CN105319476A - Printed circuit board inspection apparatus and method - Google Patents
Printed circuit board inspection apparatus and method Download PDFInfo
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- CN105319476A CN105319476A CN201510445458.2A CN201510445458A CN105319476A CN 105319476 A CN105319476 A CN 105319476A CN 201510445458 A CN201510445458 A CN 201510445458A CN 105319476 A CN105319476 A CN 105319476A
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- 238000007689 inspection Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims description 27
- 239000000523 sample Substances 0.000 claims abstract description 121
- 239000012212 insulator Substances 0.000 claims abstract description 21
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 230000008878 coupling Effects 0.000 claims description 111
- 238000010168 coupling process Methods 0.000 claims description 111
- 238000005859 coupling reaction Methods 0.000 claims description 111
- 230000008859 change Effects 0.000 claims description 76
- 239000003990 capacitor Substances 0.000 claims description 30
- 230000033228 biological regulation Effects 0.000 claims description 8
- 238000005259 measurement Methods 0.000 claims description 8
- 230000009471 action Effects 0.000 description 31
- 238000010586 diagram Methods 0.000 description 18
- 238000009413 insulation Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 10
- 239000000758 substrate Substances 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 239000012141 concentrate Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
Abstract
The present invention provides a printed circuit board inspection apparatus, which is an electrical inspection apparatus of a printed circuit board, applies an electric signal to a conductor pattern formed on the printed circuit board, and inspects whether the conductor pattern is good, wherein the printed circuit board inspection apparatus comprises: a first probe contacting one terminal of the conductor pattern; a second probe configured to the other terminal of the conductor pattern via an insulator; a constant current source; a first connecting device for connecting the first probe and the constant current source; a second connecting device for changing electric connection status of the second probe relative to the reference potential of the constant current source; and a measuring circuit for measuring the potential of the first probe relative to the reference potential of the constant current source.
Description
Technical field
The present invention relates to device and inspection method that the electric state of the conductive pattern of printed base plate is checked.
The application based on the Patent 2014-153493 CLAIM OF PRIORITY of on July 29th, 2014 in Japanese publication, and quotes its content at this.
Background technology
When the electric state such as broken string of the conductive pattern to printed base plate checks, usually make two end in contact of inspection probe and conductive pattern and carry out checking, but, sometimes the situation that the end that there is conductive pattern is covered by dielectric film or the situation etc. being formed with touch panel etc., cannot check that probe directly contact with conductive pattern.In situations as mentioned above, disclosed in patent documentation 1 and patent documentation 2 as described in content, make inspection pop one's head in the non-contacting state of conductive pattern under check.
Patent Document 1 discloses following technology, namely, in the inspecting substrate used for flexible printed board etc., probe is not contacted with the check object electrode component of the side of conductive pattern, non-contact sensor is closely configured in the check object electrode group place of the opposite side of this conductive pattern, by this non-contact sensor, catches faint electromagnetic field (or electromagnetic wave) for check object electrode, judge that whether each conductive pattern is good, such as, whether occur broken string etc.
Patent Document 2 discloses following technology, namely, probe is electrically connected with the multiple conductive patterns on printed base plate respectively, the sensor detected inspection signal is implemented capacitive coupling with multiple conductive pattern in a non-contact manner, to probe input, there is electric signal jumpy successively, by the maximal value of the transient current of flows through sensor, judge the conducting state of conductive pattern.
Patent documentation 1: Japanese Patent No. 2994259 publication
Patent documentation 2: Japanese Patent No. 3361311 publication
But, in the method described in any one patent documentation above-mentioned, detect the probe of electric signal all to configure with the non-contacting mode of conductive pattern, directly do not contact with conductive pattern, therefore, possibly cannot reliably detection signal.
Summary of the invention
The present invention proposes in view of situation as above, under its object is to be provided in the state that the probe of detection electric signal and conductive pattern are directly contacted, can reliably detection signal, the printed base plate testing fixture that can check accurately and inspection method.
Printed base plate testing fixture of the present invention is the electric checkup apparatus of printed base plate, electric signal is applied to the conductive pattern being formed at printed base plate, check that conductive pattern is whether good, this printed base plate testing fixture has: the 1st probe, the end thereof contacts of itself and described conductive pattern; 2nd probe, it is configured in the other end of described conductive pattern via insulator; Constant current source; 1st coupling arrangement, it is for being connected described 1st probe with described constant current source; 2nd coupling arrangement, it changes relative to the status of electrically connecting of the reference potential of described constant current source for making described 2nd probe; And metering circuit, it is for measuring the current potential of described 1st probe relative to the reference potential of described constant current source.
And, printed base plate inspection method of the present invention makes the 1st to pop one's head in directly and the end thereof contacts of conductive pattern, the 2nd probe is configured via insulator at the other end of described conductive pattern, at moment T1, start to flow through electric current from constant current source to described 1st probe, moment T2 after have passed through official hour t12 from moment T1, described 2nd probe is changed relative to the status of electrically connecting of the reference potential of described constant current source, according to the measurement result of described 1st probe during this change relative to the current potential of the reference potential of described constant current source, judge that whether described conductive pattern is good.
In this printed base plate inspection method, when described 2nd probe there occurs change relative to the status of electrically connecting of the reference potential of described constant current source, when the potential change amount of every one end of the described conductive pattern of regulation unit interval tu there occurs change, can be judged to be that conductive pattern is certified products.
In the present invention, make the end thereof contacts of the 1st probe and conductive pattern, the 2nd probe is configured in the other end of conductive pattern via insulator, makes the status of electrically connecting change of the 2nd probe side and measures the current potential of the 1st probe.That is, owing to detecting the 1st electric signal of popping one's head in be under the state contacted with conductive pattern, therefore, it is possible to reliably detect this electric signal, inspecting substrate accurately can be implemented.
In this case, for the insulator at other end place of conductive pattern being configured in printed base plate, when the other end of conductive pattern exposes the surface to printed base plate, can suitably ready insulator be configured on the other end of conductive pattern, but, when the other end of conductive pattern is covered by dielectric film, using this dielectric film as insulator, the 2nd probe can be configured at this dielectric film place.
