CN105200469A - Tin-copper alloy electroplate liquid and electroplating method thereof - Google Patents
Tin-copper alloy electroplate liquid and electroplating method thereof Download PDFInfo
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- CN105200469A CN105200469A CN201510733542.4A CN201510733542A CN105200469A CN 105200469 A CN105200469 A CN 105200469A CN 201510733542 A CN201510733542 A CN 201510733542A CN 105200469 A CN105200469 A CN 105200469A
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- Prior art keywords
- tin
- copper alloy
- electroplating liquid
- alloy electroplating
- copper
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- 238000009713 electroplating Methods 0.000 title claims abstract description 61
- 239000007788 liquid Substances 0.000 title claims abstract description 46
- 229910000597 tin-copper alloy Inorganic materials 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 25
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 51
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims abstract description 17
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims abstract description 17
- 235000011130 ammonium sulphate Nutrition 0.000 claims abstract description 17
- 229940026189 antimony potassium tartrate Drugs 0.000 claims abstract description 17
- 229910000365 copper sulfate Inorganic materials 0.000 claims abstract description 17
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims abstract description 17
- WBTCZEPSIIFINA-MSFWTACDSA-J dipotassium;antimony(3+);(2r,3r)-2,3-dioxidobutanedioate;trihydrate Chemical compound O.O.O.[K+].[K+].[Sb+3].[Sb+3].[O-]C(=O)[C@H]([O-])[C@@H]([O-])C([O-])=O.[O-]C(=O)[C@H]([O-])[C@@H]([O-])C([O-])=O WBTCZEPSIIFINA-MSFWTACDSA-J 0.000 claims abstract description 17
- 239000001632 sodium acetate Substances 0.000 claims abstract description 17
- 235000017281 sodium acetate Nutrition 0.000 claims abstract description 17
- DPDMMXDBJGCCQC-UHFFFAOYSA-N [Na].[Cl] Chemical compound [Na].[Cl] DPDMMXDBJGCCQC-UHFFFAOYSA-N 0.000 claims description 16
- FAKFSJNVVCGEEI-UHFFFAOYSA-J tin(4+);disulfate Chemical compound [Sn+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O FAKFSJNVVCGEEI-UHFFFAOYSA-J 0.000 claims description 16
- 239000011259 mixed solution Substances 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 239000008367 deionised water Substances 0.000 claims description 9
- 229910021641 deionized water Inorganic materials 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000000243 solution Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 abstract 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 abstract 1
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 abstract 1
- 229940081974 saccharin Drugs 0.000 abstract 1
- 235000019204 saccharin Nutrition 0.000 abstract 1
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 abstract 1
- 239000011780 sodium chloride Substances 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
- 229910052759 nickel Inorganic materials 0.000 description 7
- 230000003628 erosive effect Effects 0.000 description 4
- 208000037656 Respiratory Sounds Diseases 0.000 description 3
- 229910000570 Cupronickel Inorganic materials 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a tin-copper alloy electroplate liquid and an electroplating method thereof. The tin-copper ally electroplate liquid comprises 30-50 g/L of copper sulfate, 2-4 g/L of copper pyrophosphate, 10-15 g/L of antimony potassium tartrate, 20-40 g/L of ammonium sulfate, 40-60 g/L of citric acid, 5-20 g/L of sodium chloride, 3-10 g/L of saccharin and 3-8 g/L of sodium acetate. The tin-copper alloy electroplate liquid has good stability, high current efficiency, good corrosion resistance and good wear resistance, and a coating prepared with the electroplating method does not have cracks.
Description
Technical field
The present invention relates to electroplate liquid technical field, particularly relate to a kind of tin-copper alloy electroplating liquid and electro-plating method thereof.
Background technology
Along with the development of science and technology, more and more stricter to the requirement of product, the coating of single-element is difficult to the demand meeting plated item, and researcher turns one's attention to alloy plating gradually.
Nickel plating technology is widely used in all respects of electroplating industry, for metal device carry out anticorrosion, decoration for the purpose of surface treatment.But because nickel resources belongs to non-renewable nature, along with the continuous increase of nickel consumption, supply wretched insufficiency, cause substantial appreciation of prices, each electroplating enterprise nickel plating cost remains high.Electroplating enterprise is sought to save nickel, novel process for nickel one after another.From the character of coating, the alloys such as copper nickel should become first-selected plating.But prior art cupronickel electroplate liquid stability is bad, electroplating efficiency is low, be difficult to obtain stable coating, and the skin that metallic nickel directly contacts people can cause nickel condition susceptible, and wear resistance and the erosion resistance of plating gained coating are all poor.
