CN106935732B - A kind of thin-film encapsulation structure and its encapsulation method, OLED device - Google Patents
A kind of thin-film encapsulation structure and its encapsulation method, OLED device Download PDFInfo
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Abstract
Description
技术领域technical field
本发明涉及显示技术领域，尤其涉及一种薄膜封装结构及其封装方法、OLED装置。The invention relates to the field of display technology, in particular to a thin film packaging structure, a packaging method thereof, and an OLED device.
背景技术Background technique
有机电致发光器件(Organic Light Emitting Device，简称OLED)是近年来逐渐发展起来的显示照明器件，由于其具有高响应、高对比度、可柔性化等优点，被视为拥有广泛的应用前景。但是，由于OLED器件在水汽和氧气的作用下，会出现腐蚀损坏的现象，因此，选择较好的封装方式对OLED器件来说尤为重要。Organic Light Emitting Device (OLED) is a display lighting device that has been gradually developed in recent years. Due to its advantages of high response, high contrast, and flexibility, it is considered to have broad application prospects. However, since the OLED device will be corroded and damaged under the action of water vapor and oxygen, it is particularly important to select a better packaging method for the OLED device.
目前，薄膜封装是一种广泛应用在OLED显示器制作中的封装方式，即采用无机有机垛叠结构对OLED器件进行覆盖，以达到阻隔水氧的目的。薄膜封装中加入干燥剂可以将封装性能提高至少一个等级，然而现有技术中干燥剂一般制作在无机阻隔层内或贴覆在无机阻隔层上，吸水后容易膨胀，对无机阻隔层造成应力拉扯，影响封装效果。At present, thin-film encapsulation is a widely used encapsulation method in the manufacture of OLED displays, that is, an inorganic-organic stacked structure is used to cover OLED devices to achieve the purpose of blocking water and oxygen. Adding a desiccant to the thin film packaging can improve the packaging performance by at least one level. However, in the prior art, the desiccant is generally made in the inorganic barrier layer or attached to the inorganic barrier layer. After absorbing water, it is easy to swell and cause stress to the inorganic barrier layer. , affecting the encapsulation effect.
发明内容Contents of the invention
本发明的实施例提供一种薄膜封装结构及其封装方法、OLED装置，能够解决将干燥物设置在无机阻隔层中而造成的无机阻隔层应力拉扯问题。Embodiments of the present invention provide a thin film encapsulation structure and encapsulation method thereof, and an OLED device, which can solve the stress-pull problem of the inorganic barrier layer caused by arranging dried objects in the inorganic barrier layer.
为达到上述目的，本发明的实施例采用如下技术方案：In order to achieve the above object, embodiments of the present invention adopt the following technical solutions:
一方面，本发明实施例提供一种薄膜封装结构，包括基板，还包括：On the one hand, an embodiment of the present invention provides a thin film packaging structure, including a substrate, and further including:
覆盖所述基板上的待封装件的膜层结构；covering the film layer structure of the component to be packaged on the substrate;
所述膜层结构包括：依次形成在所述待封装件上的第一无机阻隔层、第一有机阻隔层、第二有机阻隔层和第二无机阻隔层；The film layer structure includes: a first inorganic barrier layer, a first organic barrier layer, a second organic barrier layer and a second inorganic barrier layer sequentially formed on the component to be packaged;
所述第一有机阻隔层和所述第二有机阻隔层之间设置有至少一个干燥物。At least one desiccant is disposed between the first organic barrier layer and the second organic barrier layer.
可选的，所述干燥物为条状或点状。Optionally, the dry matter is in the form of strips or dots.
可选的，所述第一有机阻隔层和所述第二有机阻隔层之间设置有多个所述干燥物；多个所述干燥物呈阵列分布。Optionally, a plurality of dried objects are arranged between the first organic barrier layer and the second organic barrier layer; the plurality of dried objects are distributed in an array.
可选的，阵列分布的所述干燥物的厚度是所述第二有机阻隔层的厚度的1/10～1/5。Optionally, the thickness of the dried products distributed in the array is 1/10˜1/5 of the thickness of the second organic barrier layer.
可选的，所述干燥物的粘度为10000mPa·s～40000mPa·s。Optionally, the viscosity of the dried product is 10000mPa·s˜40000mPa·s.
可选的，所述第二有机阻隔层的粘度为1mPa·s～10mPa·s。Optionally, the viscosity of the second organic barrier layer is 1 mPa·s˜10 mPa·s.