In addition, the 2nd coupling arrangement can connect or disconnection relative to the reference potential of constant current source by making the 2nd probe, and the 2nd connection status of popping one's head in is changed.
In addition, the 1st probe and the 2nd probe are all configured in the one side side of printed base plate sometimes, are sometimes configured in reciprocal of printed base plate.
In printed base plate testing fixture of the present invention, can between described 2nd probe and described 2nd coupling arrangement or the described 2nd pop one's head in and between the reference potential of described constant current source in certain one or be connected with the capacitor of the electric capacity with regulation both them.
By the existence of capacitor, the potential change quantitative change of the 1st probe side can be made large, can implement to check more accurately.
In printed base plate testing fixture of the present invention, can be configured to have the 3rd coupling arrangement, the 3rd coupling arrangement is used for described 1st probe to be connected with the reference potential of described constant current source via described 1st coupling arrangement.
In printed base plate inspection method of the present invention, also at moment T3, described 1st probe can be connected with the reference potential of described constant current source, described 1st probe and described reference potential is made to become off-state at moment T4, this moment T3 is the moment shifting to an earlier date official hour t31 than described moment T1, and this moment T4 is from the moment of described moment T1 through official hour t14 and before described moment T2.
Can by the 1st probe be connected with reference potential before the measurement of current potential, make wiring part etc. middle with charge discharge, eliminate charged impact, and, the electric current from constant current source can be made to stablize at short notice, promptly implement to check accurately.
Also can be configured in printed base plate testing fixture of the present invention, make the conductor plate contacted with the described conductive pattern of described printed base plate via insulcrete be connected to the reference potential of described constant current source.
Can also check that whether the 1st probe is good relative to the contact condition of conductive pattern, can, under the state making the 1st probe and conductive pattern reliably contact, implement to check accurately.
In this case, for insulcrete, the ready insulcrete independent of printed base plate can be used, but, if the part covered by dielectric film on the surface of printed base plate, then can, using this dielectric film as insulcrete, its top be contacted with conductor plate.
The effect of invention
According to the present invention, check detecting under the state that the probe of electric signal and conductive pattern directly contact, therefore, it is possible to reliably detection signal, can check accurately.
Accompanying drawing explanation
Fig. 1 is the block diagram of the general configuration of the 1st embodiment representing printed base plate testing fixture involved in the present invention.
Fig. 2 represents in the printed base plate testing fixture of Fig. 1, for the side view of the distribution state of printed base plate.
Fig. 3 is the process flow diagram of the printed base plate inspection method represented in the 1st embodiment.
Fig. 4 represents in the 1st embodiment, the current potential electric characteristic figure over time of the 1st probe when conductive pattern is certified products.
Fig. 5 represents in the 1st embodiment, the current potential electric characteristic figure over time of the 1st probe when conductive pattern is unacceptable product.
Fig. 6 is in the 1st embodiment, other the electric characteristic figure when conductive pattern is certified products.
Fig. 7 is in the 1st embodiment, other the electric characteristic figure when conductive pattern is unacceptable product.
Fig. 8 is the block diagram of the general configuration of the 2nd embodiment representing printed base plate testing fixture involved in the present invention.
Fig. 9 represents in the printed base plate testing fixture of Fig. 8, for the side view of the distribution state of printed base plate.
Figure 10 is the block diagram of the general configuration of the 3rd embodiment representing printed base plate testing fixture involved in the present invention.
Figure 11 represents in the printed base plate testing fixture of Figure 10, for the side view of the distribution state of printed base plate.
Figure 12 is the block diagram of the general configuration of the 4th embodiment representing printed base plate testing fixture involved in the present invention.
Figure 13 represents in the printed base plate testing fixture of Figure 12, for the side view of the distribution state of printed base plate.
Figure 14 is the process flow diagram of the printed base plate inspection method represented in the 4th embodiment.
Figure 15 represents in the 4th embodiment, the current potential electric characteristic figure over time of the 1st probe when conductive pattern is certified products.
Figure 16 represents in the 4th embodiment, the current potential electric characteristic figure over time of the 1st probe when conductive pattern is unacceptable product.
Figure 17 represents in the 4th embodiment, other the electric characteristic figure when conductive pattern is certified products.
Figure 18 represents in the 4th embodiment, other the electric characteristic figure when conductive pattern is unacceptable product.
Figure 19 is the block diagram of the general configuration of the 5th embodiment representing printed base plate testing fixture involved in the present invention.
Figure 20 represents in the printed base plate testing fixture of Figure 19, for the side view of the distribution state of printed base plate.
Figure 21 is the process flow diagram of the printed base plate inspection method represented in the 5th embodiment.
Figure 22 represents in the 5th embodiment, the current potential electric characteristic figure over time of the 1st probe when conductive pattern is certified products.
Figure 23 represents in the 5th embodiment, the current potential electric characteristic figure over time of the 1st probe when conductive pattern is unacceptable product.
Figure 24 represents in the 5th embodiment, other the electric characteristic figure when conductive pattern is certified products.
Figure 25 represents in the 5th embodiment, other the electric characteristic figure when conductive pattern is unacceptable product.
Figure 26 represents in the 5th embodiment, at the 1st probe relative to electric characteristic figure when conductive pattern loose contact.
Figure 27 represents in the 5th embodiment, at the 1st probe relative to other electric characteristic figure when conductive pattern loose contact.
Figure 28 is the block diagram of the structure of the 6th embodiment representing printed base plate testing fixture involved in the present invention.
Figure 29 represents in the printed base plate testing fixture of Figure 28, for the side view of the distribution state of printed base plate.
Figure 30 is the block diagram of the structure of the 7th embodiment representing printed base plate testing fixture involved in the present invention.
Figure 31 represents in the printed base plate testing fixture of Figure 30, for the side view of the distribution state of printed base plate.
