CN102497724A - PCB with high reliability and processing method thereof - Google Patents
PCB with high reliability and processing method thereof Download PDFInfo
- Publication number
- CN102497724A CN102497724A CN2011103629261A CN201110362926A CN102497724A CN 102497724 A CN102497724 A CN 102497724A CN 2011103629261 A CN2011103629261 A CN 2011103629261A CN 201110362926 A CN201110362926 A CN 201110362926A CN 102497724 A CN102497724 A CN 102497724A
- Authority
- CN
- China
- Prior art keywords
- hole
- blind hole
- pcb board
- high reliability
- straight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003672 processing method Methods 0.000 title claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000010949 copper Substances 0.000 claims abstract description 20
- 229910052802 copper Inorganic materials 0.000 claims abstract description 20
- 238000012545 processing Methods 0.000 claims abstract description 6
- 241001074085 Scophthalmus aquosus Species 0.000 claims description 10
- 230000008021 deposition Effects 0.000 claims description 4
- 239000011449 brick Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 7
- 238000005553 drilling Methods 0.000 description 4
- 238000012797 qualification Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 235000015111 chews Nutrition 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 235000003392 Curcuma domestica Nutrition 0.000 description 1
- 244000008991 Curcuma longa Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 235000003373 curcuma longa Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 235000013976 turmeric Nutrition 0.000 description 1
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention belongs to a processing technology field of a PCB and especially discloses a PCB with a high reliability and a processing method thereof. The board comprises: board body and a blind hole arranged on the board body. Aperture copper adheres to a sidewall of the blind hole. The opening of the blind hole is in a trumpet shape. The hole body of the blind hole is in a straight shape. The hole bottom of the blind hole is a V shape. According to the invention, the blind hole shape in the board body is improved; two inclined planes are made in the opening and the bottom so that bond area of the aperture copper can be larger and aperture copper adhesion uniformity can be good. A problem of bad conduction, such as aperture copper fracture and the like can be solved. And the reliability of the PCB can be improved.
Description
Technical field
The invention belongs to the processing technique field of PCB, be specifically related to a kind of high reliability pcb board and processing method thereof.
Background technology
Multilayer circuit board has been the main product of existing pcb board; Shown in Figure 1 is the structural representation of a three ply board; It comprises plate body 10 and is opened in the blind hole 20 on the said plate body 10 that said plate body 10 comprises ground floor wiring board 11 stacked together, second layer wiring board 12 and the 3rd layer of wiring board 13.In order to realize being electrically connected between each layer wiring board; That is to say like being electrically connected between first line layer 111 among the figure, second line layer 121, the tertiary circuit layer 131; Just make a blind hole 20, the hole copper 30 of deposition one deck conduction on the sidewall of blind hole 20 at the pcb board face.
As shown in Figure 1, existing blind hole 20 shapes all are straight tubbiness, and it is not enough that hole copper 30 adhesive force that on hole wall, adhere to close the uniformity, thereby cause hole copper bad phenomenon generations such as fracture to occur, influence the electric conductivity of pcb board.
Summary of the invention
In order to address the above problem, the object of the present invention is to provide a kind of electric unfailing performance higher pcb board and processing method thereof.
For realizing the foregoing invention purpose, technical scheme that the present invention adopts is following:
A kind of high reliability pcb board comprises plate body and is opened in the blind hole on the said plate body that on the sidewall of said blind hole, adhere to porose copper, the opening of said blind hole is horn-like, and the hole body of said blind hole is straight-tube shape, V-shaped shape at the bottom of the hole of said blind hole.
In the described high reliability pcb board; The upper shed diameter of its loudspeaker opening portion is 44 ± 6 Mills (mil); Angle between relative two buses of said loudspeaker opening portion is 90 degree; The internal diameter of said straight-tube shape hole body part is 24 ± 3.2 Mills (mil), and it is 130 degree that the angle between relative two buses is divided in said V-shape hole bottom.
