CN105200367B - A kind of vacuum impregnation nano hole sealing agent and its preparation method and application with high osmosis - Google Patents
A kind of vacuum impregnation nano hole sealing agent and its preparation method and application with high osmosis Download PDFInfo
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- CN105200367B CN105200367B CN201410310384.7A CN201410310384A CN105200367B CN 105200367 B CN105200367 B CN 105200367B CN 201410310384 A CN201410310384 A CN 201410310384A CN 105200367 B CN105200367 B CN 105200367B
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- 238000007789 sealing Methods 0.000 title claims abstract description 83
- 238000005470 impregnation Methods 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 66
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 44
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 22
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 22
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 18
- 239000002904 solvent Substances 0.000 claims abstract description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000126 substance Substances 0.000 claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 9
- 239000004411 aluminium Substances 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052742 iron Inorganic materials 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000000956 alloy Substances 0.000 claims abstract description 5
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 5
- 239000002002 slurry Substances 0.000 claims description 24
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 12
- 239000004814 polyurethane Substances 0.000 claims description 11
- 229920002635 polyurethane Polymers 0.000 claims description 11
- CSUFEOXMCRPQBB-UHFFFAOYSA-N 1,1,2,2-tetrafluoropropan-1-ol Chemical compound CC(F)(F)C(O)(F)F CSUFEOXMCRPQBB-UHFFFAOYSA-N 0.000 claims description 8
- 239000002562 thickening agent Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- -1 dipropylene Chemical compound 0.000 claims description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 claims 1
- 238000002386 leaching Methods 0.000 claims 1
- 230000008901 benefit Effects 0.000 abstract description 5
- 230000035699 permeability Effects 0.000 abstract description 4
- 238000010382 chemical cross-linking Methods 0.000 abstract description 3
- 239000002245 particle Substances 0.000 abstract description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 abstract description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011777 magnesium Substances 0.000 abstract description 2
- 229910052749 magnesium Inorganic materials 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 150000002739 metals Chemical class 0.000 abstract description 2
- 229910052725 zinc Inorganic materials 0.000 abstract description 2
- 239000011701 zinc Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000007745 plasma electrolytic oxidation reaction Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 125000005456 glyceride group Chemical group 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 238000011536 re-plating Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000010234 sodium benzoate Nutrition 0.000 description 1
- 239000004299 sodium benzoate Substances 0.000 description 1
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
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- Sealing Material Composition (AREA)
Abstract
The present invention discloses a kind of vacuum impregnation nano hole sealing agent with high osmosis, is made of the raw material of following quality proportioning：Silicon carbide：Silica：Auxiliary agent：Solvent=1%~5%：5%~15%：0.1%~3%：65%~95%.The invention also discloses the preparation methods of the vacuum impregnation nano hole sealing agent.The invention also discloses purposes of the vacuum impregnation nano hole sealing agent on iron system, aluminium system, copper system and alloy system precision workpiece.Vacuum impregnation nano hole sealing agent provided by the invention with high osmosis can form chemical crosslinking with metals such as iron, aluminium, zinc, magnesium and generate strong chemical bonded refractory, has the following advantages：(1) compared with general hole sealing agent, there is better permeability, particle<50nm；(2) compared with general hole sealing agent, there is better high-temperature stability；(3) compared with general hole sealing agent, also have the advantages that low viscosity, high-wearing feature.
Description
Technical field
The present invention relates to vacuum impregnation nano hole sealing agent technical fields more particularly to a kind of vacuum with high osmosis to contain
Soak nano hole sealing agent and its preparation method and application.
Background technology
For many hot-spraying coatings, sealing of hole is a necessary last handling process.When coating faces corrosion and oxidation
When (sometimes in high temperature) environment, sealing of hole is that coating designs the content necessarily considered.
