CN106978128A - Polyurethane adhesive and preparation method thereof and heat-conducting glue band - Google Patents
Polyurethane adhesive and preparation method thereof and heat-conducting glue band Download PDFInfo
- Publication number
- CN106978128A CN106978128A CN201710322589.0A CN201710322589A CN106978128A CN 106978128 A CN106978128 A CN 106978128A CN 201710322589 A CN201710322589 A CN 201710322589A CN 106978128 A CN106978128 A CN 106978128A
- Authority
- CN
- China
- Prior art keywords
- polyurethane adhesive
- weight
- heat
- preparation
- conducting glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000853 adhesive Substances 0.000 title claims abstract description 65
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 65
- 239000004814 polyurethane Substances 0.000 title claims abstract description 55
- 229920002635 polyurethane Polymers 0.000 title claims abstract description 54
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000003292 glue Substances 0.000 title claims description 31
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 34
- 239000012948 isocyanate Substances 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 20
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 18
- 238000012545 processing Methods 0.000 claims abstract description 18
- 239000002904 solvent Substances 0.000 claims abstract description 15
- 239000004970 Chain extender Substances 0.000 claims abstract description 13
- 239000003054 catalyst Substances 0.000 claims abstract description 13
- 230000008878 coupling Effects 0.000 claims abstract description 10
- 238000010168 coupling process Methods 0.000 claims abstract description 10
- 238000005859 coupling reaction Methods 0.000 claims abstract description 10
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910000077 silane Inorganic materials 0.000 claims abstract description 9
- 238000005292 vacuum distillation Methods 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims abstract description 7
- 230000018044 dehydration Effects 0.000 claims abstract description 7
- 238000006297 dehydration reaction Methods 0.000 claims abstract description 7
- 238000007599 discharging Methods 0.000 claims abstract description 7
- 238000002604 ultrasonography Methods 0.000 claims abstract description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 37
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical group ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 36
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 claims description 24
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 9
- 229920005862 polyol Polymers 0.000 claims description 9
- 150000003077 polyols Chemical class 0.000 claims description 9
- 150000005846 sugar alcohols Polymers 0.000 claims description 6
- 229920001610 polycaprolactone Polymers 0.000 claims description 5
- 239000004632 polycaprolactone Substances 0.000 claims description 5
- 125000003944 tolyl group Chemical group 0.000 claims description 5
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 claims description 4
- 239000011469 building brick Substances 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 229920006267 polyester film Polymers 0.000 claims description 4
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 3
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 3
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical class OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000012975 dibutyltin dilaurate Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 2
- 239000005062 Polybutadiene Substances 0.000 claims description 2
- 150000002170 ethers Chemical class 0.000 claims description 2
- 229920002857 polybutadiene Polymers 0.000 claims description 2
- 229920001021 polysulfide Polymers 0.000 claims description 2
- 239000005077 polysulfide Substances 0.000 claims description 2
- 150000008117 polysulfides Polymers 0.000 claims description 2
- 229960001124 trientine Drugs 0.000 claims description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- OWIKHYCFFJSOEH-UHFFFAOYSA-N Isocyanic acid Chemical compound N=C=O OWIKHYCFFJSOEH-UHFFFAOYSA-N 0.000 claims 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-N anhydrous cyanic acid Natural products OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 claims 1
- 235000010290 biphenyl Nutrition 0.000 claims 1
- 239000004305 biphenyl Substances 0.000 claims 1
- 125000006267 biphenyl group Chemical group 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- XJRAOMZCVTUHFI-UHFFFAOYSA-N isocyanic acid;methane Chemical compound C.N=C=O.N=C=O XJRAOMZCVTUHFI-UHFFFAOYSA-N 0.000 claims 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 1
- GTACSIONMHMRPD-UHFFFAOYSA-N 2-[4-[2-(benzenesulfonamido)ethylsulfanyl]-2,6-difluorophenoxy]acetamide Chemical compound C1=C(F)C(OCC(=O)N)=C(F)C=C1SCCNS(=O)(=O)C1=CC=CC=C1 GTACSIONMHMRPD-UHFFFAOYSA-N 0.000 abstract description 3
- 101710130081 Aspergillopepsin-1 Proteins 0.000 abstract description 3
- 102100031007 Cytosolic non-specific dipeptidase Human genes 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 9
