing slide rail. Reciprocating movement, the positioning mechanism on the grabbing mechanism is provided with an adjustable positioning block. The structure design of the device is reasonable, the transmission between processes is stable, the action is more flexible and reliable, and the scope of application is expanded, so that it can realize the flipping of the wafer cassette in the range of 0-90 degrees, and the tilt angle can be set arbitrarily to complete the wafer level. Or vertical automatic transmission, and at the same time, it can adapt to more complex actions in the narrow space of the process equipment, and can be flexibly stopped when encountering external interference, so as to achieve the transmission effect of precise control.

Description

Flip-type wafer automatic transfer device

technical field

The invention relates to a wafer conveying device, in particular to a flip-type wafer automatic conveying device. It has a reasonable structural design for the loading and unloading operation of the standard mechanical interface (SMIF) wafer cassette, and the transmission and operation between the processes are stable, and the flipping action of the wafer cassette in the range of 0-90 degrees is more flexible and reliable. , which expands the scope of application.

Background technique

Currently, in the semiconductor manufacturing process, wafer handling is critical to IC manufacturing. In order to ensure the quality of wafers when they are transported between different processes and avoid dust particles or other contamination of wafers, more and more transport work uses standard transport containers, that is, standard mechanical interface (SMIF for short) )technology. For example, in US Patents 4,532,970 and 4,534,389, a SMIF system is disclosed. The system reduces the contamination of the wafer by dust particles by significantly reducing the flow of dust particles through the wafer. This effect is achieved by mechanically ensuring that the gas surrounding the wafer remains stationary relative to the wafer during wafer transport, storage, and most processes, and that dust particles from the external environment do not enter the wafer environment. SMIF technology centers on the concept of "isolation technology". So-called isolation technology aims to prevent product contamination by enclosing wafers in an ultra-clean environment while relaxing the cleanliness requirements outside of this enclosure. This enables huge upfront and operating cost savings, while also enabling fabs to be more efficient and cost-effective.

In addition, US Patent No. 5934991 discloses a podloader interface improved clean air system (Podloader interface improved clean air system), which is an integrated air filtration system that can provide a clean microenvironment. The fan, filter, plenum box and loading platform in this system move as a whole. The plenum communicates with the wafer box on the loading platform through an angled screen with holes, and the clean air flow is uniform at an angle. The perforated screen is blown across the wafer surface at all heights. The mechanical device lifts the cassette housing in a micro-environment, then loads and unloads the cassette, minimizing the chance of cassette contamination during loading and unloading. This method is widely used in the industry.

U.S. Patent 6086323 discloses a method for delivering wafers to an IC manufacturing process (Method for supplying wafers to an IC manufacturing process), which includes a support box, a lift, a loading platform, and a multi-joint robotic arm. The loading platform can be connected to SMIF wafer cassette docking. A lifter is used to remove the pod cover from the SMIF pod. Clamping bars controlled by pneumatic cylinders secure the SMIF cassette to the elevator before the elevator lifts to open the cassette. After it docks the wafer box base with the loading platform of the wafer box loading interface, it opens the locking mechanism between the wafer box cover and the base. While the wafers are in a clean microenvironment, lift the pod cover off the base, move the actuator of the articulated robotic arm to the position of the exposed pod, grasp the pod, and move the mechanism The arm turns the wafer out of the microenvironment and delivers it to the IC process. The multi-joint robotic arm includes rotating shoulder joints, elbow joints and wrist joints, which can move horizontally. The screw vertical drive mechanism enables the robotic arm to move the cassette vertically. However, the function of the robotic arm is limited, which limits the application of the device. In the process that requires more complex actions for the wafer cassette, automatic transfer cannot be realized. The grabbing mechanism is powered by a cylinder. It is difficult to precisely control the movement process by using the cylinder as the power element, and a pneumatic system must be added at the same time. The positioning mechanism installed on the lower surface of the actuator uses a set of four positioning blocks mounted around the center. Forms a funnel that guides the cassette handle to a centered position. However, the installation of the actuator positioning block can only be applied to a fixed type of wafer cassette. With the development of process equipment, the forms of wafer cassettes are becoming more and more diverse, which limits the automatic transfer of wafers.

