CN104796830A - Microphone module and electronic device - Google Patents

Abstract

The invention provides a microphone module and an electronic device. The microphone module is assembled on the electronic device to acquire the sound signal provided by the electronic device. The microphone module includes a housing, a first diaphragm, a second diaphragm, and a substrate. The shell is provided with a first space and a second space which are isolated and independent from each other. The first diaphragm is disposed in the first space. The second diaphragm is configured in the second space. The substrate is electrically connected with the first vibration film and the second vibration film, wherein the sound signals respectively drive the first vibration film and the second vibration film to vibrate relative to the substrate. The vibrations generated by the first diaphragm and the vibrations generated by the second diaphragm are in opposite phase to each other.

Description

Microphone module and electronics

technical field

The present invention relates to a microphone module and an electronic device, and in particular to a microphone module and an electronic device capable of eliminating echo.

Background technique

With the advancement of technology, electronic modules with various functions have been widely used in electronic products, which may interfere with each other's functions. Taking sound sensing as an example, in current electronic devices, speakers and microphones are often used at the same time. For example, when the user uses the electronic device to communicate with others, he may be listening to music at the same time. Since the microphone is in the speech recognition state at this time, it is an inevitable physical phenomenon that the sound of the speaker will be picked up by the microphone and cause echo.

Contents of the invention

The invention provides a microphone module, which can eliminate the echo produced by structural resonance.

The invention provides an electronic device capable of providing sound signals with good sound quality.

The microphone module of the present invention is assembled in the electronic device to obtain the sound signal provided by the electronic device. The microphone module includes a casing, a first diaphragm, a second diaphragm and a substrate. The casing has a first space and a second space which are isolated and independent from each other. The first diaphragm is arranged in the first space. The second diaphragm is disposed in the second space. The substrate is electrically connected to the first diaphragm and the second diaphragm, wherein the sound signal respectively drives the first diaphragm and the second diaphragm to vibrate relative to the substrate. The vibration generated by the first diaphragm and the vibration generated by the second diaphragm are opposite to each other.

The electronic device of the present invention includes a body, a speaker, and the aforementioned microphone module. The loudspeaker is configured in the body for providing sound signals. The microphone module is configured in the body.

Based on the above, in the above-mentioned embodiments of the present invention, the microphone module in the electronic device arranges the first diaphragm and the second diaphragm relative to the substrate so that the vibration generated by the first diaphragm and the vibration generated by the second diaphragm The resulting vibrations are out of phase with each other, thereby canceling out the internal sound signal. In this way, the echo phenomenon caused by the structural resonance in the internal components of the electronic device can be solved, and thus the clarity and sound quality of the sound signal can be improved.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings.

Description of drawings

FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of the architecture of the microphone module in FIG. 1;

FIG. 3 is a schematic circuit diagram of the electronic device of FIG. 1 .

Explanation of reference signs:

100: electronic device;

110: body;

111: sound channel;

113: radio channel;

120: speaker;

130: internal components;

140: signal processing unit;

150: echo processing unit;

200: microphone module;

210: shell;

220: the first diaphragm;

230: second diaphragm;

240: substrate;

AS: sound signal;

EAS: external sound signal;

IAS: Internal Acoustic Signal;

ES1: first electronic signal;

ES2: second electronic signal;

ES3: third electronic signal;

AH: Acoustic hole;

S1: the first space;

S2: Second space.

Detailed ways

FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention. Please refer to FIG. 1 , in this embodiment, an electronic device 100 , such as a smart phone, a tablet computer, etc., includes a main body 110 , a speaker 120 and a microphone module 200 . The speaker 120 is disposed in the body 110 and used for providing the audio signal AS. The microphone module 200 is assembled in the electronic device 100 and disposed in the main body 110 to obtain the audio signal AS provided by the electronic device 100 .

Specifically, FIG. 2 is a schematic structural diagram of the microphone module in FIG. 1 . As shown in FIG. 2 , in this embodiment, the microphone module 200 is, for example, a condenser microphone, which includes a casing 210 , a first diaphragm 220 , a second diaphragm 230 and a substrate 240 . The casing 210 has a first space S1 and a second space S2 that are isolated and independent from each other. The first diaphragm 220 is disposed in the first space S1. The second diaphragm 230 is disposed in the second space S2. More specifically, in this embodiment, the substrate 240 is disposed in the housing 210 and isolates the first space S1 and the second space S2, so that the first diaphragm 220 and the second diaphragm 230 are located opposite to the substrate 240 two sides, and the substrate 240 is electrically connected to the first diaphragm 220 and the second diaphragm 230 .