It is METCO companies of the U.S. (existing SULZER METCO) that first releases seriation hole sealing agent product to market in the world,
Its hole sealing agent series has considerable scale, and successfully uses for many years, and important several hole sealing agents have：It is air-dried type glyceride
Resin is air-dried type phenolic resin, aluminium vinyl, baking-type phenolic resin and sial resin etc., wherein although first four kinds
There is a preferable chemical stability, but its operating temperature is all at 200 DEG C or so, the sealing of hole work that can not be applied under hot environment
Skill, and sial resin is although operating temperature can reach 480 DEG C has that abrasion resistance is low, poor permeability.
Other than problem above, general resin can not penetrate into small hole, for some accurate components without
Can be power, there is also significant limitations.
Invention content
One kind is provided with high osmosis, height it is an object of the invention to overcome above-mentioned the deficiencies in the prior art place
The vacuum impregnation nano hole sealing agent of wearability, high temperature tolerance, low viscosity, solve traditional hole sealing agent poor permeability, wearability it is low,
The high problem of non-refractory, viscosity seals to realize for precision components inner void is intact.
To achieve the above object, the technical solution that the present invention takes is：A kind of vacuum impregnation nanometer with high osmosis
Hole sealing agent is made of the raw material of following quality proportioning：
Silicon carbide：Silica：Auxiliary agent：Solvent=1%~5%：5%~15%：0.1%~3%：65%~95%.
It is described true as the preferred embodiment of the vacuum impregnation nano hole sealing agent of the present invention with high osmosis
Sky impregnation nano hole sealing agent is made of the raw material of following quality proportioning：
Silicon carbide：Silica：Auxiliary agent：Solvent=3.45%：11.25%：0.3%：85%.
As the preferred embodiment of the vacuum impregnation nano hole sealing agent of the present invention with high osmosis, the auxiliary agent
Including thickener and coalescents.
As the preferred embodiment of the vacuum impregnation nano hole sealing agent of the present invention with high osmosis, the thickening
Agent is polyurethane, and the coalescents are at least one of dipropylene glycol methyl ether, dipropylene, tetrafluoropropanol.
As the preferred embodiment of the vacuum impregnation nano hole sealing agent of the present invention with high osmosis, the solvent
For at least one of tetrafluoropropanol or isopropanol.
Secondly, the preparation method for the vacuum impregnation nano hole sealing agent with high osmosis that the present invention also provides a kind of is described
Method includes the following steps：
(1) it is silicon carbide according to quality proportioning：Silica：Auxiliary agent：Solvent=1%~5%：5%~15%：0.1%
~3%：65%~95% weighs the quality of each substance respectively；
Or it is silicon carbide that step (1), which is according to quality proportioning,：Silica：Auxiliary agent：Solvent=3.45%：11.25%：
0.3%：85% weighs the quality of each substance respectively；
(2) dispersing speed is adjusted to 300r/m~500r/m, is first slowly added to silicon carbide and silica, added suitable
Coalescents, the viscosity feelings of most backsight entire slurry are added to be unlikely to make the excessively high and inconvenient use of slurry viscosity in the solvent of amount
Condition adds thickener in right amount, the slurry prepared；
(3) slurry described in step (2) is placed in 200 DEG C~300 DEG C of oven low-temperature bake 10min~30min i.e.
Obtain required hole sealing agent.
Finally, the present invention also provides a kind of vacuum impregnation nano hole sealing agent with high osmosis in iron system, aluminium system, copper
Purposes in system and alloy system precision workpiece.
It is deep that hole sealing agent of the present invention can penetrate into inside workpiece after vacuum impregnation working process by capillary theory
Layer and achieve the purpose that sealing, improve air-tightness gas-tight leakage leakage, strengthen machine cut processability, increase mechanical compression strength,
It improves machining tolerance dimensional accuracy, promote accessory appearance texture and durability.
