CN106965100A - A kind of wet type polishing pad and preparation method thereof - Google Patents
A kind of wet type polishing pad and preparation method thereof Download PDFInfo
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- CN106965100A CN106965100A CN201710255744.1A CN201710255744A CN106965100A CN 106965100 A CN106965100 A CN 106965100A CN 201710255744 A CN201710255744 A CN 201710255744A CN 106965100 A CN106965100 A CN 106965100A
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- isocyanate
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- 238000005498 polishing Methods 0.000 title claims abstract description 57
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 50
- 229920000642 polymer Polymers 0.000 claims abstract description 30
- 229910052582 BN Inorganic materials 0.000 claims abstract description 29
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical group N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000012948 isocyanate Substances 0.000 claims abstract description 28
- 229920005862 polyol Polymers 0.000 claims abstract description 28
- 150000003077 polyols Chemical class 0.000 claims abstract description 28
- 150000005846 sugar alcohols Polymers 0.000 claims abstract description 28
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 25
- 229920002050 silicone resin Polymers 0.000 claims abstract description 25
- 239000004593 Epoxy Substances 0.000 claims abstract description 24
- 239000002826 coolant Substances 0.000 claims abstract description 23
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 23
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 21
- 229920001451 polypropylene glycol Polymers 0.000 claims abstract description 21
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 19
- 229920001610 polycaprolactone Polymers 0.000 claims abstract description 19
- 239000004632 polycaprolactone Substances 0.000 claims abstract description 19
- 239000003082 abrasive agent Substances 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 15
- 238000002156 mixing Methods 0.000 claims description 15
- 150000002118 epoxides Chemical class 0.000 claims description 9
- 150000002148 esters Chemical class 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 238000007493 shaping process Methods 0.000 claims description 6
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical group CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 150000004984 aromatic diamines Chemical class 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical group OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 2
- 150000002596 lactones Chemical class 0.000 claims 1
- 238000000227 grinding Methods 0.000 abstract description 17
- 230000000694 effects Effects 0.000 abstract description 10
- 230000009467 reduction Effects 0.000 abstract description 5
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- OWIKHYCFFJSOEH-UHFFFAOYSA-N Isocyanic acid Chemical compound N=C=O OWIKHYCFFJSOEH-UHFFFAOYSA-N 0.000 description 3
- 150000001335 aliphatic alkanes Chemical class 0.000 description 3
- XLJMAIOERFSOGZ-UHFFFAOYSA-N anhydrous cyanic acid Natural products OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 238000010792 warming Methods 0.000 description 3
- -1 alkane diamines Chemical class 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- 244000137852 Petrea volubilis Species 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Polyurethanes Or Polyureas (AREA)
Abstract
The present invention relates to a kind of wet type polishing pad and preparation method thereof.Wet type polishing pad of the present invention, it is prepared from by following component by weight：100 120 parts of polyalcohol, 100 120 parts isocyanate-terminated of performed polymer, 10 50 parts of curing agent, 10 30 parts of epoxy modified silicone resin, 10 20 parts of coolant, 60 80 parts of abrasive material；Wherein, the polyalcohol is mixed by PPG, polycaprolactone and crosslinking agent；The isocyanate-terminated performed polymer is reacted by polyfunctional isocyanate and low molecular weight polyols to be generated；The coolant is boron nitride and silica；Wet type polishing pad of the present invention can greatly improve grinding sharpness, and grinding efficiency is high, effectively the working strength of reduction grinding and polishing；And with excellent radiating effect.
Description
Technical field
The present invention relates to wet type polishing pad field, more particularly to a kind of wet type polishing pad and preparation method thereof.
Background technology
Polishing industry is almost and the industry such as glass manufacture, automobile production, machining, wood industry and irommongery is while develop
Come, these industries are developed rapidly in recent years, and kind, performance to polishing abrasive tool etc. require more and more higher, to its demand
Also it is increasing, it is developing progressively polishing industry for an important industry.
