CN101473072A - 电解涂覆装置和方法 - Google Patents

电解涂覆装置和方法 Download PDF

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Publication number
CN101473072A
CN101473072A CNA2007800226453A CN200780022645A CN101473072A CN 101473072 A CN101473072 A CN 101473072A CN A2007800226453 A CNA2007800226453 A CN A2007800226453A CN 200780022645 A CN200780022645 A CN 200780022645A CN 101473072 A CN101473072 A CN 101473072A
Authority
CN
China
Prior art keywords
conductive
substrate
shaft
strip
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007800226453A
Other languages
English (en)
Chinese (zh)
Inventor
R·洛赫特曼
J·卡祖恩
N·施奈德
J·普菲斯特
G·波尔
N·瓦格纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Publication of CN101473072A publication Critical patent/CN101473072A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
CNA2007800226453A 2006-04-18 2007-04-17 电解涂覆装置和方法 Pending CN101473072A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06112723 2006-04-18
EP06112723.9 2006-04-18

Publications (1)

Publication Number Publication Date
CN101473072A true CN101473072A (zh) 2009-07-01

Family

ID=38236519

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007800226453A Pending CN101473072A (zh) 2006-04-18 2007-04-17 电解涂覆装置和方法

Country Status (11)

Country Link
US (1) US20090101511A1 (fr)
EP (1) EP2010699A2 (fr)
JP (1) JP2009534527A (fr)
KR (1) KR20090009876A (fr)
CN (1) CN101473072A (fr)
BR (1) BRPI0710241A2 (fr)
CA (1) CA2649786A1 (fr)
IL (1) IL194754A0 (fr)
RU (1) RU2420616C2 (fr)
TW (1) TW200811316A (fr)
WO (1) WO2007118875A2 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395626B (fr) * 2009-12-18 2013-05-11
CN103959483A (zh) * 2011-03-12 2014-07-30 王家雄 用于制备薄膜型太阳能电池的组合式连续电沉积设备
CN105164591A (zh) * 2013-04-30 2015-12-16 尤尼韦索有限公司 用于处理微机械部件的支座
CN106795645A (zh) * 2014-09-18 2017-05-31 莫杜美拓有限公司 用于连续施加纳米层压金属涂层的方法和装置
CN113400698A (zh) * 2021-05-11 2021-09-17 重庆金美新材料科技有限公司 一种导电传动带及其制备方法、薄膜水电镀设备
WO2024082493A1 (fr) * 2022-10-19 2024-04-25 重庆金美新材料科技有限公司 Mécanisme conducteur de cathode et système d'électroplacage

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JP5301993B2 (ja) 2005-08-12 2013-09-25 モジュメタル エルエルシー 組成変調複合材料及びその形成方法
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
WO2009112573A2 (fr) * 2008-03-13 2009-09-17 Basf Se Procédé et dispersion pour l'application d'une couche métallique sur un substrat, et matière thermoplastique pour moulage métallisable
NL1035265C2 (nl) * 2008-04-07 2009-10-08 Meco Equip Eng Werkwijze en inrichting voor het elektrolytisch galvaniseren van niet-metallische glasachtige substraten.
WO2010144509A2 (fr) 2009-06-08 2010-12-16 Modumetal Llc Revêtements nanostratifiés électrodéposés et gaines pour la protection contre la corrosion
KR101103450B1 (ko) * 2010-07-27 2012-01-09 주식회사 케이씨텍 기판 도금 장치
EA201500949A1 (ru) 2013-03-15 2016-02-29 Модьюметл, Инк. Способ формирования многослойного покрытия, покрытие, сформированное вышеуказанным способом, и многослойное покрытие
HK1220742A1 (zh) 2013-03-15 2017-05-12 Modumetal, Inc. 用於连续施加纳米层压金属涂层的方法和装置
BR112015022235A2 (pt) 2013-03-15 2017-07-18 Modumetal Inc revestimentos nanolaminados
US10472727B2 (en) 2013-03-15 2019-11-12 Modumetal, Inc. Method and apparatus for continuously applying nanolaminate metal coatings
EA201500948A1 (ru) 2013-03-15 2016-03-31 Модьюметл, Инк. Способ изготовления изделия и изделие, изготовленное вышеуказанным способом
KR101419276B1 (ko) * 2013-08-27 2014-07-15 (주)엠에스티테크놀로지 플라즈마 전해 산화에 의한 코팅 형성 방법
BR112017005534A2 (pt) 2014-09-18 2017-12-05 Modumetal Inc métodos de preparação de artigos por processos de eletrodeposição e fabricação aditiva
DE102015121349A1 (de) 2015-12-08 2017-06-08 Staku Anlagenbau Gmbh Vorrichtung zur Oberflächenbehandlung eines Endlosmaterials sowie deren Verwendung
KR101681083B1 (ko) * 2016-06-26 2016-12-01 주식회사 지에스아이 곡면부를 포함하는 상대전극을 갖는 도금장치
US11365488B2 (en) 2016-09-08 2022-06-21 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
TW201821649A (zh) 2016-09-09 2018-06-16 美商馬杜合金股份有限公司 層合物與奈米層合物材料於工具及模製方法之應用
EP3512987A1 (fr) 2016-09-14 2019-07-24 Modumetal, Inc. Système de génération de champ électrique complexe, fiable et à haut rendement, et procédé de production de revêtements l'utilisant
US12076965B2 (en) 2016-11-02 2024-09-03 Modumetal, Inc. Topology optimized high interface packing structures
WO2018175975A1 (fr) 2017-03-24 2018-09-27 Modumetal, Inc. Plongeurs de levage dotés de revêtements déposés par électrodéposition, et systèmes et procédés de production de ceux-ci
EP3612669A1 (fr) 2017-04-21 2020-02-26 Modumetal, Inc. Articles tubulaires dotés de revêtements déposés par électrodéposition et systèmes et procédés de production desdits articles
CN112272717B (zh) 2018-04-27 2024-01-05 莫杜美拓有限公司 用于使用旋转生产具有纳米层压物涂层的多个制品的设备、系统和方法
CN110952121B (zh) * 2018-12-17 2023-12-05 嘉兴瑞通智能装备有限公司 焊带制造装置和电镀机构及其电镀方法
CN110306218B (zh) * 2019-07-15 2024-11-08 中国石油天然气集团有限公司 一种发动机主轴孔自动控制式刷镀设备
CN113512749A (zh) * 2020-12-08 2021-10-19 郑州大学 一种电镀金刚石刀具实验装置
US20240200222A1 (en) * 2021-04-21 2024-06-20 Mitsubishi Electric Corporation Plating electrode and plating method that uses the plating electrode
DE102023120210B4 (de) * 2023-07-28 2025-03-13 Ce Cell Engineering Gmbh Anlage zur elektrischen Kontaktierung von Wafersolarzellen, Inline-Produktionsvorrichtung und Herstellungsverfahren für eine Wafersolarzelle

