CN106933036B - 一种热敏阳图感光组合物的制备方法 - Google Patents
一种热敏阳图感光组合物的制备方法 Download PDFInfo
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- CN106933036B CN106933036B CN201710236960.1A CN201710236960A CN106933036B CN 106933036 B CN106933036 B CN 106933036B CN 201710236960 A CN201710236960 A CN 201710236960A CN 106933036 B CN106933036 B CN 106933036B
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- 239000000203 mixture Substances 0.000 title claims abstract description 49
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 238000003756 stirring Methods 0.000 claims abstract description 88
- 229920005989 resin Polymers 0.000 claims abstract description 60
- 239000011347 resin Substances 0.000 claims abstract description 60
- -1 trichloromethyl triazine compound Chemical class 0.000 claims abstract description 32
- 239000000975 dye Substances 0.000 claims abstract description 30
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000011248 coating agent Substances 0.000 claims abstract description 24
- 238000000576 coating method Methods 0.000 claims abstract description 24
- 239000000654 additive Substances 0.000 claims abstract description 19
- 238000000498 ball milling Methods 0.000 claims abstract description 19
- 238000001914 filtration Methods 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 16
- 230000000996 additive effect Effects 0.000 claims abstract description 14
- 238000002156 mixing Methods 0.000 claims abstract description 14
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 14
- GTJDTVAKIPLKBY-UHFFFAOYSA-N 2-propylnaphthalen-1-ol Chemical compound C1=CC=CC2=C(O)C(CCC)=CC=C21 GTJDTVAKIPLKBY-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000004593 Epoxy Substances 0.000 claims abstract description 13
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 claims abstract description 13
- 239000002245 particle Substances 0.000 claims abstract description 11
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 claims abstract description 10
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical compound [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 claims abstract description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 10
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N hydrogen thiocyanate Natural products SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 claims abstract description 10
- NVIFVTYDZMXWGX-UHFFFAOYSA-N sodium metaborate Chemical compound [Na+].[O-]B=O NVIFVTYDZMXWGX-UHFFFAOYSA-N 0.000 claims abstract description 10
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims abstract description 9
- 235000006408 oxalic acid Nutrition 0.000 claims abstract description 9
- 239000001045 blue dye Substances 0.000 claims abstract description 8
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000007873 sieving Methods 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 29
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 14
- 238000006116 polymerization reaction Methods 0.000 claims description 14
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims description 12
- 238000006467 substitution reaction Methods 0.000 claims description 9
- 238000001132 ultrasonic dispersion Methods 0.000 claims description 9
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 claims description 7
- 239000004743 Polypropylene Substances 0.000 claims description 7
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 239000002105 nanoparticle Substances 0.000 claims description 7
- 229920001155 polypropylene Polymers 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- SBXWFLISHPUINY-UHFFFAOYSA-N triphenyltin Chemical compound C1=CC=CC=C1[Sn](C=1C=CC=CC=1)C1=CC=CC=C1 SBXWFLISHPUINY-UHFFFAOYSA-N 0.000 claims description 7
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical group C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 4
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 claims description 3
- 238000007639 printing Methods 0.000 abstract description 24
- 230000000694 effects Effects 0.000 abstract description 17
- HIYWOHBEPVGIQN-UHFFFAOYSA-N 1h-benzo[g]indole Chemical class C1=CC=CC2=C(NC=C3)C3=CC=C21 HIYWOHBEPVGIQN-UHFFFAOYSA-N 0.000 abstract description 11
- 239000002253 acid Substances 0.000 description 26
- 230000008569 process Effects 0.000 description 22
- 238000004090 dissolution Methods 0.000 description 19
- FSMWBGXZXMCILX-UHFFFAOYSA-N 2-(oxiran-2-ylmethyl)naphthalen-1-ol Chemical compound C1=CC2=CC=CC=C2C(O)=C1CC1CO1 FSMWBGXZXMCILX-UHFFFAOYSA-N 0.000 description 16
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 16