可选的，所述待封装件上叠加设置有多个所述膜层结构。Optionally, a plurality of the film layer structures are stacked on the component to be packaged.
可选的，所述干燥物为液体干燥剂或粒径为10nm～50nm的纳米吸水材料。Optionally, the dried product is a liquid desiccant or a nano water-absorbing material with a particle size of 10 nm to 50 nm.
另一方面，本发明实施例提供一种薄膜封装方法，所述方法包括：On the other hand, an embodiment of the present invention provides a thin film encapsulation method, the method comprising:
依次形成覆盖基板上的待封装件的第一无机阻隔层和第一有机阻隔层；sequentially forming a first inorganic barrier layer and a first organic barrier layer covering the components to be packaged on the substrate;
在所述第一有机阻隔层上设置多个干燥物；disposing a plurality of desiccants on the first organic barrier layer;
形成覆盖所述干燥物的第二有机阻隔层；forming a second organic barrier layer covering the desiccant;
形成覆盖所述第二有机阻隔层的第二无机阻隔层。A second inorganic barrier layer covering the second organic barrier layer is formed.
再一方面，本发明实施例提供一种OLED装置，包括待封装件和上述任意一种所述的薄膜封装结构；其中，所述待封装件为OLED主体结构。In yet another aspect, an embodiment of the present invention provides an OLED device, including a component to be packaged and any one of the thin film packaging structures described above; wherein the component to be packaged is an OLED main structure.
本发明实施例提供的薄膜封装结构及其封装方法、OLED装置，所述薄膜封装结构包括基板，还包括：覆盖基板上的待封装件的膜层结构；膜层结构包括：依次形成在待封装件上的第一无机阻隔层、第一有机阻隔层、第二有机阻隔层和第二无机阻隔层；第一有机阻隔层和第二有机阻隔层之间设置有至少一个干燥物。相较于现有技术，本发明实施例提供的薄膜封装结构通过将干燥物设置在第一有机阻隔层和第二有机阻隔层之间，干燥物吸水膨胀后的应力可以被第一有机阻隔层和第二有机阻隔层吸收，不会对第一无机阻隔层和第二无机阻隔层产生影响，这样使得薄膜封装结构的封装效果较好。The thin film packaging structure and its packaging method and OLED device provided by the embodiments of the present invention, the thin film packaging structure includes a substrate, and further includes: a film layer structure covering the substrate to be packaged; the film layer structure includes: sequentially formed on the substrate to be packaged The first inorganic barrier layer, the first organic barrier layer, the second organic barrier layer and the second inorganic barrier layer on the piece; at least one dry object is arranged between the first organic barrier layer and the second organic barrier layer. Compared with the prior art, the film encapsulation structure provided by the embodiment of the present invention arranges the dry matter between the first organic barrier layer and the second organic barrier layer, and the stress of the dry matter after absorbing water and swelling can be suppressed by the first organic barrier layer. and the second organic barrier layer will not affect the first inorganic barrier layer and the second inorganic barrier layer, so that the encapsulation effect of the thin film encapsulation structure is better.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.
图1为本发明实施例提供的一种薄膜封装结构示意图一；FIG. 1 is a schematic diagram of a thin film packaging structure provided by an embodiment of the present invention;
图2为本发明实施例提供的一种薄膜封装结构示意图二；FIG. 2 is a second schematic diagram of a thin-film packaging structure provided by an embodiment of the present invention;
图3为本发明实施例提供的一种薄膜封装结构示意图三；Fig. 3 is a schematic diagram of a thin-film packaging structure provided by an embodiment of the present invention III;
图4为本发明实施例提供的一种薄膜封装结构示意图四。FIG. 4 is a fourth schematic diagram of a thin film packaging structure provided by an embodiment of the present invention.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
本发明实施例提供一种薄膜封装结构，如图1所示，包括基板10，还包括：覆盖基板10上的待封装件11的膜层结构；所述膜层结构包括：依次形成在待封装件11上的第一无机阻隔层12、第一有机阻隔层13、第二有机阻隔层14和第二无机阻隔层15；第一有机阻隔层13和第二有机阻隔层14之间设置有至少一个干燥物16。An embodiment of the present invention provides a thin film packaging structure, as shown in Figure 1, including a substrate 10, and also includes: a film layer structure covering the substrate 10 to be packaged 11; the film layer structure includes: sequentially formed on the to-be-packaged The first inorganic barrier layer 12, the first organic barrier layer 13, the second organic barrier layer 14 and the second inorganic barrier layer 15 on the piece 11; between the first organic barrier layer 13 and the second organic barrier layer 14, at least A dry object 16.