Because the polishing grinding material shape of the sheet-like flexible matrix such as sand paper is unstable, be typically only capable to hand polish or
Person is polished operation with hand-operated tools, and cannot be used in machinery equipment, therefore can not be carried using this polishing grinding material
High efficiency.Also, because the frictional heat of polishing pad is higher, and the thermal diffusivity of existing polishing pad is poor.
The content of the invention
Based on this, it is an object of the present invention to provide a kind of wet type polishing pad and preparation method thereof, the wet type polishing pad
Grinding sharpness can be greatly improved, grinding efficiency is high, effectively the working strength of reduction grinding and polishing；And with excellent radiating
Effect.
A kind of wet type polishing pad, it is prepared from by following component by weight：
100-120 parts of polyalcohol；
100-120 parts of isocyanate-terminated performed polymer；
10-50 parts of curing agent；
10-30 parts of epoxy modified silicone resin；
10-20 parts of coolant；
60-80 parts of abrasive material；
Wherein, the polyalcohol is mixed by PPG, polycaprolactone and crosslinking agent, the PPG,
The mixing quality ratio of polycaprolactone and crosslinking agent is 1:(0.6-0.8):(0.1-0.2)；
The isocyanate-terminated performed polymer is reacted by polyfunctional isocyanate and low molecular weight polyols to be generated, isocyanide
The molecular weight of the performed polymer of acid esters end-blocking is 400-800；The polyfunctional isocyanate and the degree of functionality of low molecular weight polyols
More than or equal to 2, the mass ratio of the polyfunctional isocyanate and low molecular weight polyols is 1:(0.1-0.3)；
The epoxide number of the epoxy modified silicone resin is 0.03-0.08.
Wet type polishing pad of the present invention, is prepared into by the isocyanate-terminated performed polymer and polyol reaction
To polyurethane polishing pad can greatly improve grinding sharpness, grinding efficiency is high, the work of effectively reduction grinding and polishing is strong
Degree；Polycaprolactone is with the addition of during polyalcohol is prepared, increases the physical crosslinking structure of polyalcohol, final polishing pad is improved
Mechanical strength；It with the addition of epoxy modified silicone resin and coolant, epoxy modified silicone resin has excellent heat-resisting
Effect, and the radiating effect of wet type polishing pad can be effectively improved by heat by coolant Quick diffusing；And pass through system
The isocyanate-terminated performed polymer of standby low molecule amount, reduces the viscosity of performed polymer, reduces the difficulty of production technology.
Further, the coolant is boron nitride and silica.Utilize the high thermal conductivity energy and height of silica
Heat endurance, the heat for the generation that rubs effectively is distributed by silica；And boron nitride and silica synergy, two
Silica promotes boron nitride to be uniformly dispersed in polishing pad, and radiating surface is increased using boron nitride, improves radiating effect.
Further, the mass ratio of the boron nitride and silica is 1:(1-2), the particle diameter of the boron nitride is 20-
80nm.This ratio is controlled, the scattered uniformity of boron nitride is can effectively ensure that, and can effectively utilize the height of silica itself
Heat-conductive characteristic.
Further, the curing agent is aromatic diamines curing agent.Due to the benzene ring structure in curing agent, and generate
Urea groups there is stronger polarity, make the material for preparing that there is higher intensity, improve the service life of material.Specifically
, chloro- 4, the 4- benzhydryls alkane diamines of the curing agent preferably 3,3- bis-.
Further, the molecular weight of the PPG is 1500-2500；The molecular weight of the polycaprolactone is
2000-3000；The crosslinking agent is pentaerythrite.
Further, the polyfunctional isocyanate is toluene di-isocyanate(TDI), and the low molecular weight polyols are second two
Alcohol.
Further, the abrasive material is carborundum or aluminum oxide.
The invention also discloses a kind of preparation method of wet type polishing pad, comprise the following steps：
(1) functional isocyanate and low molecular weight polyols are subjected to prepolymerization, it is 400-800's to obtain molecular weight
Isocyanate-terminated prepolymer；
(2) PPG, polycaprolactone and crosslinking agent are uniformly mixed in proportion, obtain polyalcohol；
(3) epoxy modified silicone resin, coolant and abrasive material will be sequentially added after polyalcohol and curing agent mixing deaeration
Well mixed pre-composition is obtained, addition isocyanate-terminated prepolymer is well mixed into pre-composition obtains mixture；
(4) mixture is poured into mould, be stripped after cold curing shaping, heat drying obtains the polishing pad.