- 229920002799 BoPET Polymers 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 3
- -1 foam Chemical class 0.000 description 3
- 239000012774 insulation material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 125000004193 piperazinyl group Chemical group 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical group NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical group CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- POULHZVOKOAJMA-UHFFFAOYSA-M dodecanoate Chemical compound CCCCCCCCCCCC([O-])=O POULHZVOKOAJMA-UHFFFAOYSA-M 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 210000003746 feather Anatomy 0.000 description 1
- 244000144992 flock Species 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 229910003472 fullerene Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 150000002440 hydroxy compounds Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 125000002462 isocyano group Chemical group *[N+]#[C-] 0.000 description 1
- 229940070765 laurate Drugs 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3203—Polyhydroxy compounds
- C08G18/3206—Polyhydroxy compounds aliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4266—Polycondensates having carboxylic or carbonic ester groups in the main chain prepared from hydroxycarboxylic acids and/or lactones
- C08G18/4269—Lactones
- C08G18/4277—Caprolactone and/or substituted caprolactone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/44—Polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6633—Compounds of group C08G18/42
- C08G18/6637—Compounds of group C08G18/42 with compounds of group C08G18/32 or polyamines of C08G18/38
- C08G18/664—Compounds of group C08G18/42 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/28—Presence of paper
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
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- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of preparation method of polyurethane adhesive, comprise the following steps：Step one：PEPA is added in reactor, vacuum dehydration；Step 2：Silane coupler carries out coupling processing to graphene oxide, and the graphene oxide and combination solvent after processing are added to reactor described in step one, ultrasound 2~8 hours by the graphene oxide after being handled；Step 3：Isocyanates, catalyst and chain extender are added into reactor described in step 2,80~90 DEG C is heated and reacts 2~7 hours；Step 4：Polyurethane adhesive is made through 80~90 DEG C of vacuum distillations, cooling discharging in material in step 3 in reactor.Polyurethane adhesive thermal conductivity factor produced by the present invention is high, and peel strength is big.
Description
Technical field
The present invention relates to tape technology field, and in particular to a kind of polyurethane adhesive and preparation method thereof and heat conduction
Adhesive tape.
Background technology
Polyurethane is birdsed of the same feather flock together compound, english abbreviation PU, by isocyanates for the one of main chain constitutional repeating unit Han-NHCOO-
(monomer) is polymerized with hydroxy compounds.Due to containing highly polar carbamate groups, insoluble in non-polar group, with good
Good oil resistivity, toughness, wearability, resistance to ag(e)ing and cohesive.Adaptation wide temperature range (- 50 can be made with different material
~150 DEG C) material, including adhesive, elastomer, thermoplastic resin and thermosetting resin.
- NCO- (isocyano) ,-NHCOO- (amino containing very highly polar and chemical activity in polyurethane adhesive
Carbamate group), polyurethane adhesive shows the activity and polarity of height, with the base material containing active hydrogen, such as foam, modeling
The porous materials such as material, timber, leather, fabric, paper, ceramics, and any surface finish such as metal, glass, rubber, plastics material
There is excellent chemical adhesive power.Polyurethane adhesive possesses excellent shear strength and impact property, it is adaptable to various
Structural bonding field, and possess excellent flexible nature.Polyurethane adhesive possesses excellent rubber property, adapts to difference
The bonding of thermal coefficient of expansion base material, it is formed between base material with soft-hard transition zone, and not only bonding force is strong, while also having
Excellent buffering, shock-absorbing function.
But the thermal conductivity factor of polyurethane material is generally less than 0.020W/mk (25 DEG C), and heat conductivility is poor, being capable of thermal insulation separation
Heat, therefore polyurethane adhesive is applied in some environment for needing heat conduction as the adhesive layer of heat-conducting glue band, such as electronics device
In part during the connection of electronic building brick, because heat conductivility is bad electronic device will be influenceed to play effective efficiency, or even in electronics
When device works overloadingly, it is possible to because temperature is too high and damages electronic building brick.