The explanation of label
1 ... printed base plate, 2 ... insulation course, E1 ~ E4 ... conductive pattern, 11 ... printed base plate testing fixture, 12 ... constant current source, 13 ... insulator, 14 ... 1st coupling arrangement, 15 ... 2nd coupling arrangement, 16 ... metering circuit, 17 ... constant current source control part, 18 ... coupling arrangement control part, 19 ... A/D transformation component, 20 ... potential measurement portion, 21 ... main control unit, 22 ... display device, 23 ... 3rd coupling arrangement, 25 ... conductor plate, P1 ~ P4 ... 1st probe, P5 ~ P8 ... 2nd probe, A1 ~ A4 ... change-over switch, B1 ~ B4 ... change-over switch, C1 ~ C4 ... capacitor, C5 ~ C8 ... capacitor, S ... change-over switch, 31, 41, 51 ... printed base plate testing fixture.
Embodiment
Below, with reference to accompanying drawing, embodiments of the present invention are described.
[about printed base plate]
In embodiment below, for the printed base plate 1 as check object, be formed with various conductive pattern E1 ~ E4 on the surface of flat insulation course 2 or inside.Insulation course 2 is individual layer sometimes, is sometimes made up of multilayer.When insulation course 2 is made up of multilayer, conductive pattern E1 ~ E4 also has multi-ply construction, is connected between levels by via hole or through hole.And the two ends (electrode section) of each conductive pattern E1 ~ E4 are arranged on the surface of insulation course 2.In this case, the two ends of conductive pattern E1 ~ E4 are all arranged on the one party in the one side of printed base plate 1 or another side sometimes, are sometimes disposed on two sides.In addition, the surface to printed base plate 1 is exposed at least one end of conductive pattern E1 ~ E4.Another end exposes the surface to printed base plate 1 sometimes, sometimes forms the state covered by dielectric film.
Embodiment below be following structure shown in the drawings of printed base plate 1, that is, form conductive pattern E1 ~ E4 at the end face of insulation course 2, the surface of the insulation course 2 to printed base plate 1 is all exposed at the both ends of each conductive pattern E1 ~ E4.
[the 1st embodiment]
As shown in Figure 1 and Figure 2, multiple conductive pattern E1 ~ E4 of the printed base plate testing fixture 11 pairs of printed base plates 1 in the 1st embodiment check, this printed base plate testing fixture 11 has: constant current source 12, and it produces the electric current of regulation; Multiple 1st probe P1 ~ P4, they directly contact with an end of exposing to each conductive pattern E1 ~ E4 on printed base plate 1 respectively; Multiple 2nd probe P5 ~ P8, they respectively via insulator 13 with another ends contact of conductive pattern E1 ~ E4; 1st coupling arrangement 14, it has the multiple change-over switch A1 ~ A4 for being connected respectively with constant current source 12 by each 1st probe P1 ~ P4; 2nd coupling arrangement 15, it has the multiple change-over switch B1 ~ B4 for being connected respectively with the reference potential (normally earthing potential) of constant current source 12 by the 2nd probe P5 ~ P8; Metering circuit 16, it is for measuring the current potential of the 1st probe P1 ~ P4 relative to the reference potential of constant current source 12; Constant current source control part 17, it is for controlling constant current source 12; Coupling arrangement control part 18, it is for controlling each coupling arrangement; A/D transformation component 19, it is connected with metering circuit 16; Potential measurement portion 20; Main control unit 21, it is for controlling these control parts and potential measurement portion; And display device 22.CPU, storer, inspection condition configuration part are set in main control unit, check detection unit and the data communication section with each portion.
For this printed base plate testing fixture 11, one end of the conductive pattern E1 ~ E4 exposed from insulation course 2 of the 1st probe P1 ~ P4 and printed base plate 1 is directly contacted, further, the 2nd probe P5 ~ P8 is configured in the other end of conductive pattern E1 ~ E4 via insulator 13.
As mentioned above, another end of conductive pattern E1 ~ E4 exposes the surface to printed base plate 1 sometimes, sometimes the state covered by dielectric film is in, when exposing the surface to printed base plate 1, the 2nd probe P5 ~ P8 is configured via suitable insulator 13, when the state that another end being in conductive pattern E1 ~ E4 is covered by dielectric film, by using this dielectric film as said insulator 13,2nd probe P5 ~ P8 is contacted with this dielectric film, thus forms the state of the configuration via insulator 13.In the example in the figures, the 2nd probe P5 ~ P8 is configured in the end of conductive pattern E1 ~ E4 via insulator 13.
Configure the 1st probe P1 ~ P4 and the 2nd probe P5 ~ P8 in the above described manner, by certain in the change-over switch A1 ~ A4 of the 1st coupling arrangement 14 1 is set to connection status, thus, form the state flowing through electric current from constant current source 12 to certain 1 the 1st probe P1 ~ P4.Thus, to the electric capacity electric power storage that the wiring part etc. of the device including certain 1 conductive pattern in conductive pattern E1 ~ E4 has, its result, by rising with the 1st some current potentials current potential of the some reference potentials relative to constant current source 12 in P1 ~ P4 (the 1st pop one's head in) being the metering circuit 16 of connection status is measured in P1 ~ P4 of popping one's head in.
Then, certain 1 change-over switch B1 in the change-over switch B1 ~ B4 of the 2nd coupling arrangement 15, that be connected with certain 1 conductive pattern (selected conductive pattern) being connected to constant current source 12, B2, B3 or B4 action is made.If the conductive pattern E1 ~ E4 selected is normal, then due to the action of the 2nd coupling arrangement 15, the current potential measured by metering circuit 16 changes.When broken string occurs the conductive pattern E1 ~ E4 selected, even if make the 2nd coupling arrangement 15 action, the current potential measured by metering circuit 16 also can not change.Can by detecting the presence or absence of the change of this current potential, thus select as certain in the conductive pattern E1 ~ E4 of check object 1 in the above described manner in order, whether the conductive pattern E1 ~ E4 selected by identification be good.
By the process flow diagram of Fig. 3, this inspection is described in detail.In the following description, by the label of each step mark to process flow diagram, the content of each step is described.
Step S1: first, by end thereof contacts that is direct for the 1st probe P1 ~ P4 and conductive pattern E1 ~ E4.In addition, also the 2nd probe P5 ~ P8 is configured in the other end of conductive pattern E1 ~ E4 via insulator 13.