The present invention has the advantages that：
(1) by preparing the isocyanate-terminated performed polymer of low molecule amount, reduce the viscosity of performed polymer, make follow-up work
Skill can be carried out in normal temperature, it is not necessary to be heated at high temperature, reduced the difficulty of production technology；
(2) the polyurethane polishing pad hardness prepared by the isocyanate-terminated performed polymer and polyol reaction
Suitably, grinding sharpness can be greatly improved, grinding efficiency is high, effectively the working strength of reduction grinding and polishing；
(3) epoxy modified silicone resin and coolant be with the addition of, epoxy modified silicone resin has excellent heat-resisting
Effect, and the radiating effect of wet type polishing pad can be effectively improved by heat by coolant Quick diffusing；
(4) using the synergy of silica and boron nitride, the high thermal conductivity energy and high thermal stability of silica,
The heat for the generation that rubs effectively is distributed by silica；And it is equal that silica promotes boron nitride to disperse in polishing pad
It is even, increase radiating surface using boron nitride, improve radiating effect；
(5) preparation method of the present invention, technique is simple, and mild condition is suitable for the production of industrial mass.
In order to more fully understand and implement, the following detailed description of the present invention.
Embodiment
The invention discloses a kind of wet type polishing pad and preparation method thereof, the wet type polishing pad by by weight as
Lower component is prepared from：100-120 parts of polyalcohol；100-120 parts of isocyanate-terminated performed polymer；10-50 parts of curing agent；Ring
10-30 parts of oxygen modified organic silicone resin；10-20 parts of coolant；60-80 parts of abrasive material；Wherein, the polyalcohol is by polyether polyols
Alcohol, polycaprolactone and crosslinking agent are mixed, and the mixing quality ratio of the PPG, polycaprolactone and crosslinking agent is 1:
(0.6-0.8):(0.1-0.2)；The isocyanate-terminated performed polymer is by polyfunctional isocyanate and low molecular weight polyols
Reaction generation, the molecular weight of isocyanate-terminated performed polymer is 400-800；The polyfunctional isocyanate and low molecule amount are more
The degree of functionality of first alcohol is more than or equal to 2, and the mass ratio of the polyfunctional isocyanate and low molecular weight polyols is 1:(0.1-
0.3)；The epoxide number of the epoxy modified silicone resin is 0.03-0.08.
Specifically, the coolant is boron nitride and silica, the mass ratio of the boron nitride and silica is 1:
(1-2), the particle diameter of the boron nitride is 20-80nm.
The curing agent is aromatic diamines curing agent, chloro- 4, the 4- benzhydryls alkane diamines of preferably 3,3- bis-.
The molecular weight of the PPG is 1500-2500；The molecular weight of the polycaprolactone is 2000-3000；Institute
Crosslinking agent is stated for pentaerythrite.
The polyfunctional isocyanate is toluene di-isocyanate(TDI), and the low molecular weight polyols are ethylene glycol.
The abrasive material is carborundum or aluminum oxide.
The invention also discloses a kind of preparation method of wet type polishing pad, comprise the following steps：
(1) functional isocyanate and low molecular weight polyols are subjected to prepolymerization, it is 400-800's to obtain molecular weight
Isocyanate-terminated prepolymer；
(2) PPG, polycaprolactone and crosslinking agent are uniformly mixed in proportion, obtain polyalcohol；
(3) epoxy modified silicone resin, coolant and abrasive material will be sequentially added after polyalcohol and curing agent mixing deaeration
Well mixed pre-composition is obtained, addition isocyanate-terminated prepolymer is well mixed into pre-composition obtains mixture；
(4) mixture is poured into mould, be stripped after cold curing shaping, heat drying obtains the polishing pad.
