CN102701774B - Thermosetting adhesive adhering and curing device - Google Patents

Abstract

The invention discloses a thermosetting adhesive adhering and curing device, which comprises a pedestal and an ultrasonic vibration apparatus and a gas liquid mixing apparatus arranged in the pedestal. The ultrasonic vibration apparatus includes an elastic plate and a piezoelectric ceramic sheet, the piezoelectric ceramic sheet is arranged at the lower surface of the elastic plate, a base body support pad is arranged at the upper surface of the elastic plate, and the upper surface of the base body support pad is provided with a base body holding groove. The gas liquid mixing apparatus is arranged on the base body support pad and includes a shell having a gas inlet pipe and a gas outlet pipe, liquid is arranged in the shell, a high temperature gas for raising the temperature of the liquid to the boiling point is introduced into the gas inlet pipe, and a flow control valve is arranged on both the gas inlet pipe and the gas outlet pipe. Compared with prior arts, the inventive device can satisfy the requirements for constant temperature, constant pressure, given duration time and uniform adhering required by adhering and curing between the base bodies through thermosetting adhesive and realize mass production of base body adhering.

Description

Heat curing adhesive paste curing device

Technical field:

The invention relates to a thermosetting adhesive pasting curing device, which belongs to the technical field of thermosetting adhesive pasting.

Background technique:

 Heat-curing adhesive is an adhesive for bonding between substrates. Because the heat-curing adhesive has strong adhesion to metal, the cured adhesive layer has good water resistance, oil resistance, temperature resistance, aging resistance, no deterioration, no precipitation and agglomeration, and can be heated by drying tunnel or oven For bonding, the injection method can be machine injection or manual injection, so it is widely used as an ideal adhesive for metal, ceramic and other substrates. The two substrates are bonded by heat-curing adhesive, which needs to be cured for a period of time under a certain temperature and pressure to achieve a firm bond. At present, the processing method after substrate bonding is mainly to cure the thermosetting adhesive at high temperature through an oven or oven, and at the same time apply pressure to the substrate in the oven or oven, so that the substrates can be firmly bonded to each other. However, the temperature of the oven or oven is not easy to control stably, and the pressure fluctuation and unevenness applied to the substrate may easily lead to uneven distribution of the adhesive layer between the mutually bonded substrates on the substrate bonding surface, thereby affecting the bonding strength and uniformity. . Therefore, the present invention aims at this problem, and invents a simple method to obtain the constant temperature and constant pressure required for the substrate to be pasted and cured, so that the adhesive layer is evenly distributed on the surface of the substrate. mass production.

Invention content:

The invention aims to develop a thermal curing adhesive paste curing device, which has the characteristics of constant temperature, constant pressure and uniform distribution of adhesive layers required for curing.

The heat-curing adhesive bonding and curing device of the present invention includes a base and an ultrasonic vibration device and a gas-liquid mixing device arranged in the base, and is characterized in that: the ultrasonic vibration device includes an elastic plate and a piezoelectric ceramic sheet, and the The piezoelectric ceramic sheet is arranged on the lower surface of the elastic plate, a substrate support pad is placed on the upper surface of the elastic plate, and the upper surface of the substrate support pad is provided with a substrate placement groove; the gas-liquid mixing device is provided On the base support pad, the gas-liquid mixing device includes a shell with an air inlet pipe and an air outlet pipe, and a liquid is arranged in the shell, and a high-temperature gas that makes the liquid reach the boiling point is introduced into the air inlet pipe, and in the Both the air inlet pipe and the air outlet pipe are provided with flow control valves.

The base supporting pad is a rubber pad.

The bottom plate of the shell is a rubber plate.

The elastic plate is integrally formed with the base.