Step S2: after configuration two groups probe P1 ~ P4, P5 ~ P8, at moment T1 (with reference to Fig. 4 etc.), certain in the change-over switch A1 ~ A4 of the 1st coupling arrangement 14 1 is set to conducting state, flows through electric current from constant current source 12 to certain 1 the 1st probe P1 ~ P4.Thus, start certain 1 in the conductive pattern E1 ~ E4 having the 1st of electric current the pop one's head in be connected with supply and supply the capacitor charging that the 1st of electric current some etc. wiring parts of popping one's head in P1 ~ P4 have, the current potential rising measured by metering circuit 16.
Step S3: the moment T2 after have passed through official hour t12 from moment T1, make in the change-over switch B1 ~ B4 of the 2nd coupling arrangement 15, the change-over switch B1 be connected with conductive pattern E1, E2, E3 or E4 of selecting, B2, B3 or B4 action, make certain 1 change of the connection status relative to the reference potential of constant current source 12 in the 2nd probe P5 ~ P8.This connection status is changed refer to, when the change-over switch B1 ~ B4 of the 2nd coupling arrangement 15 is in OFF state, 1 in them is set to ON state, or when change-over switch B1 ~ B4 is in ON state, 1 in them is set to OFF state.
Step S4: according to the measurement result of metering circuit 16, whether the potential change amount of the time per unit tu of the one end of conductive pattern E1, E2, E3 or E4 selected by judgement there occurs change, when being judged as that the potential change amount of time per unit tu there occurs change (situation of YES), enter S5, when not being judged as that the potential change amount of time per unit tu there occurs change (situation of NO), enter S8.
If be described by the electric characteristic figure of Fig. 4 and Fig. 5, then as shown in Figure 4, the moment T2 of the midway that the current potential in one end of conductive pattern E1, E2, E3 or E4 of selecting rises, when potential change amount (slope of electrical specification curve map) there occurs change (potential change amount diminishes in the diagram), enter step S5, as shown in Figure 5, when potential change amount does not change, step S8 is entered.Potential change amount changes and refers to, the electric capacity relative with the reference potential of conductive pattern E1 ~ E4 changes, and Fig. 4 illustrates the example that electric capacity increases.
On the other hand, Fig. 5 represents at moment T2, even if the situation making the 2nd coupling arrangement 15 action also not confirm potential change amount to change, in situations as mentioned above, enters step S8.
In addition, for the action of the 2nd coupling arrangement 15, certain in change-over switch B1 ~ B4 1 can be selected to switch to ON from OFF according to the characteristic of check object substrate 1, or switch to OFF from ON, as long as adopt the method for operating making the change of potential change amount become large.
Step S5: judge whether the current potential of one end of selected conductive pattern E1, E2, E3 or E4 reaches the open-circuit voltage V of constant current source 12 before being about to make the 2nd coupling arrangement 15 action
0, be judged as reaching open-circuit voltage V
0when (situation of YES), enter step S6, be not judged as reaching open-circuit voltage V
0when (situation of NO), enter step S7.
In the example shown in Fig. 4 and Fig. 5, at the time point of moment T2, current potential does not reach open-circuit voltage V
0but, in the example shown in Fig. 6 and Fig. 7, before moment T2, current potential just reaches open circuit potential V
0, in situations as mentioned above, enter step S6.
Step S6: whether the current potential of the one end of conductive pattern E1, E2, E3 or E4 selected by judgement there occurs variation on descent direction, when being judged as there occurs variation on descent direction (situation of YES), enter step S7, when not being judged as change on descent direction (situation of NO), enter step S8.
In figure 6, before moment T2, current potential reaches the open-circuit voltage V of constant current source 12
0, due to the action of the 2nd coupling arrangement 15, the instantaneous decline of current potential (that is, potential change amount is " 0 ", but current potential is along the direction change declined).As shown in Figure 6, if current potential declines, then step S7 is entered.If the capacitance variations relative with the reference potential of conductive pattern E1 ~ E4, then potential change.Fig. 6 represents the example that electric capacity increases.
On the other hand, as shown in Figure 7, even if in the 2nd coupling arrangement 15 action, current potential is not also from open-circuit voltage V
0when place changes, enter step S8.
Step S7: conductive pattern E1, E2, E3 or E4 of selection are judged to be certified products.
Step S8: conductive pattern E1, E2, E3 or E4 of selection are judged to be unacceptable product.
Namely, if the potential change amount of the one end of conductive pattern E1 ~ E4 that the 1st probe P1 ~ P4 directly contacts changes owing to being configured at the action of the 2nd coupling arrangement 15 of the 2nd probe P5 ~ P8 side of conductive pattern E1 ~ E4 other end via insulator 13, then this conductive pattern E1 ~ E4 is certified products, when potential change amount does not change, be judged as the unacceptable product formed because broken string waits.
As mentioned above, due to carrying out potential measurement with the 1st P1 ~ P4 side of popping one's head in that conductive pattern E1 ~ E4 directly contacts, therefore, it is possible to reliably detect potential change amount, can implement to check accurately.
In addition, show following example in the above-described first embodiment, namely, by in order certain in the change-over switch A1 ~ A4 of the 1st coupling arrangement 14 1 being closed, select certain 1 in conductive pattern E1 ~ E4, the change-over switch B1 that conductive pattern E1, E2, E3 or E4 of making and select are connected, B2, B3 or B4 action, thus, check the conducting state of selected conductive pattern E1, E2, E3 or E4 one by one.But also can be following situation, namely, the all change-over switch A1 ~ A4 of the 1st coupling arrangement is closed simultaneously, then, make the change-over switch B1 ~ B4 action of the 2nd coupling arrangement 15 in order, the change of current potential is now detected by metering circuit 16, thus, check the conducting state of conductive pattern E1, E2, E3 or E4 one by one.In addition, also can be following situation, namely, certain 1 in conductive pattern E1 ~ E4 is selected by certain in the change-over switch A1 ~ A4 of the 1st coupling arrangement 14 1 being closed in order, make all change-over switch B1 ~ B4 action simultaneously of the 2nd coupling arrangement 15 at every turn, the change of current potential is now detected by metering circuit 16, thus, check the conducting state of conductive pattern E1, E2, E3 or E4 one by one.
