CN105566918A - Silicon sheet and preparation method thereof - Google Patents

Silicon sheet and preparation method thereof Download PDF

Info

Publication number
CN105566918A
CN105566918A CN201410598318.4A CN201410598318A CN105566918A CN 105566918 A CN105566918 A CN 105566918A CN 201410598318 A CN201410598318 A CN 201410598318A CN 105566918 A CN105566918 A CN 105566918A
Authority
CN
China
Prior art keywords
silica gel
gel sheet
silicone oil
powder
thermally conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410598318.4A
Other languages
Chinese (zh)
Inventor
徐述荣
席建飞
张玲玲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BYD Co Ltd
Original Assignee
BYD Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BYD Co Ltd filed Critical BYD Co Ltd
Priority to CN201410598318.4A priority Critical patent/CN105566918A/en
Publication of CN105566918A publication Critical patent/CN105566918A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)

Abstract

本发明涉及一种硅胶片,该硅胶片中含有导热粉末,以所述硅胶片的总重量为基准,所述导热粉末的含量为90-97重量%。本发明还涉及一种硅胶片的制备方法,方法包括:(1)将乙烯基硅油、含氢硅油、抑制剂、催化剂进行混合,得到有机硅交联体系;(2)将导热粉末、有机硅交联体系和有机溶剂进行球磨;(3)将球磨得到的混合物喷雾造粒,制得粉体;(4)将粉体进行干压成型;(5)将干压成型得到的片材进行交联反应。本发明还涉及上述方法制备的硅胶片。本发明的硅胶片具有制备工艺简单、导热性能优异、生产成本较低等优点,能够满足电子产品模块的散热要求。The invention relates to a silica gel sheet. The silica gel sheet contains thermally conductive powder. Based on the total weight of the silica gel sheet, the content of the thermally conductive powder is 90-97% by weight. The present invention also relates to a method for preparing a silica gel sheet. The method comprises: (1) mixing vinyl silicone oil, hydrogen-containing silicone oil, an inhibitor, and a catalyst to obtain an organosilicon crosslinking system; (2) mixing heat-conducting powder, organosilicon Ball milling the cross-linking system and an organic solvent; (3) Spray granulating the mixture obtained by the ball milling to obtain a powder; (4) Dry pressing the powder; (5) Exchanging the sheet obtained by the dry pressing joint reaction. The present invention also relates to the silica gel sheet prepared by the above method. The silica gel sheet of the invention has the advantages of simple preparation process, excellent thermal conductivity, low production cost, etc., and can meet the heat dissipation requirements of electronic product modules.

Description

一种硅胶片及其制备方法A kind of silica gel sheet and preparation method thereof

技术领域technical field

本发明涉及一种硅胶片,一种硅胶片的制备方法,以及该方法制备的硅胶片。The invention relates to a silica gel sheet, a method for preparing the silica gel sheet, and the silica gel sheet prepared by the method.

背景技术Background technique

随着航空、汽车、电子等行业的高速发展,人们对导热材料的要求越来越高。有机硅因其优异的耐热、绝缘、耐候等性能,成为导热复合材料的优良载体。但是,目前有机硅复合材料导热性能差,制备过程中需要加入偶联剂,制备工艺复杂,成本也较高,严重影响了有机硅导热材料的应用。With the rapid development of industries such as aviation, automobiles, and electronics, people's requirements for thermally conductive materials are getting higher and higher. Silicone has become an excellent carrier for thermally conductive composite materials because of its excellent heat resistance, insulation, and weather resistance. However, the thermal conductivity of organic silicon composite materials is poor at present, and a coupling agent needs to be added in the preparation process. The preparation process is complicated and the cost is high, which seriously affects the application of organic silicon thermal conductive materials.

因此,目前急需一种制备工艺简单、导热性能优异、生产成本较低的有机硅导热材料。Therefore, there is an urgent need for a silicone thermally conductive material with simple preparation process, excellent thermal conductivity and low production cost.

发明内容Contents of the invention

本发明的目的是为了克服现有技术中有机硅导热材料存在制备工艺复杂、导热性能差、生产成本高的缺陷,提供一种硅胶片,一种硅胶片的制备方法,以及该方法制备的硅胶片。The purpose of the present invention is to overcome the defects of complex preparation process, poor thermal conductivity and high production cost in organic silicon heat-conducting materials in the prior art, to provide a silica gel sheet, a method for preparing a silica gel sheet, and the silica gel prepared by the method piece.

本发明的发明人在研究中发现,当硅胶片的导热系数为6W/mK以上时,能够显著提高硅胶片的导热性能,且生产成本较低,硅胶片的制备工艺也较简单。The inventors of the present invention found in research that when the thermal conductivity of the silica gel sheet is above 6W/mK, the thermal conductivity of the silica gel sheet can be significantly improved, the production cost is low, and the preparation process of the silica gel sheet is relatively simple.

因此,为了实现上述目的,一方面,本发明提供了一种硅胶片,该硅胶片的导热系数为6W/mK以上。Therefore, in order to achieve the above object, on the one hand, the present invention provides a silica gel sheet, the thermal conductivity of the silica gel sheet is above 6W/mK.

另一方面,本发明还提供了一种硅胶片的制备方法,该方法包括:On the other hand, the present invention also provides a kind of preparation method of silica gel sheet, and this method comprises:

(1)将乙烯基硅油、含氢硅油、抑制剂、催化剂进行混合,得到有机硅交联体系;(1) Mix vinyl silicone oil, hydrogen-containing silicone oil, inhibitor, and catalyst to obtain a silicone crosslinking system;

(2)将导热粉末、有机硅交联体系和有机溶剂进行球磨;(2) Ball milling the heat-conducting powder, the organosilicon cross-linking system and the organic solvent;

(3)将球磨得到的混合物喷雾造粒,制得粉体;(3) The mixture obtained by ball milling is sprayed and granulated to obtain a powder;

(4)将粉体进行干压成型;(4) Carry out dry pressing molding to powder;

(5)将干压成型得到的片材进行交联反应。(5) Perform a crosslinking reaction on the sheet obtained by dry pressing.