Summary of the invention
In view of this, one aspect of the present invention provides a kind of tin-copper alloy electroplating liquid, and this tin-copper alloy electroplating liquid good stability, current efficiency is high.
The present invention realizes by the following technical solutions.
A kind of tin-copper alloy electroplating liquid comprises following component: copper sulfate 60 ~ 80g/L, tin sulphate 30 ~ 50g/L, antimonypotassium tartrate 2 ~ 5g/L, ammonium sulfate 10 ~ 30g/L, citric acid 15 ~ 30g/L, sodium-chlor 10 ~ 20g/L, asccharin 1 ~ 3g/L and sodium acetate 3 ~ 8g/L.
Wherein, following component is comprised: the deionized water of copper sulfate 66 ~ 72g/L, tin sulphate 40 ~ 46g/L, antimonypotassium tartrate 2 ~ 3g/L, ammonium sulfate 13 ~ 25g/L, citric acid 18 ~ 26g/L, sodium-chlor 12 ~ 16g/L, asccharin 1.2 ~ 1.8g/L, sodium acetate 3.6 ~ 6g/L and surplus.
Wherein, following component is comprised: the deionized water of copper sulfate 68g/L, tin sulphate 42g/L, antimonypotassium tartrate 2.6g/L, ammonium sulfate 16g/L, citric acid 24g/L, sodium-chlor 15g/L, asccharin 1.6g/L, sodium acetate 4.2g/L and surplus.
Wherein, described tin-copper alloy electroplating liquid PH is 7 ~ 8.
The present invention on the other hand provides a kind of electro-plating method using above-mentioned tin-copper alloy electroplating liquid, adopts the obtained alloy layer of this electro-plating method not have crackle, and erosion resistance and wear resistance good.
Use an electro-plating method for above-mentioned tin-copper alloy electroplating liquid, comprise the following steps:
(1) tin-copper alloy electroplating liquid is configured: citric acid, antimonypotassium tartrate and ammonium sulfate are dissolved in wiring solution-forming in deionized water, copper sulfate, tin sulphate and sodium-chlor is added in described solution, stirring and dissolving makes mixed solution, asccharin and sodium acetate extremely dissolving is added, obtained tin-copper alloy electroplating liquid in described mixed solution;
Wherein, copper sulfate 60 ~ 80g/L, tin sulphate 30 ~ 50g/L, antimonypotassium tartrate 2 ~ 5g/L, ammonium sulfate 10 ~ 30g/L, citric acid 15 ~ 30g/L, sodium-chlor 10 ~ 20g/L, asccharin 1 ~ 3g/L and sodium acetate 3 ~ 8g/L in described tin-copper alloy electroplating liquid;
(2) take metal base as negative electrode, graphite is that anode is electroplated, obtained alloy layer.
Wherein, in described step (2), the temperature of plating is 25 ~ 35 DEG C.
Wherein, in described step (2), the current density of plating is 15 ~ 25mA/cm
2, electroplating time is 10 ~ 15min.
Wherein, in described step (2), the distance of negative electrode and positive electrode is 8 ~ 15cm.
Compared with prior art, beneficial effect of the present invention: tin-copper alloy electroplating liquid good stability of the present invention, current efficiency is high, and the obtained coating of plating does not have crackle, and erosion resistance and wear resistance better.
Embodiment
Further illustrate technical scheme of the present invention respectively below in conjunction with the embodiments.
Raw material involved in following examples is commercially available.
Embodiment 1: the tin-copper alloy electroplating liquid of the present embodiment comprises following component:
Use above-mentioned tin-copper alloy electroplating liquid electro-plating method as follows:
Configuration tin-copper alloy electroplating liquid: citric acid, antimonypotassium tartrate and ammonium sulfate are dissolved in wiring solution-forming in deionized water, copper sulfate, tin sulphate and sodium-chlor is added in described solution, stirring and dissolving makes mixed solution, asccharin and sodium acetate extremely dissolving is added, obtained tin-copper alloy electroplating liquid in described mixed solution; Wherein, in described tin-copper alloy electroplating liquid, copper sulfate 60g/L, tin sulphate 30g/L, antimonypotassium tartrate 2g/L, ammonium sulfate 10g/L, citric acid 15g/L, sodium-chlor 10g/L, asccharin 1g/L and sodium acetate 3g/L, PH are 7;
Take metal base as negative electrode, graphite is anode, and the distance of negative electrode and positive electrode is 10cm, and described tin-copper alloy electroplating liquid is 25 DEG C and current density in temperature is 15mA/cm
2electroplate 10min under condition, obtain alloy layer.