In addition, also can be following situation, namely, when whether the conductive pattern E1 ~ E4 of inspection printed base plate 1 is all certified products, the all change-over switch A1 ~ A4 of the 1st coupling arrangement is closed simultaneously, then, make all change-over switch B1 ~ B4 action simultaneously of the 2nd coupling arrangement 15, detected the change of current potential now by metering circuit 16.Content recited above is also identical to the 2nd ~ 5th described later embodiment.
[the 2nd embodiment]
Fig. 8 and Fig. 9 represents the printed base plate testing fixture 31 of the 2nd embodiment, in this printed base plate testing fixture 31, between the 2nd probe P5 ~ P8 and each change-over switch B1 ~ B4 of the 2nd coupling arrangement 15, be respectively arranged with the capacitor C1 ~ C4 of the electric capacity with regulation.
In the 2nd embodiment, other structures are in addition identical with the 1st embodiment, therefore, mark identical label and omit the description.In addition, the printed base plate inspection method that the printed base plate testing fixture 31 of the 2nd embodiment realizes is identical with the situation of the 1st embodiment shown in Fig. 3, for the current potential state over time of the 1st probe P1 ~ P4, although differences such as its absolute values, but, identical with the situation of the 1st embodiment shown in Fig. 4 ~ Fig. 7, therefore, the description thereof will be omitted.Similarly identical label is marked to the part identical with embodiment above, simplified illustration in each embodiment below.
In the 1st embodiment, by the electric capacity that the wiring part itself comprising stray capacitance has, produce the potential change during action of the 2nd coupling arrangement 15, but, in the 2nd embodiment, can by arranging the capacitor C1 ~ C4 of the electric capacity with regulation between the 2nd probe P5 ~ P8 and the 2nd coupling arrangement 15, thus, increase the change of electric capacity when making the 2nd coupling arrangement 15 action, potential change quantitative change can be made correspondingly large, implement to check more accurately.
[the 3rd embodiment]
Figure 10 and Figure 11 represents the printed base plate testing fixture 41 of the 3rd embodiment, in aforesaid 2nd embodiment, capacitor C1 ~ C4 is respectively arranged with between the 2nd probe P5 ~ P8 and each change-over switch B1 ~ B4 of the 2nd coupling arrangement 15, relative to this, in this printed base plate testing fixture 41, the capacitor C5 ~ C8 of the electric capacity with regulation is set respectively between each change-over switch B1 ~ B4 and the reference potential of constant current source 12 of the 2nd coupling arrangement 15.The position only arranging these capacitors C5 ~ C8 is different from the 2nd embodiment, and other structures are identical with the 2nd embodiment.
Thus, in the 3rd embodiment, by being arranged on the capacitor C5 ~ C8 between the 2nd coupling arrangement 15 and the reference potential of constant current source 12, thus the change of electric capacity when making the 2nd coupling arrangement 15 action can be increased, potential change quantitative change is large, implements to check more accurately.
In addition, also can be following structure, namely, aforesaid 2nd embodiment and the 3rd embodiment are combined, between the 2nd probe P5 ~ P8 and each change-over switch B1 ~ B4 of the 2nd coupling arrangement 15 and between each change-over switch B1 ~ B4 of the 2nd coupling arrangement 15 and the reference potential of constant current source 12, this two side arranges capacitor C1 ~ C4, C5 ~ C8 respectively.
[the 4th embodiment]
Figure 12 and Figure 13 represents the printed base plate testing fixture 51 of the 4th embodiment.This printed base plate testing fixture 51 is following structures, that is, relative to the printed base plate testing fixture 11 of the 1st embodiment, arrange the 3rd coupling arrangement 23 with change-over switch S between the 1st coupling arrangement 14 and the reference potential of constant current source 12.Other structures are in addition identical with the situation of the 1st embodiment.
Figure 14 represents the process flow diagram of the printed base plate testing fixture 51 of use the 4th embodiment and the printed base plate inspection method of realization.In this process flow diagram, identical label is marked and simplified illustration to the step identical with the process flow diagram of Fig. 3, be described for main with different steps.
In addition, the change of the current potential of the 1st probe (one end of conductive pattern) has been shown in Figure 15 ~ Figure 18, and these Figure 15 ~ Figure 18 are corresponding with Fig. 4 ~ Fig. 7 of the 1st embodiment.
S11: shifting to an earlier date the moment T3 of t31 than moment T1, the 3rd coupling arrangement 23 is set to conducting state.Thus, the change-over switch S of the 3rd coupling arrangement 23 is in ON state, when the wiring part of the 1st coupling arrangement 14 grade is with electric charge, is discharged by this electric charge.
S12: at moment T4, is set to off-state (change-over switch S is set to OFF) by the 3rd coupling arrangement 23, and this moment T4 have passed through official hour t14 and moment before moment T2 from moment T1.In early than the S2 of this S12, the 1st coupling arrangement 14 is set to conducting state, therefore, in this S12, by the 3rd coupling arrangement 23 is set to off-state, thus start to the 1st probe P1 ~ P4 side charging, as described in Figure 15 ~ Figure 18, the current potential of the 1st probe P1 ~ P4 side rises.
Figure 15 and Figure 16 is when making the 2nd coupling arrangement 15 action, the situation of the state of the current potential rising midway of the 1st probe P1 ~ P4, for the situation shown in Figure 15, change in moment T2 potential change amount, therefore S5 is entered, for the situation shown in Figure 16, do not change in moment T2 potential change amount, therefore enter S8.
Figure 17 and Figure 18 is that the current potential of one end of conductive pattern E1 ~ E4 reaches the open-circuit voltage V of constant current source 12 before being about to make the 2nd coupling arrangement 15 action
0situation, when confirming the decline of current potential at moment T2 as shown in figure 17, entering S7, as shown in figure 18 under moment T2 current potential does not have vicissitudinous situation, marching to S8.