第三方面,本发明还提供了上述方法制备的硅胶片。In the third aspect, the present invention also provides the silica gel sheet prepared by the above method.

本发明的硅胶片具有制备工艺简单、导热性能优异、生产成本较低等优点,能够满足电子产品模块的散热要求。The silica gel sheet of the invention has the advantages of simple preparation process, excellent thermal conductivity, low production cost, etc., and can meet the heat dissipation requirements of electronic product modules.

本发明的其它特征和优点将在随后的具体实施方式部分予以详细说明。Other features and advantages of the present invention will be described in detail in the detailed description that follows.

具体实施方式detailed description

以下对本发明的具体实施方式进行详细说明。应当理解的是,此处所描述的具体实施方式仅用于说明和解释本发明,并不用于限制本发明。Specific embodiments of the present invention will be described in detail below. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

本发明提供了一种硅胶片,该硅胶片的导热系数为6W/mK以上。The invention provides a silica gel sheet, the thermal conductivity of the silica gel sheet is above 6W/mK.

优选地,硅胶片的导热系数为6-6.8W/mK。Preferably, the thermal conductivity of the silica gel sheet is 6-6.8W/mK.

根据本发明所述的硅胶片,只要硅胶片的导热系数为6W/mK以上,即可提高硅胶片的导热性,但是为了进一步提高硅胶片的导热性,硅胶片中含有导热粉末,以所述硅胶片的总重量为基准,所述导热粉末的含量为90-97重量%。According to the silica gel sheet of the present invention, as long as the thermal conductivity of the silica gel sheet is more than 6W/mK, the thermal conductivity of the silica gel sheet can be improved, but in order to further improve the thermal conductivity of the silica gel sheet, the silica gel sheet contains thermally conductive powder. Based on the total weight of the silica gel sheet, the content of the thermally conductive powder is 90-97% by weight.

根据本发明所述的硅胶片,硅胶片中的导热粉末可以为本领域常规的导热粉末,优选选自氧化铝、氧化锌、二氧化硅、氮化铝、氮化硼和碳化硅中的至少一种,更优选为氧化铝和/或氧化锌,能够进一步提高硅胶片的导热系数,从而进一步提高硅胶片的导热性。当导热粉末为氧化铝和氧化锌的混合物时,氧化铝和氧化锌的重量比优选为1:0.2-1。According to the silica gel sheet of the present invention, the thermally conductive powder in the silica gel sheet can be a conventional thermally conductive powder in the art, preferably at least one selected from aluminum oxide, zinc oxide, silicon dioxide, aluminum nitride, boron nitride and silicon carbide. One, more preferably aluminum oxide and/or zinc oxide, can further increase the thermal conductivity of the silica gel sheet, thereby further improving the thermal conductivity of the silica gel sheet. When the heat-conducting powder is a mixture of aluminum oxide and zinc oxide, the weight ratio of aluminum oxide and zinc oxide is preferably 1:0.2-1.

根据本发明所述的硅胶片,其中,导热粉末的大小可以为本领域常规用于制备导热硅胶片的导热粉末的规格,但是,为了进一步提高硅胶片的导热性,优选地,导热粉末的粒径为0.5-4.5μm。According to the silica gel sheet of the present invention, wherein, the size of the heat-conducting powder can be the specification of the heat-conducting powder conventionally used in the art to prepare the heat-conducting silica gel sheet, but, in order to further improve the thermal conductivity of the silica gel sheet, preferably, the particle size of the heat-conducting powder The diameter is 0.5-4.5μm.

另一方面,本发明还提供了一种硅胶片的制备方法,该方法包括:On the other hand, the present invention also provides a kind of preparation method of silica gel sheet, and this method comprises:

(1)将乙烯基硅油、含氢硅油、抑制剂、催化剂进行混合,得到有机硅交联体系;(1) Mix vinyl silicone oil, hydrogen-containing silicone oil, inhibitor, and catalyst to obtain a silicone crosslinking system;

(2)将导热粉末、有机硅交联体系和有机溶剂进行球磨;(2) Ball milling the heat-conducting powder, the organosilicon cross-linking system and the organic solvent;

(3)将球磨得到的混合物喷雾造粒,制得粉体;(3) The mixture obtained by ball milling is sprayed and granulated to obtain a powder;

(4)将粉体进行干压成型;(4) Carry out dry pressing molding to powder;

(5)将干压成型得到的片材进行交联反应。(5) Perform a crosslinking reaction on the sheet obtained by dry pressing.

根据本发明所述的方法,其中,只要采用上述方法制备硅胶片,即可提高制得的硅胶片的导热性,但是,为了进一步提高制得的硅胶片的导热性,优选地,所述导热粉末选自氧化铝、氧化锌、二氧化硅、氮化铝、氮化硼和碳化硅中的至少一种,更优选为氧化铝和/或氧化锌,能够进一步提高硅胶片的导热系数,从而进一步提高硅胶片的导热性。当导热粉末为氧化铝和氧化锌的混合物时,氧化铝和氧化锌的重量比优选为1:0.2-1。According to the method of the present invention, wherein, as long as the above-mentioned method is used to prepare the silica gel sheet, the thermal conductivity of the obtained silica gel sheet can be improved, but in order to further improve the thermal conductivity of the prepared silica gel sheet, preferably, the thermal conductivity The powder is selected from at least one of aluminum oxide, zinc oxide, silicon dioxide, aluminum nitride, boron nitride and silicon carbide, more preferably aluminum oxide and/or zinc oxide, which can further improve the thermal conductivity of the silica gel sheet, thereby Further improve the thermal conductivity of the silica gel sheet. When the heat-conducting powder is a mixture of aluminum oxide and zinc oxide, the weight ratio of aluminum oxide and zinc oxide is preferably 1:0.2-1.

