CN104347330A - Fuse - Google Patents
Fuse Download PDFInfo
- Publication number
- CN104347330A CN104347330A CN201410327037.5A CN201410327037A CN104347330A CN 104347330 A CN104347330 A CN 104347330A CN 201410327037 A CN201410327037 A CN 201410327037A CN 104347330 A CN104347330 A CN 104347330A
- Authority
- CN
- China
- Prior art keywords
- fuse
- cortina
- insulative substrate
- melting point
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008018 melting Effects 0.000 claims abstract description 126
- 238000002844 melting Methods 0.000 claims abstract description 126
- 239000002184 metal Substances 0.000 claims abstract description 62
- 229910052751 metal Inorganic materials 0.000 claims abstract description 62
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 239000011230 binding agent Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000004020 conductor Substances 0.000 claims abstract description 7
- 239000007769 metal material Substances 0.000 claims abstract description 4
- 238000004544 sputter deposition Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000012528 membrane Substances 0.000 abstract 4
- 238000010438 heat treatment Methods 0.000 description 7
- 238000003466 welding Methods 0.000 description 6
- 238000002788 crimping Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011469 building brick Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
Landscapes
- Fuses (AREA)
Abstract
The invention provides a fuse, fuse materials can be fixed without depending on thickness of electrodes on a basal layer, and the fuse can be minimized and not easy to influenced by heat from the electrodes. The fuse has: an insulating substrate (2); a couple of electrodes (3) formed on the insulating substrate; a band-shaped metal fuse membrane (4), two ends of which are connected with the couple of the electrodes directly or via other conductive materials; and a low-melting-point part (5) disposed to cover at least middle portion of the metal fuse membrane and formed by a metal material with the melting point lower than the metal fuse membrane, wherein the metal fuse membrane has a narrow width portion (4a) formed in a manner of having the width narrower than that of other portions or the electrodes, and the low-melting-point part is formed in a manner of having the width wider than that of the narrow width portion and directly fixed on the insulating substrate via a binder.
Description
Technical field
The present invention relates to a kind of in the electric circuits such as automobile when producing overcurrent or protected the fuse of electronic building brick or circuit etc. during temperature anomaly by fusing with the generation of overcurrent.
Background technology
Usually, in automobile or electronic product etc., fuse is assembled with in order to protecting electronic building brick and circuit etc. under overcurrent and abnormal temperature.Especially in recent years, multiple battery and capacitor in hybrid electric vehicle or electric motor car etc., is equipped with, and also at use fuse in the protective circuit relevant to these.
In the past, temperature fuse was used in the materials such as the alloy that more than certain fusing point melts as conductor, and was fused more than set temperature by this conductor and realize (such as, patent documentation 1 etc.).
Patent documentation 1: Japanese Patent Publication 7-130277 publication
Following problem is left in above-mentioned technology in the past.
In the joint method of the electrode in the structure of fuse in the past and the fuse material of low melting point, welding can be used as low temperature joint method, but likely melt as high temperature joint method solder, therefore use ultrasonic bonding or crimping as high temperature joint method.But when the electrode of basalis is thinner, ultrasonic bonding or crimping etc. are difficult to obtain sufficient bond strength.Further, when direct bonding electrodes and fuse material, fuse material sometimes because of the heat that causes such as welding during assembling fuse with the junction surface of electrode near fuse, thus result in the decline of finished product rate.And then need utilize the size of fuse entirety to relax the thermal impact of self-electrode, therefore the miniaturization of fuse is also difficult to realize.
Summary of the invention
The present invention completes in view of above-mentioned problem, and its object is to provide a kind of does not rely on the thickness of the electrode of basalis and can fix fuse material, and is not easy the thermal impact being subject to self-electrode, and can realize miniaturized fuse.
The present invention have employed following structure to solve above-mentioned problem.That is, the feature of the fuse involved by the 1st invention is to possess: insulative substrate; Pair of electrodes, is formed in described insulative substrate; Metal Melting cortina, for the banded and electric conducting material of its two ends directly or via other is connected with described pair of electrodes; And low melting point parts, cover at least mid portion of described Metal Melting cortina and arrange, and formed by the metal material of fusing point lower than described Metal Melting cortina, wherein, described Metal Melting cortina has the narrow width part formed than other parts or the narrow mode of described electrode with width, described low melting point parts are formed in the mode that its width is wider than described narrow width part, and are directly fixed in described insulative substrate by binding agent.
In this fuse, low melting point parts are formed in the mode that its width is wider than described narrow width part, and be directly fixed in insulative substrate by binding agent, therefore, no matter whether electrode is electrically connected with Metal Melting cortina, low melting point parts melt mainly through the heat come from insulative substrate conduction, and the narrow width part below low melting point parts is fused.That is, low melting point parts are by being conducted to the heat of insulative substrate and melting by other the position of carrying out generating heat, and the melting not by the resistance heating of Metal Melting cortina or low melting point parts.
