CN102768972A - Wafer drying device - Google Patents

Abstract

The invention discloses a wafer drying device. The wafer drying device includes: a body; a wafer clamping mechanism, which is arranged on the body to support a vertically oriented wafer; a water tank, which can move up and down Provided on the body, the top wall of the water tank is provided with a notch penetrating the top wall in the up and down direction for passing the wafer; the water tank driver, the water tank driver is arranged on the body and is connected with The water tank is connected so as to drive the water tank to move up and down; and an IPA drying system, the IPA drying system is arranged on the water tank for drying the wafer. The wafer drying device according to the embodiment of the present invention has the advantages of low manufacturing difficulty, low manufacturing cost, high reliability, etc., and greatly reduces the requirement on repeat positioning accuracy of the manipulator used to transport the wafer.

Description

Wafer Drying Unit

technical field

The invention relates to the field of semiconductor manufacturing, in particular to a wafer drying device.

Background technique

The existing wafer drying device adopts the technology of spinning and drying. However, the wafer needs to be rotated at a high speed, and a drying process will be added at the same time, which will affect the overall stability of the wafer, and even damage the wafer in severe cases. At the same time, the high-speed rotation of the turntable will also accelerate the loss of mechanical equipment.

Contents of the invention

The present invention aims at solving one of the above technical problems at least to a certain extent or at least providing a useful commercial choice. Therefore, an object of the present invention is to provide a wafer drying device that can greatly reduce the requirement on repeat positioning accuracy of a manipulator used to transfer wafers.

In order to achieve the above object, a wafer drying device is proposed according to an embodiment of the present invention, the wafer drying device includes: a body; a wafer clamping mechanism, the wafer clamping mechanism is arranged on the body for Supporting the wafer oriented in the vertical direction; the water tank, the water tank is arranged on the body so that it can move up and down, and the top wall of the water tank is provided with a notch penetrating the top wall in the up and down direction for passing the wafer circle; the water tank driver, the water tank driver is located on the body and is connected with the water tank so as to drive the water tank to move up and down; and the IPA drying system, the IPA drying system is located on the water tank for drying the wafer.

According to the wafer drying device according to the embodiment of the present invention, the water tank driver is provided on the body to drive the water tank to move up and down, so that the wafer can be kept still when the wafer is dried. The water tank moves up and down, which can greatly reduce the accuracy requirements of the lifting movement (ie, up and down movement), thereby not only greatly reducing the processing accuracy of the wafer drying device and the difficulty of installing and debugging the wafer drying device , and can make the wafer drying device operate smoothly during operation. Therefore, the wafer drying device according to the embodiment of the present invention has the advantages of low manufacturing difficulty, low manufacturing cost, and high reliability.

Moreover, since the wafer remains stationary while the water tank 30 moves up and down when the wafer is dried, the requirements for repeat positioning accuracy of the manipulator used to transport the wafer can be greatly reduced, thereby The manipulator can grasp the wafer better and more accurately, ensuring the overall stability of the wafer.

In addition, the wafer drying device according to the above-mentioned embodiments of the present invention may also have the following additional technical features:

According to an embodiment of the present invention, the wafer clamping mechanism includes: a bracket, the bracket is arranged on the body; a lower clamping claw bracket, the lower clamping claw bracket is L-shaped, and the lower clamping The vertical leg of the claw-holding bracket is connected with the support and the lower end of the vertical leg stretches into the water tank; the first and second upper clamping claws; the upper clamping claw driver, the upper clamping claw a driving member is provided on one of the bracket and the lower clamping jaw bracket and is connected with the first and second upper clamping jaws so as to drive the first and second upper clamping jaws to move up and down; and a lower clamping jaw provided on a horizontal leg of the lower clamping jaw bracket, wherein the lower clamping jaw cooperates with the first and second upper clamping jaws to support the wafer and orienting the wafer in a vertical direction. The wafer clamping mechanism has the advantage of simple structure. Moreover, by setting the lower clamping claw, the first upper clamping claw and the second upper clamping claw, the wafer clamping mechanism can not only clamp the wafer more stably, but also The wafer can be positioned more precisely in the vertical direction so that the wafer can be dried better.