根据本发明所述的方法,其中,导热粉末的大小可以为本领域常规用于制备导热硅胶片的导热粉末的规格,但是,为了进一步提高制得的硅胶片的导热性,优选地,导热粉末的粒径为0.5-4.5μm。According to the method of the present invention, wherein, the size of the heat-conducting powder can be the specification of the heat-conducting powder conventionally used in the art to prepare the heat-conducting silica gel sheet, but, in order to further improve the thermal conductivity of the prepared silica gel sheet, preferably, the heat-conducting powder The particle size is 0.5-4.5μm.

根据本发明所述的方法,其中,步骤(5)中,交联反应的条件可以为本领域常规的交联反应的条件,但是,为了进一步提高制得的硅胶片的导热性,优选地,交联反应的条件包括:温度为130-180℃,时间为15-60min。According to the method of the present invention, wherein, in step (5), the conditions of the crosslinking reaction can be the conditions of the conventional crosslinking reaction in the art, but, in order to further improve the thermal conductivity of the prepared silica gel sheet, preferably, The conditions of the crosslinking reaction include: the temperature is 130-180° C., and the time is 15-60 minutes.

根据本发明所述的方法,其中,步骤(1)中,乙烯基硅油、含氢硅油、抑制剂、催化剂间的用量比可以为本领域常规的用量比,例如,乙烯基硅油、含氢硅油、抑制剂、催化剂的重量比可以为100:7-15:0.02-0.1:0.02-0.1。According to the method of the present invention, wherein, in step (1), the amount ratio between vinyl silicone oil, hydrogen-containing silicone oil, inhibitor and catalyst can be the conventional amount ratio in this field, for example, vinyl silicone oil, hydrogen-containing silicone oil The weight ratio of the inhibitor and the catalyst can be 100:7-15:0.02-0.1:0.02-0.1.

根据本发明所述的方法,其中,步骤(2)中,导热粉末、有机硅交联体系和有机溶剂间的用量比可以为本领域常规的用量比,例如,导热粉末、有机硅交联体系和有机溶剂的重量比可以为100:3-6:200-500。According to the method of the present invention, wherein, in step (2), the amount ratio between the heat-conducting powder, the organosilicon crosslinking system and the organic solvent can be a conventional amount ratio in the field, for example, the heat-conducting powder, the organosilicon crosslinking system The weight ratio with the organic solvent can be 100:3-6:200-500.

本发明中,有机溶剂可以为本领域常规的有机溶剂,例如可以选自正己烷、丙酮、二甲苯和甲苯中的至少一种。In the present invention, the organic solvent may be a conventional organic solvent in the art, for example, at least one selected from n-hexane, acetone, xylene and toluene.

本发明中,球磨的方法和条件可以采用本领域常规的球磨方法和条件,例如球磨的条件可以包括:在球磨罐中球磨2-4h。In the present invention, the ball milling method and conditions can adopt conventional ball milling methods and conditions in the art, for example, the ball milling conditions can include: ball milling in a ball mill jar for 2-4 hours.

根据本发明所述的方法,其中,步骤(3)中,喷雾造粒的条件可以为本领域常规的喷雾造粒的条件,优选地,喷雾造粒的条件包括:温度为70-100℃。当在该温度范围内时,能够使得球磨得到的混合物在喷雾造粒过程中不发生交联反应。其中,喷雾造粒的方法可以为本领域常规的喷雾造粒的方法。According to the method of the present invention, wherein, in step (3), the spray granulation conditions can be conventional spray granulation conditions in the art, preferably, the spray granulation conditions include: the temperature is 70-100°C. When the temperature is within this range, the mixture obtained by ball milling can be prevented from cross-linking reaction during the spray granulation process. Wherein, the spray granulation method can be a conventional spray granulation method in the art.

根据本发明所述的方法,其中,步骤(4)中,干压成型的条件可以为本领域常规的干压成型的条件,例如,干压成型的条件可以包括:压力为8-80MPa。其中,干压成型的方法可以为本领域常规的干压成型的方法。According to the method of the present invention, wherein, in step (4), the conditions of dry pressing can be conventional dry pressing conditions in the art, for example, the conditions of dry pressing can include: the pressure is 8-80 MPa. Wherein, the method of dry pressing may be a conventional dry pressing method in the art.

根据本发明所述的方法,其中,乙烯基硅油可以为本领域的用于制备硅胶片的乙烯基硅油,例如可以为端乙烯基硅油。本发明中,对乙烯基硅油的粘度和乙烯基含量没有特别的限定,例如其粘度可以为100-50000cp,以乙烯基硅油的摩尔数为基准,所述乙烯基硅油中乙烯基的含量为0.2-2mol%。根据本发明所述的方法,其中,含氢硅油可以为本领域常规用于制备硅胶片的含氢硅油,例如可以为端氢硅油。本发明中,对含氢硅油中SiH的含量没有特别的限定,例如含氢硅油中SiH的含量可以为0.05-0.5重量%。According to the method of the present invention, wherein the vinyl silicone oil can be the vinyl silicone oil used in the art for preparing silica gel sheets, for example, it can be vinyl-terminated silicone oil. In the present invention, the viscosity and vinyl content of vinyl silicone oil are not particularly limited, for example, its viscosity can be 100-50000cp, based on the moles of vinyl silicone oil, the content of vinyl in the vinyl silicone oil is 0.2 -2mol%. According to the method of the present invention, wherein the hydrogen-containing silicone oil can be the hydrogen-containing silicone oil commonly used in the art to prepare silica gel sheets, for example, it can be hydrogen-terminated silicone oil. In the present invention, the content of SiH in the hydrogen-containing silicone oil is not particularly limited, for example, the content of SiH in the hydrogen-containing silicone oil may be 0.05-0.5% by weight.

