CN106252187B - 在带电粒子显微镜中分析样品表面改性的方法 - Google Patents

在带电粒子显微镜中分析样品表面改性的方法 Download PDF

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Publication number
CN106252187B
CN106252187B CN201610400193.9A CN201610400193A CN106252187B CN 106252187 B CN106252187 B CN 106252187B CN 201610400193 A CN201610400193 A CN 201610400193A CN 106252187 B CN106252187 B CN 106252187B
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China
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image
sample
primary
modification
charged particle
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Chinese (zh)
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CN106252187A (zh
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P.波托塞克
F.鲍霍贝
M.P.W.范登博加尔德
E.科克马兹
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FEI Co
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FEI Co
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002—Details
    • H01J37/3005—Observing the objects or the point of impact on the object
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/244—Detectors; Associated components or circuits therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/261—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/206—Modifying objects while observing
    • H01J2237/2067—Surface alteration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/22—Treatment of data
    • H01J2237/221—Image processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244—Detection characterized by the detecting means
    • H01J2237/24495—Signal processing, e.g. mixing of two or more signals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
    • H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching for microworking, e. g. etching of gratings or trimming of electrical components

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
CN201610400193.9A 2015-06-09 2016-06-08 在带电粒子显微镜中分析样品表面改性的方法 Active CN106252187B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP15171227.0A EP3104155A1 (en) 2015-06-09 2015-06-09 Method of analyzing surface modification of a specimen in a charged-particle microscope
EP15171227.0 2015-06-09

Publications (2)

Publication Number Publication Date
CN106252187A CN106252187A (zh) 2016-12-21
CN106252187B true CN106252187B (zh) 2020-12-01

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Country Link
US (2) US10115561B2 (2)
EP (2) EP3104155A1 (2)
JP (1) JP6692217B2 (2)
CN (1) CN106252187B (2)

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EP3518270A1 (en) * 2018-01-25 2019-07-31 FEI Company Innovative imaging technique in transmission charged particle microscopy
CN110415203A (zh) * 2018-04-26 2019-11-05 比亚迪股份有限公司 图片检测方法、装置和电子设备
EP3591685A1 (en) * 2018-07-06 2020-01-08 FEI Company Electron microscope with improved imaging resolution
DE102018120630B3 (de) * 2018-08-23 2019-10-31 Carl Zeiss Microscopy Gmbh Verfahren zum Bearbeiten eines Objekts und Programm zur Steuerung eines Partikelstrahlsystems
EP3647763B1 (en) * 2018-10-29 2021-07-14 FEI Company A method of preparing a biological sample for study in an analysis device
DE102019210452A1 (de) * 2019-07-16 2021-01-21 Carl Zeiss Microscopy Gmbh Verfahren und Vorrichtung zum Erfassen von Volumeninformationen dreidimensionaler Proben
US10921268B1 (en) * 2019-09-09 2021-02-16 Fei Company Methods and devices for preparing sample for cryogenic electron microscopy
SE543979C2 (en) * 2019-09-20 2021-10-12 Metso Outotec Finland Oy Mining Equipment Inspection System, Mining Equipment Inspection Method, and Mining Equipment Inspection Device
US20210374467A1 (en) * 2020-05-29 2021-12-02 Fei Company Correlated slice and view image annotation for machine learning
US11282670B1 (en) * 2020-12-29 2022-03-22 Fei Company Slice depth reconstruction of charged particle images using model simulation for improved generation of 3D sample images
EP4024039B1 (en) * 2020-12-30 2023-10-25 FEI Company Data acquisition and processing techniques for three-dimensional reconstruction
DE102021124099B4 (de) * 2021-09-17 2023-09-28 Carl Zeiss Multisem Gmbh Verfahren zum Betreiben eines Vielstrahl-Teilchenmikroskops in einem Kontrast-Betriebsmodus mit defokussierter Strahlführung, Computerprogramprodukt und Vielstrahlteilchenmikroskop
DE102021214447A1 (de) * 2021-12-15 2023-06-15 Carl Zeiss Smt Gmbh Elektronenmikroskop zum Untersuchen einer Probe

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US6175417B1 (en) * 1998-02-13 2001-01-16 Micron Technology, Inc. Method and apparatus for detecting defects in the manufacture of an electronic device
CN103839743A (zh) * 2012-11-27 2014-06-04 Fei公司 采样样本和显示获得的信息的方法
CN104217910A (zh) * 2013-04-25 2014-12-17 Fei公司 在透射电子显微镜中使用相位片的方法
EP2869328A1 (en) * 2013-10-29 2015-05-06 Fei Company Differential imaging with pattern recognition for process automation of cross sectioning applications

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US6399944B1 (en) 1999-07-09 2002-06-04 Fei Company Measurement of film thickness by inelastic electron scattering
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US6175417B1 (en) * 1998-02-13 2001-01-16 Micron Technology, Inc. Method and apparatus for detecting defects in the manufacture of an electronic device
CN103839743A (zh) * 2012-11-27 2014-06-04 Fei公司 采样样本和显示获得的信息的方法
CN104217910A (zh) * 2013-04-25 2014-12-17 Fei公司 在透射电子显微镜中使用相位片的方法
EP2869328A1 (en) * 2013-10-29 2015-05-06 Fei Company Differential imaging with pattern recognition for process automation of cross sectioning applications

Also Published As

Publication number Publication date
JP2017004948A (ja) 2017-01-05
CN106252187A (zh) 2016-12-21
US20190051492A1 (en) 2019-02-14
EP3104155A1 (en) 2016-12-14
JP6692217B2 (ja) 2020-05-13
US10811223B2 (en) 2020-10-20
US10115561B2 (en) 2018-10-30
EP3104392A1 (en) 2016-12-14
US20160365224A1 (en) 2016-12-15

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