CN1062444A - 制备具有内部铜导体的多层陶瓷的方法 - Google Patents

制备具有内部铜导体的多层陶瓷的方法 Download PDF

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Publication number
CN1062444A
CN1062444A CN91108028A CN91108028A CN1062444A CN 1062444 A CN1062444 A CN 1062444A CN 91108028 A CN91108028 A CN 91108028A CN 91108028 A CN91108028 A CN 91108028A CN 1062444 A CN1062444 A CN 1062444A
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CN
China
Prior art keywords
atmosphere
heating
moisture
sintering
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN91108028A
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English (en)
Chinese (zh)
Inventor
S·S·坦汉卡
M·J·基施纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Messer LLC
Original Assignee
BOC Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOC Group Inc filed Critical BOC Group Inc
Publication of CN1062444A publication Critical patent/CN1062444A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64—Burning or sintering processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Structural Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ceramic Capacitors (AREA)
CN91108028A 1990-10-11 1991-09-24 制备具有内部铜导体的多层陶瓷的方法 Pending CN1062444A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US596,122 1984-04-02
US59612290A 1990-10-11 1990-10-11

Publications (1)

Publication Number Publication Date
CN1062444A true CN1062444A (zh) 1992-07-01

Family

ID=24386063

Family Applications (1)

Application Number Title Priority Date Filing Date
CN91108028A Pending CN1062444A (zh) 1990-10-11 1991-09-24 制备具有内部铜导体的多层陶瓷的方法

Country Status (8)

Country Link
EP (1) EP0487196A1 (2)
JP (1) JP2506520B2 (2)
CN (1) CN1062444A (2)
AU (1) AU644481B2 (2)
CA (1) CA2051843A1 (2)
IE (1) IE913574A1 (2)
TW (1) TW215079B (2)
ZA (1) ZA917489B (2)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101341585B (zh) * 2006-06-05 2010-06-02 田中贵金属工业株式会社 接合方法
CN102869207A (zh) * 2012-09-24 2013-01-09 胜宏科技（惠州）股份有限公司 一种多层led混合材料线路板的层压方法
CN111133610A (zh) * 2017-09-29 2020-05-08 罗伯特·博世有限公司 具有经涂覆的材料的固体复合电极
CN115863289A (zh) * 2022-11-25 2023-03-28 上海富乐华半导体科技有限公司 一种多层铜片键合方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5682018A (en) * 1991-10-18 1997-10-28 International Business Machines Corporation Interface regions between metal and ceramic in a metal/ceramic substrate
DE4443365A1 (de) * 1994-12-06 1996-06-13 Philips Patentverwaltung Brenn- und Sinterverfahren für ein keramisches elektronisches Bauteil
EP1525090B1 (de) * 2002-08-02 2015-09-30 Epcos Ag Verfahren zur herstellung eines keramischen substrats

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60221358A (ja) * 1984-04-13 1985-11-06 日本碍子株式会社 電気絶縁体用セラミック組成物
US4906405A (en) * 1987-05-19 1990-03-06 Matsushita Electric Industrial Co., Ltd. Conductor composition and method of manufacturing a multilayered ceramic body using the composition
FR2626270B1 (fr) * 1988-01-22 1992-04-30 Pechiney Recherche Procede de cofrittage, de conducteurs en cuivre ou en alliages a base de cuivre et de leur substrat ceramique en cordierite
FR2643364B1 (fr) * 1989-02-22 1993-08-13 Air Liquide Procede d'elaboration de composants multicouches ceramique-metal et appareil pour sa mise en oeuvre
FR2643365B1 (fr) * 1989-02-22 1993-11-05 Air Liquide Procede de metallisation de ceramiques et appareil pour sa mise en oeuvr

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101341585B (zh) * 2006-06-05 2010-06-02 田中贵金属工业株式会社 接合方法
CN102869207A (zh) * 2012-09-24 2013-01-09 胜宏科技（惠州）股份有限公司 一种多层led混合材料线路板的层压方法
CN111133610A (zh) * 2017-09-29 2020-05-08 罗伯特·博世有限公司 具有经涂覆的材料的固体复合电极
US11527754B2 (en) 2017-09-29 2022-12-13 Robert Bosch Gmbh Solid composite electrode with coated materials
CN115863289A (zh) * 2022-11-25 2023-03-28 上海富乐华半导体科技有限公司 一种多层铜片键合方法
CN115863289B (zh) * 2022-11-25 2025-11-18 上海富乐华半导体科技有限公司 一种多层铜片键合方法

Also Published As

Publication number Publication date
EP0487196A1 (en) 1992-05-27
TW215079B (2) 1993-10-21
IE913574A1 (en) 1992-04-22
JP2506520B2 (ja) 1996-06-12
AU8551791A (en) 1992-04-16
CA2051843A1 (en) 1992-04-12
JPH0616489A (ja) 1994-01-25
AU644481B2 (en) 1993-12-09
ZA917489B (en) 1993-03-05

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