U.S. Patent No. 5,975,825 discloses a transfer apparatus for wafers (Transfer apparatus for wafers), which includes a linear stage that can move up and down, and the linear stage carries a mechanical arm. The robotic arm consists of two extension arms (placed on both sides of the cassette) and a blocking device (used to hold against the edge of the wafer). The shutter assembly consists of two lips made of elastic material that allow it to rest against the edge of the wafer. However, there are some disadvantages in this kind of wafer transfer device, which are reflected in the following aspects:

1. The structure of the mechanical arm is complex, and the two extended arms limit the use of the equipment.

2. The rotational movement of the robotic arm requires a large space for rotation, and while the robotic arm rotates, the linear stage must be lifted and lowered, and the horizontal operation stability of the wafer box must be ensured during the coordination, so that the components can be matched accurately. Accurate. Therefore, the device not only takes up a large space, but also requires high equipment cost, and is limited by its structure, so it cannot be applied to the process of performing complex actions in a narrow space.

3. The function of the mechanical arm is single, which limits its application occasions. On special process equipment that requires wafer cassettes to perform more complex actions, automatic transfer cannot be realized.

4. The setting of the actuator positioning block can only be applied to a fixed type of wafer cassette, and cannot adapt to the automatic transmission of wafer cassettes of various shapes corresponding to diversified process equipment.

The patent announcement number is CN2327664Y "wafer transport device with standard mechanical interface", which adopts the vertical lifting mechanism of the jaws to lift the jaws to a fixed point to grab the wafer box, and is used to use the double-stroke design to move the jaws up and down. The wafer box is transported to the fixed-point gripper horizontal movement mechanism and the gripper swing mechanism is used to return the wafer in the box. Among them, the vertical lifting mechanism of the jaws lifts up on the side of the wafer box to drive the horizontal movement mechanism of the jaws and the swinging mechanism of the jaws to move together, which occupies a large space inside, resulting in a large equipment volume. At the same time, the structural characteristics of the wafer transport device , limiting its application.

Korean Patent Publication No. 100594371B1 "A loader having function for carrying out cassette" uses a vertical axis link unit to lift up on the side of the wafer cassette to drive the jaws to move horizontally to grab Take the mechanism of the two bottom edges on the side of the wafer box. However, because the internal gripping mechanism is still used, the volume of the equipment is too large, and the function of the robotic arm is limited, and it is impossible to manipulate the wafer cassette to perform more complex actions.

Due to the diversity and particularity of process equipment, it is difficult for existing wafer loading equipment to fully meet the requirements. From the published literature, it has not been found that the same equipment can automatically transport the wafers in the SMIF wafer box to the specific position required for the next process while automatically unloading the SMIF wafer box, that is, to realize the wafer box at 0 -90 degree range flip, and the tilt angle can be set freely to complete the automatic transfer of wafers in horizontal or vertical state; and after the processing is completed, the automatic transfer device of the wafer cassette is retracted again. It can be seen that the existing wafer transfer device cannot meet the requirements of the process equipment for wafers in various spatial positions during the loading and unloading process, and can also meet the requirements of the process equipment for more complex actions in a narrow space. Purpose, therefore, the existing wafer transfer device needs to be further improved.

Contents of the invention

The purpose of the present invention is to provide a flip-type automatic transfer device for wafers. In addition to inheriting the advantages of providing a clean microenvironment from the isolation technology in the SMIF in the prior art, it can also effectively overcome its structural limitations and make it unsuitable. Due to the shortcomings of complex actions in the narrow space of the process, the device has a reasonable structural design, stable transmission and operation between processes, more flexible and reliable actions, and expands the scope of application, enabling it to flip the wafer cassette in the range of 0-90 degrees. And the tilt angle can be set arbitrarily to complete the automatic transfer of wafers in horizontal or vertical state. At the same time, it can adapt to more complex actions in the narrow space of process equipment, and can be flexibly stopped when encountering external interference to achieve precise control of transfer. Effect.

The technical solution adopted in the present invention is: the flip-type wafer automatic transfer device includes a frame, a feeding platform fixed on the frame, a bellows body with a claw mechanism assembled on the frame for lifting and moving, and An arm mechanism with a grasping mechanism for lifting and stretching, the technical points are: the lower arm of the arm mechanism is connected to the grasping mechanism through a turning mechanism, that is, the lower arm of the arm mechanism and the turning mechanism The overturning bases are hinged together, the fixed plate of the grabbing mechanism is hinged on the overturning base through the overturning shaft, and the overturning shaft is driven to rotate by the gear link transmission mechanism assembled on the overturning base, driving The fixed plate of the grabbing mechanism rotates around the axis, and the grabbing motor arranged on the grabbing mechanism drives the grabbing link through the worm gear to drive the jaws to reciprocate along the grabbing slide rail of the fixing plate of the grabbing mechanism. The positioning mechanism on the grasping mechanism is provided with an adjustable positioning block.