In the 4th embodiment, be provided with the 3rd coupling arrangement 23, though charged in the capacitive part of wiring part etc. thus, also can being made after it discharges by the 3rd coupling arrangement 23, start to check, therefore, it is possible to measure the current potential of the 1st probe P1 ~ P4 more exactly.In addition, under the state the 1st probe P1 ~ P4 is connected with reference potential by the 3rd coupling arrangement 23,1st coupling arrangement 14 is connected, after this, disconnect the 3rd coupling arrangement 23, therefore, it is possible to make the value from constant current source 12 to the electric current of conductive pattern E1 ~ E4 stablize at short notice, can implement to check more rapidly.
[mode of texturing of the 4th embodiment]
Can using the printed base plate testing fixture 51 of the 4th embodiment shown in Figure 12 and Figure 13 as basic structure, on this basis, in the mode of the 2nd embodiment shown in Fig. 8 and Fig. 9, capacitor C1 ~ C4 is set respectively between the 2nd probe P5 ~ P8 and each change-over switch B1 ~ B4 of the 2nd coupling arrangement 15.
In addition, also in the mode of the 3rd embodiment shown in Figure 10 and Figure 11, capacitor C5 ~ C8 can be configured respectively between each change-over switch B1 ~ B4 and the reference potential of constant current source 12 of the 2nd coupling arrangement 15.
In addition, capacitor C1 ~ C4, the C5 ~ C8 both them can also be configured.
No matter which kind of situation, can both, by arranging capacitor C1 ~ C4 or C5 ~ C8, making potential change quantitative change large, implementing to check more accurately.
[the 5th embodiment]
Figure 19 and Figure 20 represents the printed base plate testing fixture 61 of the 5th embodiment.In this printed base plate testing fixture 61, what directly contact except the one end of the conductive pattern E1 ~ E4 with printed base plate 1 the 1st to pop one's head in P1 ~ P4 and be configured in the 2nd of the other end of conductive pattern E1 ~ E4 via insulator 13 and pop one's head in except P5 ~ P8, also has the conductor plate 25 be connected with the reference potential of constant current source 12.And in the example shown in this Figure 19 and Figure 20, the 1st probe P1 ~ P4 and the 2nd probe P5 ~ P8 is all configured in the one side side of printed base plate 1, and conductor plate 25 contacts with the insulation course 2 of the another side of printed base plate 1, and is connected with the reference potential of constant current source 12.In this case, conductor plate 25 be formed as can with whole the size contacted of the insulation course 2 of printed base plate 1, but be at least formed as can via insulation course 2 size relative with a part of the conductive pattern E1 ~ E4 as check object.
As the aforementioned illustrated by " about printed base plate " hurdle, when the two ends of conductive pattern E1 ~ E4 are disposed on the two sides of printed base plate 1, the 2nd probe P5 ~ P8 is configured at the position avoiding conductor plate 25 in the side identical with conductor plate 25 via insulation course.
Process flow diagram when carrying out inspecting substrate by this printed base plate testing fixture 61 as shown in figure 21, in the initial preparation checked, when the P5 ~ P8 that popped one's head in by the 1st probe P1 ~ P4 end thereof contacts, the 2nd that is direct and conductive pattern E1 ~ E4 is configured in the other end of conductive pattern E1 ~ E4 via insulator 13, the face of the insulation course 2 of printed base plate 1 configures conductor plate 25 (S15), in addition, identical with the S2 of the process flow diagram of Fig. 3 and later step thereof.
By configuring this conductor plate 25, thus, if the 1st coupling arrangement 14 is set to conducting state at moment T1, electric current (S2) is flow through to the 1st probe P1 ~ P4 from constant current source 12, then to the capacitor charging be present between conductive pattern E1 ~ E4 and conductor plate 25, the current potential that metering circuit 16 detects rises.Then, make the 2nd coupling arrangement 15 action at moment T2, the 2nd probe P5 ~ P8 is changed relative to the connection status of the reference potential of constant current source 12.
Figure 22 represents compared with the electric capacity between conductive pattern E1 ~ E4 and current-carrying plate 25, when the electric capacity of wiring part is minimum, the change of the current potential of the 1st probe P1 ~ P4 when making the 2nd coupling arrangement 15 action, for the electric capacity between conductive pattern E1 ~ E4 and conductor plate 25, if conductive pattern E1 ~ E4 is certified products, then because the connection status of the electric capacity including the wiring part of conductive pattern E1 ~ E4 changes, thus along with the change of the electric capacity on apparent, the potential change amount of time per unit tu reduces.If the electric capacity relative with the reference potential of conductive pattern E1 ~ E4 changes, then potential change amount changes.Figure 22 represents the example that electric capacity increases.
When conductive pattern E1 ~ E4 is unacceptable product, as shown in figure 23, even if make the 2nd coupling arrangement 15 action, potential change amount does not also change, and maintains the state made before the 2nd coupling arrangement 15 action.
To this, when the electric capacity of wiring part compared with the electric capacity between conductive pattern E1 ~ E4 and current-carrying plate 25 is larger, or under the electric capacity between conductive pattern E1 ~ E4 and current-carrying plate 25 does not almost have discrepant situation compared to the electric capacity of wiring part, as shown in figure 24, if conductive pattern E1 ~ E4 is certified products, then by making the 2nd coupling arrangement 15 action, after the current potential of the 1st probe P1 ~ P4 declines on a small quantity, current potential rises with the potential change amount less than the potential change amount before connection.If the electric capacity relative with the reference potential of conductive pattern E1 ~ E4 changes, then current potential changes.Figure 24 represents the example that electric capacity increases.
When conductive pattern E1 ~ E4 is unacceptable product, as shown in figure 25, even if make the 2nd coupling arrangement 15 action, potential change amount does not also change, and maintains the state made before the 2nd coupling arrangement 15 action.
When the electric capacity of wiring part compared with the electric capacity between this conductive pattern E1 ~ E4 and current-carrying plate 25 is larger, or under the electric capacity between conductive pattern E1 ~ E4 and current-carrying plate 25 does not almost have discrepant situation compared to the electric capacity of wiring part, make the potential change amount of the per time tu before the 2nd coupling arrangement 15 action less, thus, the current potential of the 1st probe P1 ~ P4 reaches open-circuit voltage V
0need spended time, therefore, the prepotential not being illustrated in moment T2 reaches the open-circuit voltage V of constant current source 12
0situation, but, reach the open-circuit voltage V of constant current source 12 in the prepotential of moment T2
0when, identical with situations such as the 1st embodiments, when conductive pattern E1 ~ E4 is certified products, current potential is with from open-circuit voltage V
0the mode declined changes, not relative to open-circuit voltage V
0when changing, conductive pattern E1 ~ E4 is unacceptable product.
