CN106537585B - 液体套及液冷套的制造方法 - Google Patents

液体套及液冷套的制造方法 Download PDF

Info

Publication number
CN106537585B
CN106537585B CN201580038149.1A CN201580038149A CN106537585B CN 106537585 B CN106537585 B CN 106537585B CN 201580038149 A CN201580038149 A CN 201580038149A CN 106537585 B CN106537585 B CN 106537585B
Authority
CN
China
Prior art keywords
main body
liquid
liquid cooling
header
upstream
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201580038149.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN106537585A (zh
Inventor
樋野治道
中村拓海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Light Metal Co Ltd
Original Assignee
Nippon Light Metal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2014145776A external-priority patent/JP6248842B2/ja
Priority claimed from JP2014145775A external-priority patent/JP6248841B2/ja
Application filed by Nippon Light Metal Co Ltd filed Critical Nippon Light Metal Co Ltd
Publication of CN106537585A publication Critical patent/CN106537585A/zh
Application granted granted Critical
Publication of CN106537585B publication Critical patent/CN106537585B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201580038149.1A 2014-07-16 2015-05-29 液体套及液冷套的制造方法 Expired - Fee Related CN106537585B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2014-145776 2014-07-16
JP2014145776A JP6248842B2 (ja) 2014-07-16 2014-07-16 液冷ジャケットの製造方法及び液冷ジャケット
JP2014-145775 2014-07-16
JP2014145775A JP6248841B2 (ja) 2014-07-16 2014-07-16 液冷ジャケット及び液冷ジャケットの製造方法
PCT/JP2015/065522 WO2016009727A1 (fr) 2014-07-16 2015-05-29 Chemise à refroidissement liquide et procédé de fabrication de chemise à refroidissement liquide

Publications (2)

Publication Number Publication Date
CN106537585A CN106537585A (zh) 2017-03-22
CN106537585B true CN106537585B (zh) 2019-03-01

Family

ID=55078230

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580038149.1A Expired - Fee Related CN106537585B (zh) 2014-07-16 2015-05-29 液体套及液冷套的制造方法

Country Status (3)

Country Link
CN (1) CN106537585B (fr)
TW (1) TWI605236B (fr)
WO (1) WO2016009727A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI589105B (zh) * 2016-07-18 2017-06-21 大銀微系統股份有限公司 馬達一次側之傳熱機構
JP6885175B2 (ja) 2017-04-14 2021-06-09 富士電機株式会社 半導体装置
KR102259600B1 (ko) * 2017-05-08 2021-06-02 닛산 지도우샤 가부시키가이샤 전력 변환 장치의 냉각 구조
JP7159620B2 (ja) 2018-05-30 2022-10-25 富士電機株式会社 半導体装置、冷却モジュール、電力変換装置及び電動車両
NL2027865B1 (en) * 2021-03-30 2022-11-23 E Traction Europe Bv Insulated-gate bipolar transistor module cooling system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63127194U (fr) * 1987-02-12 1988-08-19
JP2002164491A (ja) * 2000-11-24 2002-06-07 Denso Corp 積層冷却器
TWM258569U (en) * 2004-05-18 2005-03-01 Cooler Master Co Ltd Liquid flow-path plate of water cooling heat sink
JP2010278286A (ja) * 2009-05-29 2010-12-09 Mitsubishi Electric Corp ヒートシンク装置
CN102317027A (zh) * 2009-02-23 2012-01-11 日本轻金属株式会社 液冷套的制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011017516A (ja) * 2009-07-10 2011-01-27 Mitsubishi Electric Corp プレート積層型冷却装置及びその製造方法
WO2011087027A1 (fr) * 2010-01-12 2011-07-21 日本軽金属株式会社 Substrat intégré refroidi par un liquide et procédé pour fabriquer un substrat intégré refroidi par un liquide
JP5573973B2 (ja) * 2013-01-17 2014-08-20 日本軽金属株式会社 液冷ジャケットの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63127194U (fr) * 1987-02-12 1988-08-19
JP2002164491A (ja) * 2000-11-24 2002-06-07 Denso Corp 積層冷却器
TWM258569U (en) * 2004-05-18 2005-03-01 Cooler Master Co Ltd Liquid flow-path plate of water cooling heat sink
CN102317027A (zh) * 2009-02-23 2012-01-11 日本轻金属株式会社 液冷套的制造方法
JP2010278286A (ja) * 2009-05-29 2010-12-09 Mitsubishi Electric Corp ヒートシンク装置

Also Published As

Publication number Publication date
CN106537585A (zh) 2017-03-22
TWI605236B (zh) 2017-11-11
TW201608198A (zh) 2016-03-01
WO2016009727A1 (fr) 2016-01-21

Similar Documents

Publication Publication Date Title
CN106537585B (zh) 液体套及液冷套的制造方法
US9748199B2 (en) Thermal compression bonding process cooling manifold
TWI274244B (en) Cold plate
US8199505B2 (en) Jet impingement heat exchanger apparatuses and power electronics modules
CN208609321U (zh) 冷却系统及水冷排
JPS6336695Y2 (fr)
US8441794B2 (en) Liquid cooler and method of its manufacture
CN106455456B (zh) 一种铜铝复合水冷板及其加工制作方法、水冷散热方法
TWI726806B (zh) 水冷散熱裝置及其製造方法
JP2010123881A (ja) コールドプレート
JP6248841B2 (ja) 液冷ジャケット及び液冷ジャケットの製造方法
CN113714588A (zh) 泵浦源封装工装、装置及封装方法
CN109729740A (zh) 散热单元的制造方法
AU2007216908A1 (en) Air conditioner heat transfer water tank and manufacturing process thereof
TWM622696U (zh) 液冷裝置
TWM243830U (en) Liquid cooling apparatus
CN218735701U (zh) 散热装置
CN217217265U (zh) 液冷散热装置及具有该液冷散热装置的液冷散热系统
CN205305328U (zh) 无缝焊接水冷装置
JP6510817B2 (ja) モータの冷却構造およびこれを備えた溶接トーチユニット
CN212629071U (zh) 冷板
JP2014013848A (ja) 熱交換器
JP2007250701A (ja) 電子機器用冷却装置
CN215356600U (zh) 泵浦源封装工装及装置
JP2016025098A (ja) 液冷ジャケットの製造方法及び液冷ジャケット

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190301