Embodiment 2: the tin-copper alloy electroplating liquid of the present embodiment comprises following component:
Use above-mentioned tin-copper alloy electroplating liquid electro-plating method as follows:
Configuration tin-copper alloy electroplating liquid: citric acid, antimonypotassium tartrate and ammonium sulfate are dissolved in wiring solution-forming in deionized water, copper sulfate, tin sulphate and sodium-chlor is added in described solution, stirring and dissolving makes mixed solution, asccharin and sodium acetate extremely dissolving is added, obtained tin-copper alloy electroplating liquid in described mixed solution; Wherein, in described tin-copper alloy electroplating liquid, copper sulfate 66g/L, tin sulphate 40g/L, antimonypotassium tartrate 2g/L, ammonium sulfate 13g/L, citric acid 18g/L, sodium-chlor 12g/L, asccharin 1.2g/L and sodium acetate 3.6g/L, PH are 8;
Take metal base as negative electrode, graphite is anode, and the distance of negative electrode and positive electrode is 12cm, and described tin-copper alloy electroplating liquid is 20 DEG C and current density in temperature is 20mA/cm
2electroplate 12min under condition, obtain alloy layer.
Embodiment 3: the tin-copper alloy electroplating liquid of the present embodiment comprises following component:
Use above-mentioned tin-copper alloy electroplating liquid electro-plating method as follows:
Configuration tin-copper alloy electroplating liquid: citric acid, antimonypotassium tartrate and ammonium sulfate are dissolved in wiring solution-forming in deionized water, copper sulfate, tin sulphate and sodium-chlor is added in described solution, stirring and dissolving makes mixed solution, asccharin and sodium acetate extremely dissolving is added, obtained tin-copper alloy electroplating liquid in described mixed solution; Wherein, in described tin-copper alloy electroplating liquid, copper sulfate 68g/L, tin sulphate 42g/L, antimonypotassium tartrate 2.6g/L, ammonium sulfate 16g/L, citric acid 24g/L, sodium-chlor 15g/L, asccharin 1.6g/L and sodium acetate 4.2g/L, PH are 7;
Take metal base as negative electrode, graphite is anode, and the distance of negative electrode and positive electrode is 10cm, and described tin-copper alloy electroplating liquid is 28 DEG C and current density in temperature is 18mA/cm
2electroplate 12min under condition, obtain alloy layer.
Tin-copper alloy electroplating liquid good stability of the present invention, current efficiency is high; Electroplate the alloy layer that obtains and there is no crackle, and erosion resistance and wear resistance better.
It should be noted that and understand, when not departing from the spirit and scope of accompanying claim the present invention for required protection, various amendment and improvement can be made to the present invention of foregoing detailed description.Therefore, the scope of claimed technical scheme is not by the restriction of given any specific exemplary teachings.
Applicant states, the present invention illustrates detailed process equipment and process flow process of the present invention by above-described embodiment, but the present invention is not limited to above-mentioned detailed process equipment and process flow process, namely do not mean that the present invention must rely on above-mentioned detailed process equipment and process flow process and could implement.Person of ordinary skill in the field should understand, any improvement in the present invention, to equivalence replacement and the interpolation of ancillary component, the concrete way choice etc. of each raw material of product of the present invention, all drops within protection scope of the present invention and open scope.
Claims (8)
1. a tin-copper alloy electroplating liquid, it is characterized in that, comprise following component: copper sulfate 60 ~ 80g/L, tin sulphate 30 ~ 50g/L, antimonypotassium tartrate 2 ~ 5g/L, ammonium sulfate 10 ~ 30g/L, citric acid 15 ~ 30g/L, sodium-chlor 10 ~ 20g/L, asccharin 1 ~ 3g/L and sodium acetate 3 ~ 8g/L.
2. tin-copper alloy electroplating liquid according to claim 1, it is characterized in that, comprise following component: the deionized water of copper sulfate 66 ~ 72g/L, tin sulphate 40 ~ 46g/L, antimonypotassium tartrate 2 ~ 3g/L, ammonium sulfate 13 ~ 25g/L, citric acid 18 ~ 26g/L, sodium-chlor 12 ~ 16g/L, asccharin 1.2 ~ 1.8g/L, sodium acetate 3.6 ~ 6g/L and surplus.