In existing production process, some meetings, which are taken, to be had graphite linings in polyurethane adhesive adhesion coating external pasting or directly utilizes stone
Ink is combined with polyurethane adhesive, but thermal conductivity factor improves little, however it remains the problem of thermal diffusivity is bad.
Therefore, thus be badly in need of a kind of high polyurethane adhesive of new thermal conductivity factor is developed to prepare heat-conducting glue band.
The content of the invention
It is an object of the invention to provide a kind of polyurethane adhesive and preparation method thereof, for solving existing polyurethane
Adhesive thermal conductivity factor is low, the technical problem of influence radiating.
To achieve these goals, the present invention provides following technical scheme：A kind of preparation method of polyurethane adhesive, bag
Include following steps：
Step one：10~15 weight of polyester polyalcohols are added in reactor, vacuum dehydration 4~6 hours；
Step 2：1~5 parts by weight silane coupler carries out coupling processing to 5~10 parts by weight graphene oxides, obtains everywhere
Graphene oxide after reason, the graphene oxide after processing and 70~80 parts by weight of composition solvents are added in step one
The reactor, ultrasound 2~8 hours；
Step 3：30~40 parts by weight isocyanates, 1~5 part by weight of catalyst and 4~8 parts by weight chain extenders are added
Enter reactor described in step 2, heat 80~90 DEG C and react 2~7 hours；
Step 4：Polyurethane adhesive is made through 80~90 DEG C of vacuum distillations, cooling discharging in material in step 3 in reactor
Stick.
Preferably, PEPA includes polycarbonate polyol, polycaprolactone polyol, polybutadiene in the step one
One or more combinations in alkene polyalcohol and polysulfide polyalcohol.
Preferably, combination solvent includes the composition of dichloromethane and ethyl ketone in the step 2, wherein dichloromethane and
The mass ratio of ethyl ketone is：4~8:1.
Preferably, isocyanates includes toluene di-isocyanate(TDI) and methyl diphenylene diisocyanate in the step 3
The mass ratio of composition, wherein toluene di-isocyanate(TDI) and methyl diphenylene diisocyanate is：10~15:1.
Preferably, chain extender includes BDO, ethylene glycol, diglycol, ethylenediamine, two in the step 3
One or more combinations in ethylene diamine, triethylene tetramine.
Preferably, catalyst is 2,2- dimorpholine base Anaesthetie Ethers or dibutyltin dilaurate in the step 3.
Further, also to provide a kind of polyurethane prepared according to any of the above-described preparation method gluing by the present invention
Agent.
Further, the present invention also provides a kind of heat-conducting glue band, for the connection between each electronic building brick in electronic device,
Its adhesive linkage for including substrate layer and being stacked at the substrate layer one or both sides, the adhesive linkage is according to above-mentioned polyurethane adhesive
Stick is sprayed at the substrate layer and is made.
Preferably, the substrate layer is polyester film.
Preferably, the heat-conducting glue band also includes mould release membrance, and the adhesive linkage is located in the substrate layer and described release
Between film.
Compared to prior art, polyurethane adhesive of the present invention and preparation method thereof and heat-conducting glue band have with
Lower advantage：
First, the present invention carries out coupling processing, Jin Erjia using silane coupler to the oxidation of precursor graphene of graphene
Enter into the course of reaction of polyurethane adhesive so that graphene can be evenly spread in polyurethane adhesive, effectively improved
The thermal conductivity factor of polyurethane adhesive, improves the heat conductivility of heat-conducting glue band；
2nd, the invention provides mixing isocyanates, the advantage of two kinds of isocyanates can be gathered, diphenyl methane two is different
Cyanate provides rapid curing, and toluene di-isocyanate(TDI) provides high-NCO content, it is possible to increase the property of polyurethane adhesive
Energy.
Embodiment
The invention provides many applicable creative concepts, the creative concept can be reflected in a large number of on specific
Hereinafter.Specific embodiment described in following embodiments of the present invention is only as embodiment of the invention
Exemplary illustration, and be not meant to limit the scope of the invention.
With reference to specific embodiment, the invention will be further described.
