CN106932094A - Spectral Image Analysis System Using Digital Micromirror Device - Google Patents
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Abstract
Description
技术领域technical field
本发明有关光谱影像分析系统，尤指一种使用数字微型反射镜装置的光谱影像分析系统。The present invention relates to a spectral image analysis system, in particular to a spectral image analysis system using a digital micro-mirror device.
背景技术Background technique
由于遥感检测、生物或医学检测、基础科学研究、鉴识科学等各领域的应用蓬勃发展，对光谱分析的需求日益增加。Due to the vigorous development of applications in various fields such as remote sensing detection, biological or medical detection, basic scientific research, and forensic science, the demand for spectral analysis is increasing.
传统的扫描式光谱影像分析系统需要变换不同波长的光线来扫描待测物，不仅整个过程相当费时，而且也难以适用在需要即时监测并进行光谱分析的应用中。The traditional scanning spectral image analysis system needs to change the light of different wavelengths to scan the object to be measured. Not only is the whole process quite time-consuming, but it is also difficult to apply to applications that require real-time monitoring and spectral analysis.
发明内容Contents of the invention
有鉴于此，如何有效增加光谱影像分析系统的应用范围，并同时改善光谱分析的效率，实为业界有待解决的问题。In view of this, how to effectively increase the application scope of the spectral image analysis system and simultaneously improve the efficiency of spectral analysis is a problem to be solved in the industry.
本说明书提供一种光谱影像分析系统的实施例，其包含：一阵列式光谱仪，设置成对接收到的一光谱影像进行分析；一显示装置；一数字微型反射镜装置，包含多个微型反射元件，设置成反射一入射光；以及一控制装置，耦接于该阵列式光谱仪、该显示装置、与该数字微型反射镜装置，设置成分别控制该多个微型反射元件的反射方向，并控制该显示装置显示该控制装置依据该阵列式光谱仪的分析结果产生的一分析结果画面；其中，当该多个微型反射元件将该入射光反射至一光学成像装置时，该控制装置依据一使用者的设置改变该多个微型反射元件中的一部分目标反射元件的反射方向，以将该入射光的其中一部分改反射至该阵列式光谱仪的接收端，使该阵列式光谱仪接收该光谱影像。This specification provides an embodiment of a spectral image analysis system, which includes: an array spectrometer, configured to analyze a received spectral image; a display device; a digital micro-mirror device, including a plurality of micro-reflective elements , configured to reflect an incident light; and a control device, coupled to the array spectrometer, the display device, and the digital micro-mirror device, configured to control the reflection directions of the plurality of micro-reflective elements respectively, and control the The display device displays an analysis result screen generated by the control device based on the analysis results of the array spectrometer; wherein, when the plurality of micro-reflective elements reflect the incident light to an optical imaging device, the control device generates the image according to a user's The reflective direction of a part of the target reflective elements in the plurality of micro reflective elements is set to be changed, so as to reflect a part of the incident light to the receiving end of the array spectrometer, so that the array spectrometer receives the spectral image.
上述实施例的主要优点，是光谱影像分析系统的架构简单、体积小、能快速进行光谱影像分析，也适用于需要即时监测并进行光谱分析的应用中。The main advantages of the above embodiments are that the spectral image analysis system has a simple structure, small size, and can quickly perform spectral image analysis, and is also suitable for applications that require real-time monitoring and spectral analysis.
本发明的其他优点将藉由以下的说明和附图进行更详细的解说。Other advantages of the present invention will be explained in more detail with the following description and accompanying drawings.
附图说明Description of drawings
此处所说明的附图用来提供对本申请的进一步理解，构成本申请的一部分，本申请的示意性实施例及其说明用于解释本申请，并不构成对本申请的不当限定。The drawings described here are used to provide a further understanding of the application and constitute a part of the application. The schematic embodiments and descriptions of the application are used to explain the application and do not constitute an improper limitation to the application.