So, because low melting point parts are directly bonded in insulative substrate by binding agent, therefore be electrically connected without the need to low melting point parts are engaged on Metal Melting cortina by ultrasonic bonding or crimping etc., and the thickness of metal fuse film can not be relied on and be fixed with high bond strength.And, because low melting point parts do not engage with the Metal Melting cortina being connected to electrode, and be fixed in insulative substrate, therefore, it is possible to by the thermal impact carrying out self-electrode caused such as welding when being reduced in assembling fuse, and the phenomenon of low melting point parts fusing when assembling can be suppressed, and overall miniaturization can be realized.In addition, binding agent to spread upon in insulative substrate but not on Metal Melting cortina, is therefore difficult to have an impact when the melting of Metal Melting cortina.
The feature of the fuse involved by the 2nd invention is, in the 1st invention, described low melting point parts are bonded in described insulative substrate by binding agent in the both sides of described narrow width part.
That is, in this fuse, low melting point parts are bonded in insulative substrate in the both sides of narrow width part by binding agent, and therefore low melting point parts can melting from the both sides of narrow width part, thus reliably makes narrow width part fuse.
The feature of the fuse involved by the 3rd invention is, in the 2nd invention, described low melting point parts are formed as the H type being equipped with a pair recess in the both sides of described narrow width part, and are bonded in described insulative substrate by the binding agent coating described recess.
Namely, in this fuse, low melting point parts are formed as the H type being equipped with a pair recess in the both sides of narrow width part, and be bonded in insulative substrate by the binding agent coating recess, therefore, because the mode with point-like on a pair recess is provided with binding agent, therefore when Metal Melting cortina fuses, binding agent is difficult to flow to Metal Melting cortina side, thus can suppress the impact on fusing further.Further, because low melting point parts are formed as H type, be therefore pulled to both sides when melting, thus become and easily fuse in central authorities.
The feature of the fuse involved by the 4th invention is, in arbitrary invention of the 1st to the 3rd invention, described Metal Melting cortina is film forming by sputtering.
That is, in this fuse, Metal Melting cortina is film forming by sputtering, therefore the heat carrying out self-electrode during assembling can be made more to be difficult to conduct to low melting point parts by the Metal Melting cortina thinner than the film formed based on plating or evaporation.
The feature of the fuse involved by the 5th invention is, in arbitrary invention of the 1st to the 4th invention, possess and be formed in described insulative substrate by the resistance material generated heat by being energized, and the resistance body be connected with described pair of electrodes, wherein, at least one party of described pair of electrodes is connected with described resistance body via described Metal Melting cortina.
Namely, in this fuse, insulative substrate possesses the resistance body be connected with pair of electrodes, and at least one party of pair of electrodes is connected with resistance body via Metal Melting cortina, therefore, when overcurrent flows through, the heat of the resistance body of heating conducts to low melting point parts via insulative substrate, thus can make its melting, and Metal Melting cortina is fused.Further, resistance body and fuse mechanism can be made to be integrally formed as monolithic and to make it miniaturized, and assembly number of packages can be reduced, and narrower setting area can be tackled.
According to the present invention, play following effect.
Namely, according to fuse involved in the present invention, low melting point parts are formed in the mode of its width wider than narrow width part and are directly fixed in insulative substrate by binding agent, therefore, it is possible to do not rely on the thickness of metal fuse film and with high bond strength, low melting point parts be fixed on Metal Melting cortina, and by the thermal impact carrying out self-electrode caused such as welding when can be reduced in assembling fuse, and then overall miniaturization can also be realized.
Thus, fuse of the present invention is small-sized and can obtain higher reliability, especially preferably uses as the protective circuit being equipped with the hybrid electric vehicle of battery and capacitor or electric motor car etc.
Accompanying drawing explanation
Fig. 1 is the vertical view of the execution mode representing fuse involved in the present invention.
Fig. 2 is the A-A ' cutaway view of Fig. 1.
Fig. 3 is the B-B ' cutaway view of Fig. 1.
Embodiment
Below, referring to figs. 1 to Fig. 3, one execution mode of fuse involved in the present invention is described.
As shown in Figure 1 to Figure 3, the fuse system 1 of present embodiment possesses: insulative substrate 2; Pair of electrodes 3, is formed in insulative substrate 2; Metal Melting cortina 4, for the banded and electric conducting material of its two ends directly or via other is connected with pair of electrodes 3; Low melting point parts 5, at least mid portion of covering metal fuse film 4 and arranging, and formed by the metal material of fusing point lower than Metal Melting cortina 4; And resistance body 6, be formed in insulative substrate 2 by the resistance material generated heat by being energized, and be connected with pair of electrodes 3.