According to an embodiment of the present invention, the width of the slot is adapted to the thickness of the wafer. In this way, the notch can be used to clamp the wafer when the water tank immerses the wafer.

According to an embodiment of the present invention, the water tank is provided with a water inlet and a water outlet, and the water inlet is suitable for being connected with a water source. By setting the water outlet and the water inlet connected to the water source on the water tank, water can be injected into the water tank from the water inlet and discharged from the water tank through the water outlet. In other words, the water in the water tank can always be in a circulating state, so that the water in the water tank can be kept clean, and the cleanliness of the wafer can be greatly improved.

According to an embodiment of the present invention, the IPA drying system includes first and second pipelines, the first and second pipelines are spaced apart in the axial direction of the wafer, and the first and second A portion of each of the pipes is located within the tank and another portion protrudes from the tank, wherein the portion of the first pipe is provided with a first nozzle and the portion of the second pipe is provided with a A second nozzle to spray IPA vapor to both surfaces of the wafer. The IPA drying system has the advantage of simple structure.

According to an embodiment of the present invention, the first pipeline is parallel to the second pipeline, the first nozzles are equidistantly arranged on the first pipeline and the second nozzles are equidistantly arranged on the on the second pipe. In this way, the IPA drying system can spray IPA steam onto the two surfaces of the wafer more evenly, so that the two surfaces of the wafer can be dried more evenly so as to avoid the surface of the wafer There are water marks.

According to an embodiment of the present invention, the water tank driving part includes: a driving motor, the driving motor is arranged on the body; and a ball screw, the screw of the ball screw is connected with the driving motor, the The nut of the ball screw is connected with the water tank. By using the ball screw to drive the water tank to move up and down, the water tank can be moved up and down at a uniform speed, which can not only greatly improve the stability of the wafer drying device during operation, but also more evenly Both surfaces of the wafer are dried in order to avoid water marks on the surface of the wafer.

According to an embodiment of the present invention, the wafer drying device further includes a water tank support, the water tank is arranged on the water tank support, wherein the water tank driving member is connected with the water tank support so as to drive the water tank support and the water tank support. The water tank moves up and down. By setting the water tank bracket, the water tank driving part can be directly connected with the water tank bracket and drive the water tank to move up and down through the water tank bracket, so as to avoid damage to the water tank and improve the service life of the water tank .

According to an embodiment of the present invention, the water tank support includes: a horizontal plate on which the water tank is set; and a vertical plate A plate extends upwardly, and the vertical plate is connected to the tank drive. The water tank bracket has the advantage of simple structure.

According to an embodiment of the present invention, the wafer drying device further includes a ball guide rail, the guide rail of the ball guide rail is arranged on the body and extends in the vertical direction, and the slider of the ball guide rail is arranged on the vertical board. By providing the ball guide rail having a guide rail extending in the vertical direction, the water tank bracket and the water tank can be moved in the vertical direction more precisely.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and comprehensible from the description of the embodiments in conjunction with the following drawings, wherein:

1 is a schematic structural view of a wafer drying device according to an embodiment of the present invention;

2 is a schematic structural view of a wafer drying device according to an embodiment of the present invention; and

FIG. 3 is a cross-sectional view of a wafer drying apparatus according to an embodiment of the present invention.

Detailed ways

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation or position indicated by "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. The relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, therefore It should not be construed as a limitation of the present invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

A wafer drying apparatus 1 according to an embodiment of the present invention will be described below with reference to FIGS. 1 to 3 . As shown in FIGS. 1 to 3 , a wafer drying device 1 according to an embodiment of the present invention includes a body 10 , a wafer clamping mechanism, a water tank 30 , a water tank driver 40 and an IPA drying system 50 .

The wafer clamping mechanism is provided on the body 10 to support a wafer oriented in a vertical direction (the vertical direction A is shown as the arrow direction in FIGS. 1 to 3 , wherein the vertical direction is the same as the up and down direction) 2. The water tank 30 is provided on the body 10 so as to be movable up and down, and the top wall 32 of the water tank 30 is provided with a notch 31 penetrating the top wall 32 in the vertical direction for passing the wafer 2 . The water tank driving part 40 is arranged on the body 10, and the water tank driving part 40 is connected with the water tank 30 so as to drive the water tank 30 to move up and down. The IPA drying system 50 is provided on the water tank 30 for drying the wafer 2 .