On the one hand there are organic matters to form chemical bonded refractory for the hole sealing agent, on the other hand there is inorganic matter and generates bond, because
This can form chemical crosslinking with metals such as iron, aluminium, zinc, magnesium and generate strong chemical bonded refractory, be that excellent product quality is most important
Fundamental requirement.Rather than the resin hole sealing agent of the epoxy resin or worse first-class used in general impregnation sealing of hole factory, this kind of resin are
A kind of macromolecule of macromolecule simple surface layer can only form a kind of resin of cladding again for workpiece, can not penetrate into
The inside of workpiece, therefore after workpiece sealing of hole, often fraction defective is high when re-plating and uses the operating condition in high temperature height friction
Under be easy to make plating film stripping, also tend to that perfect requirement is not achieved under salt spray resistance condition test.
The hole sealing agent be nanoscale molecule (<50nm), there is high osmosis, low-viscosity, even if small hole
Hole can also be penetrated into, and drying itself can start to polymerize (polymerization) when evaporating, and finally after liquid evaporation, form ceramics
Film and hole and hole interior surface are taken into account and completely sealed.
Application range can be used in powder metallurgy spare part, the airtight component of Pneumatic hand tools, cylinder head, engine spare part,
Fuel system, refrigerant condenser, power-operated control system, rack and pinion shell cover, turbine engine spare part, switch valve, menifold, tune
Save device, casinghead gas controller, oil pressure side Pu spare part, motor and electronics, military equipment, space flight computer hardware etc..
The reaction mechanism of the hole sealing agent sealing of hole is as follows：
A, it permeates, as shown in Figure 3：
Hole sealing agent, which contains, to be impregnated into the gap of deep layer, hole sealing agent and workpiece internal layer【Iron system, aluminium system, copper system, alloy system】Point
Not Cun situation.
B, crosslinking and polymerization, as shown in Figure 4：
Hole sealing agent starts to polymerize (polymerization) and cross-linking reaction (corss-link) ceramics when drying evaporation
Body gradually forms.
C, sealing of hole, as shown in Figure 5：
Hole sealing agent and workpiece substrate【Iron system, aluminium system, copper system, alloy system】Strong chemical crosslinking occurs and itself is poly-
Close reaction, the ceramic body being formed simultaneously and the efficiency for reaching sealing of hole.
Vacuum impregnation nano hole sealing agent provided by the invention with high osmosis, by change formula rate, have with
Lower advantage：(1) compared with general hole sealing agent, there is better permeability, particle<50nm；(2) compared with general hole sealing agent, tool
There is a better high-temperature stability, 600 DEG C；(3) compared with general hole sealing agent, also have the advantages that low viscosity, high-wearing feature.
Description of the drawings
Fig. 1 is the SEM that vacuum impregnation nano hole sealing agent of the present invention is applied to before and after micro-arc oxidation workpiece disk sealing of hole
Figure.
Fig. 2 is that the SEM of vacuum impregnation nano hole sealing agent embodiment 2 of the present invention schemes.
Fig. 3 is the infiltration mechanism choice of hole sealing agent sealing of hole of the present invention reaction.
Fig. 4 is crosslinking and the polymerization machine drawing of hole sealing agent sealing of hole of the present invention reaction.
Fig. 5 is the sealing of hole mechanism choice of hole sealing agent sealing of hole of the present invention reaction.
Specific implementation mode
To better illustrate the object, technical solutions and advantages of the present invention, below in conjunction with specific embodiment to the present invention
It is described further.
Embodiment 1
The raw material by following mass ratio of vacuum impregnation nano hole sealing agent with high osmosis described in the present embodiment is made：
Silicon carbide：Silica：Auxiliary agent：Isopropanol=1%：5%：0.1%：65%, wherein the quality proportioning of auxiliary agent is
Polyurethane：Tetrafluoropropanol=1:1.