Embodiment one
The present embodiment provides a kind of preparation method of polyurethane adhesive, comprises the following steps：
Step one：10 weight of polyester polyalcohols are added in reactor, vacuum dehydration 4 hours；
Wherein, the PEPA is polycarbonate polyol, specifically, be PCDL, a kind of white
Waxy solid, hydroxyl value is 100mgKOH/g, it is possible to provide cohesive force is big, the high performed polymer of adhesive strength.
Step 2：1 parts by weight silane coupler carries out coupling processing to 6 parts by weight graphene oxides, after being handled
Graphene oxide, reactor described in step one is added to by the graphene oxide after processing and 70 parts by weight of composition solvents,
Ultrasound 2.5 hours；
Wherein, the combination solvent includes the quality of the composition, wherein dichloromethane and ethyl ketone of dichloromethane and ethyl ketone
Than for：4:1, the compatibility of each raw material can be improved using combination solvent.
Graphene is the carbonaceous material of single layer of carbon atom bi-dimensional cellular shape structure, can be regarded as structure fullerene, carbon and receives
The basic structural unit of mitron, graphene has high thermal conductivity factor, can reach about 5000W/mk, but graphene is neither close
Water also not oleophylic, therefore the present invention utilizes predecessor graphene oxide progress coupling modifier of the silane coupler to graphene, oxygen
Graphite alkene surface is contained after substantial amounts of hydroxyl, epoxy radicals, carboxyl and carbonyl isoreactivity group, coupling processing, changes oxidation
The surface property of graphene, makes it to be stably dispersed in combination solvent, with good compatibility.
Step 3：30 parts by weight isocyanates, 1 part by weight of catalyst and 4 parts by weight chain extenders are added in step 2
The reactor, heats 80-90 DEG C and reacts 5 hours；
Wherein, the isocyanates includes the composition of toluene di-isocyanate(TDI) and methyl diphenylene diisocyanate, this
Invention provides mixing isocyanates, can gather the advantage of two kinds of isocyanates, methyl diphenylene diisocyanate is provided
Rapid curing, toluene di-isocyanate(TDI) provides high-NCO content, it is possible to increase the performance of polyurethane adhesive.
The mass ratio of wherein toluene di-isocyanate(TDI) and methyl diphenylene diisocyanate is：10:1；The catalyst is
Dibutyltin dilaurate；The chain extender is 1,4- butanediols.
Step 4：Polyurethane adhesive is made through 80~90 DEG C of vacuum distillations, cooling discharging in material in step 3 in reactor
Stick.Product vacuum distillation can remove remnants isocyanates.
Further, the present invention provides polyester film (PET film) as substrate layer, and polyurethane described in step 4 is gluing
Agent is sprayed on the polyester film, is made on adhesive linkage, the adhesive linkage and is covered mould release membrance, heat-conducting glue band is made.Namely
Say, the heat-conducting glue band includes substrate layer, is stacked at the adhesive linkage and mould release membrance of the substrate layer one or both sides, described viscous
Layer is connect to be located between the substrate layer and the mould release membrance.It is one-faced tapes when substrate layer side is provided with adhesive linkage, works as base
Material layer both sides are two-sided tape when being equipped with adhesive linkage.
The PET film transparency is good, glossy；With good air-tightness and fragrance protectiveness；The mechanical performance of PET film is excellent
Good, its obdurability is best in all thermoplastics, and tensile strength and the general film of impact strength ratio are much higher；And very
Power is good, dimensionally stable.PET film also has excellent heat-resisting, cold resistance and good chemical proofing and oil resistivity.
The mould release membrance can be leaching membrane paper, can protect the viscosity of the adhesive linkage, and the mould release membrance high temperature resistant,
Grease proofing protection against the tide, is adapted to use in electronics industry.
The thermal conductivity factor of the polyurethane adhesive and the peel strength of the heat-conducting glue band are detected, specifically, using surely
State method conductometer detects the thermal conductivity factor of polyurethane adhesive, and the peel strength of heat-conducting glue band, knot are determined using 180 ° of stripping methods
Fruit is as shown in table 1.
Thermal conductivity factor refers under the conditions of steady heat transfer, material thick 1m, and the temperature difference of both side surface is 1 degree (K, DEG C), 1
In second, the heat transmitted by 1 square metre of area, unit for watt/ meter Du (W/ (mK)).The relatively low material of thermal conductivity factor
Referred to as (China's national Specification, thermal conductivity factor is not more than 0.12W/ (m to insulation material when all mean temperatures are not higher than 350 DEG C
K material) is referred to as insulation material), and the material thermal conductivity factor in 0.05W/ (m.K) below calls thermal insulation material.