A kind of processing method of processing said high reliability pcb board may further comprise the steps:
Use first tapered bur on the plate body of pcb board, to get out its straight-tube shape hole body part and V-shape hole bottom branch, the said first taper brick is to bore body brill cylindrical, that the end is back taper to chew;
Go out its loudspeaker opening with the upper shed part counterboring of second tapered bur body part in its straight-tube shape hole again and form its blind hole, said second tapered bur is that the lower end is that the brill of back taper is chewed, and the diameter of said second tapered bur is bigger than the diameter of first tapered bur;
Deposition hole copper in said blind hole.
The present invention improves the blind hole shape in the plate body; Made two inclined-planes at its opening and bottom, made that not only the bond area of hole copper is bigger, and it is better to make hole copper adhere to uniformity; Certainly can improve the bad problems of conduction such as hole copper fracture, improve the reliability of PCB.
Description of drawings
The picture that this description of drawings provided is used for auxiliary to further understanding of the present invention, constitutes the application's a part, does not constitute to improper qualification of the present invention, in the accompanying drawings:
Fig. 1 is the pcb board structural representation of existing band blind hole;
Fig. 2 is a pcb board structural representation of the present invention.
Diagram:
10, plate body 11, ground floor wiring board
12, second layer wiring board 13, the 3rd layer of wiring board
111, first line layer 121, second line layer
131, tertiary circuit layer 20, blind hole
30, hole copper
Embodiment
To combine accompanying drawing and practical implementation method to specify the present invention below, be used for explaining the present invention in schematic enforcement of the present invention and explanation, but not as to qualification of the present invention.
Embodiment 1:
As shown in Figure 2; The invention discloses a kind of high reliability pcb board; It still comprises plate body 10 and is opened in the blind hole 20 on the plate body 10, on the sidewall of blind hole 20, adheres to porose copper 30, the situation of the three ply board that schematically drawn among the figure; As shown in the figure, plate body 10 comprises ground floor wiring board 11 stacked together, second layer wiring board 12 and the 3rd layer of wiring board 13.Realize that for knowing clearly the opening that better is electrically connected performance blind hole 20 that has between each layer wiring board is horn-like, the hole body of blind hole 20 is straight-tube shape, V-shaped shape at the bottom of the hole of blind hole 20.
As shown in Figure 2, the upper shed diameter L1 of the loudspeaker opening portion of blind hole 20 is 44 ± 6 Mills (mil).
As shown in Figure 2, the angle β between relative two buses of the loudspeaker opening portion of blind hole 20 is 90 degree.
As shown in Figure 2, the internal diameter L2 of the straight-tube shape hole body part of blind hole 20 is 24 ± 3.2 Mills (mil).
As shown in Figure 2, it is 130 degree that the angle δ between relative two buses is divided in the V-shape hole bottom of blind hole 20.
A kind of processing method of processing aforesaid high reliability pcb board may further comprise the steps:
Use first tapered bur on the plate body of pcb board, to get out its straight-tube shape hole body part and V-shape hole bottom branch, the said first taper brick is to bore body brill cylindrical, that the end is back taper to chew;
Go out its loudspeaker opening with the upper shed part counterboring of second tapered bur body part in its straight-tube shape hole again and form its blind hole, said second tapered bur is that the lower end is that the brill of back taper is chewed, and the diameter of said second tapered bur is bigger than the diameter of first tapered bur;
Deposition hole copper in said blind hole.
Detailed test is processed points for attention, processing result etc. as follows:
Before boring, on a false plate, adjust parameter values such as drilling depth through test drilling earlier, must transfer the Z value of first and second time boring when boring test plate (panel) adjustment Z value respectively;
Plate all must not take off when holing several times, produces off normal when avoiding holing;
Must adjust the Z value during each time boring, to guarantee drilling depth;
Fold for one one during boring, can not use aluminium flake above, otherwise can cause the aluminium powder consent easily;
That one side of bellmouth must be to transferring plate when sinking the copper nog plate, and nog plate speed: 1.5m/min is to guarantee that dust cleans up in the bellmouth;
Plate must tiltedly be hung when heavy copper, turmeric, and that placement that faces down of bellmouth is to avoid the built-in liquid medicine in hole;
Must adopt low current density when plate electricity and figure electricity, the mode of prolongation electroplating time is produced, and is respectively 60min and 120min program and produces.
