CN106287496A - Led光源组件、led光电一体化模组和led射灯 - Google Patents

Led光源组件、led光电一体化模组和led射灯 Download PDF

Info

Publication number: CN106287496A
Authority: CN; China
Prior art keywords: led; metal pattern; light source; heat dissipation; pattern area
Prior art date: 2015-05-19
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

CN201510255535.8A

Other languages

English (en)

Chinese (zh)

Inventor

赵依军

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Individual

Original Assignee

Individual

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2015-05-19

Filing date

2015-05-19

Publication date

2017-01-04

2015-05-19 Application filed by Individual filed Critical Individual

2015-05-19 Priority to CN201510255535.8A priority Critical patent/CN106287496A/zh

2016-05-16 Priority to PCT/CN2016/082172 priority patent/WO2016184372A2/fr

2017-01-04 Publication of CN106287496A publication Critical patent/CN106287496A/zh

Status Pending legal-status Critical Current

Links

230000010354 integration Effects 0.000 title claims abstract description 18
229910052751 metal Inorganic materials 0.000 claims abstract description 141
239000002184 metal Substances 0.000 claims abstract description 141
230000017525 heat dissipation Effects 0.000 claims abstract description 55
230000004888 barrier function Effects 0.000 claims abstract description 16
239000011521 glass Substances 0.000 claims description 33
239000000463 material Substances 0.000 claims description 31
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
229910052737 gold Inorganic materials 0.000 claims description 7
239000010931 gold Substances 0.000 claims description 7
238000000576 coating method Methods 0.000 claims description 5
230000005611 electricity Effects 0.000 claims description 5
239000003292 glue Substances 0.000 claims description 5
230000037237 body shape Effects 0.000 claims description 3
239000011248 coating agent Substances 0.000 claims description 3
239000004519 grease Substances 0.000 claims description 3
229920001296 polysiloxane Polymers 0.000 claims description 3
239000004065 semiconductor Substances 0.000 abstract description 9
238000000034 method Methods 0.000 abstract description 5
238000005286 illumination Methods 0.000 abstract description 3
238000010586 diagram Methods 0.000 description 6
239000000843 powder Substances 0.000 description 6
229910052782 aluminium Inorganic materials 0.000 description 5
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
239000000956 alloy Substances 0.000 description 4
230000008901 benefit Effects 0.000 description 4
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
229910052802 copper Inorganic materials 0.000 description 3
239000010949 copper Substances 0.000 description 3
230000000694 effects Effects 0.000 description 3
238000000605 extraction Methods 0.000 description 3
230000003287 optical effect Effects 0.000 description 3
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
230000005540 biological transmission Effects 0.000 description 2
238000006243 chemical reaction Methods 0.000 description 2
238000010276 construction Methods 0.000 description 2
238000000354 decomposition reaction Methods 0.000 description 2
239000008393 encapsulating agent Substances 0.000 description 2
238000005538 encapsulation Methods 0.000 description 2
238000005516 engineering process Methods 0.000 description 2
230000004907 flux Effects 0.000 description 2
230000001678 irradiating effect Effects 0.000 description 2
239000000178 monomer Substances 0.000 description 2
238000005457 optimization Methods 0.000 description 2
239000011347 resin Substances 0.000 description 2
229920005989 resin Polymers 0.000 description 2
238000009738 saturating Methods 0.000 description 2
239000000741 silica gel Substances 0.000 description 2
229910002027 silica gel Inorganic materials 0.000 description 2
229910001218 Gallium arsenide Inorganic materials 0.000 description 1
BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
229910045601 alloy Inorganic materials 0.000 description 1
239000003990 capacitor Substances 0.000 description 1
150000004651 carbonic acid esters Chemical class 0.000 description 1
230000015556 catabolic process Effects 0.000 description 1
230000008859 change Effects 0.000 description 1
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238000010168 coupling process Methods 0.000 description 1
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239000013078 crystal Substances 0.000 description 1
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238000006731 degradation reaction Methods 0.000 description 1
229910003460 diamond Inorganic materials 0.000 description 1
239000010432 diamond Substances 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
238000005530 etching Methods 0.000 description 1
238000011049 filling Methods 0.000 description 1
239000002223 garnet Substances 0.000 description 1
239000000411 inducer Substances 0.000 description 1
239000011256 inorganic filler Substances 0.000 description 1
229910003475 inorganic filler Inorganic materials 0.000 description 1
238000003780 insertion Methods 0.000 description 1
230000037431 insertion Effects 0.000 description 1
238000009434 installation Methods 0.000 description 1
238000009413 insulation Methods 0.000 description 1
208000030208 low-grade fever Diseases 0.000 description 1
239000007769 metal material Substances 0.000 description 1
229910044991 metal oxide Inorganic materials 0.000 description 1
150000004706 metal oxides Chemical class 0.000 description 1
150000004767 nitrides Chemical class 0.000 description 1
230000005693 optoelectronics Effects 0.000 description 1
230000000149 penetrating effect Effects 0.000 description 1
239000004033 plastic Substances 0.000 description 1
229920003023 plastic Polymers 0.000 description 1
229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
239000004926 polymethyl methacrylate Substances 0.000 description 1
230000005855 radiation Effects 0.000 description 1
238000005215 recombination Methods 0.000 description 1
229910052594 sapphire Inorganic materials 0.000 description 1
239000010980 sapphire Substances 0.000 description 1
229910052710 silicon Inorganic materials 0.000 description 1
239000010703 silicon Substances 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000004332 silver Substances 0.000 description 1