The flipping shaft hinged on the flipping base is fixed on both sides of the gripping mechanism fixing plate, and the flipping shaft stretches out from the shaft hole end of the flipping base and the flipping link end in the gear linkage transmission mechanism. Fixed connection.

A pair of meshed pinion and bull gear in the gear linkage transmission mechanism are assembled on the flip base, the pinion is assembled on the motor shaft of the flip base, and the side of the bull gear passes through One end of the pin shaft is hinged to the transmission link, and the other end of the transmission link is hinged to the other end of the turnover link fixedly connected to the tip of the turnover shaft.

The arm lifting motor and the arm stretching motor that drive the arm mechanism to lift and stretch are respectively fixed on the frame and on the arm lifting base plate that slides along the arm lifting single slide rail of the frame, and the arm lifting motor The No. 3 transmission belt and the arm lifting screw drive the arm lifting nut fixed on the arm lifting base plate to reciprocate along the screw axis, so that the arm mechanism moves vertically with the frame.

The arm stretching motor drives the arm transmission shaft fixed on the upper arm to rotate through the reduction mechanism and the No. 2 transmission belt, and the arm transmission shaft drives the upper arm to swing around the arm fixed shaft, and the lower arm hinged with the upper arm through the arm rotation shaft is on the upper arm. Driven by the internal transmission belt, it swings around the upper arm, and the turning mechanism hinged with the lower arm through the arm rotation shaft swings around the lower arm under the drive of the internal transmission belt of the lower arm, so that the arm mechanism performs stretching motion along the direction perpendicular to the frame.

The bellows body is assembled on the bellows body fixing seat with the bellows body lifting nut, and the bellows body lifting motor fixed on the frame drives the bellows body lifting nut along the screw rod through the No. 1 transmission belt and the bellows body lifting screw. Axial reciprocating movement drives the bellows body fixing seat to slide up and down along the bellows body lifting single slide rail of the frame.

The claw motor of the claw mechanism of the bellows body is hinged with one end of the claw rod by assembling the pull rod pin on the shaft, the other end of the claw rod is hinged with the crank at the end of the claw shaft, and the other end of the claw shaft is fixed with a buckle The claw, the motor drives the crank on the claw shaft to rotate around the axis, driving the claw to open and close.

The advantages and positive effects of the present invention are: since the present invention improves the design on the basis of the structure of the transfer equipment in the existing method of delivering wafers, it provides a clean In addition to the advantages of the micro-environment, it can also effectively overcome the disadvantages of being unable to perform complex actions in the narrow space of the process due to structural limitations. The lower arm of the arm mechanism of the device is connected to the grasping mechanism through the turning mechanism, and the grasping mechanism adopts the structural form of the grasping motor driving the grasping link through the worm gear to replace the pneumatic system in the existing grasping mechanism to drive the jaws Action to ensure that the wafer cassette will not fall off after clamped by the jaws, so its structural design is more reasonable, the transmission operation between processes is not only stable, but also the wafer cassette can be turned over in the range of 0-90 degrees to set the tilt angle at will, The action is more flexible and reliable, which expands the scope of application of different process equipment, so that it can not only complete the automatic transfer of wafers in horizontal or vertical states, but also meet the requirements of process equipment for wafers in various spatial positions, and can It is suitable for more complex actions in the narrow space of the process equipment, and can be flexibly stopped when encountering external interference, so as to achieve the transmission effect of precise control.

Description of drawings

The present invention will be further described below in conjunction with accompanying drawing.

Fig. 1 is a kind of specific structure schematic diagram of the present invention.

Fig. 2 is a right side view of Fig. 1 .

Fig. 3 is a structural schematic diagram of the arm mechanism in Fig. 1 .

Fig. 4 is a structural schematic diagram of the extended state of the arm mechanism in Fig. 1 .

FIG. 5 is a top view of FIG. 4 .

FIG. 6 is a right side view of FIG. 4 .