The process of drying a wafer 2 using a wafer drying device 1 according to an embodiment of the present invention will be described below with reference to FIGS. 1 to 3 . Firstly, the manipulator (not shown in the figure) transports the undried wafer 2 to the wafer clamping mechanism, and then the water tank driver 40 drives the water tank 30 to move upward until the water in the water tank 30 fully covers the wafer 2 Immersion (the wafer 2 enters the water tank 30 from the slot 31 ). Then the water tank driver 40 drives the water tank 30 to move downwards. When the upper end of the wafer 2 is exposed to the water surface, the IPA drying system 50 is used to dry the wafer 2 until the wafer 2 is completely exposed to the water surface. dry. The dried wafer 2 is transported away from the wafer clamping mechanism by the manipulator.

According to the wafer drying device 1 of the embodiment of the present invention, the water tank driver 40 for driving the water tank 30 to move up and down is provided on the body 10, so that the water tank 30 can be moved up and down while the wafer 2 is dried while keeping the wafer 2 still. , which can greatly reduce the accuracy requirements for the lifting motion (that is, up and down motion), so that not only can the processing accuracy of the wafer drying device 1 and the difficulty of installing and debugging the wafer drying device 1 be greatly reduced, but also the wafer can be dried The device 1 moves smoothly during operation. Therefore, the wafer drying device 1 according to the embodiment of the present invention has the advantages of low manufacturing difficulty, low manufacturing cost, and high reliability.

Moreover, since the wafer 2 remains stationary and the water tank 30 moves up and down when the wafer 2 is dried, the requirements for repeat positioning accuracy of the manipulator for carrying the wafer 2 can be greatly reduced, so that the manipulator can Grasping the wafer 2 better and more precisely ensures the overall stability of the wafer 2 .

As shown in Figures 1 to 3, in some embodiments of the present invention, the wafer clamping mechanism may include a bracket 21, a lower clamping jaw bracket 22, a first upper clamping jaw 23, a second upper clamping jaw Jaw 24 , upper clamping jaw driver 25 and lower clamping jaw 26 .

The bracket 21 can be provided on the body 10 . The lower clamping claw support 22 can be L-shaped, and the vertical limb 221 of the lower clamping claw support 22 can link to each other with the support 21, and the lower end of the vertical limb 221 can stretch into the water tank 30 (the top wall 32 of the water tank 30 can There is a through hole penetrating the top wall 32 in the vertical direction for passing the lower end of the vertical limb 221 ). The upper clamping jaw driver 25 can be located on one of the bracket 21 and the lower clamping jaw bracket 22, and the upper clamping jaw driver 25 can be connected with the first upper clamping jaw 23 and the second upper clamping jaw 24 In order to drive the first upper clamping claw 23 and the second upper clamping claw 24 to move up and down. The lower clamping claw 26 can be provided on the horizontal limb 222 of the lower clamping claw bracket 22, wherein the lower clamping claw 26 can cooperate with the first upper clamping claw 23 and the second upper clamping claw 24 to support the wafer 2 and can hold the wafer 2. Wafer 2 is oriented in a vertical direction.

Advantageously, the lower ends of the vertical limbs 221 can extend into the water tank 30, so that the horizontal limbs 222 can all be arranged in the accommodating cavity of the water tank 30, so that the top wall of the water tank 30 can be provided with the upper and lower sides that pass through the water tank 30. The through hole of the top wall is used to pass the vertical limb 221, and the through hole can be adapted to the lower end of the vertical limb 221

The wafer clamping mechanism has the advantage of simple structure. Moreover, the wafer clamping mechanism can not only clamp the wafer 2 more stably by setting the lower clamping claws 26, the first upper clamping claws 23 and the second upper clamping claws 24, but also more precisely Positioning the wafer 2 in a vertical direction allows for better drying of the wafer 2 . Specifically, the upper clamping claw driving member 25 may be an air cylinder, and the upper clamping claw driving member 25 may also be an electric cylinder.