其中，待封装件11为需要进行薄膜封装的器件，本发明实施例对此不做限定。在实际应用中，待封装件11可以是OLED主体结构。Wherein, the component to be packaged 11 is a device that needs to be packaged with a thin film, which is not limited in this embodiment of the present invention. In practical applications, the component to be packaged 11 may be an OLED body structure.
本发明实施例对于第一无机阻隔层12、第一有机阻隔层13、第二有机阻隔层14和第二无机阻隔层15的材料、制作工艺、制作厚度、粘度等均不做限定，本领域技术人员可以根据实际情况进行设定。The embodiment of the present invention does not limit the materials, manufacturing process, manufacturing thickness, viscosity, etc. of the first inorganic barrier layer 12, the first organic barrier layer 13, the second organic barrier layer 14, and the second inorganic barrier layer 15. Technicians can set according to the actual situation.
干燥物16为能够吸附水分的物质，本发明实施例对于干燥物16的具体材料、设置数量、形状、粘度等均不做限定。参考图1所示，干燥物16设置在第一有机阻隔层13和第二有机阻隔层14之间，其仅与第一有机阻隔层13和第二有机阻隔层14接触。这样干燥物16吸水膨胀后的应力可以被第一有机阻隔层13和第二有机阻隔层14吸收，不会对第一无机阻隔层12和第二无机阻隔层15产生影响，这样使得薄膜封装结构的封装效果较好。The dried object 16 is a substance capable of absorbing moisture, and the embodiment of the present invention does not limit the specific material, quantity, shape, viscosity, etc. of the dried object 16 . Referring to FIG. 1 , the dried object 16 is disposed between the first organic barrier layer 13 and the second organic barrier layer 14 , and it is only in contact with the first organic barrier layer 13 and the second organic barrier layer 14 . In this way, the stress after the dried object 16 absorbs water and swells can be absorbed by the first organic barrier layer 13 and the second organic barrier layer 14, without affecting the first inorganic barrier layer 12 and the second inorganic barrier layer 15, so that the thin film encapsulation structure The encapsulation effect is better.
较佳的，参考图1所示，干燥物16为条状或点状。这样便于干燥物16对不同区域的水分的吸收；并且相比于将干燥物16设置成一整块，将干燥物16分散设置成多个条状或点状，可以使得第一有机阻隔层13和第二有机阻隔层14之间粘结更好。Preferably, as shown in FIG. 1 , the dried object 16 is in the form of strips or dots. This facilitates the absorption of moisture in different regions by the dried object 16; and compared to setting the dried object 16 as a whole piece, the dried object 16 is dispersed into a plurality of strips or dots, which can make the first organic barrier layer 13 and The bonding between the second organic barrier layers 14 is better.
进一步的，第一有机阻隔层13和第二有机阻隔层14之间设置有多个干燥物16；多个干燥物16呈阵列分布。这样便于工艺制作，也更加有利于干燥物16对不同区域的水分的均匀吸收。本发明实施例对于阵列分布的多个干燥物16之间的间距和单个干燥物16的尺寸均不做限定。在实际制作时，相邻两个干燥物16之间的间隔可以设置为1mm～2mm。当干燥物16为点状时，干燥物16的等效直径可以为0.5mm～2mm。干燥物16的主体材料可以为10-50nm粒径的CaO、BaO、TiO2等纳米吸水材料，在主体材料中可以添加甲醇、乙醇等易挥发溶剂形成膏状物；或者，干燥物16为甘油、二甘醇等液体干燥剂。干燥物16可以通过喷涂、打印或印刷的方式制作在第一有机阻隔层13的表面。Further, a plurality of desiccants 16 are disposed between the first organic barrier layer 13 and the second organic barrier layer 14; the plurality of desiccants 16 are distributed in an array. This facilitates the manufacturing process and is more conducive to the uniform absorption of moisture in different regions by the dried object 16 . The embodiment of the present invention does not limit the spacing between multiple dried objects 16 distributed in an array and the size of a single dried object 16 . In actual production, the interval between two adjacent dry objects 16 can be set at 1mm-2mm. When the dried object 16 is point-shaped, the equivalent diameter of the dried object 16 may be 0.5mm˜2mm. The main material of the dry matter 16 can be nano-water-absorbing materials such as CaO, BaO, and TiO2 with a particle size of 10-50nm, and volatile solvents such as methanol and ethanol can be added to the main material to form a paste; or, the dry matter 16 is glycerin , diethylene glycol and other liquid desiccants. The dry matter 16 can be made on the surface of the first organic barrier layer 13 by spraying, printing or printing.