图1为本发明一实施例的光谱影像分析系统简化后的功能方块图。FIG. 1 is a simplified functional block diagram of a spectral image analysis system according to an embodiment of the present invention.
图2与图3为图1中的显示装置所显示的目标影像画面的一实施例简化后的示意图。2 and 3 are simplified schematic diagrams of an embodiment of the target image frame displayed by the display device in FIG. 1 .
图4为图1的光谱影像分析系统进行即时监测及光谱分析运作的一实施例简化后的示意图。FIG. 4 is a simplified schematic diagram of an embodiment of the real-time monitoring and spectral analysis operation performed by the spectral image analysis system in FIG. 1 .
【符号说明】【Symbol Description】
100 光谱影像分析系统100 spectral image analysis system
102 入射光102 incident light
110 光学成像装置110 optical imaging device
120 阵列式光谱仪120 Array Spectrometer
130 显示装置130 display device
132 目标影像画面132 target image screen
134 分析结果画面134 Analysis result screen
140 数字微型反射镜装置140 Digital Micromirror Device
141-149 微型反射元件141-149 Miniature reflective elements
150 控制装置150 Controls
210 光标210 Cursor
221-225 工厂221-225 Factory
231-235 子影像区域231-235 sub image area
310 目标影像位置310 target image position
具体实施方式detailed description
以下将配合相关附图来说明本发明的实施例。在附图中，相同的标号表示相同或类似的元件或方法流程。Embodiments of the present invention will be described below in conjunction with related drawings. In the drawings, the same reference numerals represent the same or similar elements or method flows.
图1为本发明一实施例的光谱影像分析系统(spectral image analysissystem)100简化后的功能方块图。如图所示，光谱影像分析系统100包含一阵列式光谱仪(array spectrometer)120、一显示装置130、一数字微型反射镜装置(digital micromirror device，DMD)140、以及一控制装置150。在实际应用上，光谱影像分析系统100会搭配一光学成像装置(optical imaging device)110进行运作。FIG. 1 is a simplified functional block diagram of a spectral image analysis system 100 according to an embodiment of the present invention. As shown in the figure, the spectral image analysis system 100 includes an array spectrometer 120 , a display device 130 , a digital micromirror device (DMD) 140 , and a control device 150 . In practical applications, the spectral image analysis system 100 will be operated with an optical imaging device (optical imaging device) 110 .
在光谱影像分析系统100中，阵列式光谱仪120设置成对接收到的一光谱影像(spectral image)进行分析。数字微型反射镜装置140包含多个微型反射元件(micro reflection element)，并设置成反射一入射光102。控制装置150耦接于阵列式光谱仪120、显示装置130、与数字微型反射镜装置140，并设置成控制显示装置130显示控制装置150依据阵列式光谱仪120的分析结果所产生的一分析结果画面134。此外，控制装置150还设置成可分别控制数字微型反射镜装置140中的多个微型反射元件的反射方向。In the spectral image analysis system 100 , the array spectrometer 120 is configured to analyze a received spectral image. The DMD 140 includes a plurality of micro reflection elements configured to reflect an incident light 102 . The control device 150 is coupled to the array spectrometer 120, the display device 130, and the digital micromirror device 140, and is configured to control the display device 130 to display an analysis result screen 134 generated by the control device 150 according to the analysis result of the array spectrometer 120 . In addition, the control device 150 is also configured to separately control the reflection directions of the multiple micro-reflective elements in the digital micro-mirror device 140 .
请注意，一般的数字微型反射镜装置140上通常设置有数十万至数百万个微型反射元件。为了说明上的方便，在本说明书的相关图示中仅绘示其中的一小部分的示意图来进行描述。Please note that a general digital micromirror device 140 is usually provided with hundreds of thousands to millions of microreflective elements. For the convenience of description, only a small part of the schematic diagrams are shown in the relevant diagrams in this specification for description.