根据本发明所述的方法,其中,抑制剂可以为本领域常规的阻止交联反应发生的抑制剂,例如其可以选自3-甲基-1-丁炔-3-醇、1-乙炔基环己醇、甲肼、苯肼、三苯基膦、亚磷酸三苯酯、亚砜类中的至少一种。According to the method of the present invention, wherein, the inhibitor can be a conventional inhibitor in the art that prevents the crosslinking reaction from occurring, for example, it can be selected from 3-methyl-1-butyn-3-ol, 1-ethynyl At least one of cyclohexanol, methylhydrazine, phenylhydrazine, triphenylphosphine, triphenylphosphite, and sulfoxides.

根据本发明所述的方法,其中,催化剂可以为本领域常规的用于催化乙烯基硅油和含氢硅油发生交联反应的催化剂,所述催化剂优选为第八族过渡金属及其化合物或配合物,更优选为铂类催化剂,进一步优选为氯铂酸-异丙醇、氯铂酸-二乙烯基四甲基二硅氧烷和氯铂酸-邻苯二甲酸二乙酯中的至少一种。According to the method of the present invention, wherein, the catalyst can be a conventional catalyst used in the art to catalyze the crosslinking reaction of vinyl silicone oil and hydrogen-containing silicone oil, and the catalyst is preferably a Group VIII transition metal and its compound or complex , more preferably a platinum catalyst, more preferably at least one of chloroplatinic acid-isopropanol, chloroplatinic acid-divinyl tetramethyldisiloxane and chloroplatinic acid-diethyl phthalate .

第三方面,本发明还提供了上述方法制备的硅胶片。In the third aspect, the present invention also provides the silica gel sheet prepared by the above method.

本发明的硅胶片中导热粉末的填充量高达90-97重量%,导热系数可达到6W/mK以上,因此,本发明的硅胶片具有优异的导热性能。The filling amount of thermal conductive powder in the silica gel sheet of the present invention is as high as 90-97% by weight, and the thermal conductivity can reach more than 6W/mK. Therefore, the silica gel sheet of the present invention has excellent thermal conductivity.

实施例Example

实施例1Example 1

本实施例用于说明本发明的硅胶片及其制备方法。This example is used to illustrate the silica gel sheet of the present invention and its preparation method.

(1)将乙烯基硅油(粘度为100cp,乙烯基含量为0.2mol%)、含氢硅油(SiH的含量为0.05重量%)、1-乙炔基环己醇、氯铂酸-二乙烯基四甲基二硅氧烷按照重量比100:7:0.06:0.02进行混合均匀,得到有机硅交联体系;(1) Vinyl silicone oil (viscosity is 100cp, vinyl content is 0.2mol%), hydrogen-containing silicone oil (SiH content is 0.05% by weight), 1-ethynyl cyclohexanol, chloroplatinic acid-divinyl tetra Methyldisiloxane is mixed uniformly according to the weight ratio of 100:7:0.06:0.02 to obtain a silicone crosslinking system;

(2)将氧化铝(粒径为4.5μm)、有机硅交联体系和正己烷按照重量比100:3:200进行球磨3h;(2) Ball mill aluminum oxide (with a particle size of 4.5 μm), silicone crosslinking system and n-hexane for 3 hours at a weight ratio of 100:3:200;

(3)将球磨得到的混合物在80℃下进行喷雾造粒,制得粉体;(3) performing spray granulation on the mixture obtained by ball milling at 80° C. to obtain a powder;

(4)将粉体在压力为8MPa的条件下进行干压成型,得到厚度为2mm的片材;(4) Dry pressing the powder under the condition of 8MPa to obtain a sheet with a thickness of 2mm;

(5)将干压成型得到的片材在180℃下交联反应15min,制得硅胶片A1。(5) The sheet obtained by dry pressing was subjected to a crosslinking reaction at 180° C. for 15 minutes to obtain a silica gel sheet A1.

实施例2Example 2

本实施例用于说明本发明的硅胶片及其制备方法。This example is used to illustrate the silica gel sheet of the present invention and its preparation method.

(1)将乙烯基硅油(粘度为20000cp,乙烯基含量为2mol%)、含氢硅油(SiH的含量为0.5重量%)、三苯基膦、氯铂酸-异丙醇按照重量比100:11:0.06:0.02进行混合均匀,得到有机硅交联体系;(1) Vinyl silicone oil (viscosity is 20000cp, vinyl content is 2mol%), hydrogen-containing silicone oil (SiH content is 0.5% by weight), triphenylphosphine, chloroplatinic acid-isopropanol according to the weight ratio of 100: 11:0.06:0.02 to mix evenly to obtain a silicone cross-linking system;

(2)将氧化锌(粒径为4.5μm)、有机硅交联体系和正己烷按照重量比100:3.5:400进行球磨2h;(2) Ball mill zinc oxide (with a particle size of 4.5 μm), silicone crosslinking system and n-hexane for 2 hours at a weight ratio of 100:3.5:400;

(3)将球磨得到的混合物在85℃下进行喷雾造粒,制得粉体;(3) The mixture obtained by ball milling is subjected to spray granulation at 85° C. to obtain a powder;

(4)将粉体在压力为40MPa的条件下进行干压成型,得到厚度为2mm的片材;(4) Dry pressing the powder under the condition of 40MPa to obtain a sheet with a thickness of 2mm;

(5)将干压成型得到的片材在150℃下交联反应60min,制得硅胶片A2,氧化锌在制得的硅胶片中的填充量根据喷雾后残留组分质量计算,结果见表1。(5) The sheet obtained by dry pressing was subjected to crosslinking reaction at 150°C for 60 minutes to obtain silica gel sheet A2. The filling amount of zinc oxide in the prepared silica gel sheet was calculated according to the mass of the residual components after spraying. The results are shown in the table 1.