Embodiment 1
Wet type polishing pad described in the present embodiment is prepared from by following component by weight：100 parts of polyalcohol；It is different
100 parts of the performed polymer of cyanate end-blocking；10 parts of curing agent；20 parts of epoxy modified silicone resin；20 parts of coolant；Abrasive material 60
Part；Wherein, the polyalcohol is mixed by PPG, polycaprolactone and crosslinking agent, the PPG, gather oneself in
The mixing quality ratio of ester and crosslinking agent is 1:0.6:0.1；The isocyanate-terminated performed polymer by polyfunctional isocyanate with
Low molecular weight polyols reaction generation, the molecular weight of isocyanate-terminated performed polymer is 400-800；The multifunctional isocyanic acid
The degree of functionality of ester and low molecular weight polyols is equal to 2, and the mass ratio of the polyfunctional isocyanate and low molecular weight polyols is
1:0.2；The epoxide number of the epoxy modified silicone resin is 0.06.The coolant be boron nitride and silica, it is described
The mass ratio of boron nitride and silica is 1:1, the particle diameter of the boron nitride is 20-80nm.
The preparation method of the wet type polishing pad is comprised the following steps that：
(1) 100g liquid toluene diisocyanate is put into reaction vessel, 300 turns/min stirrings.Then 20g is weighed
Ethylene glycol is slowly added dropwise in toluene di-isocyanate(TDI), after completion of dropping, rise temperature to insulation reaction 2h under the conditions of 60 DEG C, so
Deaeration processing is carried out afterwards, obtains isocyanate-terminated prepolymer.
(2) polycaprolactone 60g and season penta 4 that PPG 100g, molecular weight that molecular weight is 1500 are 3000 are weighed
Alcohol 10g is uniformly mixed in another reaction vessel, obtains polyalcohol.
(3) the polyalcohol 100g for taking step (2) to prepare, adds 10g curing agent 3, chloro- 4, the 4- benzhydryls alkane of 3- bis-
After diamines mixing, 120 DEG C are warming up to, stirring is well mixed it after to be solidified dose of fusing, then carries out vacuum defoamation processing；So
Epoxy modified silicone resin, 10g boron nitride, 10g silica and 60g that 20g epoxide numbers are 0.06 are sequentially added afterwards
Alumina abrasive, it is well mixed in 3000 turns/min high-speed stirreds；What then addition step (1) was prepared is isocyanate-terminated
Performed polymer 100g, in the mixing of 3000 turns/min high-speed stirreds, obtains mixture.
(4) mixture is poured into mould, be stripped after cold curing 2h shapings, heat drying is obtained in 80 DEG C of baking ovens
The polishing pad.
Relative to prior art, wet type polishing pad of the present invention, by the isocyanate-terminated performed polymer and
The polyurethane polishing pad that polyol reaction is prepared can greatly improve grinding sharpness, and grinding efficiency is high, effectively reduction
The working strength of grinding and polishing；Epoxy modified silicone resin and coolant are with the addition of, epoxy modified silicone resin has excellent
Different heat-resisting effect, and the radiating effect of wet type polishing pad can be effectively improved by heat by coolant Quick diffusing；And
And by preparing the isocyanate-terminated performed polymer of low molecule amount, reduce the viscosity of performed polymer, reduce production technology
Difficulty.
Embodiment 2
Wet type polishing pad described in the present embodiment is prepared from by following component by weight：120 parts of polyalcohol；It is different
110 parts of the performed polymer of cyanate end-blocking；50 parts of curing agent；30 parts of epoxy modified silicone resin；15 parts of coolant；Abrasive material 70
Part；Wherein, the polyalcohol is mixed by PPG, polycaprolactone and crosslinking agent, the PPG, gather oneself in
The mixing quality ratio of ester and crosslinking agent is 1:0.8:0.2；The isocyanate-terminated performed polymer by polyfunctional isocyanate with
Low molecular weight polyols reaction generation, the molecular weight of isocyanate-terminated performed polymer is 400-800；The multifunctional isocyanic acid
The degree of functionality of ester and low molecular weight polyols is equal to 2, and the mass ratio of the polyfunctional isocyanate and low molecular weight polyols is
1:0.1；The epoxide number of the epoxy modified silicone resin is 0.03.The coolant be boron nitride and silica, it is described
The mass ratio of boron nitride and silica is 1:2, the particle diameter of the boron nitride is 20-80nm.