FIG. 7 is a schematic structural view of the grabbing mechanism in FIG. 3 .

FIG. 8 is a structural schematic diagram of the positioning mechanism in FIG. 3 .

FIG. 9 is a structural schematic diagram of the claw mechanism in FIG. 2 .

Description of serial numbers in the figure: 1 frame, 2 bellows body lifting motor, 3 No. 1 transmission belt, 4 bellows body fixing seat, 5 bellows body lifting nut, 6 bellows body lifting screw, 7 bellows body lifting single slide rail , 8 Arm lifting single slide rail, 9 No. 2 transmission belt, 10 Speed reduction mechanism, 11 Arm extension motor, 12 Arm lifting base plate, 13 Arm lifting screw, 14 No. 3 transmission belt, 15 Arm lifting motor, 16 Arm lifting nut, 17 Arm fixing Seat, 18 arm transmission shaft, 19 arm mechanism, 20 claw mechanism, 21 loading platform, 22 bellows body, 23 positioning mechanism, 24 grabbing mechanism, 25 turning shaft, 26 turning mechanism, 27 lower arm, 28 arm rotation Shaft, 29 upper arm, 30 arm fixed shaft, 31 small gear, 32 pin shaft, 33 large gear, 34 transmission connecting rod, 35 turning base, 36 turning connecting rod, 37 gripper, 38 grasping motor, 39 grasping Slide rail, 40 grabbing connecting rod, 41 coupling, 42 connecting rod pin, 43 worm, 44 turbine, 45 grabbing mechanism fixing plate, 46 adjustable positioning block, 47 grabbing fixing plate, 48 fixed positioning block, 49 buckle claw motor, 50 tie rod pin shaft, 51 buckle claw pull rod, 52 fixing seat, 53 buckle claw shaft, 54 buckle claw.

Detailed ways

The specific structure of the present invention will be described in detail with reference to FIGS. 1 to 9 . The flip-type wafer automatic transfer device is based on the advantages of patented technologies such as "a method of delivering wafers for IC manufacturing" in US Patent 6,086,323, and is redesigned according to the defects in the prior art. It includes a frame 1, a feeding platform 21 fixed on the frame 1, a bellows body 22 with a claw mechanism 20 assembled on the frame 1 for lifting and moving, and a bellows body 22 with a claw mechanism 20 for lifting and extending movement. The arm mechanism 19 etc. of mechanism 24. Wherein the wind box body 22 is an integrated air filtration system, which can provide a clean microenvironment. Its working principle is basically the same as the method in the above-mentioned US patent technology, and will not be repeated here.

As shown in Figures 1 and 2, the bellows body 22 is assembled on the bellows body fixing base 4 with the bellows body lifting nut 5, and the bellows body lifting motor 2 fixed on the frame 1 passes through the No. 1 transmission belt 3 and the wind box body. The box lifting screw rod 6 drives the bellows box lifting nut 5 to reciprocate along the screw rod axis, and drives the bellows box fixing seat 4 to slide up and down along the bellows box lifting single slide rail 7 of the frame 1. Adopt bellows body lifting single slide rail 7 to compare with the bellows body lifting double slide rail of the prior art, can simplify transmission structure, not only easy to install, and be convenient to adjust during maintenance.

As shown in FIG. 9 , the claw mechanism 20 of the bellows body 22 is composed of a claw motor 49 , a pull rod pin 50 , a claw pull rod 51 , a holder 52 , a claw shaft 53 , and a claw 54 . The claw mechanism 20 is driven by the claw motor 49 instead of the cylinder transmission of the pneumatic system, which not only solves the problem that it cannot accurately control the movement process, but also saves a set of pneumatic system. The claw mechanism 20 adopts the claw motor 49 and is hinged with one end of the claw pull rod 51 by assembling the pull rod pin shaft 50 on the shaft, and the other end of the claw pull rod 51 is hinged with the crank at one end of the claw shaft 53, and is assembled with a fixed seat 52 The other end of the claw shaft 53 on the bellows body 22 is fixed with a claw 54 . The claw motor 49 drives the crank on the claw shaft 53 to rotate around the axis through the pull rod pin shaft 50 and the claw pull rod 51 to drive the claw 54 to open and close. The claw mechanism 20 is powered by the claw motor 49, which enhances the stability and controllability of the mechanism.