实作上，前述的光学成像装置110可用各种相机或摄影机来实现；显示装置130可用各种显示屏幕或投影装置来实现；数字微型反射镜装置140可用各种既有的DMD芯片来实现；而控制装置150则可用计算机或具有足够计算能力的其他设备来实现。In practice, the aforementioned optical imaging device 110 can be realized by various cameras or cameras; the display device 130 can be realized by various display screens or projection devices; the digital micromirror device 140 can be realized by various existing DMD chips; The control device 150 can be implemented by a computer or other devices with sufficient computing power.
在一实施例中，数字微型反射镜装置140接收到的入射光102，可以是光谱影像分析系统100中的光源(例如氙气灯、氘灯、或卤素灯等，未绘示于图中)发出的光线，照射到待测物后再反射至数字微型反射镜装置140的光线。在另一实施例中，入射光102则可以是外部的环境光线照射到待测物后再反射至数字微型反射镜装置140的光线。In one embodiment, the incident light 102 received by the digital micromirror device 140 may be emitted by a light source (such as a xenon lamp, a deuterium lamp, or a halogen lamp, etc., not shown in the figure) in the spectral image analysis system 100. The light is irradiated to the object to be measured and then reflected to the light of the digital micro-mirror device 140 . In another embodiment, the incident light 102 may be light from external ambient light irradiating the object under test and then reflected to the digital micro-mirror device 140 .
请注意，光学成像装置110可以是在有需要时才耦接于光谱影像分析系统100的控制装置150的独立装置，也可以整合成为光谱影像分析系统100的一部分。Please note that the optical imaging device 110 can be an independent device coupled to the control device 150 of the spectral image analysis system 100 when necessary, or can be integrated as a part of the spectral image analysis system 100 .
在运作时，控制装置150会耦接于光学成像装置110，且控制装置150可控制显示装置130显示光学成像装置110依据接收到的光线所产生的一目标影像画面132。换言之，控制装置150可控制显示装置130同时显示光学成像装置110所产生的目标影像画面132，以及控制装置150依据阵列式光谱仪120的分析结果所产生的分析结果画面134。因此，光谱影像分析系统100不仅可用于分析静态待测物的应用中，也适用在需要即时监测并进行光谱分析的应用中。During operation, the control device 150 is coupled to the optical imaging device 110 , and the control device 150 can control the display device 130 to display a target image frame 132 generated by the optical imaging device 110 according to the light received. In other words, the control device 150 can control the display device 130 to simultaneously display the target image frame 132 generated by the optical imaging device 110 and the analysis result frame 134 generated by the control device 150 according to the analysis result of the array spectrometer 120 . Therefore, the spectral image analysis system 100 can not only be used in the application of analyzing the static object to be measured, but also applicable in the application requiring real-time monitoring and spectral analysis.
例如，以下将搭配图2与图4来进一步说明光谱影像分析系统100进行即时监测及光谱分析的运作方式。For example, the operation mode of real-time monitoring and spectral analysis performed by the spectral image analysis system 100 will be further described below with reference to FIG. 2 and FIG. 4 .
图2与图3为显示装置130所显示的目标影像画面132的一实施例简化后的示意图。图4为光谱影像分析系统100进行即时监测及光谱分析运作的一实施例简化后的示意图。2 and 3 are simplified schematic diagrams of an embodiment of the target image frame 132 displayed by the display device 130 . FIG. 4 is a simplified schematic diagram of an embodiment of the real-time monitoring and spectral analysis operation performed by the spectral image analysis system 100 .
在运作时，控制装置150可先将数字微型反射镜装置140的多个(或所有)微型反射元件(例如，图1中所绘示的微型反射元件141-149及其他微型反射元件)的反射方向，都调整成朝向光学成像装置110的接收端，以使入射光102被反射至光学成像装置110。当数字微型反射镜装置140中的微型反射元件将入射光102反射至光学成像装置110时，控制装置150可控制显示装置130显示光学成像装置110所产生的目标影像画面132。During operation, the control device 150 can first reflect reflections of multiple (or all) micro-reflective elements (for example, micro-reflective elements 141-149 and other micro-reflective elements shown in FIG. 1 ) of the digital micro-mirror device 140. The directions are all adjusted to face the receiving end of the optical imaging device 110 , so that the incident light 102 is reflected to the optical imaging device 110 . When the micro-reflective elements in the digital micro-mirror device 140 reflect the incident light 102 to the optical imaging device 110 , the control device 150 can control the display device 130 to display the target image frame 132 generated by the optical imaging device 110 .
