CN104968711B - 可固化有机硅组合物、其固化产物及光学半导体器件 - Google Patents

可固化有机硅组合物、其固化产物及光学半导体器件 Download PDF

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Publication number
CN104968711B
CN104968711B CN201380072300.4A CN201380072300A CN104968711B CN 104968711 B CN104968711 B CN 104968711B CN 201380072300 A CN201380072300 A CN 201380072300A CN 104968711 B CN104968711 B CN 104968711B
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component
sio
groups
carbon
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Chinese (zh)
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CN104968711A (zh
Inventor
西岛裕
西岛一裕
佐川贵志
饭村智浩
须藤通孝
竹内香须美
古川晴彦
森田好次
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Dow Toray Co Ltd
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Dow Corning Toray Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Sealing Material Composition (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
CN201380072300.4A 2012-12-28 2013-12-24 可固化有机硅组合物、其固化产物及光学半导体器件 Active CN104968711B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-288122 2012-12-28
JP2012288122A JP5985981B2 (ja) 2012-12-28 2012-12-28 硬化性シリコーン組成物、その硬化物、および光半導体装置
PCT/JP2013/085314 WO2014104389A2 (en) 2012-12-28 2013-12-24 Curable silicone composition, cured product thereof, and optical semiconductor device

Publications (2)

Publication Number Publication Date
CN104968711A CN104968711A (zh) 2015-10-07
CN104968711B true CN104968711B (zh) 2018-04-27

Family

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CN201380072300.4A Active CN104968711B (zh) 2012-12-28 2013-12-24 可固化有机硅组合物、其固化产物及光学半导体器件

Country Status (7)

Country Link
US (1) US9752032B2 (2)
EP (1) EP2938655B1 (2)
JP (1) JP5985981B2 (2)
KR (1) KR101686450B1 (2)
CN (1) CN104968711B (2)
TW (1) TWI623586B (2)
WO (1) WO2014104389A2 (2)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015136820A1 (ja) * 2014-03-12 2015-09-17 横浜ゴム株式会社 硬化性樹脂組成物
JPWO2017110468A1 (ja) 2015-12-24 2018-10-18 Jnc株式会社 熱硬化性樹脂組成物
JP7158100B2 (ja) * 2016-09-30 2022-10-21 日産化学株式会社 架橋性オルガノポリシロキサン組成物、その硬化物及びｌｅｄ装置
CN106634807A (zh) * 2016-10-28 2017-05-10 烟台德邦先进硅材料有限公司 一种萘基超高折led封装硅胶
CN106633076B (zh) * 2016-12-29 2017-12-19 广州市斯洛柯高分子聚合物有限公司 一种有机硅弹性体凝胶及其制备方法
CN106866722B (zh) * 2017-01-12 2020-05-12 复旦大学 一种含苯并环丁烯官能化的有机硅化合物及其制备方法
JP6863878B2 (ja) * 2017-11-02 2021-04-21 信越化学工業株式会社 付加硬化型シリコーン組成物、硬化物、及び光学素子
JP6823578B2 (ja) * 2017-11-02 2021-02-03 信越化学工業株式会社 付加硬化型シリコーン組成物、硬化物、光学素子
TWI787444B (zh) * 2018-02-07 2022-12-21 日商陶氏東麗股份有限公司 可固化聚矽氧組成物、其固化產物、及光學半導體裝置
JP6905486B2 (ja) * 2018-03-13 2021-07-21 信越化学工業株式会社 付加硬化型シリコーン組成物、シリコーン硬化物、及び半導体装置
WO2025264369A1 (en) * 2024-06-18 2025-12-26 Dow Silicones Corporation Polyphenylsiloxane with anhydride functionalized adhesion promoter

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1424363A1 (en) * 2002-11-29 2004-06-02 Shin-Etsu Chemical Co., Ltd. Silicone resin composition for led devices
WO2007001039A1 (en) * 2005-06-28 2007-01-04 Dow Corning Toray Co., Ltd. Curable organopolysiloxane resin composition and optical part molded therefrom
WO2007100445A2 (en) * 2006-02-24 2007-09-07 Dow Corning Corporation Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
WO2009154260A1 (en) * 2008-06-18 2009-12-23 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition and semiconductor device
CN102532915A (zh) * 2010-09-02 2012-07-04 信越化学工业株式会社 低气体渗透性硅氧烷树脂组合物和光电器件

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005089671A (ja) 2003-09-19 2005-04-07 Shin Etsu Chem Co Ltd 硬化性シリコーン樹脂組成物
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5469874B2 (ja) * 2008-09-05 2014-04-16 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
JP5499774B2 (ja) * 2009-03-04 2014-05-21 信越化学工業株式会社 光半導体封止用組成物及びそれを用いた光半導体装置
KR101152869B1 (ko) 2010-01-25 2012-06-12 주식회사 엘지화학 경화성 조성물
JP2012052035A (ja) 2010-09-01 2012-03-15 Shin-Etsu Chemical Co Ltd 付加硬化型シリコーン組成物、該組成物からなる光学素子封止材、及び該光学素子封止材の硬化物により光学素子が封止された半導体装置
WO2012093907A2 (ko) 2011-01-06 2012-07-12 주식회사 엘지화학 경화성 조성물
JP5652387B2 (ja) * 2011-12-22 2015-01-14 信越化学工業株式会社 高信頼性硬化性シリコーン樹脂組成物及びそれを使用した光半導体装置
KR101560042B1 (ko) 2012-07-27 2015-10-15 주식회사 엘지화학 경화성 조성물
JP6212122B2 (ja) 2012-12-28 2017-10-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6059010B2 (ja) 2012-12-28 2017-01-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1424363A1 (en) * 2002-11-29 2004-06-02 Shin-Etsu Chemical Co., Ltd. Silicone resin composition for led devices
WO2007001039A1 (en) * 2005-06-28 2007-01-04 Dow Corning Toray Co., Ltd. Curable organopolysiloxane resin composition and optical part molded therefrom
WO2007100445A2 (en) * 2006-02-24 2007-09-07 Dow Corning Corporation Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
WO2009154260A1 (en) * 2008-06-18 2009-12-23 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition and semiconductor device
CN102532915A (zh) * 2010-09-02 2012-07-04 信越化学工业株式会社 低气体渗透性硅氧烷树脂组合物和光电器件

Also Published As

Publication number Publication date
WO2014104389A3 (en) 2014-08-21
WO2014104389A2 (en) 2014-07-03
JP5985981B2 (ja) 2016-09-06
EP2938655B1 (en) 2016-09-14
JP2014129478A (ja) 2014-07-10
KR101686450B1 (ko) 2016-12-14
US9752032B2 (en) 2017-09-05
EP2938655A2 (en) 2015-11-04
TW201431960A (zh) 2014-08-16
US20150344692A1 (en) 2015-12-03
TWI623586B (zh) 2018-05-11
KR20150103108A (ko) 2015-09-09
CN104968711A (zh) 2015-10-07

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