实施例3Example 3

本实施例用于说明本发明的硅胶片及其制备方法。This example is used to illustrate the silica gel sheet of the present invention and its preparation method.

(1)将乙烯基硅油(粘度为50000cp,乙烯基含量为1.5mol%)、含氢硅油(SiH的含量为0.25重量%)、苯肼、氯铂酸-邻苯二甲酸二乙酯按照重量比100:15:0.02:0.1进行混合均匀,得到有机硅交联体系;(1) Vinyl silicone oil (viscosity is 50000cp, vinyl content is 1.5mol%), hydrogen-containing silicone oil (the content of SiH is 0.25% by weight), phenylhydrazine, chloroplatinic acid-diethyl phthalate Mix evenly at a ratio of 100:15:0.02:0.1 to obtain a silicone crosslinking system;

(2)将氧化铝和氧化锌混合物(氧化铝和氧化锌的重量比为3:1,粒径均为0.5μm)、有机硅交联体系和正己烷按照重量比100:5:500进行球磨4h;(2) Ball mill the mixture of alumina and zinc oxide (the weight ratio of alumina and zinc oxide is 3:1, and the particle size is 0.5 μm), the silicone crosslinking system and n-hexane according to the weight ratio of 100:5:500 4h;

(3)将球磨得到的混合物在100℃下进行喷雾造粒,制得粉体;(3) Spray granulating the mixture obtained by ball milling at 100° C. to obtain a powder;

(4)将粉体在压力为50MPa的条件下进行干压成型,得到厚度为2mm的片材;(4) Dry pressing the powder under the condition of 50MPa to obtain a sheet with a thickness of 2mm;

(5)将干压成型得到的片材在130℃下交联反应30min,制得硅胶片A3。(5) The sheet obtained by dry pressing was subjected to a cross-linking reaction at 130° C. for 30 minutes to obtain a silica gel sheet A3.

实施例4Example 4

本实施例用于说明本发明的硅胶片及其制备方法。This example is used to illustrate the silica gel sheet of the present invention and its preparation method.

按照实施例1的方法制备硅胶片,不同的是,用相同粒径的氮化硼代替相同粒径的氧化铝,制得硅胶片A4。A silica gel sheet was prepared according to the method in Example 1, except that boron nitride with the same particle size was used instead of alumina with the same particle size to obtain a silica gel sheet A4.

实施例5Example 5

本实施例用于说明本发明的硅胶片及其制备方法。This example is used to illustrate the silica gel sheet of the present invention and its preparation method.

按照实施例1的方法制备硅胶片,不同的是,将粒径为4.5μm的氧化铝替换为粒径为10μm的氧化铝,制得硅胶片A5。A silica gel sheet was prepared according to the method of Example 1, except that the alumina with a particle size of 4.5 μm was replaced with alumina with a particle size of 10 μm to obtain a silica gel sheet A5.

对比例1Comparative example 1

先制备A胶和B胶,其中,A胶的组分含量为:50份乙烯基硅油,7份含氢,0.06份环己醇:210.5份氧化铝粉;B胶的组分含量为:50份乙烯基硅油,0.02份氯铂酸-二乙烯基四甲基二硅氧烷,217.5份氧化铝粉,A胶和B胶的制备只要将其组分进行混合即可制得,然后将A胶和B胶按照重量比为1:1进行混合,并搅拌0.5h,制得浆料,再将该浆料压延成型,然后在120℃下交联0.5h,制得与实施例1相同厚度的硅胶片D1。Prepare glue A and glue B first, wherein the component content of glue A is: 50 parts of vinyl silicone oil, 7 parts of hydrogen, 0.06 parts of cyclohexanol: 210.5 parts of alumina powder; the content of components of glue B is: 50 parts Part of vinyl silicone oil, 0.02 part of chloroplatinic acid-divinyltetramethyldisiloxane, 217.5 parts of alumina powder, the preparation of glue A and glue B can be prepared as long as its components are mixed, and then A Glue and B glue were mixed according to the weight ratio of 1:1, and stirred for 0.5h to obtain a slurry, and then the slurry was calendered, and then cross-linked at 120°C for 0.5h to obtain the same thickness as in Example 1 Silicone sheet D1.

测试例test case

采用热失重法测定实施例1-5制得的硅胶片A1-A5和对比例1制得的硅胶片D1的导热粉末的填充量。具体方法为:将硅胶片称重,然后在空气氛围下从25℃以5℃/min的速度升温至800℃,升温至800℃时得到的剩余固体为该硅胶片中填充的导热粉末,然后将剩余固体称重,计算导热粉末的填充量。The filling amount of the thermally conductive powder of the silica gel sheets A1-A5 prepared in Examples 1-5 and the silica gel sheet D1 prepared in Comparative Example 1 was determined by thermogravimetric method. The specific method is: weigh the silica gel sheet, then raise the temperature from 25°C to 800°C at a rate of 5°C/min in the air atmosphere, and the remaining solid obtained when the temperature rises to 800°C is the thermal conductive powder filled in the silica gel sheet, and then Weigh the remaining solids to calculate the filling amount of the thermally conductive powder.