[mode of texturing of the 5th embodiment]
For the situation of the 5th embodiment shown in Figure 19 and Figure 20, also can using their illustrated printed base plate testing fixtures 61 as basic structure, on this basis, in the mode of the 2nd embodiment shown in Fig. 8 and Fig. 9, between the 2nd probe P5 ~ P8 and each change-over switch B1 ~ B4 of the 2nd coupling arrangement 15, configure capacitor C1 ~ C4 respectively.
In addition, also in the mode of the 3rd embodiment shown in Figure 10 and Figure 11, capacitor C5 ~ C8 can be configured respectively between each change-over switch B1 ~ B4 and the reference potential of constant current source 12 of the 2nd coupling arrangement 15.
In addition, capacitor C1 ~ C4, the C5 ~ C8 both them can also be configured.
No matter which kind of situation, can both, by arranging capacitor C1 ~ C4 or C5 ~ C8, making potential change quantitative change large, implementing to check more accurately.
Further, in the mode of the 4th embodiment shown in Figure 12 and Figure 13, the 3rd coupling arrangement 23 with change-over switch S can be set between the 1st coupling arrangement 14 and the reference potential of constant current source 12.
By arranging the 3rd coupling arrangement 23, thus charged in the capacitive part such as conductive pattern E1 ~ E4, also can being made by the 3rd coupling arrangement 23 after it discharges, to start to check, therefore, current potential can be measured more exactly, in addition, the value from constant current source 12 to the electric current of conductive pattern E1 ~ E4 can be made to stablize at short notice, can implement to check more rapidly, further, can implement to check more accurately.
In addition, in the 5th embodiment and its mode of texturing, the 1st probe P1 ~ P4 can be detected and whether reliably contact with conductive pattern E1 ~ E4.
Figure 26 represents in the 5th embodiment shown in Figure 19 and Figure 20, the situation of capacitor C1 ~ C4 is configured with respectively between the 2nd probe P5 ~ P8 and each change-over switch B1 ~ B4 of the 2nd coupling arrangement 15, or the device of a certain situation when being configured with capacitor C5 ~ C8 respectively between each change-over switch B1 ~ B4 and the reference potential of constant current source 12 of the 2nd coupling arrangement 15, when the 1st probe P1 ~ P4 and conductive pattern E1 ~ E4 loose contact, due to the electric capacity between the 1st probe P1 ~ P4 and conductive pattern E1 ~ E4, integral capacitor on apparent diminishes, therefore, at moment T1, current potential sharply rises, reach open-circuit voltage V instantaneously
0.By detecting the propradation of this current potential, the contact condition of the 1st probe P1 ~ P4 can be detected.
Figure 27 represents the situation of the device having installed the 3rd coupling arrangement 23 to the 5th embodiment, if the 3rd coupling arrangement 23 is disconnected and flows through electric current (moment T4) to the 1st probe P1 ~ P4, then when the 1st probe P1 ~ P4 loose contact, identically with Figure 26, current potential sharply rises, therefore, it is possible to by detecting this propradation, detect the contact condition of the 1st probe P1 ~ P4.
After the loose contact detecting the 1st probe P1 ~ P4 according to the propradation of this current potential, again adjust the contact position, attitude etc. of the 1st probe P1 ~ P4.
[the 6th embodiment]
Below, with reference to Figure 28 and Figure 29, the printed base plate testing fixture 71 of the 6th embodiment is described.
The printed base plate testing fixture 71 of the 6th embodiment has the 1st coupling arrangement 14 ', and the change-over switch A1 ~ A4 of the 1st coupling arrangement 14 in the printed base plate testing fixture 11 of the 1st embodiment concentrates as single change-over switch A1 by the 1st coupling arrangement 14 '.That is, multiple 1st probe P1 ~ P4 is connected with change-over switch A1 in parallel.By this change-over switch A1 closed, thus multiple 1st probe P1 ~ P4 becomes connection status simultaneously, supplies electric current from constant current source 12 to multiple 1st probe P1 ~ P4 simultaneously.
Thus, to the electric capacity electric power storage that the wiring part etc. of the device including conductive pattern E1 ~ E4 has, its result, the current potential measured by metering circuit 16 (the 1st pop one's head in the current potential of P1 ~ P4 relative to the reference potential of constant current source 12) being in the state that the P1 ~ P4 that to pop one's head in the 1st is connected rises.
Then, the change-over switch B1 ~ B4 action of the 2nd coupling arrangement 15 is made in order.If conductive pattern E1 ~ E4 is normal, then by the action of the 2nd coupling arrangement 15, the current potential measured by metering circuit 16 changes.When broken string occurs at conductive pattern E1 ~ E4 place, even if make the 2nd coupling arrangement 15 action, the current potential measured by metering circuit 16 does not also change.By detecting the presence or absence of the change of this current potential, thus can identify that whether conductive pattern E1 ~ E4 is good.
In the above-described 6th embodiment, have the 1st coupling arrangement 14 ', the change-over switch A1 ~ A4 of the 1st coupling arrangement 14 in the printed base plate testing fixture 11 of the 1st embodiment concentrates as single change-over switch A1 by the 1st coupling arrangement 14 '.This structure also can be applied to the 1st coupling arrangement 14 of the printed base plate testing fixture in aforesaid 2nd embodiment (Fig. 8), the 3rd embodiment (Figure 10), the 4th embodiment (Figure 12) and the 5th embodiment (Figure 19).
[the 7th embodiment]
Below, with reference to Figure 30 and Figure 31, the printed base plate testing fixture 81 of the 7th embodiment is described.