As shown in Figures 3, 4, 5, and 6, the arm mechanism 19 consists of a positioning mechanism 23, a grabbing mechanism 24, an overturning shaft 25, an overturning mechanism 26, a lower arm 27, an arm rotation axis 28, an upper arm 29, and an arm drive shaft 18. , arm fixed shaft 30 etc. are formed. Turning mechanism 26 is made up of pinion 31, bearing pin 32, bull gear 33, transmission connecting rod 34, turning base 35, turning connecting rod 36 etc.

As shown in Figure 7, the grabbing mechanism 24 consists of jaws 37, grabbing motor 38, grabbing slide rail 39, grabbing connecting rod 40, coupling 41, connecting rod pin 42, worm 43, turbine 44, grabbing Get mechanism fixed plate 45 etc. to form.

As shown in FIG. 8 , the positioning mechanism 23 is composed of an adjustable positioning block 46 , a grasping and fixing plate 47 , a fixed positioning block 48 and the like.

Wherein the lower arm 27 of the arm mechanism 19 is connected to the grasping mechanism 24 through the turning mechanism 26, that is, the lower arm 27 of the arm mechanism 19 is hinged together with the turning base 35 of the turning mechanism 26. At the same time as the automatic transmission of the circular horizontal or vertical state, it can also realize the flipping of the wafer cassette in the range of 0-90 degrees according to the actual needs, and set the tilt angle at will to meet the requirements of different process equipment structure characteristics. The grabbing mechanism fixing plate 45 is hinged on the turning base 35 through the turning shaft 25, and the turning shaft 25 is driven to rotate by the gear link transmission mechanism assembled on the turning base 35, and the grabbing mechanism fixing plate 45 is driven to rotate around the axis. The grabbing motor 38 arranged on the grabbing mechanism 24 drives the grabbing link 40 through the worm gear 44 and the worm 43 to drive the jaws 37 to reciprocate along the grabbing slide rail 39 fixed on the grabbing mechanism fixing plate 45 . The positioning mechanism 23 on the grabbing mechanism 24 is provided with an adjustable positioning block 46 . The turning shaft 25 hinged on the turning base 35 is fixed on both sides of the grabbing mechanism fixing plate 45 . Turning shaft 25 stretches out turning base 35 shaft hole ends and is fixedly connected with one end of turning link 36 in the gear linkage transmission mechanism. The gear linkage transmission mechanism is made up of pinion 31, bearing pin 32, bull gear 33, transmission link 34, overturning link 36 driven by the motor. A pair of meshed pinion gear 31 and bull gear 33 in the gear link transmission mechanism are assembled on the turning base 35 . The pinion 31 is assembled on the motor shaft (not shown in the figure) of the turning base 35 . The bull gear 33 is hinged to one end of the transmission link 34 by a pin shaft 32, and the other end of the transmission link 34 is hinged to the other end of the turnover link 36 fixedly connected to the turnover shaft 25 ends.

Drive arm mechanism 19 to do lifting, the arm lifting motor 15 that stretches moves and the arm stretching motor 11 is respectively fixed on the frame 1 and is fixed on the arm lifting base plate 12 that slides along the arm lifting single slide rail 8 of frame 1. Compared with the arm lifting double slide rails in the prior art, the transmission structure can be simplified by adopting the arm lifting single slide rail 8, which is not only easy to install, but also easy to adjust during maintenance. The arm lifting motor 15 drives the arm lifting nut 16 fixed on the arm lifting base plate 12 to reciprocate along the screw axis through the No. 3 transmission belt 14 and the arm lifting screw rod 13, so that the arm mechanism 19 moves along Make lifting movement with the vertical direction of frame 1. The arm extension motor 11 drives the arm transmission shaft 18 fixed on the upper arm 29 through the speed reduction mechanism 10 and the No. 2 transmission belt 9 to rotate. The lower arm 27 connected by 29 swings around the upper arm 29 under the drive of the upper arm 29 internal transmission belt, and the turning mechanism 26 hinged with the lower arm 27 by the arm rotating shaft 28 swings around the lower arm 27 under the drive of the lower arm 27 internal transmission belt, ( See the partial cross-sectional view in Fig. 3), make the arm mechanism 19 stretch along the vertical direction with the frame 1.