将实施例1-5制得的硅胶片A1-A5和对比例1制得的硅胶片D1进行导热性能测试,导热性能测试的方法为激光闪射法,设备为激光导热仪,型号为NETZSCHLFA447,测试结果见表1。The silica gel sheet A1-A5 that embodiment 1-5 makes and the silica gel sheet D1 that comparative example 1 makes carry out thermal conductivity test, and the method for thermal conductivity test is laser flash method, and equipment is laser thermal conductivity meter, model is NETZSCHLFA447, test The results are shown in Table 1.

表1Table 1

样品编号Sample serial number 填充量(重量%)Filling amount (weight%) 导热系数(W/mK)Thermal conductivity (W/mK) A1A1 97.197.1 6.86.8 A2A2 96.696.6 6.86.8 A3A3 95.295.2 6.76.7 A4A4 90.990.9 6.16.1 A5A5 90.190.1 66 D1D1 8080 1.51.5

将实施例1-5与对比例1比较可以看出,本发明的硅胶片中导热粉末的填充量高达90-97重量%,导热系数可达到6W/mK以上,因此,本发明的硅胶片具有优异的导热性能。Comparing Examples 1-5 with Comparative Example 1, it can be seen that the filling amount of heat-conducting powder in the silica gel sheet of the present invention is as high as 90-97% by weight, and the thermal conductivity can reach more than 6W/mK. Therefore, the silica gel sheet of the present invention has Excellent thermal conductivity.

将实施例1与实施例4比较可以看出,当导热粉末为氧化铝和/或氧化锌时,能够进一步提高制得的硅胶片的导热性能。Comparing Example 1 with Example 4, it can be seen that when the thermally conductive powder is aluminum oxide and/or zinc oxide, the thermal conductivity of the prepared silica gel sheet can be further improved.

将实施例1与实施例5比较可以看出,当导热粉末的粒径为0.5-4.5μm时,能够进一步提高制得的硅胶片的导热性能,即采用较小粒径导电粉末,能够进一步提高制得的硅胶片的导热性能。Comparing Example 1 with Example 5, it can be seen that when the particle size of the thermally conductive powder is 0.5-4.5 μm, the thermal conductivity of the prepared silica gel sheet can be further improved, that is, the use of a smaller particle size conductive powder can further improve The thermal conductivity of the prepared silica gel sheets.

本发明的硅胶片具有制备工艺简单、导热性能优异、生产成本较低等优点,能够满足电子产品模块的散热要求。The silica gel sheet of the invention has the advantages of simple preparation process, excellent thermal conductivity, low production cost, etc., and can meet the heat dissipation requirements of electronic product modules.

以上详细描述了本发明的优选实施方式,但是,本发明并不限于上述实施方式中的具体细节,在本发明的技术构思范围内,可以对本发明的技术方案进行多种简单变型,这些简单变型均属于本发明的保护范围。The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solutions of the present invention. These simple modifications All belong to the protection scope of the present invention.

另外需要说明的是,在上述具体实施方式中所描述的各个具体技术特征,在不矛盾的情况下,可以通过任何合适的方式进行组合,为了避免不必要的重复,本发明对各种可能的组合方式不再另行说明。In addition, it should be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable way if there is no contradiction. The combination method will not be described separately.

此外,本发明的各种不同的实施方式之间也可以进行任意组合,只要其不违背本发明的思想,其同样应当视为本发明所公开的内容。In addition, various combinations of different embodiments of the present invention can also be combined arbitrarily, as long as they do not violate the idea of the present invention, they should also be regarded as the disclosed content of the present invention.

Claims (17)