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 16
- 238000005516 engineering process Methods 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical group [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 7
- 238000010511 deprotection reaction Methods 0.000 description 7
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 6
- 239000003112 inhibitor Substances 0.000 description 6
- 238000012216 screening Methods 0.000 description 6
- 239000003623 enhancer Substances 0.000 description 5
- 230000002708 enhancing effect Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 5
- 238000001459 lithography Methods 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- 239000003340 retarding agent Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- IVQGJZCJWJVSJX-UHFFFAOYSA-N 5-phenylbenzene-1,2,3-triol Chemical compound OC1=C(O)C(O)=CC(C=2C=CC=CC=2)=C1 IVQGJZCJWJVSJX-UHFFFAOYSA-N 0.000 description 3
- 206010034972 Photosensitivity reaction Diseases 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 230000002401 inhibitory effect Effects 0.000 description 3
- 230000036211 photosensitivity Effects 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 206010034960 Photophobia Diseases 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 208000013469 light sensitivity Diseases 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 230000008542 thermal sensitivity Effects 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710236960.1A CN106933036B (zh) | 2017-04-12 | 2017-04-12 | 一种热敏阳图感光组合物的制备方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710236960.1A CN106933036B (zh) | 2017-04-12 | 2017-04-12 | 一种热敏阳图感光组合物的制备方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106933036A CN106933036A (zh) | 2017-07-07 |
| CN106933036B true CN106933036B (zh) | 2020-06-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710236960.1A Active CN106933036B (zh) | 2017-04-12 | 2017-04-12 | 一种热敏阳图感光组合物的制备方法 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106933036B (zh) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1967383A (zh) * | 2005-11-16 | 2007-05-23 | 株式会社日本触媒 | 感光性树脂组合物 |
| CN101225149A (zh) * | 2008-02-15 | 2008-07-23 | 深圳市容大电子材料有限公司 | 一种环氧改性酚醛清漆树脂和由其得到的光刻胶组合物 |
| CN102114725A (zh) * | 2009-12-30 | 2011-07-06 | 乐凯集团第二胶片厂 | 一种阳图热敏平版印刷版前体及其制版方法 |
| CN102659993A (zh) * | 2012-04-12 | 2012-09-12 | 上海大学 | Ctp版用免处理热敏型成膜树脂及其制备方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4927731A (en) * | 1987-03-30 | 1990-05-22 | Fuji Photo Film Co., Ltd. | Light-sensitive material containing silver halide, reducing agent, polymerizable compound, and polar compound |
| JP2587696B2 (ja) * | 1989-02-17 | 1997-03-05 | 富士写真フイルム株式会社 | 感光材料 |
| CN101734036B (zh) * | 2009-12-14 | 2013-06-19 | 泰兴市东方实业公司 | 联苯三酚与二乙烯基苯缩聚树脂的活性醚化物的阳图热敏ctp版材及其制备方法 |
| CN102436144B (zh) * | 2011-12-30 | 2014-07-02 | 乐凯华光印刷科技有限公司 | 一种感光组合物及其在阳图热敏ctp版材中的应用 |
| CN103885286B (zh) * | 2012-12-21 | 2017-02-08 | 乐凯华光印刷科技有限公司 | 一种阳图热敏感光组合物及其应用 |
-
2017
- 2017-04-12 CN CN201710236960.1A patent/CN106933036B/zh active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1967383A (zh) * | 2005-11-16 | 2007-05-23 | 株式会社日本触媒 | 感光性树脂组合物 |
| CN101225149A (zh) * | 2008-02-15 | 2008-07-23 | 深圳市容大电子材料有限公司 | 一种环氧改性酚醛清漆树脂和由其得到的光刻胶组合物 |
| CN102114725A (zh) * | 2009-12-30 | 2011-07-06 | 乐凯集团第二胶片厂 | 一种阳图热敏平版印刷版前体及其制版方法 |
| CN102659993A (zh) * | 2012-04-12 | 2012-09-12 | 上海大学 | Ctp版用免处理热敏型成膜树脂及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106933036A (zh) | 2017-07-07 |
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Legal Events
| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 242200 No. 37, Pengju Road, Guangde Economic Development Zone, Xuancheng City, Anhui Province Patentee after: Anhui Qiangbang New Material Co.,Ltd. Address before: 242200 No. 37, Pengju Road, Guangde Economic Development Zone, Xuancheng City, Anhui Province Patentee before: ANHUI STRONG STATE PRINTING MATERIAL Co.,Ltd. |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A preparation method of thermal positive map photosensitive composition Effective date of registration: 20211130 Granted publication date: 20200626 Pledgee: Industrial and Commercial Bank of China Limited Guangde sub branch Pledgor: Anhui Qiangbang New Material Co.,Ltd. Registration number: Y2021980013663 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230308 Granted publication date: 20200626 Pledgee: Industrial and Commercial Bank of China Limited Guangde sub branch Pledgor: Anhui Qiangbang New Material Co.,Ltd. Registration number: Y2021980013663 |