The model drilling parameter is following:
Rig is selected: the rig 2# of Hitachi main shaft; The chock plate is the new chock plate of 12mm;
0.70mm*130 spend that common brill is chewed, the tapered bur of 1.5mm*90 degree is chewed, the forsner bit of 1.20mm*165 degree chews its brill and chew collar height and must be consistent; The collar degree of depth remains on 20.5mm;
The boring manufacturing parameter
| Brill is chewed type | Rotating speed | Following cutter speed | Return cutter speed | The Z value |
| 0.70mm*130 spending common brill chews | 71,000 rev/mins | 60 | 80 | 12.17 |
| 1.5mm*90 the tapered bur of degree is chewed | 71,000 rev/mins | 60 | 80 | 12.48 |
| 1.20mm*165 the forsner bit of degree is chewed | 71,000 rev/mins | 60 | 80 | 12.17 |
Test result
Model qualification rate E-TEST testing yield is 98% (pressing SET calculates), and the FQC appearance yield is 96%,
Bellmouth test result such as following table:
Therefore, through bad problems of conduction such as the hole copper fractures that improved of the present invention, improved the reliability of PCB.
More than the technical scheme that the embodiment of the invention provided has been carried out detailed introduction; Used concrete example among this paper the principle and the execution mode of the embodiment of the invention are set forth, the explanation of above embodiment only is applicable to the principle that helps to understand the embodiment of the invention; Simultaneously, for one of ordinary skill in the art, according to the embodiment of the invention, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (6)
1. a high reliability pcb board comprises plate body (10) and is opened in the blind hole (20) on the said plate body (10), on the sidewall of said blind hole (20), adheres to porose copper (30), it is characterized in that:
The opening of said blind hole (20) is horn-like, and the hole body of said blind hole (20) is straight-tube shape, V-shaped shape at the bottom of the hole of said blind hole (20).
2. high reliability pcb board according to claim 1 is characterized in that:
The upper shed diameter of said loudspeaker opening portion is 44 ± 6 Mills (mil).
3. high reliability pcb board according to claim 1 is characterized in that:
Angle between relative two buses of said loudspeaker opening portion is 90 degree.
4. high reliability pcb board according to claim 1 is characterized in that:
The internal diameter of said straight-tube shape hole body part is 24 ± 3.2 Mills (mil).
5. high reliability pcb board according to claim 1 is characterized in that:
It is 130 degree that the angle between relative two buses is divided in said V-shape hole bottom.
6. the processing method of a processing high reliability pcb board according to claim 1 is characterized in that, may further comprise the steps:
Use first tapered bur on the plate body of pcb board, to get out its straight-tube shape hole body part and V-shape hole bottom branch, the said first taper brick is to bore body brill cylindrical, that the end is back taper to chew;
Go out its loudspeaker opening with the upper shed part counterboring of second tapered bur body part in its straight-tube shape hole again and form its blind hole, said second tapered bur is that the lower end is that the brill of back taper is chewed, and the diameter of said second tapered bur is bigger than the diameter of first tapered bur;
Deposition hole copper in said blind hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103629261A CN102497724A (en) | 2011-11-16 | 2011-11-16 | PCB with high reliability and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103629261A CN102497724A (en) | 2011-11-16 | 2011-11-16 | PCB with high reliability and processing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102497724A true CN102497724A (en) | 2012-06-13 |
Family
ID=46189499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103629261A Pending CN102497724A (en) | 2011-11-16 | 2011-11-16 | PCB with high reliability and processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102497724A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211592A (en) * | 2016-08-31 | 2016-12-07 | 奥士康科技股份有限公司 | A kind of method for designing about ink plugging instrument |
| CN110785014A (en) * | 2019-10-31 | 2020-02-11 | 珠海精毅电路有限公司 | Circuit board manufacturing process |
| CN111052879A (en) * | 2017-08-29 | 2020-04-21 | 京瓷株式会社 | Circuit board and electronic device including the same |