为了便于在第一有机阻隔层13的表面形成条状或点状的干燥物16，干燥物16的粘度一般较大，其粘度可以在10000mPa·s～40000mPa·s；在干燥物16上制作第二有机阻隔层14时，为了通过自然流平的方式覆盖干燥物16，第二有机阻隔层14的粘度一般较小，其粘度可以在1mPa·s～10mPa·s。为了保证第二有机阻隔层14对干燥物16的覆盖效果，较佳的，阵列分布的干燥物16的厚度是第二有机阻隔层14的厚度的1/10～1/5。In order to facilitate the formation of strip-shaped or dot-shaped dry matter 16 on the surface of the first organic barrier layer 13, the viscosity of the dry matter 16 is generally relatively large, and its viscosity can be 10000mPa·s～40000mPa·s; When the second organic barrier layer 14 is used, in order to cover the dried object 16 by natural leveling, the viscosity of the second organic barrier layer 14 is generally low, and its viscosity may be 1 mPa·s˜10 mPa·s. In order to ensure the covering effect of the second organic barrier layer 14 on the dried objects 16 , preferably, the thickness of the dried objects 16 distributed in an array is 1/10˜1/5 of the thickness of the second organic barrier layer 14 .
在实际应用中，第一无机阻隔层12和第二无机阻隔层15的材料可以为SiNx、SiO2、SiC、Al2O3、ZnS、ZnO等具有阻隔水氧作用的材料，通过化学气相沉积(CVD)、溅射、原子力沉积(ALD)等方式形成0.05μm～2.5μm的薄膜。第一有机阻隔层13和第二有机阻隔层14的材料可以为单体、聚丙烯酸酯、聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯等聚合物，通过喷涂、打印或印刷等方式形成薄膜。其中，第一有机阻隔层13的厚度可以为0.5μm-5μm；第二有机阻隔层14的厚度可以为10μm-20μm。In practical applications, the materials of the first inorganic barrier layer 12 and the second inorganic barrier layer 15 can be SiNx, SiO 2 , SiC, Al 2 O 3 , ZnS, ZnO and other materials that have the function of blocking water and oxygen. (CVD), sputtering, atomic force deposition (ALD) and other methods to form thin films of 0.05 μm to 2.5 μm. The materials of the first organic barrier layer 13 and the second organic barrier layer 14 can be monomers, polyacrylates, polymethyl methacrylate (PMMA), polycarbonate and other polymers, formed by spraying, printing or printing, etc. film. Wherein, the thickness of the first organic barrier layer 13 may be 0.5 μm-5 μm; the thickness of the second organic barrier layer 14 may be 10 μm-20 μm.
需要说明的是，第一有机阻隔层13和第二有机阻隔层14的材料可以相同，也可以不同，本发明实施例对此不做限定，较佳的，第一有机阻隔层13和第二有机阻隔层14的材料相同，这样可以使得第一有机阻隔层13和第二有机阻隔层14的粘结效果更好。It should be noted that the materials of the first organic barrier layer 13 and the second organic barrier layer 14 may be the same or different, which is not limited in this embodiment of the present invention. Preferably, the first organic barrier layer 13 and the second organic barrier layer The materials of the organic barrier layer 14 are the same, which can make the bonding effect of the first organic barrier layer 13 and the second organic barrier layer 14 better.
为了进一步提高对待封装件11的封装效果，待封装件11上可以叠加设置多个所述膜层结构，本发明实施例对于所述膜层结构的具体设置数量不做限定。In order to further improve the packaging effect of the component to be packaged 11 , a plurality of the film layer structures can be stacked on the component to be packaged 11 , and the embodiment of the present invention does not limit the specific number of the film layer structures.
