CN106102403A - A kind of busbar group and the mounting assembly of power semiconductor - Google Patents
A kind of busbar group and the mounting assembly of power semiconductor Download PDFInfo
- Publication number
- CN106102403A CN106102403A CN201610588822.5A CN201610588822A CN106102403A CN 106102403 A CN106102403 A CN 106102403A CN 201610588822 A CN201610588822 A CN 201610588822A CN 106102403 A CN106102403 A CN 106102403A
- Authority
- CN
- China
- Prior art keywords
- busbar
- power semiconductor
- mounting assembly
- group
- line bank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 238000009413 insulation Methods 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 6
- 230000003014 reinforcing effect Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 6
- 238000001149 thermolysis Methods 0.000 abstract description 4
- 238000010276 construction Methods 0.000 abstract description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides the mounting assembly of a kind of busbar group and power semiconductor, busbar group at least includes the first busbar and the second busbar, first busbar and the second busbar are parallel to each other, and power semiconductor is installed between the first busbar and the second busbar and is gripped by the first busbar and the second busbar.In the mounting assembly of busbar group and power semiconductor that the present invention provides, busbar serves thermolysis while conduction, and simple in construction, with low cost, radiating effect is outstanding.
Description
Technical field
The present invention relates to a kind of busbar mounting structure, be specifically related to the peace of a kind of busbar group and power semiconductor
Arrangement, belongs to technical field of electricity.
Background technology
Power semiconductor, is also called power electronic devices, is to have process high voltage, the quasiconductor of big current capacity
Device.Voltage process range reaches as high as kilo-ampere from tens to several kilovolts, current capacity.Typical Power Processing, bag
Include frequency conversion, transformation, unsteady flow, power management etc..Power semiconductor in early days has: heavy-duty diode, IGCT etc., mainly
For industry and power system.Along with developing rapidly of the Novel power semiconductor with power MOSFET device as representative,
Power semiconductor is the most now.
Based on power semiconductor high voltage, the characteristic of big electric current, during its work, caloric value is very big, only relies on self
Natural heat dissipation is to be difficult to ensure that normal work, it is therefore necessary to its auxiliary heat dissipation.As a example by modal IGCT dispels the heat, generally
Being arranged on by IGCT on radiator, radiator is with heat radiation gear piece, then relies on radiator fan to blow away the heat of heat radiation gear piece,
The heat radiation of IGCT is realized with this.The shortcoming of this radiating mode is, IGCT is very fast near the heat radiation of the position of radiator, away from
The position of radiator is the most still dependent on its natural heat dissipation, and radiating effect is undesirable.Additionally, IGCT connects metal material
Busbar, busbar has conducted the partial heat that IGCT produces, and radiator fan blows less than busbar, and this partial heat is more difficult to be dissipated
Go out.
In summary, the traditional approach radiating effect utilizing radiator and fan to dispel the heat power semiconductor is the best,
Those skilled in the art's just constantly research and development application is in other radiator structures of power semiconductor and radiating mode.
Summary of the invention
The technical problem to be solved is: how to make radiator and busbar convenient fixing, saves Material Cost
And cost of labor；Power semiconductor how is made preferably to dispel the heat.
In order to solve above technical problem, the invention provides the installation group of a kind of busbar group and power semiconductor
Part, busbar group at least includes that the first busbar and the second busbar, the first busbar and the second busbar are parallel to each other, power
Semiconductor device is installed between the first busbar and the second busbar and is clamped solid by the first busbar and the second busbar
Fixed.
Further, the first busbar and the second busbar are machined with several insulating mounting holes, the first busbar exhausted
The insulating mounting hole corresponding matching of edge installing hole and the second busbar.
Further, the first surface of the first busbar is machined with the first shiny surface, the first shiny surface and power semiconductor
The first surface of device is in close contact；The first surface of the second busbar is machined with the second shiny surface, the second shiny surface and power
The second surface of semiconductor device is in close contact.