The preparation process of vacuum impregnation nano hole sealing agent, includes the following steps described in the present embodiment：
(1) it is silicon carbide according to quality proportioning：Silica：Polyurethane：Tetrafluoropropanol：Isopropanol=1%：5%：
0.05%：0.05%：65% weighs the quality of each substance respectively；
(2) dispersing speed is adjusted to 300r/m, is first slowly added to silicon carbide and silica, add suitable isopropyl
Tetrafluoropropanol is added to be unlikely to make the excessively high and inconvenient use of slurry viscosity in alcohol, and the viscosity situation of most backsight entire slurry is appropriate
Add polyurethane, the slurry prepared；
(3) slurry described in step (2) is placed in low-temperature bake 10min in 200 DEG C of oven and obtains required sealing of hole
Agent.
Embodiment 2
The raw material by following mass ratio of vacuum impregnation nano hole sealing agent with high osmosis described in the present embodiment is made：
Silicon carbide：Silica：Auxiliary agent：Isopropanol=3.45%：11.25%：0.3%：85%, wherein the matter of auxiliary agent
Amount proportioning is polyurethane：Dipropylene=1:1.
The preparation process of vacuum impregnation nano hole sealing agent, includes the following steps described in the present embodiment：
(1) it is silicon carbide according to quality proportioning：Silica：Polyurethane：Dipropylene：Isopropanol=3.45%：
11.25%：0.15%：0.15%：85% weighs the quality of each substance respectively；
(2) dispersing speed is adjusted to 400r/m, is first slowly added to silicon carbide and silica, add suitable isopropyl
Dipropylene, the viscosity situation of most backsight entire slurry is added to be unlikely to make the excessively high and inconvenient use of slurry viscosity in alcohol
Appropriate addition polyurethane, the slurry prepared；
(3) slurry described in step (2) is placed in low-temperature bake 20min in 250 DEG C of oven and obtains required sealing of hole
Agent.
Fig. 2 is the SEM figures of the present embodiment, there it can be seen that nanometer particle size<50nm, even if facing small hole, this
Inventing the vacuum impregnation nano hole sealing agent can also penetrate into, and achieve the effect that seal hole completely.
Embodiment 3
The raw material by following mass ratio of vacuum impregnation nano hole sealing agent with high osmosis described in the present embodiment is made：
Silicon carbide：Silica：Auxiliary agent：Tetrafluoropropanol=5%：15%：3%：95%, wherein the quality proportioning of auxiliary agent
For polyurethane：Dipropylene glycol methyl ether=1:1.
The preparation process of vacuum impregnation nano hole sealing agent, includes the following steps described in the present embodiment：
(1) it is silicon carbide according to quality proportioning：Silica：Polyurethane：Dipropylene glycol methyl ether：Tetrafluoropropanol=5%：
15%：1.5%：1.5%：95% weighs the quality of each substance respectively；
(2) dispersing speed is adjusted to 500r/m, is first slowly added to silicon carbide and silica, add suitable tetrafluoro
Dipropylene glycol methyl ether, the viscosity feelings of most backsight entire slurry are added to be unlikely to make the excessively high and inconvenient use of slurry viscosity in propyl alcohol
Condition adds polyurethane in right amount, the slurry prepared；
(3) slurry described in step (2) is placed in low-temperature bake 30min in 300 DEG C of oven and obtains required sealing of hole
Agent.
Comparative example 1
This comparative example is to carry out the performance of vacuum impregnation nano hole sealing agent in embodiment 1-3 and general hole sealing agent, comparison
As a result shown in following table.Wherein, the raw material group of general hole sealing agent becomes：Nickel acetate：Benzoic acid：Sodium benzoate：How to be sulfonate：Have
Machine silicon defoaming agent=75%：1%：1%：15%：0.5%.