The preparation method of the wet type polishing pad is comprised the following steps that：
(1) 120g liquid toluene diisocyanate is put into reaction vessel, 300 turns/min stirrings.Then 12g is weighed
Ethylene glycol is slowly added dropwise in toluene di-isocyanate(TDI), after completion of dropping, rise temperature to insulation reaction 2h under the conditions of 60 DEG C, so
Deaeration processing is carried out afterwards, obtains isocyanate-terminated prepolymer.
(2) polycaprolactone 96g and season penta 4 that PPG 120g, molecular weight that molecular weight is 2000 are 2500 are weighed
Alcohol 24g is uniformly mixed in another reaction vessel, obtains polyalcohol.
(3) the polyalcohol 120g for taking step (2) to prepare, adds 50g curing agent 3, chloro- 4, the 4- benzhydryls alkane of 3- bis-
After diamines mixing, 120 DEG C are warming up to, stirring is well mixed it after to be solidified dose of fusing, then carries out vacuum defoamation processing；So
Epoxy modified silicone resin, 5g boron nitride, 10g silica and 70g that 30g epoxide numbers are 0.03 oxygen are sequentially added afterwards
Change aluminium abrasive material, it is well mixed in 3000 turns/min high-speed stirreds；What then addition step (1) was prepared is isocyanate-terminated pre-
Aggressiveness 110g, in the mixing of 3000 turns/min high-speed stirreds, obtains mixture.
(4) mixture is poured into mould, be stripped after cold curing 2h shapings, heat drying is obtained in 80 DEG C of baking ovens
The polishing pad.
Embodiment 3
Wet type polishing pad described in the present embodiment is prepared from by following component by weight：110 parts of polyalcohol；It is different
120 parts of the performed polymer of cyanate end-blocking；20 parts of curing agent；30 parts of epoxy modified silicone resin；15 parts of coolant；Abrasive material 70
Part；Wherein, the polyalcohol is mixed by PPG, polycaprolactone and crosslinking agent, the PPG, gather oneself in
The mixing quality ratio of ester and crosslinking agent is 1:0.7:0.15；The isocyanate-terminated performed polymer by polyfunctional isocyanate with
Low molecular weight polyols reaction generation, the molecular weight of isocyanate-terminated performed polymer is 400-800；The multifunctional isocyanic acid
The degree of functionality of ester and low molecular weight polyols is equal to 2, and the mass ratio of the polyfunctional isocyanate and low molecular weight polyols is
1:0.3；The epoxide number of the epoxy modified silicone resin is 0.08.The coolant be boron nitride and silica, it is described
The mass ratio of boron nitride and silica is 1:1.5, the particle diameter of the boron nitride is 20-80nm.
The preparation method of the wet type polishing pad is comprised the following steps that：
(1) 100g liquid toluene diisocyanate is put into reaction vessel, 300 turns/min stirrings.Then 30g is weighed
Ethylene glycol is slowly added dropwise in toluene di-isocyanate(TDI), after completion of dropping, rise temperature to insulation reaction 2h under the conditions of 60 DEG C, so
Deaeration processing is carried out afterwards, obtains isocyanate-terminated prepolymer.
(2) polycaprolactone 70g and season penta 4 that PPG 100g, molecular weight that molecular weight is 2500 are 2000 are weighed
Alcohol 15g is uniformly mixed in another reaction vessel, obtains polyalcohol.