Further, it is machined with for Positioning power semiconductor device on the first shiny surface and/or the second shiny surface
Protruding.
Further, the first busbar has the first line bank, and the second busbar has the second line bank.
Further, the first line bank is processed to form by the end of the first busbar, and the second line bank is by the second busbar
End be processed to form.
Further, the second two ends, line bank left and right all have base installing hole.
Further, the first line bank is fixed on the first end of the first busbar by secure component, and the second line bank leads to
Cross secure component and be fixed on the first end of the second busbar.
Further, the second line bank has base installing hole, and the second line bank has reinforcing and installs row, reinforces the row of installation
It is fixed on the second end of the second line bank by secure component, reinforces installation row and there is base installing hole.
Further, the first busbar and the second busbar are processed by shape, and the first busbar and second is led
It is provided with heat radiation gear piece on electricity row.
Beneficial effects of the present invention: busbar serves thermolysis while conduction, simple in construction, with low cost,
Radiating effect is outstanding.
Accompanying drawing explanation
Fig. 1 is the busbar Facad structure figure in a preferred embodiment of the present invention；
Fig. 2 is the busbar inverse layer structure figure in a preferred embodiment of the present invention；
Fig. 3 is the mounting assembly overview in a preferred embodiment of the present invention；
Fig. 4 is the mounting assembly side view in a preferred embodiment of the present invention；
Fig. 5 is the busbar structure chart in another preferred embodiment of the present invention；
Fig. 6 is the mounting assembly overview in another preferred embodiment of the present invention；
Fig. 7 is the mounting assembly side view in another preferred embodiment of the present invention.
Detailed description of the invention
Below with reference to accompanying drawing, the technique effect of design, concrete structure and the generation of the present invention is described further, with
It is fully understood from the purpose of the present invention, feature and effect.
Embodiment 1
As it is shown on figure 3, the invention provides the mounting assembly of a kind of busbar group and power semiconductor, busbar group
Being parallel to each other including busbar 1 and busbar 2, busbar 1 and busbar 2, power semiconductor 3 is installed in busbar 1
And grip between busbar 2 and by busbar 1 and busbar 2.Busbar 1 is machined with 3 insulating mounting holes, busbar 2
It is machined with 3 insulating mounting holes, two groups of insulating mounting hole one_to_one corresponding equally.Insulation tube 4 is each passed through busbar 1 and busbar
The insulating mounting hole of 2, the bottom of busbar 2 is furnished with stator 5, stator 5 has 3 screw (not shown)s, screw (figure
Not shown in) through insulation tube 4 and be screwed into the screw of stator 5, realize busbar 1 and the insulation of busbar 2 with this.With
Time, relying on screw and the cooperation of stator, power semiconductor 3 is fixed between busbar 1 and busbar 2.Busbar 1
It is not limited to this, as long as ensureing both insulation and fixing with the fixed form of busbar 2.Busbar 1 and busbar 2 are by aluminium profiles
Material or copper material are processed into.Fig. 4 is the side view of Fig. 3.
Shown in Fig. 1 is the Facad structure of busbar 1.Busbar 1 Surface Machining has shiny surface 11, shiny surface 11 and power
The intimate surface contact of semiconductor device 3, the heat making power semiconductor 3 send is easier to pass to busbar 1 shed.
There is a projection 12 in the middle of shiny surface 11, for the location of power semiconductor 3 and fixing.Shiny surface 12 and protruding 12 is cut
Cutting and be processed to form, shiny surface 11 is the part machined away, and protruding 12 is the part stayed.Busbar 1 is machined with 3 insulating mounting
Hole 13, insulating mounting hole 13 is used for installing insulation tube 4.One end of busbar 1 is processed to line bank 15, the afterbody of line bank 15
Offer wiring hole 16.
Shown in Fig. 2 is the inverse layer structure of busbar 1, and the reverse side at busbar 1 is machined with heat radiation gear piece 17, makes busbar
1 plays thermolysis.It is true that the busbar 1 of the present invention has conduction and thermolysis concurrently, save lot of materials, reduce
Cost.