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DE1756267U (de) * 1957-06-27 1957-11-14 Aschaffenburger Zellstoffwerke Polsterkissen fuer verpakkungszwecke und als sitzkissen geeignet.
DE1756267A1 (de) * 1968-04-27 1971-10-07 Carl Klingspor Galvanisiervorrichtung fuer Gewebe
LU80496A1 (fr) * 1978-11-09 1980-06-05 Cockerill Procede et diopositif pour le depot electrolytique en continu et a haute densite de courant d'un metal de recouvrement sur une tole
SU1435668A1 (ru) * 1986-06-09 1988-11-07 Предприятие П/Я В-8657 Устройство дл двусторонней жидкостной обработки плоских изделий
DE4413149A1 (de) * 1994-04-15 1995-10-19 Schmid Gmbh & Co Geb Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten
GB0005883D0 (en) * 2000-03-13 2000-05-03 Lowe John M Electro-plating apparatus and a method of electoplating
DE10234705B4 (de) * 2001-10-25 2008-01-17 Infineon Technologies Ag Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen
WO2003038158A2 (fr) * 2001-10-25 2003-05-08 Infineon Technologies Ag Dispositif de galvanisation et systeme de galvanisation concus pour revetir des structures deja conductrices
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395626B (fr) * 2009-12-18 2013-05-11
CN103959483A (zh) * 2011-03-12 2014-07-30 王家雄 用于制备薄膜型太阳能电池的组合式连续电沉积设备
CN103959483B (zh) * 2011-03-12 2016-10-26 王家雄 用于制备薄膜型太阳能电池的组合式连续电沉积设备
CN105164591A (zh) * 2013-04-30 2015-12-16 尤尼韦索有限公司 用于处理微机械部件的支座
CN105164591B (zh) * 2013-04-30 2017-05-31 尤尼韦索有限公司 用于处理微机械部件的支座和包括该支座的组件
CN106795645A (zh) * 2014-09-18 2017-05-31 莫杜美拓有限公司 用于连续施加纳米层压金属涂层的方法和装置
CN106795645B (zh) * 2014-09-18 2020-03-27 莫杜美拓有限公司 用于连续施加纳米层压金属涂层的方法和装置
CN113400698A (zh) * 2021-05-11 2021-09-17 重庆金美新材料科技有限公司 一种导电传动带及其制备方法、薄膜水电镀设备
WO2024082493A1 (fr) * 2022-10-19 2024-04-25 重庆金美新材料科技有限公司 Mécanisme conducteur de cathode et système d'électroplacage

Also Published As

Publication number Publication date
EP2010699A2 (fr) 2009-01-07
US20090101511A1 (en) 2009-04-23
KR20090009876A (ko) 2009-01-23
IL194754A0 (en) 2009-08-03
WO2007118875A2 (fr) 2007-10-25
JP2009534527A (ja) 2009-09-24
RU2008145108A (ru) 2010-05-27
WO2007118875A3 (fr) 2008-08-07
BRPI0710241A2 (pt) 2011-08-09
TW200811316A (en) 2008-03-01
RU2420616C2 (ru) 2011-06-10
CA2649786A1 (fr) 2007-10-25

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20090701