In one embodiment of the present invention, the width of the notch 31 can be adapted to the thickness of the wafer 2 , so that the notch 31 can be used to clamp the wafer 2 when the water tank 30 immerses the wafer 2 . Advantageously, the notch 31 can be a rectangular notch, and the length of the notch 31 can be much larger than the width of the notch 31 .

Specifically, when the water tank driver 40 drives the water tank 30 to move upward and the lower end of the wafer 2 enters the water tank 30, the upper clamping claw driver 25 can drive the first upper clamping claw 23 and the second upper clamping claw 24 to disengage the wafer. The circle 2 moves upwards so that the wafer 2 can be completely submerged in the water in the water tank 30, at this time the notch 31 and the lower clamping claw 26 can cooperate to support the wafer 2 and can orient the wafer 2 in a vertical direction. When the water tank driver 40 drives the water tank 30 to move downward and the upper part of the wafer 2 stretches out of the water tank 30, the upper clamping claw driver 25 can drive the first upper clamping claw 23 and the second upper clamping claw 24 to move downward. In order to make the first upper clamping claw 23 and the second upper clamping claw 24 cooperate with the lower clamping claw 26 to support the wafer 2 and orient the wafer 2 along the vertical direction.

The pick-and-place process of the wafer 2 is described below with reference to FIGS. 1 to 3 . When placing the wafer 2, first the upper clamping claw driver 25 can be used to drive the first upper clamping claw 23 and the second upper clamping claw 24 to move upwards so as to avoid the wafer 2, and then the manipulator can be used to move the wafer 2 The circle 2 is transported to the lower clamping jaw 26 (the lower clamping jaw 26 clamps the wafer 2), and then the upper clamping jaw driver 25 can be used to drive the first upper clamping jaw 23 and the second upper clamping jaw 24 to Move down so that the first upper clamping claw 23 and the second upper clamping claw 24 cooperate with the lower clamping claw 26 to support the wafer 2 and orient the wafer 2 in the vertical direction, and finally the manipulator breaks away from the wafer 2 and reset. The process of taking out the wafer 2 is opposite to the process of placing the wafer 2 and will not be described in detail here.

Advantageously, the water tank 30 can be provided with a water inlet and a water outlet, and the water inlet can be adapted to be connected with a water source. By setting the water outlet and the water inlet connected to the water source on the water tank 30 , water can be injected into the water tank 30 from the water inlet and discharged from the water tank 30 through the water outlet. In other words, the water in the water tank 30 can always be in a circulating state, so that the water in the water tank 30 can be kept clean, and the cleanliness of the wafer 2 can be greatly improved. Specifically, the water in the water tank 30 may be deionized water.

As shown in Figures 1 to 3, in some examples of the present invention, the IPA drying system 50 may include a first pipeline 51 and a second pipeline 52, and the first pipeline 51 and the second pipeline 52 may be arranged in the axial direction of the wafer 2. Set apart from each other, a part of each of the first pipeline 51 and the second pipeline 52 can be located in the water tank 30, and the other part of each of the first pipeline 51 and the second pipeline 52 can extend out of the water tank 30 ( The other part of each of the first pipeline 51 and the second pipeline 52 can be connected with the IPA steam generator), wherein the part of the first pipeline 51 (that is, the part of the first pipeline 51 located in the water tank 30) can be The first nozzle is provided and the part of the second pipeline 52 (that is, the part of the second pipeline 52 located in the water tank 30 ) may be provided with a second nozzle so as to spray IPA (isopropanol) to the two surfaces of the wafer 2. )steam. The IPA drying system 50 has the advantage of simple structure.

In a specific example of the present invention, the first pipe 51 may be parallel to the second pipe 52, the first nozzles may be equidistantly arranged on the first pipe 51 and the second nozzles may be equidistantly arranged on the second pipe 52. On the second pipeline 52 . In other words, there may be multiple first nozzles and the multiple first nozzles may be equidistantly arranged on the first pipe 51, and there may be multiple second nozzles and the multiple second nozzles may be equally spaced. It is arranged at intervals on the second pipe 52 . In this way, the IPA drying system 50 can spray the IPA steam onto the two surfaces of the wafer 2 more evenly, so that the two surfaces of the wafer 2 can be dried more evenly so as to avoid leaving water marks on the surface of the wafer 2 .