在图2的实施例中，目标影像画面132中包含一光标210、一第一待监测工厂221、一第二待监测工厂223、以及一第三待监测工厂225。如图2所示，目标影像画面132中还包含与第一待监测工厂221排放的气体所形成的烟雾相对应的一第一子影像区域231、与第二待监测工厂223排放的气体所形成的烟雾相对应的一第二子影像区域233、以及与第三待监测工厂225排放的气体所形成的烟雾相对应的一第三子影像区域235。In the embodiment of FIG. 2 , the target image frame 132 includes a cursor 210 , a first factory to be monitored 221 , a second factory to be monitored 223 , and a third factory to be monitored 225 . As shown in Figure 2, the target image frame 132 also includes a first sub-image area 231 corresponding to the smog formed by the gas discharged by the first factory to be monitored 221, and a first sub-image area 231 formed by the gas discharged by the second factory to be monitored 223. A second sub-image area 233 corresponding to the smog, and a third sub-image area 235 corresponding to the smog formed by the gas discharged from the third factory 225 to be monitored.
通过显示在显示装置130上的目标影像画面132，使用者便可即时观测到待监控地区的影像。Through the target image frame 132 displayed on the display device 130 , the user can observe the image of the area to be monitored in real time.
当使用者想对目标影像画面132中特定位置的影像内容进行光谱分析时，可利用控制装置150的输入装置(例如，鼠标、键盘、触控屏幕等，未绘示于图中)将目标影像画面132上的光标210移动到该特定位置上。When the user wants to perform spectral analysis on the image content of a specific position in the target image frame 132, he can use the input device (such as a mouse, keyboard, touch screen, etc., not shown in the figure) of the control device 150 to display the target image The cursor 210 on the screen 132 moves to the specific position.
例如，当使用者要对第一待监测工厂221当时所排放的气体即时进行光谱分析时，可利用控制装置150的输入装置将光标210移动到第一子影像区域231上进行点击。为了方便说明起见，以下假设使用者选择了位于第一子影像区域231内的一目标影像位置310，如图3所示。For example, when the user wants to perform spectral analysis on the gas emitted by the first factory to be monitored 221 at that time, the user can use the input device of the control device 150 to move the cursor 210 to the first sub-image area 231 for clicking. For convenience of description, it is assumed that the user selects a target image position 310 located in the first sub-image area 231 , as shown in FIG. 3 .
此时，控制装置150会从数字微型反射镜装置140中，选择与目标影像位置310相对应的反射元件(在本例中为微型反射元件141-142及144-145)。如图4所示，控制装置150还会调整被选定的反射元件141-142及144-145的反射方向，以控制被选定的反射元件141-142及144-145将入射光102的其中一部分改反射至阵列式光谱仪120的接收端，使阵列式光谱仪120接收并分析与第一待监测工厂221当时所排放的气体相对应的光谱影像。At this time, the control device 150 selects reflective elements (in this example, microreflective elements 141 - 142 and 144 - 145 ) corresponding to the target image position 310 from the digital micromirror device 140 . As shown in FIG. 4 , the control device 150 will also adjust the reflection directions of the selected reflective elements 141-142 and 144-145, so as to control the selected reflective elements 141-142 and 144-145 to direct the incident light 102 A part is reflected to the receiving end of the array spectrometer 120, so that the array spectrometer 120 receives and analyzes the spectral image corresponding to the gas emitted by the first factory 221 to be monitored at that time.