3. tin-copper alloy electroplating liquid according to claim 1, it is characterized in that, comprise following component: the deionized water of copper sulfate 68g/L, tin sulphate 42g/L, antimonypotassium tartrate 2.6g/L, ammonium sulfate 16g/L, citric acid 24g/L, sodium-chlor 15g/L, asccharin 1.6g/L, sodium acetate 4.2g/L and surplus.
4. tin-copper alloy electroplating liquid according to claim 1, is characterized in that, described tin-copper alloy electroplating liquid PH is 7 ~ 8.
5. use an electro-plating method for the tin-copper alloy electroplating liquid described in claim 1, it is characterized in that, comprise the following steps:
(1) tin-copper alloy electroplating liquid is configured: citric acid, antimonypotassium tartrate and ammonium sulfate are dissolved in wiring solution-forming in deionized water, copper sulfate, tin sulphate and sodium-chlor is added in described solution, stirring and dissolving makes mixed solution, asccharin and sodium acetate extremely dissolving is added, obtained tin-copper alloy electroplating liquid in described mixed solution;
Wherein, copper sulfate 60 ~ 80g/L, tin sulphate 30 ~ 50g/L, antimonypotassium tartrate 2 ~ 5g/L, ammonium sulfate 10 ~ 30g/L, citric acid 15 ~ 30g/L, sodium-chlor 10 ~ 20g/L, asccharin 1 ~ 3g/L and sodium acetate 3 ~ 8g/L in described tin-copper alloy electroplating liquid;
(2) take metal base as negative electrode, graphite is that anode is electroplated, obtained alloy layer.
6. electro-plating method according to claim 5, is characterized in that, in described step (2), the temperature of plating is 25 ~ 35 DEG C.
7. electro-plating method according to claim 5, is characterized in that, in described step (2), the current density of plating is 15 ~ 25mA/cm
2, electroplating time is 10 ~ 15min.
8. electro-plating method according to claim 5, is characterized in that, in described step (2), the distance of negative electrode and positive electrode is 8 ~ 15cm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510733542.4A CN105200469A (en) | 2015-10-30 | 2015-10-30 | Tin-copper alloy electroplate liquid and electroplating method thereof |
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| CN201510733542.4A CN105200469A (en) | 2015-10-30 | 2015-10-30 | Tin-copper alloy electroplate liquid and electroplating method thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1300881A (en) * | 1999-10-07 | 2001-06-27 | 荏原优莱特科技股份有限公司 | Sn-Cu alloy electroplating bath |
| JP2002241987A (en) * | 2001-02-21 | 2002-08-28 | Shinko Electric Ind Co Ltd | Sn-Cu alloy plating bath and Sn-Cu alloy plating method |
| WO2009146865A1 (en) * | 2008-06-02 | 2009-12-10 | Atotech Deutschland Gmbh | Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys |
| CN102051648A (en) * | 2011-01-20 | 2011-05-11 | 广州市二轻工业科学技术研究所 | Cyanogen-free plating method of zinc alloy die casting |
| CN104928734A (en) * | 2015-07-03 | 2015-09-23 | 重庆跃进机械厂有限公司 | Method for electroplating steel part with tin bronze in cyanide-free mode |
| CN105002529A (en) * | 2015-08-21 | 2015-10-28 | 无锡桥阳机械制造有限公司 | Bismuth-plating electroplating liquid and pulse plating method for bismuth thin film |
-
2015
- 2015-10-30 CN CN201510733542.4A patent/CN105200469A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1300881A (en) * | 1999-10-07 | 2001-06-27 | 荏原优莱特科技股份有限公司 | Sn-Cu alloy electroplating bath |
| JP2002241987A (en) * | 2001-02-21 | 2002-08-28 | Shinko Electric Ind Co Ltd | Sn-Cu alloy plating bath and Sn-Cu alloy plating method |
| WO2009146865A1 (en) * | 2008-06-02 | 2009-12-10 | Atotech Deutschland Gmbh | Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys |
| CN102051648A (en) * | 2011-01-20 | 2011-05-11 | 广州市二轻工业科学技术研究所 | Cyanogen-free plating method of zinc alloy die casting |
| CN104928734A (en) * | 2015-07-03 | 2015-09-23 | 重庆跃进机械厂有限公司 | Method for electroplating steel part with tin bronze in cyanide-free mode |
| CN105002529A (en) * | 2015-08-21 | 2015-10-28 | 无锡桥阳机械制造有限公司 | Bismuth-plating electroplating liquid and pulse plating method for bismuth thin film |
Non-Patent Citations (4)
| Title |
|---|
| 屠振密: "《防护性装饰镀层》", 29 February 2004 * |
| 张允诚 等: "《电镀手册》", 31 January 2007 * |
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