Above-mentioned Metal Melting cortina 4 has the narrow width part 4a formed than other parts or the narrow mode of electrode 3 with width.That is, narrow width part 4a is the necking part that live width attenuates locally, and the part for fusing when low melting point parts 5 are melted.
Above-mentioned low melting point parts 5 are formed in the mode that its width is wider than narrow width part 4a, and are directly fixed in insulative substrate 2 by binding agent S.Specifically, low melting point parts 5 are bonded in insulative substrate 2 by binding agent S in the both sides of narrow width part 4a.That is, low melting point parts 5 are formed as the H type being equipped with a pair recess 5a in the both sides of narrow width part 4a, and are bonded in insulative substrate 2 by the binding agent S coating recess 5a.
The film that above-mentioned Metal Melting cortina 4 and electrode 3 are the one film forming by sputtering.Such as, the Cu film that Metal Melting cortina 4 and electrode 3 are the sputtering and film forming by using Cu sputtering target, such as its thickness is less than 3 μm.
Above-mentioned insulative substrate 2 is such as the ceramic substrates such as AlN.
Above-mentioned resistance body 6 is the such as TaSi etc. of film forming by sputtering, and the resistive film for being generated heat by resistance heating when being energized.
One side of pair of electrodes 3 is connected with resistance body 6 via Metal Melting cortina 4.That is, one end of Metal Melting cortina 4 is connected with the rectangular electrode 3 of the end side being disposed in insulative substrate 2, and the other end of Metal Melting cortina 4 is connected to one end of resistance body 6.That is, the other end of Metal Melting cortina 4 is connected to electrode 3 via electric conducting material and resistance body 6.Further, the other end of resistance body 6 is connected to the electrode 3 of another side being disposed in insulative substrate 2.So, the opposing party of a side of pair of electrodes 3, Metal Melting cortina 4, resistance body 6 and pair of electrodes 3 is electrically connected in the mode of series connection successively.
In above-mentioned pair of electrodes 3, block electrode terminal 7 is engaged respectively by welding etc.
Above-mentioned low melting point parts 5, can adopt the alloy of such as Ag/Sn/Cu, Sn/Pb, Ag/Sn, Au/Sn/Cu or Au/Sn etc.These low melting point parts 5 are set as that its thickness is significantly thicker than the Metal Melting cortina 4 being disposed in bottom, are namely set as the thickness of about 10 times.
In the fuse 1 of present embodiment, when electric current flows through between pair of electrodes 3, the resistance body 6 be connected in series is resistively heated and generates heat.Now sent heat is conducted to insulative substrate 2, thus low melting point parts 5 are also subject to heat.If the electric current flow through between pair of electrodes 3 is comparatively large, and the heating of above-mentioned resistance body 6 uprises and the temperature of insulative substrate 2 exceedes the fusing point of low melting point parts 5, then low melting point parts 5 melting by the heat from insulative substrate 2.Further, the narrow width part 4a being positioned at the Metal Melting cortina 4 below low melting point parts 5 is fused by the low melting point parts 5 be melted.That is, if flow through excessive electric current between pair of electrodes 3, then make low melting point parts 5 melting by the resistance body 6 after high temperature, and Metal Melting cortina 4 is fused.
So in the fuse 1 of present embodiment, low melting point parts 5 are formed as its width wider than narrow width part 4a, and be directly fixed in insulative substrate 2 by binding agent S, therefore, no matter whether electrode 3 is electrically connected with Metal Melting cortina 4, low melting point parts 5 melt mainly through conducting next heat from insulative substrate 2, and the narrow width part 4a be positioned at below low melting point parts 5 is fused.That is, low melting point parts 5 are by conducting to the heat of insulative substrate 2 and melting from other the position (being resistance body 6 in present embodiment) of carrying out generating heat, and the melting not by the resistance heating of Metal Melting cortina 4 or low melting point parts 5.
So, low melting point parts 5 are directly bonded in insulative substrate 2 by binding agent S, therefore be electrically connected without the need to low melting point parts 5 are engaged on Metal Melting cortina 4 by ultrasonic bonding or crimping etc., and the thickness of metal fuse film 4 can not be relied on and with high bond strength, low melting point parts 5 are fixed on metal film 4.And, because low melting point parts 5 do not engage with the Metal Melting cortina 4 being connected to electrode 3, and be fixed in insulative substrate 2, therefore, it is possible to by the thermal impact carrying out self-electrode 3 caused such as welding when being reduced in assembling fuse, and the phenomenon of low melting point parts 5 fusing when assembling can be suppressed, and overall miniaturization can be realized.In addition, binding agent S to spread upon in insulative substrate 2 but not on Metal Melting cortina 4, is therefore difficult to have an impact when 4 melting of Metal Melting cortina.