According to national sector standard GB/T 2,792 2014, peel strength refers at an angle with speed by unit width
Adhesive tape peeled off from specific bonding plane required in, unit is N/20mm.Peel strength is big, and viscosity is better.In PET#
Mount, at room temperature, draw speed be 300mm/mi under conditions of do 180 DEG C peel off measurement.
Comparative example
Polyurethane adhesive is prepared according to the step in embodiment one, but is directly added into step 2 identical weight part
Graphene；
Heat-conducting glue band is prepared according to the method in embodiment one, detects the thermal conductivity factor of the polyurethane adhesive and described
The peel strength of heat-conducting glue band, as a result as shown in table 1.
Blank Example
Polyurethane adhesive is prepared according to the step in embodiment one, but graphene is added without in step 2, is only added
The combination solvent of phase homogenous quantities；
Heat-conducting glue band is prepared according to the method in embodiment one, detects the thermal conductivity factor of the polyurethane adhesive and described
The peel strength of heat-conducting glue band, as a result as shown in table 1.
Table 1
| Embodiment | Thermal conductivity factor W/ (mK) | Peel strength N/20mm |
| Embodiment one | 4.0 | 15 |
| Comparative example | 1.0 | 11 |
| Blank Example | 0.02 | 8 |
As it can be seen from table 1 compared to directly addition graphene or without heat-conducting glue band made from graphene, passing through
Heat-conducting glue band made from the method that the present invention is provided, thermal conductivity factor is significantly improved, and peel strength has also been lifted.
Embodiment two
Step one：12 parts by weight polycaprolactone polyols are added in reactor, vacuum dehydration 5 hours.
Step 2：3 parts by weight silane couplers carry out coupling processing to 10 parts by weight graphene oxides, after being handled
Graphene oxide, reactor described in step one is added to by the graphene oxide after processing and 77 parts by weight of composition solvents,
Ultrasound 4 hours；
Wherein, the combination solvent includes the quality of the composition, wherein dichloromethane and ethyl ketone of dichloromethane and ethyl ketone
Than for：6:1.
Step 3：38 parts by weight isocyanates, 3 part by weight of catalyst and 6 parts by weight chain extenders are added in step 2
The reactor, heats 80~90 DEG C and reacts 5 hours；
Wherein, the isocyanates includes the composition of toluene di-isocyanate(TDI) and methyl diphenylene diisocyanate, its
The mass ratio of middle toluene di-isocyanate(TDI) and methyl diphenylene diisocyanate is：12:1；The catalyst is 2,2- dimorpholines
Base Anaesthetie Ether；The chain extender is ethylene glycol.
Step 4：Polyurethane adhesive is made through 80~90 DEG C of vacuum distillations, cooling discharging in material in step 3 in reactor
Stick.
Heat-conducting glue band is prepared according to the method in embodiment one, detects the thermal conductivity factor of the polyurethane adhesive and described
The peel strength of heat-conducting glue band, as a result as shown in table 2.
Embodiment three
Step one：14 parts by weight polycaprolactone polyols are added in reactor, vacuum dehydration 6 hours.
Step 2：5 parts by weight silane couplers carry out coupling processing to 6 parts by weight graphene oxides, after being handled
Graphene oxide, reactor described in step one is added to by the graphene oxide after processing and 80 parts by weight of composition solvents,
Ultrasound 8 hours；
Wherein, the combination solvent includes the quality of the composition, wherein dichloromethane and ethyl ketone of dichloromethane and ethyl ketone
Than for：8:1.
Step 3：38 parts by weight isocyanates, 3 part by weight of catalyst and 6 parts by weight chain extenders are added in step 2
The reactor, heats 80~90 DEG C and reacts 5 hours；
Wherein, the isocyanates includes the composition of toluene di-isocyanate(TDI) and methyl diphenylene diisocyanate, its
The mass ratio of middle toluene di-isocyanate(TDI) and methyl diphenylene diisocyanate is：15:1；The catalyst is 2,2- dimorpholines
Base Anaesthetie Ether；The chain extender is diethylene diamine.