Advantageously, both ends of the first pipeline 51 can extend out of the water tank 30 (that is, the middle part of the first pipeline 51 can be located in the water tank 30) and both ends of the first pipeline 51 can be connected with the IPA steam generator, and the second pipeline 52 Both ends of the second pipeline 52 can extend out of the water tank 30 (that is, the middle part of the second pipeline 52 can be located in the water tank 30 ), and both ends of the second pipeline 52 can be connected with the IPA steam generator. That is to say, the IPA steam can enter the first pipeline 51 from both ends of the first pipeline 51 and the IPA steam can enter the second pipeline 52 from both ends of the second pipeline 52 simultaneously. In this way, the IPA drying system 50 can spray the IPA steam onto the two surfaces of the wafer 2 more evenly, so that the two surfaces of the wafer 2 can be dried more evenly so as to avoid leaving water marks on the surface of the wafer 2 .

As shown in FIGS. 1 to 3 , in some embodiments of the present invention, the water tank driving member 40 may include a driving motor 41 and a ball screw 42 . The driving motor 41 can be arranged on the body 10 , the screw 421 of the ball screw 42 can be connected with the driving motor 41 , and the nut 422 of the ball screw 42 can be connected with the water tank 30 . The driving motor 41 can drive the screw rod 421 of the ball screw 42 to rotate, and then the nut 422 of the ball screw 42 can drive the water tank 30 to move up and down. By using the ball screw 42 to drive the water tank 30 to move up and down, the water tank 30 can be moved up and down at a constant speed, which not only can greatly improve the stability of the wafer drying device 1 during operation, but also can more evenly dry the wafer 2. Both surfaces are dried in order to avoid water marks on the surface of wafer 2 (wafer 2 can emerge from the water at a constant speed). The water tank driver 40 can also be an electric cylinder.

In an example of the present invention, as shown in FIG. 1 to FIG. 3 , the wafer drying device 1 may further include a water tank support 60, the water tank 30 may be arranged on the water tank support 60, wherein the water tank driving member 40 may be connected with the water tank support 60 In order to drive the water tank bracket 60 and the water tank 30 to move up and down. By setting the water tank bracket 60, the water tank driver 40 can be directly connected with the water tank bracket 60 and the water tank 30 can be driven to move up and down by the water tank bracket 60, so as to avoid damage to the water tank 30 and improve the service life of the water tank 30. Specifically, the nut 422 of the ball screw 42 can be connected with the water tank bracket 60 . The water tank bracket 60 can be made of metal material, and the water tank 30 can be made of non-metal material (such as plastic).

Optionally, the water tank bracket 60 may include a horizontal plate 61 and a vertical plate 62, and the water tank 30 may be set on the horizontal plate 61 (for example, the water tank 30 may be detachably fixed on the horizontal plate 61 by fasteners (such as screws) ), the vertical plate 62 can be arranged on the horizontal plate 61 , and the vertical plate 62 can extend upward from the horizontal plate 61 , and the vertical plate 62 can be connected with the water tank driving member 40 . The water tank bracket 60 has the advantage of simple structure. Specifically, the nut 422 of the ball screw 42 may be connected to the rear surface of the vertical plate 62 , wherein the rear surface of the vertical plate 62 refers to the surface of the vertical plate 62 away from the water tank 30 .

Advantageously, the water tank bracket 60 may further include a left side panel and a right side panel, each of which may be substantially a right triangle. Wherein, a right-angle side of the left side plate can be connected with the left side of the horizontal plate 61 and another right-angle side of the left side plate can be connected with the left side of the vertical plate 62, and a right-angle side of the right side plate can be connected with the left side of the vertical plate 62. One side may be connected to the right side of the horizontal plate 61 and the other right-angled side of said right side plate may be connected to the right side of the vertical plate 62 .