Classifications

- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S9/00—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply
- F21S9/02—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors

Landscapes

Engineering & Computer Science (AREA)
General Engineering & Computer Science (AREA)
Led Device Packages (AREA)
Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Non-Portable Lighting Devices Or Systems Thereof (AREA)

CN201510255535.8A 2015-05-19 2015-05-19 Led光源组件、led光电一体化模组和led射灯 Pending CN106287496A (zh)

Priority Applications (2)

Application Number	Priority Date	Filing Date	Title
CN201510255535.8A CN106287496A (zh)	2015-05-19	2015-05-19	Led光源组件、led光电一体化模组和led射灯
PCT/CN2016/082172 WO2016184372A2 (fr)	2015-05-19	2016-05-16	Ensemble source de lumière à del, module d'intégration photoélectrique à del et projecteur à faisceau étroit à del

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CN201510255535.8A CN106287496A (zh)	2015-05-19	2015-05-19	Led光源组件、led光电一体化模组和led射灯

Publications (1)

Publication Number	Publication Date
CN106287496A true CN106287496A (zh)	2017-01-04

Family

ID=57319429

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN201510255535.8A Pending CN106287496A (zh)	2015-05-19	2015-05-19	Led光源组件、led光电一体化模组和led射灯

Country Status (2)

Country	Link
CN (1)	CN106287496A (fr)
WO (1)	WO2016184372A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN107388065A (zh) *	2017-08-10	2017-11-24	浙江生辉照明有限公司	插脚灯泡
CN108447854A (zh) *	2018-03-30	2018-08-24	南昌大学	一种led芯片的封装模块及其制备方法

Citations (8)

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US20070158669A1 (en) *	2006-01-10	2007-07-12	Samsung Electro-Mechanics Co., Ltd.	Chip coated light emitting diode package and manufacturing method thereof
US20120056217A1 (en) *	2009-07-03	2012-03-08	Seoul Semiconductor Co., Ltd.	Light emitting diode package
US20120193671A1 (en) *	2011-02-01	2012-08-02	Chi Mei Lighting Technology Corp.	Light-emitting diode device and method for manufacturing the same
CN103579210A (zh) *	2012-07-31	2014-02-12	赵依军	发光二极管单元与散热基板的连接
CN103574323A (zh) *	2012-07-31	2014-02-12	赵依军	提供定向光束的发光二极管照明装置
CN103672459A (zh) *	2012-08-28	2014-03-26	赵依军	具有紧凑结构的提供定向光束的发光二极管照明装置
CN204240090U (zh) *	2014-06-30	2015-04-01	赵依军	用于提供定向光束的led照明装置
CN204853254U (zh) *	2015-05-19	2015-12-09	赵依军	Led光源组件、led光电一体化模组和led射灯

Family Cites Families (3)

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Publication number	Priority date	Publication date	Assignee	Title
EP2450613B1 (fr) *	2010-11-08	2015-01-28	LG Innotek Co., Ltd.	Dispositif d'éclairage
CN103528010A (zh) *	2013-09-22	2014-01-22	上海俪德照明科技股份有限公司	一种led光电模组
CN104747934A (zh) *	2013-12-31	2015-07-01	赵依军	用于提供定向光束的led照明装置

2015
- 2015-05-19 CN CN201510255535.8A patent/CN106287496A/zh active Pending
2016
- 2016-05-16 WO PCT/CN2016/082172 patent/WO2016184372A2/fr not_active Ceased

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20070158669A1 (en) *	2006-01-10	2007-07-12	Samsung Electro-Mechanics Co., Ltd.	Chip coated light emitting diode package and manufacturing method thereof
US20120056217A1 (en) *	2009-07-03	2012-03-08	Seoul Semiconductor Co., Ltd.	Light emitting diode package
US20120193671A1 (en) *	2011-02-01	2012-08-02	Chi Mei Lighting Technology Corp.	Light-emitting diode device and method for manufacturing the same
CN103579210A (zh) *	2012-07-31	2014-02-12	赵依军	发光二极管单元与散热基板的连接
CN103574323A (zh) *	2012-07-31	2014-02-12	赵依军	提供定向光束的发光二极管照明装置
CN103672459A (zh) *	2012-08-28	2014-03-26	赵依军	具有紧凑结构的提供定向光束的发光二极管照明装置
CN204240090U (zh) *	2014-06-30	2015-04-01	赵依军	用于提供定向光束的led照明装置
CN204853254U (zh) *	2015-05-19	2015-12-09	赵依军	Led光源组件、led光电一体化模组和led射灯

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN107388065A (zh) *	2017-08-10	2017-11-24	浙江生辉照明有限公司	插脚灯泡
CN108447854A (zh) *	2018-03-30	2018-08-24	南昌大学	一种led芯片的封装模块及其制备方法
CN108447854B (zh) *	2018-03-30	2024-08-27	南昌大学	一种led芯片的封装模块及其制备方法

Also Published As

Publication number	Publication date
WO2016184372A3 (fr)	2017-02-02
WO2016184372A2 (fr)	2016-11-24

Legal Events

Date	Code	Title
2017-01-04	C06	Publication
2017-01-04	PB01	Publication
2018-06-15	SE01	Entry into force of request for substantive examination

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