It should be noted here that the microphone module 200 is used to receive various sound sources outside the electronic device 100 . However, in this embodiment, only the echo situation caused by the sound provided by the speaker 120 is described.

Further, FIG. 3 is a schematic circuit diagram of the electronic device in FIG. 1 . Please refer to FIG. 1 to FIG. 3 at the same time. In this embodiment, the speaker 120 is used to convert the first electronic signal ES1 into an audio signal AS. In more detail, as shown in FIG. 1 and FIG. 2 , in this embodiment, the body 110 has a sound output channel 111 and a sound collection channel 113 , and the sound output channel 111 communicates with the speaker 120 and the outside of the body 110 . When the speaker 120 emits the sound signal AS, the sound signal AS provided by the speaker 120 will be transmitted out of the main body 110 through the sound output channel 111 to form an external sound signal EAS. The sound receiving channel 113 communicates with the first space S1 of the microphone module 200 and the outside of the body 110 through the sound receiving hole AH of the microphone module 200 , so that the first diaphragm 220 of the microphone module 200 can receive the external sound signal EAS through the sound receiving channel 113 .

On the other hand, as shown in FIG. 1, when the speaker 120 emits the sound signal AS, it will also cause vibration through the physical contact of the internal components 130 assembled in the electronic device 100, such as the casing, printed circuit board or screen, etc. The first diaphragm 220 and the second diaphragm 230 of the microphone module 200 also resonate accordingly. In other words, the audio signal AS is transmitted through the interior of the body 110 of the electronic device 100 to form the internal audio signal IAS. Further, please refer to FIG. 2. In this embodiment, when the sound signal AS is transmitted to the microphone module 200, since the substrate 240 is electrically connected to the first diaphragm 220 and the second diaphragm 230, the sound signal AS will be The first diaphragm 220 and the second diaphragm 230 are respectively driven to vibrate relative to the substrate 240, and through the configuration of the substrate 240, the vibrations generated by the first diaphragm 220 and the vibrations generated by the second diaphragm 230 are opposite to each other in phase. cancel each other out. For example, in this embodiment, since the first diaphragm 220 and the second diaphragm 230 are located on opposite sides of the substrate 240, the first diaphragm 220 and the second diaphragm 230 receive the internal acoustic signal IAS at the same time. Vibrations with opposite phases to the substrate 240 are generated to cancel the internal acoustic signal IAS.

In another not-shown embodiment, the microphone module 200 further includes a processor (not shown) electrically connected to the first diaphragm 220 and the second diaphragm 230, and is used to adjust the first diaphragm 220 and the second diaphragm. The phase difference of the corresponding electrical signal caused by the vibration of the diaphragm 230 . In this way, the phases of vibrations generated by the first diaphragm 220 and the second diaphragm 230 while receiving the internal acoustic signal IAS relative to the substrate 240 are also adjusted by the processor (not shown) to be opposite to each other, thereby canceling each other out.

Please refer to FIG. 3 again. In this embodiment, the electronic device 100 further includes a signal processing unit 140 and an echo processing unit 150 . The signal processing unit 140 is electrically connected to the substrate 240 . The echo processing unit 150 is electrically connected to the signal processing unit 140 and the speaker 120 . The microphone module 200 is used to receive the sound signal AS and convert it into a second electronic signal ES2, and because the microphone module 200 cancels the internal sound signal IAS through the configuration of the first diaphragm 220 and the second diaphragm 230, the second electronic signal ES2 will only have external sound signal EAS present. The echo processing unit 150 is used to convert the first electronic signal ES1 into a third electronic signal ES3, and the signal processing unit 140 is used to receive and process the second electronic signal ES2 and the third electronic signal ES3 to eliminate the echo of the sound signal AS Effect. In detail, in this embodiment, the echo processing unit 150 receives and processes the first electronic signal ES1 provided by the speaker 120 into a third electronic signal ES3, and uses the third electronic signal ES3 as a means of eliminating the echo effect of the sound signal AS. Part of it is sent to the signal processing unit 140. The signal processing unit 140 calculates and processes the third electronic signal ES3 and the second electronic signal ES2 to eliminate the echo of the sound signal AS. In this way, the echo phenomenon caused by the mechanism resonance in the internal components 130 of the electronic device 100 can be solved, and thus the calculation burden of the signal processing unit 140 in the electronic device 100 can be reduced, and the clarity and clarity of the sound signal AS can be improved at the same time. sound quality.