前述的光学成像装置110、阵列式光谱仪120、及数字微型反射镜装置140三者是按照一预定的相对空间关系排列，使控制装置150可掌握前述三个装置之间的空间关系，以准确地控制被选定的反射元件的反射方向的调整量。The aforementioned optical imaging device 110, array spectrometer 120, and digital micromirror device 140 are arranged according to a predetermined relative spatial relationship, so that the control device 150 can grasp the spatial relationship between the aforementioned three devices to accurately Controls the amount to adjust the reflection direction of the selected reflective element.
由前述说明可知，当数字微型反射镜装置140的多个(或所有)微型反射元件将入射光102反射至光学成像装置110时，控制装置150可依据使用者的设置改变数字微型反射镜装置140中的一部分反射元件的反射方向，以将入射光102的其中一部分改反射至阵列式光谱仪120的接收端，使阵列式光谱仪120接收到待分析的光谱影像。As can be seen from the foregoing description, when multiple (or all) microreflective elements of the digital micromirror device 140 reflect the incident light 102 to the optical imaging device 110, the control device 150 can change the digital micromirror device 140 according to the settings of the user. The reflection direction of a part of the reflective elements is used to reflect a part of the incident light 102 to the receiving end of the array spectrometer 120 so that the array spectrometer 120 receives the spectral image to be analyzed.
如此一来，光谱影像分析系统100便可在使用者观看目标影像画面132之际，即时对目标影像画面132中的特定位置的光谱影像进行光谱分析，并将光谱分析结果同时呈现在分析结果画面134中。In this way, when the user watches the target image screen 132, the spectral image analysis system 100 can perform spectral analysis on the spectral image at a specific position in the target image screen 132 in real time, and simultaneously present the spectral analysis results on the analysis result screen 134 in.
因此，前述的光谱影像分析系统100不仅适用于各种静态待测物的光谱分析应用中，还能满足使用者即时监控的需求，并即时产生相关的光谱分析结果给使用者。很明显的，前述光谱影像分析系统100的应用范围及应用弹性是传统架构的光谱分析系统难以比拟的。Therefore, the aforementioned spectral image analysis system 100 is not only suitable for spectral analysis applications of various static objects to be measured, but also can meet the needs of users for real-time monitoring and generate relevant spectral analysis results for users in real time. Obviously, the application scope and application flexibility of the aforementioned spectral image analysis system 100 are incomparable with traditional spectral analysis systems.
另外，由于前述的光谱影像分析系统100的架构简单，故体积比传统的光谱影像分析系统来得更小，因此具有更高的操作便利性。In addition, due to the simple structure of the aforementioned spectral image analysis system 100 , its volume is smaller than that of traditional spectral image analysis systems, and thus it has higher operational convenience.
在说明书及权利要求书中使用了某些词汇来指称特定的元件。然而，所属技术领域的技术人员应可理解，同样的元件可能会用不同的名词来称呼。说明书及权利要求书并不以名称的差异作为区分元件的方式，而是以元件在功能上的差异来作为区分的基准。在说明书及权利要求书所提及的「包含」为开放式的用语，故应解释成「包含但不限定于」。另外，「耦接」在此包含任何直接及间接的连接手段。因此，若文中描述第一元件耦接于第二元件，则代表第一元件可通过电性连接或无线传输、光学传输等信号连接方式而直接地连接于第二元件，或者通过其他元件或连接手段间接地电性或信号连接至该第二元件。Certain terms are used in the description and claims to refer to particular elements. However, those skilled in the art should understand that the same element may be called by different terms. The specification and claims do not use the difference in name as the way to distinguish components, but the difference in function of the components as the basis for distinction. The "comprising" mentioned in the specification and claims is an open term, so it should be interpreted as "including but not limited to". In addition, "coupling" here includes any direct and indirect connection means. Therefore, if it is described that the first element is coupled to the second element, it means that the first element can be directly connected to the second element through electrical connection or signal connection means such as wireless transmission or optical transmission, or through other elements or connections. The means are indirectly electrically or signally connected to the second element.