In addition, low melting point parts 5 are bonded in insulative substrate 2 in the both sides of narrow width part 4a by binding agent S, and therefore low melting point parts 5 can melting from the both sides of narrow width part 4a, thus reliably makes narrow width part 4a fuse.
And, low melting point parts 5 are formed as the H type being equipped with a pair recess 5a in the both sides of narrow width part 4a, and be bonded in insulative substrate 2 by the binding agent S coating recess 5a, therefore, owing to being provided with binding agent S in the mode of point-like on a pair recess 5a, therefore when Metal Melting cortina 4 fuses, binding agent S is difficult to flow to Metal Melting cortina 4 side, thus can suppress the impact on fusing further.Further, because low melting point parts 5 are formed as H type, be therefore pulled to both sides when melting, thus become and easily fuse in central authorities.
Further, Metal Melting cortina 4 is film forming by sputtering, therefore, the heat carrying out self-electrode 3 during assembling can be made more to be difficult to conduct to low melting point parts 5 by the Metal Melting cortina 4 thinner than the film formed based on plating or evaporation.
And, insulative substrate 2 possesses the resistance body 6 being connected to pair of electrodes 3, and a side of pair of electrodes 3 is connected with resistance body 6 via Metal Melting cortina 4, therefore when overcurrent flows through, the heat of the resistance body 6 of heating conducts to low melting point parts 5 via insulative substrate 2, thus its melting can be made, and Metal Melting cortina 4 is fused.Further, resistance body 6 and fuse mechanism can be made to be integrally formed as monolithic and to make it miniaturized, and assembly number of packages can be reduced, and narrower setting area can be tackled.
[embodiment]
Make embodiments of the invention according to above-mentioned execution mode, and carry out the function test of fuse when heating.In addition, in embodiments of the invention, adopt Ag/Sn/Cu (mass ratio Ag:Sn:Cu=3.0:96.5:0.5, fusing point about 220 DEG C) as low melting point parts, adopt the thickness of the film forming by sputtering to be that the Cu film of 1 μm is as electrode and Metal Melting cortina.
This result of the test, when in the above-described embodiments insulative substrate being heated to 300 DEG C, the narrow width part fusing of Metal Melting cortina after 30 seconds.
In addition, technical scope of the present invention is not limited to above-mentioned execution mode, without departing from the scope of spirit of the present invention can various change in addition.
Symbol description
1-fuse, 2-insulative substrate, 3-electrode, 4-Metal Melting cortina, 4a-narrow width part, 5-low melting point parts, the recess of 5a-low melting point parts, 6-resistance body, S-binding agent.
Claims (5)
1. a fuse, is characterized in that, possesses:
Insulative substrate;
Pair of electrodes, is formed in described insulative substrate;
Metal Melting cortina, for the banded and electric conducting material of its two ends directly or via other is connected with described pair of electrodes; And
Low melting point parts, cover at least mid portion of described Metal Melting cortina and arrange, and being formed by the metal material of fusing point lower than described Metal Melting cortina,
Described Metal Melting cortina has the narrow width part formed than other parts or the narrow mode of described electrode with width,
Described low melting point parts are formed in the mode that its width is wider than described narrow width part, and are directly fixed in described insulative substrate by binding agent.
2. fuse according to claim 1, is characterized in that,
Described low melting point parts are bonded in described insulative substrate by binding agent in the both sides of described narrow width part.
3. fuse according to claim 2, is characterized in that,
Described low melting point parts are formed as the H type being equipped with a pair recess in the both sides of described narrow width part, and are bonded in described insulative substrate by the binding agent coating described recess.
4. fuse according to any one of claim 1 to 3, is characterized in that,
Described Metal Melting cortina is film forming by sputtering.
5. fuse according to any one of claim 1 to 4, is characterized in that, possesses:
Resistance body, is formed in described insulative substrate by the low electrical resistant material generated heat by being energized, and is connected with described pair of electrodes,
At least one party of described pair of electrodes is connected with described resistance body via described Metal Melting cortina.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-160517 | 2013-08-01 | ||
| JP2013160517A JP2015032423A (en) | 2013-08-01 | 2013-08-01 | fuse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104347330A true CN104347330A (en) | 2015-02-11 |
Family
ID=52502722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410327037.5A Pending CN104347330A (en) | 2013-08-01 | 2014-07-10 | Fuse |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2015032423A (en) |
| CN (1) | CN104347330A (en) |
-
2013
- 2013-08-01 JP JP2013160517A patent/JP2015032423A/en active Pending
-
2014
- 2014-07-10 CN CN201410327037.5A patent/CN104347330A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015032423A (en) | 2015-02-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150211 |