(3) the polyalcohol 110g for taking step (2) to prepare, adds 20g curing agent 3, chloro- 4, the 4- benzhydryls alkane of 3- bis-
After diamines mixing, 120 DEG C are warming up to, stirring is well mixed it after to be solidified dose of fusing, then carries out vacuum defoamation processing；So
Epoxy modified silicone resin, 4g boron nitride, 6g silica and 80g that 10g epoxide numbers are 0.08 oxygen are sequentially added afterwards
Change aluminium abrasive material, it is well mixed in 3000 turns/min high-speed stirreds；What then addition step (1) was prepared is isocyanate-terminated pre-
Aggressiveness 120g, in the mixing of 3000 turns/min high-speed stirreds, obtains mixture.
(4) mixture is poured into mould, be stripped after cold curing 2h shapings, heat drying is obtained in 80 DEG C of baking ovens
The polishing pad.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that coming for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.
Claims (8)
1. a kind of wet type polishing pad, it is characterised in that：It is prepared from by following component by weight：
100-120 parts of polyalcohol；
100-120 parts of isocyanate-terminated performed polymer；
10-50 parts of curing agent；
10-30 parts of epoxy modified silicone resin；
10-20 parts of coolant；
60-80 parts of abrasive material；
Wherein, the polyalcohol is mixed by PPG, polycaprolactone and crosslinking agent, the PPG, gather oneself
The mixing quality ratio of lactone and crosslinking agent is 1:(0.6-0.8):(0.1-0.2)；
The isocyanate-terminated performed polymer is reacted by polyfunctional isocyanate and low molecular weight polyols to be generated, isocyanates
The molecular weight of the performed polymer of end-blocking is 400-800；The degree of functionality of the polyfunctional isocyanate and low molecular weight polyols is more than
Or equal to 2, the mass ratio of the polyfunctional isocyanate and low molecular weight polyols is 1:(0.1-0.3)；
The epoxide number of the epoxy modified silicone resin is 0.03-0.08.
2. wet type polishing pad according to claim 1, it is characterised in that：The coolant is boron nitride and silica.
3. wet type polishing pad according to claim 2, it is characterised in that：The mass ratio of the boron nitride and silica is
1:(1-2), the particle diameter of the boron nitride is 20-80nm.
4. wet type polishing pad according to claim 1, it is characterised in that：The curing agent solidifies for aromatic diamines
Agent.
5. wet type polishing pad according to claim 1, it is characterised in that：The molecular weight of the PPG is 1500-
2500；The molecular weight of the polycaprolactone is 2000-3000；The crosslinking agent is pentaerythrite.
6. wet type polishing pad according to claim 1, it is characterised in that：The polyfunctional isocyanate is toluene diisocyanate
Acid esters, the low molecular weight polyols are ethylene glycol.
7. wet type polishing pad according to claim 1, it is characterised in that：The abrasive material is carborundum or aluminum oxide.
8. a kind of preparation method of any one of claim 1-7 wet type polishing pads, it is characterised in that：Comprise the following steps：
(1) functional isocyanate and low molecular weight polyols are subjected to prepolymerization, obtain the isocyanide that molecular weight is 400-800
Acid esters terminated prepolymer；
(2) PPG, polycaprolactone and crosslinking agent are uniformly mixed in proportion, obtain polyalcohol；
(3) epoxy modified silicone resin, coolant and abrasive material will be sequentially added after polyalcohol and curing agent mixing deaeration to obtain
Well mixed pre-composition, into pre-composition, addition isocyanate-terminated prepolymer is well mixed obtains mixture；
(4) mixture is poured into mould, be stripped after cold curing shaping, heat drying obtains the polishing pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710255744.1A CN106965100A (en) | 2017-04-19 | 2017-04-19 | A kind of wet type polishing pad and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN108789135A (en) * | 2018-05-25 | 2018-11-13 | 湖北鼎龙控股股份有限公司 | Chemical mechanical polishing pads |
| CN114560989A (en) * | 2022-02-14 | 2022-05-31 | 赢聚化学技术研发(南京)有限公司 | Polishing pad based on low-free polyurethane prepolymer and preparation method thereof |
| CN120775373A (en) * | 2025-08-06 | 2025-10-14 | 广东骏达精密科技有限公司 | Polishing pad for polishing silicon carbide wafer and preparation method and application thereof |
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