In an example of the present invention, as shown in FIG. 1 and FIG. 2 , the wafer drying device 1 may further include a ball guide rail 70, the guide rail of the ball guide rail 70 may be arranged on the body 10, and the guide rail of the ball guide rail 70 may be arranged along the upper and lower Extending in the direction, the slider of the ball guide rail 70 can be arranged on the vertical plate 62 . By providing the ball guide rail 70 having a guide rail extending in the vertical direction, the water tank holder 60 and the water tank 30 can be moved in the vertical direction more accurately. Specifically, the slider of the ball guide rail 70 may be connected to the rear surface of the vertical plate 62 .

The wafer drying device 1 according to the embodiment of the present invention has the advantages of low manufacturing difficulty, low manufacturing cost, high reliability, etc., and greatly reduces the requirement for repeat positioning accuracy of the manipulator used to transport the wafer 2 .

In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be construed as limitations to the present invention. Variations, modifications, substitutions, and modifications to the above-described embodiments are possible within the scope of the present invention.

Claims (10)

1. a drying wafer device is characterized in that, comprising:

Body;

Wafer fixture, said wafer fixture are located at and are used to support vertically directed wafer on the said body;

Water tank, said water tank can be located on the said body up or down, and the roof of said water tank is provided with the notch that connects said roof along the vertical direction and is used for through wafer;

Water tank actuator, said water tank actuator are located on the said body and link to each other with said water tank and move up and down so that drive said water tank; With

IPA drying system, said IPA drying system are located at and are used for dry said wafer on the said water tank.

2. drying wafer device according to claim 1 is characterized in that, said wafer fixture comprises:

Support, said is erected on the said body;

Following gripper jaw support, said gripper jaw support down is L shaped, the said vertical limb of gripper jaw support down links to each other with said support and the lower end of said vertical limb is stretched in the said water tank;

Gripper jaw on first and second;

Last gripper jaw actuator, said go up that the gripper jaw actuator is located at that in said support and the said gripper jaw support down one goes up and with said first and second on gripper jaw link to each other so that drive that gripper jaw moves up and down on said first and second; With

Following gripper jaw, said gripper jaw down are located on the horizontal limb of said gripper jaw support down, and said wafer and said wafer is vertically directed is supported in the gripper jaw cooperation on the wherein said gripper jaw and said first and second down.

3. drying wafer device according to claim 1 is characterized in that, the width of said notch and the thickness of said wafer are adaptive.

4. drying wafer device according to claim 1 is characterized in that said water tank is provided with water inlet and delivery port, and said water inlet is suitable for linking to each other with the water source.

5. drying wafer device according to claim 1; It is characterized in that; Said IPA drying system comprises first and second pipelines; Said first and second pipelines said wafer axially on the setting of turning up the soil at interval; Said first and second ducted each parts are positioned at said water tank and another part stretches out said water tank, and the said part that the said part of wherein said first pipeline is provided with first nozzle and said second pipeline is provided with second nozzle so that to two jet surface IPA steam of said wafer.

6. drying wafer device according to claim 5 is characterized in that, said first pipeline is parallel to said second pipeline, and said first nozzle is located on said first pipeline equally spacedly and said second nozzle is located on said second pipeline equally spacedly.

7. drying wafer device according to claim 1 is characterized in that, said water tank actuator comprises:

Drive motors, said drive motors are located on the said body; With

Ball-screw, the screw rod of said ball-screw links to each other with said drive motors, and the nut of said ball-screw links to each other with said water tank.

8. according to each described drying wafer device among the claim 1-7; It is characterized in that; Also comprise tank bracket, said water tank is located on the said tank bracket, and wherein said water tank actuator links to each other with said tank bracket so that drive said tank bracket and said water tank moves up and down.

9. drying wafer device according to claim 8 is characterized in that, said tank bracket comprises:

Level board, said water tank are located on the said level board; With

Vertical plate, said vertical plate is located on the said level board and from said level board and extends upward, and said vertical plate links to each other with said water tank actuator.

10. according to each described drying wafer device among the claim 1-9, it is characterized in that, also comprise spherical guide, the guide rail of said spherical guide is located on the said body and extends along the vertical direction, and the slide block of said spherical guide is located on the said vertical plate.

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