Return Fig. 3, busbar 1 offers installing hole 14, be the ingenious part of the present invention.In order to reduce parts
Model, busbar 1 and busbar 2 are designed to completely the same.In busbar 2, installing hole 14 is for by whole mounting assembly
It is fixed on (including busbar 1, busbar 2, power semiconductor 3) pedestal or the housing of outside.In order to reinforced insulation is with scattered
Heat, with insulated column 6, mounting assembly is padded.Insulated column about 6 is respectively arranged with a screw (not shown), and lower screw is used for insulating
Fixing with pedestal or housing of post 6, upper screw is for fixing with whole mounting assembly of insulated column 6.Two screws are each passed through
When mounting assembly is fixed on insulated column 6 by two installing holes of busbar 2, the installing hole 14 of busbar 1 act as the sight of screw 7
Examine hole and tool passage, screwdriver or inner hexagon spanner to stretch into installing hole 14 and tightened by screw 7.
Embodiment 2
What Fig. 5～Fig. 7 showed is an alternative embodiment of the invention.The present embodiment is with the difference of embodiment 1: (1)
Terminals and the connected mode of busbar；(2) whole mounting assembly and pedestal or the connected mode of housing；Described below:
What Fig. 5 showed is busbar Facad structure figure, and line bank is direct by busbar end the most as in Example 1
It is processed to form, but other parts are fixed on the screw of busbar by two screws.Fig. 6 is that mounting assembly entirety regards
Figure, Fig. 7 is the side view of mounting assembly.
Also having two fixing threaded holes on line bank, mounting assembly is fixed on base by fixing threaded hole by two fixing screws
On seat or housing.In order to more firmly install, the busbar near pedestal or housing has been also connected with reinforcing the row of installation, reinforces and installs
Fixing for busbar of first group of screw of row, reinforces second group of screw of the row of installation for consolidating with pedestal or housing
Fixed.Comparing embodiment 1, the parts of the present embodiment are more, but its advantage is the processing simplicity of busbar.
The preferred embodiment of the present invention described in detail above.Should be appreciated that those of ordinary skill in the art without
Need creative work just can make many modifications and variations according to the design of the present invention.Therefore, all technology in the art
Personnel are available by logical analysis, reasoning, or a limited experiment the most on the basis of existing technology
Technical scheme, all should be in the protection domain being defined in the patent claims.
Claims (10)
1. a busbar group and the mounting assembly of power semiconductor, it is characterised in that described busbar group at least includes
First busbar and the second busbar, described first busbar and the second busbar be parallel to each other, described power semiconductor
It is installed between described first busbar and the second busbar and is gripped by described first busbar and the second busbar.
A kind of busbar group the most according to claim 1 and the mounting assembly of power semiconductor, it is characterised in that institute
State the first busbar and described second busbar is machined with several insulating mounting holes, the described insulation peace of described first busbar
Dress hole and the described insulating mounting hole corresponding matching of described second busbar.
A kind of busbar group the most according to claim 1 and the mounting assembly of power semiconductor, it is characterised in that institute
State the first surface of the first busbar and be machined with the first shiny surface, the of described first shiny surface and described power semiconductor
One intimate surface contact；The first surface of described second busbar is machined with the second shiny surface, and described second shiny surface is with described
The second surface of power semiconductor is in close contact.
A kind of busbar group the most according to claim 3 and the mounting assembly of power semiconductor, it is characterised in that institute
State and be machined with the projection for positioning described power semiconductor on the first shiny surface and/or described second shiny surface.
A kind of busbar group the most according to claim 1 and the mounting assembly of power semiconductor, it is characterised in that institute
Stating the first busbar and have the first line bank, described second busbar has the second line bank.
A kind of busbar group the most according to claim 5 and the mounting assembly of power semiconductor, it is characterised in that institute
Stating the first line bank to be processed to form by the end of the first busbar, described second line bank is processed shape by the end of the second busbar
Become.