1.一种硅胶片,其特征在于,该硅胶片的导热系数为6W/mK以上。1. A silica gel sheet, characterized in that the thermal conductivity of the silica gel sheet is more than 6W/mK. 2.根据权利要求1所述的硅胶片,其中,该硅胶片中含有导热粉末,以所述硅胶片的总重量为基准,所述导热粉末的含量为90-97重量%。2. The silica gel sheet according to claim 1, wherein the silica gel sheet contains thermally conductive powder, based on the total weight of the silica gel sheet, the content of the thermally conductive powder is 90-97% by weight. 3.根据权利要求2所述的硅胶片,其中,所述导热粉末选自氧化铝、氧化锌、二氧化硅、氮化铝、氮化硼和碳化硅中的至少一种,优选为氧化铝和/或氧化锌。3. The silica gel sheet according to claim 2, wherein the thermally conductive powder is selected from at least one of aluminum oxide, zinc oxide, silicon dioxide, aluminum nitride, boron nitride and silicon carbide, preferably aluminum oxide and/or zinc oxide. 4.根据权利要求2或3所述的硅胶片,其中,所述导热粉末的粒径为0.5-4.5μm。4. The silica gel sheet according to claim 2 or 3, wherein the particle size of the heat-conducting powder is 0.5-4.5 μm. 5.一种硅胶片的制备方法,其特征在于,该方法包括:5. a preparation method of silica gel sheet, it is characterized in that, the method comprises: (1)将乙烯基硅油、含氢硅油、抑制剂、催化剂进行混合,得到有机硅交联体系;(1) Mix vinyl silicone oil, hydrogen-containing silicone oil, inhibitor, and catalyst to obtain a silicone crosslinking system; (2)将导热粉末、有机硅交联体系和有机溶剂进行球磨;(2) Ball milling the heat-conducting powder, the organosilicon cross-linking system and the organic solvent; (3)将球磨得到的混合物喷雾造粒,制得粉体;(3) The mixture obtained by ball milling is sprayed and granulated to obtain a powder; (4)将粉体进行干压成型;(4) Carry out dry pressing molding to powder; (5)将干压成型得到的片材进行交联反应。(5) Perform a crosslinking reaction on the sheet obtained by dry pressing. 6.根据权利要求5所述的方法,其中,步骤(5)中,交联反应的条件包括:温度为130-180℃,时间为15-60min。6 . The method according to claim 5 , wherein, in step (5), the conditions of the crosslinking reaction include: the temperature is 130-180° C., and the time is 15-60 min. 7.根据权利要求5所述的方法,其中,所述导热粉末选自氧化铝、氧化锌、二氧化硅、氮化铝、氮化硼和碳化硅中的至少一种,优选为氧化铝和/或氧化锌。7. The method according to claim 5, wherein the thermally conductive powder is selected from at least one of aluminum oxide, zinc oxide, silicon dioxide, aluminum nitride, boron nitride and silicon carbide, preferably aluminum oxide and / or zinc oxide. 8.根据权利要求5或7所述的方法,其中,所述导热粉末的粒径为0.5-4.5μm。8. The method according to claim 5 or 7, wherein the particle size of the thermally conductive powder is 0.5-4.5 μm. 9.根据权利要求5所述的方法,其中,步骤(1)中,乙烯基硅油、含氢硅油、抑制剂、催化剂的重量比为100:7-15:0.02-0.1:0.02-0.1。9. The method according to claim 5, wherein, in step (1), the weight ratio of vinyl silicone oil, hydrogen-containing silicone oil, inhibitor, and catalyst is 100:7-15:0.02-0.1:0.02-0.1. 10.根据权利要求5所述的方法,其中,步骤(2)中,导热粉末、有机硅交联体系和有机溶剂的重量比为100:3-6:200-500。10. The method according to claim 5, wherein, in step (2), the weight ratio of the heat-conducting powder, the silicone cross-linking system and the organic solvent is 100:3-6:200-500. 11.根据权利要求5所述的方法,其中,步骤(3)中,喷雾造粒的条件包括:温度为70-100℃。11. The method according to claim 5, wherein, in step (3), the conditions for spray granulation include: a temperature of 70-100°C. 12.根据权利要求5所述的方法,其中,步骤(4)中,干压成型的条件包括:压力为8-80MPa。12. The method according to claim 5, wherein, in step (4), the conditions for dry pressing include: the pressure is 8-80 MPa. 13.根据权利要求5或9所述的方法,其中,所述乙烯基硅油的粘度为100-50000cp,以乙烯基硅油的摩尔数为基准,所述乙烯基硅油中乙烯基的含量为0.2-2mol%。13. The method according to claim 5 or 9, wherein the viscosity of the vinyl silicone oil is 100-50000cp, based on the number of moles of the vinyl silicone oil, the content of vinyl in the vinyl silicone oil is 0.2- 2mol%. 14.根据权利要求5或9所述的方法,其中,以含氢硅油的总重量为基准,所述含氢硅油中SiH的含量为0.05-0.5重量%。14. The method according to claim 5 or 9, wherein, based on the total weight of the hydrogen-containing silicone oil, the content of SiH in the hydrogen-containing silicone oil is 0.05-0.5% by weight. 15.根据权利要求5或9所述的方法,其中,所述抑制剂选自3-甲基-1-丁炔-3-醇、1-乙炔基环己醇、甲肼、苯肼、三苯基膦、亚磷酸三苯酯、亚砜类中的至少一种。15. The method according to claim 5 or 9, wherein the inhibitor is selected from the group consisting of 3-methyl-1-butyn-3-ol, 1-ethynylcyclohexanol, methylhydrazine, phenylhydrazine, tris At least one of phenylphosphine, triphenyl phosphite, and sulfoxides. 16.根据权利要求5或9所述的方法,其中,所述催化剂为第八族过渡金属及其化合物或配合物,优选为铂类催化剂,更优选为氯铂酸-异丙醇、氯铂酸-二乙烯基四甲基二硅氧烷和氯铂酸-邻苯二甲酸二乙酯中的至少一种。16. The method according to claim 5 or 9, wherein the catalyst is a Group VIII transition metal and a compound or complex thereof, preferably a platinum catalyst, more preferably chloroplatinic acid-isopropanol, platinum chloride At least one of acid-divinyltetramethyldisiloxane and chloroplatinic acid-diethylphthalate. 17.根据权利要求5-16中任意一项所述方法制备的硅胶片。17. The silica gel sheet prepared by the method according to any one of claims 5-16.
CN201410598318.4A 2014-10-30 2014-10-30 Silicon sheet and preparation method thereof Pending CN105566918A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410598318.4A CN105566918A (en) 2014-10-30 2014-10-30 Silicon sheet and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410598318.4A CN105566918A (en) 2014-10-30 2014-10-30 Silicon sheet and preparation method thereof

Publications (1)

Publication Number Publication Date
CN105566918A true CN105566918A (en) 2016-05-11

Family

ID=55877583

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410598318.4A Pending CN105566918A (en) 2014-10-30 2014-10-30 Silicon sheet and preparation method thereof

Country Status (1)