The printed base plate testing fixture 81 of the 7th embodiment has the 2nd coupling arrangement 15 ', and the change-over switch B1 ~ B4 of the 2nd coupling arrangement 15 in the printed base plate testing fixture 11 of the 1st embodiment concentrates as single change-over switch B1 by the 2nd coupling arrangement 15 '.That is, multiple 2nd probe P5 ~ P8 is connected with change-over switch B1 in parallel.By this change-over switch B1 closed, multiple 2nd probe P5 ~ P8 ground connection simultaneously.
According to this structure, by closing certain 1 in the change-over switch A1 ~ A4 of the 1st coupling arrangement 14 in order, select certain 1 in conductive pattern E1 ~ E4 thus, make the change-over switch B1 action of the 2nd coupling arrangement 15 ' at every turn, the change of current potential now can be detected by metering circuit 16, thus, check the conducting state of conductive pattern E1, E2, E3 or E4.
In the above-described 7th embodiment, have the 2nd coupling arrangement 15 ', the change-over switch B1 ~ B4 of the 2nd coupling arrangement 15 in the printed base plate testing fixture 11 of the 1st embodiment concentrates as single change-over switch B1 by the 2nd coupling arrangement 15 '.This structure can also be applied to the 2nd coupling arrangement 15 of the printed base plate testing fixture in aforesaid 2nd embodiment (Fig. 8), the 3rd embodiment (Figure 10), the 4th embodiment (Figure 12) and the 5th embodiment (Figure 19).
And, in the printed base plate testing fixture of the 2nd embodiment, use has the 2nd coupling arrangement 15 ' of single change-over switch B1, multiple capacitor C1 ~ C4 can be configured in as 1 capacitor between the 2nd probe P5 ~ P8 and the 2nd coupling arrangement 15 '.Equally, use has the 2nd coupling arrangement 15 ' of single change-over switch B1 in the printed base plate testing fixture of the 3rd embodiment, multiple capacitor C5 ~ C8 can be configured in the 2nd between coupling arrangement 15 ' and ground wire as 1 capacitor.
, describe the embodiments of the present invention above, but the present invention is not limited to these embodiments, and can apply various change without departing from the scope of spirit of the present invention.
For official hour t12, t31, t14, tu, the Best Times matched with the electrical specification of printed base plate can be set, can by adjusting them, thus more rapidly, reliably detect the change of the potential change amount of one end of conductive pattern E1 ~ E4, can promptly implement inspecting substrate accurately.
In addition, for the electric capacity of capacitor C1 ~ C4, C5 ~ C8, the optimum value that can be matched by setting and the electrical specification of printed base plate, thus more rapidly, reliably detect the change of the potential change amount of one end of conductive pattern E1 ~ E4, can promptly implement inspecting substrate accurately.
Claims (7)
1. a printed base plate testing fixture, it is the electric checkup apparatus of printed base plate, applies electric signal to the conductive pattern being formed at printed base plate, checks that whether conductive pattern is good,
The feature of this printed base plate testing fixture is to have:
1st probe, the end thereof contacts of itself and described conductive pattern;
2nd probe, it is configured in the other end of described conductive pattern via insulator;
Constant current source;
1st coupling arrangement, it is for being connected described 1st probe with described constant current source;
2nd coupling arrangement, it changes relative to the status of electrically connecting of the reference potential of described constant current source for making described 2nd probe; And
Metering circuit, it is for measuring the current potential of described 1st probe relative to the reference potential of described constant current source.
2. printed base plate testing fixture according to claim 1, is characterized in that,
Between described 2nd probe and described 2nd coupling arrangement or the described 2nd pop one's head in and between the reference potential of described constant current source in certain one or be connected with the capacitor of the electric capacity with regulation both them.
3. printed base plate testing fixture according to claim 1 and 2, is characterized in that,
Have the 3rd coupling arrangement, the 3rd coupling arrangement is used for described 1st probe to be connected with the reference potential of described constant current source via described 1st coupling arrangement.
4. printed base plate testing fixture according to any one of claim 1 to 3, is characterized in that,
The conductor plate contacted with the described conductive pattern of described printed base plate via insulator is connected with the reference potential of described constant current source.
5. a printed base plate inspection method, is characterized in that,
The 1st is made to pop one's head in directly and the end thereof contacts of conductive pattern, the 2nd probe is configured via insulator at the other end of described conductive pattern, at moment T1, start to flow through electric current from constant current source to described 1st probe, moment T2 after have passed through official hour t12 from moment T1, described 2nd probe is changed relative to the status of electrically connecting of the reference potential of described constant current source, according to described 1st probe during this change relative to the measurement result of the current potential of the reference potential of described constant current source, judge that whether described conductive pattern is good.
6. printed base plate inspection method according to claim 5, is characterized in that,
When described 2nd probe there occurs change relative to the status of electrically connecting of the reference potential of described constant current source, when the potential change amount of every one end of the described conductive pattern of regulation unit interval tu there occurs change, be judged to be that conductive pattern is certified products.
7. the printed base plate inspection method according to claim 5 or 6, is characterized in that,
At moment T3, described 1st probe is connected with the reference potential of described constant current source, described 1st probe and described reference potential is made to become off-state at moment T4, this moment T3 is the moment shifting to an earlier date official hour t31 than described moment T1, and this moment T4 is from moment through the time t14 shorter than described time t12 and before described moment T2 of described moment T1.
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| JP (1) | JP6095735B2 (en) |
| KR (1) | KR101706465B1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106824832A (en) * | 2017-02-15 | 2017-06-13 | 友达光电（苏州）有限公司 | A kind of detection means and its application method |
| CN107278016A (en) * | 2016-04-04 | 2017-10-20 | 发那科株式会社 | The deterioration detection means of printed base plate |
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| JP7009814B2 (en) * | 2017-07-27 | 2022-02-10 | 日本電産リード株式会社 | Insulation inspection equipment and insulation inspection method |
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Also Published As
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| CN105319476B (en) | 2018-05-08 |
| JP2016033511A (en) | 2016-03-10 |
| TW201604564A (en) | 2016-02-01 |
| TWI598604B (en) | 2017-09-11 |
| KR101706465B1 (en) | 2017-02-13 |
| JP6095735B2 (en) | 2017-03-15 |
| KR20160014540A (en) | 2016-02-11 |
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