在此所使用的「及/或」的描述方式，包含所列举的其中之一或多个项目的任意组合。另外，除非说明书中特别指明，否则任何单数格的用语都同时包含复数格的涵义。The description of "and/or" used herein includes any combination of one or more of the listed items. In addition, unless otherwise specified in the specification, any singular term also includes plural meanings.
在说明书及权利要求书当中所提及的「元件」(element)一词，包含了构件(component)、层构造(layer)、或区域(region)的概念。The term "element" mentioned in the specification and claims includes the concepts of component, layer, or region.
附图的某些元件的尺寸及相对大小会被加以放大，或者某些元件的形状会被简化，以便能更清楚地表达实施例的内容。因此，除非申请人有特别指明，附图中各元件的形状、尺寸、相对大小及相对位置等仅是便于说明，而不应被用来限缩本发明的专利范围。此外，本发明可用许多不同的形式来体现，在解释本发明时，不应仅局限于本说明书所提出的实施例态样。The dimensions and relative sizes of some elements in the drawings will be exaggerated, or the shapes of some elements will be simplified in order to express the contents of the embodiments more clearly. Therefore, unless otherwise specified by the applicant, the shape, size, relative size and relative position of each element in the drawings are only for convenience of description, and should not be used to limit the patent scope of the present invention. In addition, the present invention can be embodied in many different forms, and when explaining the present invention, it should not be limited only to the embodiments presented in this specification.
为了说明上的方便，说明书中可能会使用一些与空间中的相对位置有关的叙述，对附图中某元件的功能或是该元件与其他元件间的相对空间关系进行描述。例如，「于…上」、「在…上方」、「于…下」、「在…下方」、「高于…」、「低于…」、「向上」、「向下」等等。所属技术领域的技术人员应可理解，这些与空间中的相对位置有关的叙述，不仅包含所描述的元件在附图中的指向关系(orientation)，也包含所描述的元件在使用、运作、或组装时的各种不同指向关系。例如，若将附图上下颠倒过来，则原先用「于…上」来描述的元件，就会变成「于…下」。因此，在说明书中所使用的「于…上」的描述方式，解释上包含了「于…下」以及「于…上」两种不同的指向关系。同理，在此所使用的「向上」一词，解释上包含了「向上」以及「向下」两种不同的指向关系。For the convenience of description, some descriptions related to relative positions in space may be used in the description to describe the function of an element in the drawings or the relative spatial relationship between the element and other elements. For example, "on," "above," "below," "below," "above," "below," "up," "down," and the like. Those skilled in the art should understand that these descriptions related to relative positions in space not only include the orientation of the described elements in the drawings, but also include the use, operation, or orientation of the described elements. Various pointing relationships during assembly. For example, if the drawing is turned upside down, an element originally described as "on" will become "below". Therefore, the description of "on" used in the specification includes two different pointing relationships of "below" and "on". In the same way, the term "upward" used here includes two different pointing relationships of "upward" and "downward".
在说明书及权利要求书中，若描述第一元件位于第二元件上、在第二元件上方、连接、接合、耦接于第二元件或与第二元件相接，则表示第一元件可直接位在第二元件上、直接连接、直接接合、直接耦接于第二元件，亦可表示第一元件与第二元件间存在其他元件。相对之下，若描述第一元件直接位在第二元件上、直接连接、直接接合、直接耦接、或直接相接于第二元件，则代表第一元件与第二元件间不存在其他元件。In the specification and claims, if it is described that a first element is located on, above, connected, bonded, coupled to, or in contact with a second element, it means that the first element can be directly connected to the second element. Located on the second element, directly connected, directly bonded, or directly coupled to the second element may also mean that there are other elements between the first element and the second element. In contrast, if it is described that the first element is directly on the second element, directly connected, directly bonded, directly coupled, or directly connected to the second element, it means that there are no other elements between the first element and the second element .
以上仅为本发明的较佳实施例，凡依本发明权利要求所做的均等变化与修饰，皆应属本发明的涵盖范围。The above are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the claims of the present invention shall fall within the scope of the present invention.
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