Country Link
CN (1) CN105566918A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018121215A1 (en) * 2016-12-29 2018-07-05 比亚迪股份有限公司 Liquid optical silicone composition, optical silicone, double-glass photovoltaic assembly, and preparation method therefor
CN108752588A (en) * 2018-06-07 2018-11-06 福建农林大学 A kind of preparation method of the super-hydrophobic organic silicon nano particle containing Si -- H bond
CN109401732A (en) * 2018-10-31 2019-03-01 深圳联腾达科技有限公司 Hypotonic oil heat conductive silica gel gasket and preparation method thereof
CN110172250A (en) * 2019-05-22 2019-08-27 平湖阿莱德实业有限公司 A kind of new-energy automobile extremely-low density high thermal conductivity calking boundary material and preparation method thereof
CN110511728A (en) * 2019-07-17 2019-11-29 平湖阿莱德实业有限公司 A kind of pureed two-component high thermal conductivity coefficient interface sealant and preparation method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102533152A (en) * 2012-01-18 2012-07-04 苏州领胜电子科技有限公司 Heat-conducting siliconfilm and manufacturing method thereof
CN102558876A (en) * 2011-12-29 2012-07-11 深圳德邦界面材料有限公司 Low-cost radiating silica gel sheet and preparation method thereof
CN102555331A (en) * 2012-01-18 2012-07-11 苏州领胜电子科技有限公司 Thermal-conductive silicon sheet and manufacturing method thereof
CN103059576A (en) * 2012-12-30 2013-04-24 深圳市鸿富诚屏蔽材料有限公司 High-heat-conductivity flexible silica gel gasket and preparation method thereof
CN103351627A (en) * 2013-07-09 2013-10-16 东莞兆舜有机硅新材料科技有限公司 A kind of addition type heat-conducting silicone rubber and preparation method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102558876A (en) * 2011-12-29 2012-07-11 深圳德邦界面材料有限公司 Low-cost radiating silica gel sheet and preparation method thereof
CN102533152A (en) * 2012-01-18 2012-07-04 苏州领胜电子科技有限公司 Heat-conducting siliconfilm and manufacturing method thereof
CN102555331A (en) * 2012-01-18 2012-07-11 苏州领胜电子科技有限公司 Thermal-conductive silicon sheet and manufacturing method thereof
CN103059576A (en) * 2012-12-30 2013-04-24 深圳市鸿富诚屏蔽材料有限公司 High-heat-conductivity flexible silica gel gasket and preparation method thereof
CN103351627A (en) * 2013-07-09 2013-10-16 东莞兆舜有机硅新材料科技有限公司 A kind of addition type heat-conducting silicone rubber and preparation method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
陈纯洋: "《单组份加成型绝缘导热硅橡胶的研究》", 《硕士学位论文》 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018121215A1 (en) * 2016-12-29 2018-07-05 比亚迪股份有限公司 Liquid optical silicone composition, optical silicone, double-glass photovoltaic assembly, and preparation method therefor
CN108752588A (en) * 2018-06-07 2018-11-06 福建农林大学 A kind of preparation method of the super-hydrophobic organic silicon nano particle containing Si -- H bond
CN109401732A (en) * 2018-10-31 2019-03-01 深圳联腾达科技有限公司 Hypotonic oil heat conductive silica gel gasket and preparation method thereof
CN110172250A (en) * 2019-05-22 2019-08-27 平湖阿莱德实业有限公司 A kind of new-energy automobile extremely-low density high thermal conductivity calking boundary material and preparation method thereof
CN110511728A (en) * 2019-07-17 2019-11-29 平湖阿莱德实业有限公司 A kind of pureed two-component high thermal conductivity coefficient interface sealant and preparation method thereof

Similar Documents

Publication Publication Date Title
CN104178076B (en) A kind of heat conductive insulating epoxy resin embedding adhesive and preparation method
CN100575443C (en) A high thermal conductivity silicone potting compound
CN109735112B (en) Addition type organic silicon heat-conducting gel and preparation method thereof
CN102559048B (en) A kind of preparation method of epoxy modified silicone insulating heat-conductive high-temperature resistant coating and goods
CN103131381B (en) High-performance environmentally-friendly flame retardant type organic electron pouring sealant and preparation method thereof
CN103059576B (en) High-heat-conductivity flexible silica gel gasket and preparation method thereof
CN105566918A (en) Silicon sheet and preparation method thereof
CN102827480B (en) Method for preparing high-heat-conducting silicon rubber compound material
CN109705804B (en) High enthalpy value phase-change silica gel gasket and preparation method thereof
CN105524469B (en) Heat-conducting glue and its preparation method and use
CN103030976A (en) Single-component heat-curing liquid silicone rubber and preparation method thereof
CN107201171B (en) A kind of boron bakelite resin/epoxy modified silicone resin coating of resistance to ablation protection and preparation method thereof
CN106867444B (en) Low-specific-gravity flame-retardant heat-conducting pouring sealant for automobile power battery and preparation method thereof
CN103951983B (en) A kind of high heat conduction high temperature resistant polysiloxanes ceramic composite and preparation method thereof and application
CN104232017B (en) A kind of preparation method of room temperature curable ceramic precursor binder
CN103396759B (en) A kind of desulfuration chimney inner wall anti-corrosive organic silicon adhesive and method for formulating thereof
CN104893307A (en) Heat-conduction electric-insulation rubber-plastic composite material and preparation method thereof
CN104513487A (en) Bi-component heat conduction silica gel and application thereof
CN111286299A (en) Bi-component condensed type encapsulating material convenient for construction and preparation method thereof
CN108130039A (en) A kind of low-gravity low viscosity heat conduction casting glue and preparation method thereof
CN106047073B (en) A kind of graphene oxide based high-temp-resistant bicomponent epoxy resin coating
CN103555262B (en) A kind of heat conduction hot melt adhesive and preparation method thereof
CN112608708A (en) Polyurethane heat-conducting insulating adhesive and preparation method thereof
CN103409115A (en) Enhanced heat conducting interface material and preparation method thereof
CN104725879A (en) Ablation-resistant organosilicon composite, and preparation method and application thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20160511

RJ01 Rejection of invention patent application after publication