本发明实施例提供的薄膜封装结构，包括基板，还包括：覆盖基板上的待封装件的膜层结构；膜层结构包括：依次形成在待封装件上的第一无机阻隔层、第一有机阻隔层、第二有机阻隔层和第二无机阻隔层；第一有机阻隔层和第二有机阻隔层之间设置有至少一个干燥物。相较于现有技术，本发明实施例提供的薄膜封装结构通过将干燥物设置在第一有机阻隔层和第二有机阻隔层之间，干燥物吸水膨胀后的应力可以被第一有机阻隔层和第二有机阻隔层吸收，不会对第一无机阻隔层和第二无机阻隔层产生影响，这样使得薄膜封装结构的封装效果较好。The thin film packaging structure provided by the embodiment of the present invention includes a substrate, and further includes: a film layer structure covering the object to be packaged on the substrate; the film layer structure includes: a first inorganic barrier layer, a first organic The barrier layer, the second organic barrier layer and the second inorganic barrier layer; at least one dry object is arranged between the first organic barrier layer and the second organic barrier layer. Compared with the prior art, the film encapsulation structure provided by the embodiment of the present invention arranges the dry matter between the first organic barrier layer and the second organic barrier layer, and the stress of the dry matter after absorbing water and swelling can be suppressed by the first organic barrier layer. and the second organic barrier layer will not affect the first inorganic barrier layer and the second inorganic barrier layer, so that the encapsulation effect of the thin film encapsulation structure is better.
本发明另一实施例提供一种薄膜封装方法，如图1至图4所示，所述方法包括：依次形成覆盖基板10上的待封装件11的第一无机阻隔层12和第一有机阻隔层13；在第一有机阻隔层13上设置多个干燥物16；形成覆盖干燥物16的第二有机阻隔层14；形成覆盖第二有机阻隔层14的第二无机阻隔层15。Another embodiment of the present invention provides a thin film encapsulation method, as shown in FIGS. 1 to 4 , the method includes: sequentially forming a first inorganic barrier layer 12 and a first organic barrier layer covering a substrate 10 to be packaged 11 layer 13; a plurality of desiccants 16 are disposed on the first organic barrier layer 13; a second organic barrier layer 14 covering the desiccants 16 is formed; a second inorganic barrier layer 15 covering the second organic barrier layer 14 is formed.
本发明实施例对于第一无机阻隔层12、第一有机阻隔层13、干燥物16、第二有机阻隔层14和第二无机阻隔层15的具体制作工艺均不做限定。The embodiment of the present invention does not limit the specific manufacturing process of the first inorganic barrier layer 12 , the first organic barrier layer 13 , the dried material 16 , the second organic barrier layer 14 and the second inorganic barrier layer 15 .
在实际制作中，参考图1至图4所示，首先在待封装件11上形成第一无机阻隔层12，在第一无机阻隔层12的表面形成第一有机阻隔层13，并固化；然后在第一有机阻隔层13的表面以涂布或打印的方式形成阵列分布的条状或点状的干燥物16，在干燥物16间隙采用喷墨打印的方式形成第二有机阻隔层14，通过第二有机阻隔层14的自然流平，覆盖住干燥物16，再进行第二有机阻隔层14固化，之后再制作第二无机阻隔层15。In actual production, with reference to Fig. 1 to Fig. 4, first form the first inorganic barrier layer 12 on the object to be packaged 11, form the first organic barrier layer 13 on the surface of the first inorganic barrier layer 12, and cure; then On the surface of the first organic barrier layer 13, strip-like or dot-like dried objects 16 distributed in arrays are formed by coating or printing, and the second organic barrier layer 14 is formed by inkjet printing in the gaps between the dried objects 16. The natural leveling of the second organic barrier layer 14 covers the dried object 16 , and then the second organic barrier layer 14 is cured, and then the second inorganic barrier layer 15 is fabricated.
本发明再一实施例提供一种OLED装置，包括待封装件11和上述中任意一种所述的薄膜封装结构；其中，待封装件11为OLED主体结构。Still another embodiment of the present invention provides an OLED device, which includes a component to be packaged 11 and any one of the thin film packaging structures described above; wherein the component to be packaged 11 is an OLED main structure.
本发明实施例对于薄膜封装结构的各膜层的具体材料、厚度、制作工艺等均不做限定。The embodiment of the present invention does not limit the specific material, thickness, manufacturing process, etc. of each film layer of the thin film encapsulation structure.