The action process of the flip-type wafer automatic transfer device is:

It consists of the lifting of the bellows body 22, the lifting of the arm mechanism 19, the extension of the arm mechanism 19, the opening and closing of the claw mechanism 20, the opening and closing of the grasping mechanism 24, the overturning of the grasping mechanism 24 and other components. The special controller of this device is used as the central processing unit and the unique software control technology is used to make the automatic transfer of wafers be completed by coordinating movements among various components.

The bellows body lifting motor 2 drives the bellows body lifting screw 6 to rotate through the No. 1 transmission belt 3, and the bellows body lifting nut 5 moves up and down along the bellows body lifting screw 6, driving the bellows body 22 to lift and slide along the bellows body Rail 7 moves up and down.

The arm lifting motor 15 drives the arm lifting screw 13 to rotate through the No. 3 transmission belt 14, and the arm lifting nut 16 moves up and down along the arm lifting screw 13, and drives the arm lifting base plate 12 to move up and down along the arm lifting single slide rail 8, realizing the arm lift. The up and down movement of mechanism 19. Arm lifting motor 15 is done position feedback by encoder, can realize the precise control of rising and falling position.

Arm mechanism 19 is under the common swing action of upper arm 29 and lower arm 27, makes it hinged with the overturning mechanism 26 of grasping mechanism 24 and realized to do linear motion along the direction perpendicular to frame 1, i.e. the stretching motion of arm mechanism 19 . Arm extension motor 15 is done position feedback by encoder, can realize the precise control of extension position. The design of the ascending, descending and extending positions ensures that the positioning accuracy is within 0.1mm, and when encountering external interference, it can be flexibly stopped at any time without hitting objects, and the mechanism itself is not easy to be damaged.

The turnover mechanism 26 can realize the turnover of the wafer cassette within the extension stroke of the arm mechanism 19 . The small gear 31 driven by the motor of the turnover mechanism 26 drives the large gear 33, and the large gear 33 rotates through the pin shaft 32 to push the transmission link 34 to swing. Under the push of the transmission connecting rod 34 , the turning of the turning connecting rod 36 through the turning of the turning shaft 25 drives the turning movement of the grasping mechanism 24 .

The grasping motor 38 of the grasping mechanism 24 drives the worm 43 and the turbine 44 to rotate through the coupling 41, and the turbine 44 pushes the grasping connecting rod 40 to drive the jaws 37 through the connecting rod pin 42, and under the restriction of the grasping slide rail 39 , The jaws 37 make a linear reciprocating motion along the grabbing slide rail 39 . The opening and closing of the jaws 37 can be realized by controlling the forward rotation and reverse rotation of the grasping motor 38 . The control design of grabbing motor 38 plus encoder can ensure that the wafer cassette will not fall off after the clamping jaws are clamped.

The positioning mechanism 23 installed at the lower end of the grabbing mechanism 24 is used to realize the positioning of the wafer cassette. Both the adjustable positioning block 46 and the fixed positioning block 48 have an inclined inner surface, which can guide the cassette to a centered position. The adjustable positioning block 46 has the function of position adjustment, and the wafer cassette can be in a proper position by adjusting the position of the adjustable positioning block 46 when the outer shape of the wafer cassette is different.

The claw mechanism 20 is used to fix the wafer box on the bellows body 22 before lifting the wafer box. When the claw motor 49 of the claw mechanism 20 moves, the motor shaft stretches out, and the claw pull rod 51 is pulled by the pull rod pin 50 to swing, and the swing of the claw pull rod 51 drives the claw shaft 53 to rotate around the fixed seat 52 . The buckle claw 54 rotates with the rotation of the claw claw shaft 53 to complete the buckling action of the buckle claw 54 . Otherwise, the motor shaft of the claw motor 49 retracts, and the claw shaft 53 rotates in the opposite direction under the pulling of the claw pull rod 51, that is, drives the claw 54 to open, thus completing the snapping and opening of the claw mechanism 20 action.

The working process of the flip-type wafer automatic transfer device is as follows:

The operator places the wafer cassette on the loading platform 21 . When the equipment starts to work, the wafer box is opened by a common locking mechanism, the claw mechanism 20 moves, and the claw 54 fixes the cover of the wafer box on the bellows body 22 . The bellows body 22 rises to the top, driving the wafer cassette cover to be lifted from the wafer cassette. At this time, the wafer cassette is in the microenvironment of the bellows body 22 .