To sum up, in the above-mentioned embodiments of the present invention, the microphone module in the electronic device arranges the first diaphragm and the second diaphragm relative to the substrate so that the vibration generated by the first diaphragm and the second diaphragm The vibrations produced by the membrane are out of phase with each other, thereby canceling out the internal sound signal. In this way, the echo phenomenon caused by the structural resonance in the internal components of the electronic device can be solved, thereby reducing the calculation burden of the signal processing unit, and improving the clarity and sound quality of the sound signal at the same time.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the various embodiments of the present invention. scope.

Claims (9)

1. A microphone module assembled in an electronic device to obtain a sound signal provided by the electronic device, characterized in that the microphone module comprises: A casing having a first space and a second space isolated and independent from each other; a first diaphragm configured in the first space; a second diaphragm configured in the second space; and A substrate, electrically connected to the first diaphragm and the second diaphragm, wherein the sound signal respectively drives the first diaphragm and the second diaphragm to vibrate relative to the substrate, and the sound generated by the first diaphragm The vibration and the vibration generated by the second diaphragm are opposite to each other in phase. 2. The microphone module according to claim 1, wherein the substrate is disposed in the casing and isolates the first space and the second space, so that the first diaphragm and the second diaphragm are located opposite sides of the substrate. 3. The microphone module according to claim 1, wherein the sound signal is transmitted through the electronic device to form an internal sound signal, and the first diaphragm and the second diaphragm receive the internal sound signal simultaneously A vibration with opposite phase to the substrate is generated to cancel the internal sound signal. 4. The microphone module according to claim 1, characterized in that, the electronic device also has a sound receiving channel, which communicates the first space with the outside of the electronic device, and the sound signal is formed by transmitting the sound signal from the outside of the electronic device An external sound signal, the first diaphragm receives the external sound signal through the sound receiving channel. 5. An electronic device, characterized in that it comprises: a body; A loudspeaker is arranged in the body, and the loudspeaker is used to provide an audio signal; A microphone module is configured in the body, and the microphone module includes: A casing having a first space and a second space isolated and independent from each other; a first diaphragm configured in the first space; a second diaphragm configured in the second space; and A substrate, electrically connected to the first diaphragm and the second diaphragm, wherein the sound signal respectively drives the first diaphragm and the second diaphragm to vibrate relative to the substrate, and the sound generated by the first diaphragm The vibration and the vibration generated by the second diaphragm are opposite to each other in phase. 6. The electronic device according to claim 5, wherein the substrate is disposed in the casing and isolates the first space and the second space, so that the first diaphragm and the second diaphragm are located opposite sides of the substrate. 7. The electronic device according to claim 5, wherein the sound signal is transmitted through the inside of the body to form an internal sound signal, and the first diaphragm and the second diaphragm receive the internal sound signal at the same time. Vibrations are generated in opposite phase with respect to the substrate to cancel the internal acoustic signal. 8. The electronic device according to claim 5, wherein the body has a sound output channel and a sound receiving channel, the sound output channel communicates with the speaker and the outside of the body, and the sound signal provided by the speaker passes through the The sound output channel transmits the body to form the external sound signal, the sound receiving channel connects the first space and the outside of the body, and the first diaphragm receives the external sound signal through the sound receiving channel. 9. The electronic device according to claim 5, further comprising: a signal processing unit electrically connected to the substrate; and an echo processing unit electrically connected to the signal processing unit and the speaker, wherein the speaker is used to convert a first electronic signal into the sound signal, and the microphone module is used to receive the sound signal and convert it into a second electronic signal, The echo processing unit is used for converting the first electronic signal into a third electronic signal, and the signal processing unit is used for receiving and processing the second electronic signal and the third electronic signal.