Experimental example 2
Hole sealing agent in the present embodiment 2 is applied to micro-arc oxidation workpiece disk, as shown in Figure 1, upper left and upper right quarter
Before being divided into sealing of hole, the pattern of micro-arc oxidation workpiece disk, it is clear that there are many holes for workpiece disk, aperture is most
It is big up to 4 μm or so, it is minimum up to Nano grade, in embodiment 2 hole sealing agent by vacuum impregnation process in differential arc oxidation
After on workpiece disk, as shown in Figure 1, bottom left section and lower right-most portion are the patterns after sealing of hole, it is evident that see, workpiece disk
Hole sealed by intact.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention rather than is protected to the present invention
The limitation of range is protected, although being explained in detail to the present invention with reference to preferred embodiment, those skilled in the art should
Understand, technical scheme of the present invention can be modified or replaced equivalently, without departing from the essence of technical solution of the present invention
And range.
Claims (5)
1. a kind of vacuum impregnation nano hole sealing agent with high osmosis, is made of the raw material of following quality proportioning：
Silicon carbide：Silica：Auxiliary agent：Solvent=1%~5%：5%~15%：0.1%~3%：65%~95%；
The auxiliary agent includes thickener and coalescents；The thickener is polyurethane, and the coalescents are dipropylene glycol first
At least one of ether, dipropylene, tetrafluoropropanol；
The solvent is at least one of tetrafluoropropanol or isopropanol；
The preparation method of the vacuum impregnation nano hole sealing agent with high osmosis includes the following steps：
(1) it is silicon carbide according to quality proportioning：Silica：Auxiliary agent：Solvent=1%~5%：5%~15%：0.1%~
3%：65%~95% weighs the quality of each substance respectively；
(2) dispersing speed is adjusted to 300r/m~500r/m, is first slowly added to silicon carbide and silica, added suitable
Coalescents are added to be unlikely to make the excessively high and inconvenient use of slurry viscosity in solvent, and the viscosity situation of most backsight entire slurry is suitable
Amount addition thickener, the slurry prepared；
(3) slurry described in step (2) low-temperature bake 10min~30min in 200 DEG C~300 DEG C of oven is placed in obtain
Required hole sealing agent.
2. the vacuum impregnation nano hole sealing agent with high osmosis according to claim 1, which is characterized in that the vacuum contains
Leaching nano hole sealing agent is made of the raw material of following quality proportioning：
Silicon carbide：Silica：Auxiliary agent：Solvent=3.45%：11.25%：0.3%：85%.
3. a kind of preparation method of the vacuum impregnation nano hole sealing agent with high osmosis as described in claim 1-2 is any,
It is characterized in that, the described method comprises the following steps：
(1) it is silicon carbide according to quality proportioning：Silica：Auxiliary agent：Solvent=1%~5%：5%~15%：0.1%~
3%：65%~95% weighs the quality of each substance respectively；
Or it is silicon carbide that step (1), which is according to quality proportioning,：Silica：Auxiliary agent：Solvent=3.45%：11.25%：0.3%：
85% weighs the quality of each substance respectively；
(2) dispersing speed is adjusted to 300r/m~500r/m, is first slowly added to silicon carbide and silica, added suitable
Coalescents are added to be unlikely to make the excessively high and inconvenient use of slurry viscosity in solvent, and the viscosity situation of most backsight entire slurry is suitable
Amount addition thickener, the slurry prepared；
(3) slurry described in step (2) low-temperature bake 10min~30min in 200 DEG C~300 DEG C of oven is placed in obtain
Required hole sealing agent.
4. a kind of vacuum impregnation nano hole sealing agent with high osmosis as described in claim 1-2 is any is in iron system, aluminium system, copper
It is the purposes on precision workpiece.
5. the purposes of the vacuum impregnation nano hole sealing agent with high osmosis as claimed in claim 4, which is characterized in that the essence
Close workpiece is alloy system precision workpiece.
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| CN105200367B true CN105200367B (en) | 2018-08-28 |
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| CN103881496A (en) * | 2014-03-18 | 2014-06-25 | 中国兵器工业集团第五三研究所 | Transparent protective coat for concrete |
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| CN103498179A (en) * | 2013-10-22 | 2014-01-08 | 哈尔滨三泳金属表面技术有限公司 | Aluminum or aluminum alloy surface oxide film and method for preparing same |
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