The piezoelectric ceramics of the device of the present invention are pasted on the elastic plate of the ultrasonic vibration device, and the vibration is generated after the voltage is applied to make the upper surface of the elastic plate vibrate uniformly and continuously with a slight amplitude, and the upper surface of the elastic plate, the piezoelectric ceramic sheet group and the base are processed. The formed grooves together constitute the ultrasonic vibration groove; the rubber pad is placed in the ultrasonic vibration groove, and the substrate pasted by the heat-curing glue is placed in the substrate placement groove formed by the surface processing of the rubber pad; the gas-liquid mixing is performed by an external steam device The steam inlet pipe installed in the device inputs steam, and forms a gas-liquid mixture in the inner cavity of the gas-liquid mixing device, and part of the steam is output from the gas outlet pipe and enters the external steam device for circulation. After a certain period of steam cooling and circulation, the gas-liquid mixing device The temperature of the gas-liquid mixture in the inner cavity reaches the boiling point of liquid vaporization and can be kept constant; the gas-liquid mixing device is placed above the rubber pad to apply pressure to the substrate and adjust the steam input gas-liquid mixing through the flow regulating valve The amount of the device can be controlled. The total weight of the gas-liquid mixing device remains constant, so a constant pressure can be provided on the substrate. In addition, the composition of impurities contained in the steam can be adjusted according to the temperature required for the curing of the heat-curing adhesive to provide Constant temperature; due to the continuous slight vibration of the elastic plate, the adhesive layer between the substrates is evenly distributed on the bonding surface of the substrate; increasing the groove of the rubber pad according to actual needs can realize the mass production of the substrate adhesive curing.

Description of drawings:

Fig. 1 is a structural representation of the device of the present invention.

Fig. 2 is a schematic diagram of the connection between the base and the elastic plate of the present invention.

Fig. 3 is a schematic diagram of the structure of the ultrasonic vibration device of the present invention.

Fig. 4 is a schematic diagram of the structure of the support pad.

Figure 5 is a schematic diagram of the gas-liquid mixing device.

Among them: 1. Base, 2. Ultrasonic vibration groove, 3. Elastic plate, 4. Substrate support pad, 5. Substrate placement groove, 6. Rubber shell, 7. Inlet pipe, 8. Outlet pipe, 10. Steam bubble, 11. Gas-liquid mixture, 12. Internal cavity.

Detailed ways:

The present invention will be described in detail below in conjunction with the accompanying drawings. The thermosetting adhesive curing device of the present invention, as shown in FIG. The structure of the ultrasonic vibration device is shown in FIG. 3 , which is composed of an elastic plate 3 and a piezoelectric ceramic sheet 9 . The structure of the gas-liquid mixing device is shown in Figure 5, which consists of a casing 6, an air inlet pipe 7, an air outlet pipe 8, and a gas-liquid mixture 11, wherein the casing 6 can be made of rubber. The ultrasonic vibrating device is fixed on the upper end of the base 1, and forms an ultrasonic vibrating groove 2 with the groove formed on the upper surface of the base 1. Groove, the upper surface of the groove is the lower surface of the elastic plate 3, and the piezoelectric ceramic sheet 9 is pasted on the lower surface of the elastic plate 3. It is also possible to place a layer of substrate support pad 4 on the elastic plate. The substrate support pad 4 is preferably a rubber pad, and several substrate placement grooves 5 are formed on the upper surface of the rubber pad. After the gas-liquid mixing device is input with steam, after the temperature and total weight of the whole device are constant, it is placed on the viscose substrate that has been placed in the groove on the surface of the rubber pad.

The present invention uses the inverse piezoelectric effect of piezoelectric ceramics to excite the elastic plate in the ultrasonic vibration device to perform reciprocating micro-amplitude vibration, forms a vibration plane on the surface of the elastic plate, and transmits the micro-amplitude vibration of the vibration plane to the place via the rubber pad. The viscose matrix in the groove of the rubber pad makes the adhesive layer between the viscose matrix evenly distributed on the pasting surface; secondly, the steam is input into the gas-liquid mixing device to apply a constant pressure to the viscose matrix to provide thermal curing. The continuous pressure required by the glue in the process of sticking the substrate, and at the same time compress and evenly distribute the thickness of the adhesive layer between the adhesive substrates. In addition, the inner cavity of the gas-liquid mixing rubber device is filled with steam and liquid gas-liquid mixture. At this time, the inner cavity The temperature is the boiling point of the liquid, which provides a constant temperature for the curing of the heat-curing adhesive; finally, increasing the structural size ratio of the curing device and processing several grooves on the surface of the rubber pad can realize the mass production of the base adhesive. Therefore, the thermosetting glue curing device proposed by the present invention has the following characteristics:

(1) To provide a constant temperature for the curing of the heat-curing adhesive of the substrate adhesive layer. The temperature is changed from steam to liquid after cooling, and then determined by the boiling point of liquid vaporization. The temperature change can be adjusted by adding impurities to the steam or liquid;

(2) Control the total weight of the rubber device by adjusting the flow control valve to adjust the amount of steam input and output gas-liquid mixing rubber device, and provide a constant external pressure for the curing of the heat-curing glue;

(3) The continuous micro-vibration in the ultrasonic vibration tank is transmitted to the viscose matrix through the rubber pad, which can make the glue layer on the pasting surface of the matrix evenly distributed on the pasting surface, greatly reducing the uneven distribution of the glue layer between the mutually bonded substrates. probability of falling out;

(4) According to the needs of actual working conditions, by increasing the structural design ratio of the curing device and increasing the number of processing grooves on the surface of the rubber pad, mass production of the adhesive matrix can be realized.

The following will be described with specific examples. A piezoelectric vibrator is a device that captures or dissipates energy formed by pasting an elastomer material and a piezoelectric ceramic sheet. Many studies on piezoelectric devices are related to piezoelectric vibrators. How to make piezoelectric vibrators have better performance has become one of the key issues in the breakthrough of piezoelectric device technology. One of the reasons for the performance degradation of the piezoelectric vibrator is the problem of poor bonding between the elastomer and the piezoelectric ceramic sheet using a thermosetting adhesive. At present, the bonding of piezoelectric vibrators in the way of drying tunnels or ovens will inevitably lead to the results of falling off between the elastomer and the piezoelectric ceramic sheet, excessive thickness of the adhesive layer, and poor curing effect. The curing device can avoid this phenomenon. The continuous micro-vibration of the ultrasonic vibration tank makes the adhesive layer between the elastic body and the piezoelectric ceramic evenly distributed on the bonding surface of the two, which can avoid the interruption and discontinuity of the adhesive layer; secondly, the gas-liquid mixing rubber device is a press The sticking of the electric vibrator provides constant pressure and temperature, which can avoid the phenomenon that the adhesive layer is too thick and the curing effect is poor; finally, a large number of piezoelectric vibrator placement slots are processed on the rubber pad, which can greatly shorten the batch bonding of piezoelectric vibrators. The total time of the whole batch of piezoelectric devices can be mass-produced.

Claims (4)

1. a heat-curable glue is pasted solidification equipment, comprise pedestal (1) and be arranged on pedestal (1) interior ultrasonic vibration installation and Liqiud-gas mixing device, it is characterized in that: described ultrasonic vibration installation comprises elastic plate (3) and piezoelectric ceramic piece (9), described piezoelectric ceramic piece (9) is arranged on the lower surface of described elastic plate (3), upper surface at described elastic plate (3) is placed with matrix supporting pad (4), and the upper surface of matrix supporting pad (4) is provided with matrix standing groove (5); Described Liqiud-gas mixing device is arranged on described matrix supporting pad (4), Liqiud-gas mixing device comprises the shell (6) of have inlet pipe (7) and escape pipe (8), be provided with liquid in shell (6), pass into the high-temperature gas that makes described liquid arrive boiling point in described inlet pipe (7), be provided with flowrate control valve on described inlet pipe (7) and escape pipe (8).

2. heat-curable glue according to claim 1 is pasted solidification equipment, and it is characterized in that: described matrix supporting pad is rubber pad.

3. heat-curable glue according to claim 1 and 2 is pasted solidification equipment, and it is characterized in that: the base plate of described shell (6) is rubber plate.

4. heat-curable glue according to claim 3 is pasted solidification equipment, it is characterized in that: described elastic plate (3) is one-body molded with described pedestal (1).

Images