A kind of busbar group the most according to claim 6 and the mounting assembly of power semiconductor, it is characterised in that institute
State the second two ends, line bank left and right and all have base installing hole.
A kind of busbar group the most according to claim 5 and the mounting assembly of power semiconductor, it is characterised in that institute
Stating the first line bank and be fixed on the first end of described first busbar by secure component, described second line bank passes through fastening part
Part is fixed on the first end of described second busbar.
A kind of busbar group the most according to claim 8 and the mounting assembly of power semiconductor, it is characterised in that institute
Stating the second line bank and have base installing hole, described second line bank has reinforcing and installs row, and the described row of installation that reinforces is by tightly
Gu parts are fixed on the second end of described second line bank, described reinforcing is installed and has been arranged base installing hole.
A kind of busbar group the most according to claim 1 and the mounting assembly of power semiconductor, it is characterised in that
Described first busbar and described second busbar are processed by shape, on described first busbar and the second busbar
It is provided with heat radiation gear piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610588822.5A CN106102403A (en) | 2016-07-25 | 2016-07-25 | A kind of busbar group and the mounting assembly of power semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610588822.5A CN106102403A (en) | 2016-07-25 | 2016-07-25 | A kind of busbar group and the mounting assembly of power semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106102403A true CN106102403A (en) | 2016-11-09 |
Family
ID=57450504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610588822.5A Pending CN106102403A (en) | 2016-07-25 | 2016-07-25 | A kind of busbar group and the mounting assembly of power semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106102403A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111240301A (en) * | 2020-01-08 | 2020-06-05 | 广东纽恩泰新能源科技发展有限公司 | Convenient and safe control logic test tool |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0441572A2 (en) * | 1990-02-07 | 1991-08-14 | Ngk Insulators, Ltd. | Power semiconductor device with heat dissipating property |
| CN2549592Y (en) * | 2002-03-08 | 2003-05-07 | 刘树华 | Heat pipe radiator |
| CN2617036Y (en) * | 2003-04-03 | 2004-05-19 | 鞍山鞍明热管制造有限公司 | Heat-tube radiator for high-power electric-power semiconductor device |
| CN102810832A (en) * | 2012-08-14 | 2012-12-05 | 江苏华威线路设备集团有限公司 | Busway connector |
| CN103594990A (en) * | 2013-10-14 | 2014-02-19 | 镇江众志电力设备有限公司 | Heat conduction type bus duct |
| CN204303710U (en) * | 2015-01-13 | 2015-04-29 | 浙江天正电气股份有限公司 | A kind of DC circuit breaker radiation conductive device reducing eddy current effect |
-
2016
- 2016-07-25 CN CN201610588822.5A patent/CN106102403A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0441572A2 (en) * | 1990-02-07 | 1991-08-14 | Ngk Insulators, Ltd. | Power semiconductor device with heat dissipating property |
| CN2549592Y (en) * | 2002-03-08 | 2003-05-07 | 刘树华 | Heat pipe radiator |
| CN2617036Y (en) * | 2003-04-03 | 2004-05-19 | 鞍山鞍明热管制造有限公司 | Heat-tube radiator for high-power electric-power semiconductor device |
| CN102810832A (en) * | 2012-08-14 | 2012-12-05 | 江苏华威线路设备集团有限公司 | Busway connector |
| CN103594990A (en) * | 2013-10-14 | 2014-02-19 | 镇江众志电力设备有限公司 | Heat conduction type bus duct |
| CN204303710U (en) * | 2015-01-13 | 2015-04-29 | 浙江天正电气股份有限公司 | A kind of DC circuit breaker radiation conductive device reducing eddy current effect |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111240301A (en) * | 2020-01-08 | 2020-06-05 | 广东纽恩泰新能源科技发展有限公司 | Convenient and safe control logic test tool |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161109 |