| CN114449763A (en) * | 2021-12-31 | 2022-05-06 | 广东兴达鸿业电子有限公司 | Production method for non-metallization of bottom of metallized countersunk hole |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05299838A (en) * | 1991-06-12 | 1993-11-12 | Toshiba Corp | Method for manufacturing multilayer printed wiring board |
| JPH09331155A (en) * | 1996-06-10 | 1997-12-22 | Elna Co Ltd | Multilayer printed-wiring board and manufacture thereof |
| US20090211799A1 (en) * | 2008-02-22 | 2009-08-27 | Tdk Corporation | Printed wiring board and manufacturing method therefor |
| CN101772279A (en) * | 2009-12-21 | 2010-07-07 | 艾默生网络能源有限公司 | Method for manufacturing PCB plate with blind holes |
-
2011
- 2011-11-16 CN CN2011103629261A patent/CN102497724A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05299838A (en) * | 1991-06-12 | 1993-11-12 | Toshiba Corp | Method for manufacturing multilayer printed wiring board |
| JPH09331155A (en) * | 1996-06-10 | 1997-12-22 | Elna Co Ltd | Multilayer printed-wiring board and manufacture thereof |
| US20090211799A1 (en) * | 2008-02-22 | 2009-08-27 | Tdk Corporation | Printed wiring board and manufacturing method therefor |
| CN101772279A (en) * | 2009-12-21 | 2010-07-07 | 艾默生网络能源有限公司 | Method for manufacturing PCB plate with blind holes |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211592A (en) * | 2016-08-31 | 2016-12-07 | 奥士康科技股份有限公司 | A kind of method for designing about ink plugging instrument |
| CN106211592B (en) * | 2016-08-31 | 2019-01-29 | 奥士康科技股份有限公司 | A kind of design method about ink plugging tool |
| CN111052879A (en) * | 2017-08-29 | 2020-04-21 | 京瓷株式会社 | Circuit board and electronic device including the same |
| CN111052879B (en) * | 2017-08-29 | 2023-03-31 | 京瓷株式会社 | Circuit board and electronic device provided with same |
| CN110785014A (en) * | 2019-10-31 | 2020-02-11 | 珠海精毅电路有限公司 | Circuit board manufacturing process |
| CN114449763A (en) * | 2021-12-31 | 2022-05-06 | 广东兴达鸿业电子有限公司 | Production method for non-metallization of bottom of metallized countersunk hole |
| CN114449763B (en) * | 2021-12-31 | 2023-12-29 | 广东兴达鸿业电子有限公司 | Production method for non-metallization of bottom of metallized counter bore |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102497724A (en) | PCB with high reliability and processing method thereof | |
| CN104717845A (en) | Technological method for outer layer circuit board resin hole plugging of multi-layer circuit board | |
| CN101861055B (en) | A kind of PCB board processing technology method | |
| CN111417262A (en) | Method for manufacturing deep micro-via hole | |
| CN110719690A (en) | High speed multi-layer PCB stack and routing method | |
| CN107124821A (en) | A kind of via and its manufacture method and printed circuit board | |
| CN104105339A (en) | Via hole anti-pad | |
| CN202565569U (en) | High-reliability PCB | |
| CN103889147A (en) | Machining method of PCB stepped plate and PCB stepped plate | |
| CN107466161A (en) | A kind of method for hollowing out copper foil at differential pair via | |
| CN105430906B (en) | A kind of boring method of circuit board | |
| CN101877945B (en) | Method for removing via stub and PCB designed by using the method | |
| CN106132082A (en) | A kind of LED circuit board of side paster and preparation method thereof | |
| CN103841755A (en) | Method for reducing via stub and printing circuit board designed by using the method | |
| CN104080279A (en) | Method for machining PCB through hole | |
| CN103929878A (en) | A PCB substrate plug hole manufacturing method and its structure | |
| CN105101649B (en) | A kind of multi-layer PCB board shooting method | |
| CN207475997U (en) | A kind of thickness copper printed circuit board | |
| CN112019456A (en) | Gigabit Switching System | |
| CN110121236A (en) | A kind of double-side plug-in wiring board and manufacturing method | |
| CN205852927U (en) | A kind of boring composing structure of high-frequency high-speed wiring board | |
| CN205430783U (en) | Hole metallization hydrocarbon pottery high frequency multilayer backplate | |
| CN205902197U (en) | Novel thick copper buried via hole multilayer circuit board | |
| CN108712817A (en) | A kind of wireless charging FPC multi-layer boards and its manufacture craft | |
| CN106332455A (en) | Machine drilling big-hole lead hole adding technology |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120613 |