The arm mechanism 19 descends to the top of the wafer cassette, the positioning mechanism 23 positions the wafer cassette to the central position, the grasping mechanism 24 moves, and the jaws 37 clamp the wafer cassette; the arm mechanism 19 rises to move the wafer cassette from the loading Lift on platform 21.

The arm mechanism 19 is extended to send the wafer cassette above the processing position of the process equipment; the arm mechanism 19 is lowered to place the wafer cassette at the processing position. At the same time, if the process equipment requires the wafers to be placed vertically, the arm mechanism 19 activates the turning mechanism 26 during the process of transporting the wafer cassette to turn the wafer cassette 90 degrees, and then place it in the processing position.

When the processing operation of the wafer is completed, the equipment performs the reverse process, and the wafer cassette is reloaded into the wafer cassette of the equipment, so that the operator can take it away.

Claims (7)

1. A flip-type wafer automatic transfer device, including a frame, a feeding platform fixed on the frame, a bellows body with a claw mechanism that is assembled on the frame for lifting and moving, and for lifting and extending movement The arm mechanism with grabbing mechanism is characterized in that: the lower arm of the arm mechanism is connected to the grabbing mechanism through an overturning mechanism, that is, the lower arm of the arm mechanism is hinged to the overturning base of the overturning mechanism Together, the fixing plate of the grabbing mechanism is hinged on the flipping base through the turning shaft, and the turning shaft is driven to rotate by the gear link transmission mechanism assembled on the turning base, driving the grabbing mechanism to fix The plate rotates around the axis, and the grabbing motor arranged on the grabbing mechanism drives the grabbing link through the worm gear to drive the jaws to reciprocate along the grabbing slide rail of the fixing plate of the grabbing mechanism. The positioning mechanism is provided with an adjustable positioning block. 2. The flip-type wafer automatic transfer device according to claim 1, characterized in that: the flip shaft hinged on the flip base is fixed on both sides of the gripping mechanism fixing plate, and the flip shaft extends The shaft hole end of the overturn base is fixedly connected with the overturn link end in the gear link transmission mechanism. 3. The flip-type wafer automatic transfer device according to claim 1 or 2, characterized in that: a pair of meshing pinion gears and large gears in the gear linkage transmission mechanism are assembled on the flip base , the pinion is assembled on the motor shaft of the turning base, the side of the big gear is hinged to one end of the transmission link through a pin shaft, and the other end of the transmission link is fixedly connected to the turning link at the end of the turning shaft The other end is hinged. 4. The flip-type wafer automatic transfer device according to claim 1, characterized in that: the arm lift motor and the arm stretch motor that drive the arm mechanism to move up and down and extend are respectively fixed on the frame and fixed on the On the arm lift base plate that slides along the arm lift single slide rail of the frame, the arm lift motor drives the arm lift nut fixed on the arm lift base plate to reciprocate along the screw axis through the No. Make lifting movement along the vertical direction of the rack. 5. The flip-type wafer automatic transfer device according to claim 4, characterized in that: the arm extension motor drives the arm transmission shaft fixed on the upper arm to rotate through the reduction mechanism and the No. 2 transmission belt, and the arm transmission shaft drives the upper arm to rotate. The arm swings around the fixed axis of the arm, and the lower arm hinged with the upper arm through the arm rotation axis swings around the upper arm driven by the internal transmission belt of the upper arm, and the turning mechanism hinged with the lower arm through the arm rotation axis rotates around the upper arm under the drive of the internal transmission belt of the lower arm. The lower arm swings to make the arm mechanism stretch along the direction perpendicular to the frame. 6. The flip-type wafer automatic transfer device according to claim 1, characterized in that: the bellows body is assembled on the bellows body fixing seat with the bellows body lifting nut, and the wind box body fixed on the frame The box body lifting motor and the bellows body lifting screw drive the bellows body lifting nut to reciprocate along the screw rod axis through the No. 1 transmission belt, and drive the bellows body fixing seat to slide up and down along the bellows body lifting single slide rail of the frame. 7. The flip-type wafer automatic transfer device according to claim 1, characterized in that: the claw motor of the claw mechanism of the bellows body is hinged to one end of the claw rod by assembling the pull rod pin on its shaft, The other end of the claw pull rod is hinged with the crank at the claw shaft end, the other end of the claw shaft is fixed with a claw, and the motor drives the crank on the claw shaft to rotate around the axis to drive the claws to open and close.

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