示例的，在进行OLED主体结构的薄膜封装时，在OLED主体结构上采用CVD的方式形成0.5μm SiNx薄膜，作为第一无机阻隔层12，在第一无机阻隔层12的表面采用打印的方式形成1μm的单体薄膜作为第一有机阻隔层13，并UV照射固化；在第一有机阻隔层13的表面以印刷的方式形成间隔1mm，宽1mm，高度2μm的条状液体干燥物16，在干燥物16间隙采用喷墨打印的方式形成10μm的单体作为第二有机阻隔层14，通过第二有机阻隔层14的自然流平，覆盖住液态干燥物16，再进行第二有机阻隔层14的UV照射固化，这样将干燥物16夹设在第一有机阻隔层13和第二有机阻隔层14之间，之后再制作1μm的SiNx薄膜作为第二无机阻隔层15。For example, when performing thin-film packaging of the OLED main structure, a 0.5 μm SiNx thin film is formed on the OLED main structure by CVD, as the first inorganic barrier layer 12, and is formed on the surface of the first inorganic barrier layer 12 by printing A monomer film of 1 μm is used as the first organic barrier layer 13, and it is cured by UV radiation; on the surface of the first organic barrier layer 13, strip-shaped liquid dried objects 16 with an interval of 1 mm, a width of 1 mm, and a height of 2 μm are formed by printing. A 10 μm monomer is formed in the gap between the objects 16 by inkjet printing as the second organic barrier layer 14, and the liquid dry object 16 is covered by the natural leveling of the second organic barrier layer 14, and then the second organic barrier layer 14 is formed. Curing by UV irradiation, so that the dried object 16 is interposed between the first organic barrier layer 13 and the second organic barrier layer 14 , and then a 1 μm SiNx thin film is fabricated as the second inorganic barrier layer 15 .
或者，在OLED主体结构上采用ALD的方式形成0.05μm的Al2O3薄膜，作为第一无机阻隔层12，在第一无机阻隔层12的表面采用打印的方式形成1μm的单体作为第一有机阻隔层13，并UV照射固化；在第一有机阻隔层13的表面以喷涂的方式形成间隔1mm、宽1mm、高度2μm的点状的CaO和乙醇混合膏状干燥物16，并在40℃环境下烘干；在干燥物16间隙采用喷墨打印的方式形成10μm的单体作为第二有机阻隔层14，通过第二有机阻隔层14的自然流平，覆盖住液态干燥物16，再进行第二有机阻隔层14的UV照射固化，这样将干燥物16夹设在第一有机阻隔层13和第二有机阻隔层14之间，之后再制作1μm的SiNx薄膜作为第二无机阻隔层15。Alternatively, a 0.05 μm Al 2 O 3 thin film is formed by ALD on the OLED main structure as the first inorganic barrier layer 12, and a 1 μm monomer is formed on the surface of the first inorganic barrier layer 12 by printing as the first inorganic barrier layer 12. The organic barrier layer 13 is cured by UV irradiation; the surface of the first organic barrier layer 13 is sprayed to form a dotted CaO and ethanol mixed paste dry product 16 with an interval of 1 mm, a width of 1 mm, and a height of 2 μm, and is heated at 40 ° C. drying under ambient conditions; inkjet printing is used to form a 10 μm monomer in the gap between the dried objects 16 as the second organic barrier layer 14, and the liquid dried objects 16 are covered by the natural leveling of the second organic barrier layer 14, and then The second organic barrier layer 14 is cured by UV irradiation, so that the dried product 16 is sandwiched between the first organic barrier layer 13 and the second organic barrier layer 14 , and then a 1 μm SiNx film is made as the second inorganic barrier layer 15 .
由于本发明实施例提供的薄膜封装结构是将干燥物设置在第一有机阻隔层和第二有机阻隔层之间，干燥物吸水膨胀后的应力可以被第一有机阻隔层和第二有机阻隔层吸收，不会对第一无机阻隔层和第二无机阻隔层产生影响，这样使得薄膜封装结构的封装效果较好。Since the thin film encapsulation structure provided by the embodiment of the present invention is to arrange the desiccated substance between the first organic barrier layer and the second organic barrier layer, the stress after the desiccated substance absorbs water and swells can be suppressed by the first organic barrier layer and the second organic barrier layer. The absorption will not affect the first inorganic barrier layer and the second inorganic barrier layer, so that the encapsulation effect of the thin film encapsulation structure is better.
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.
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