Step 4：Polyurethane adhesive is made through 80~90 DEG C of vacuum distillations, cooling discharging in material in step 3 in reactor
Stick.
Heat-conducting glue band is prepared according to the method in embodiment one, detects the thermal conductivity factor of the polyurethane adhesive and described
The peel strength of heat-conducting glue band, as a result as shown in table 2.
Example IV
Step one：15 parts by weight polycaprolactone polyols are added in reactor, vacuum dehydration 5 hours.
Step 2：3.5 parts by weight silane couplers carry out coupling processing to 6 parts by weight graphene oxides, obtain after processing
Graphene oxide, by the graphene oxide after processing and 72 parts by weight of composition solvents be added to described in step one react
Kettle, ultrasound 4 hours；
Wherein, the combination solvent includes the quality of the composition, wherein dichloromethane and ethyl ketone of dichloromethane and ethyl ketone
Than for：4.5:1.
Step 3：40 parts by weight isocyanates, 5 part by weight of catalyst and 8 parts by weight chain extenders are added in step 2
The reactor, heats 80~90 DEG C and reacts 7 hours；
Wherein, the isocyanates includes the composition of toluene di-isocyanate(TDI) and methyl diphenylene diisocyanate, its
The mass ratio of middle toluene di-isocyanate(TDI) and methyl diphenylene diisocyanate is：12:1；The catalyst is dibutyl tin two
Laurate；The chain extender is diethylene diamine.
Step 4：Polyurethane adhesive is made through 80~90 DEG C of vacuum distillations, cooling discharging in material in step 3 in reactor
Stick.
Heat-conducting glue band is prepared according to the method in embodiment one, detects the thermal conductivity factor of the polyurethane adhesive and described
The peel strength of heat-conducting glue band, as a result as shown in table 2.
Table 2
| Embodiment | Thermal conductivity factor W/ (mK) | Peel strength N/20mm |
| Embodiment one | 4.0 | 15 |
| Embodiment two | 4.5 | 14 |
| Embodiment three | 4.2 | 14 |
| Example IV | 4.7 | 16 |
From table 2 it can be seen that the thermal conductivity factor of polyurethane adhesive is stable at made from the method provided by the present invention
4.0~5.0W/ (mK), the peel strength of heat-conducting glue band is also very stable, illustrates that the polyurethane adhesive has superior glue
Paste performance and heat conductivility.
The present invention also provides a kind of heat-conducting glue band, and it includes substrate layer, located at the viscous of the one or both sides of the substrate layer
Layer and mould release membrance are connect, the adhesive linkage is located between the substrate layer and the mould release membrance.
It should be noted that the present invention will be described rather than limits the invention for above-described embodiment, and this
Art personnel can design alternative embodiment without departing from the scope of the appended claims.In claim
In, any reference symbol between bracket should not be configured to limitations on claims.Word "comprising" is not excluded for depositing
In element or step not listed in the claims.
Claims (10)
1. a kind of preparation method of polyurethane adhesive, it is characterised in that comprise the following steps：
Step one：10~15 weight of polyester polyalcohols are added in reactor, vacuum dehydration 4~6 hours；
Step 2：1~5 parts by weight silane coupler carries out coupling processing to 5~10 parts by weight graphene oxides, obtains after processing
Graphene oxide, the graphene oxide after processing and 70~80 parts by weight of composition solvents are added to described in step one anti-
Answer kettle, ultrasound 2~8 hours；
Step 3：30~40 parts by weight isocyanates, 1~3 part by weight of catalyst and 4~8 parts by weight chain extenders are added and walked
Reactor described in rapid two, is heated to 80~90 DEG C and reacts 2-7 hours；
Step 4：Polyurethane adhesive is made through 80~90 DEG C of vacuum distillations, cooling discharging in material in step 3 in reactor.
2. the preparation method of polyurethane adhesive according to claim 1, it is characterised in that polyester is more in the step one
First alcohol includes one in polycarbonate polyol, polycaprolactone polyol, polybutadiene polyol and polysulfide polyalcohol
Plant or a variety of combinations.
3. the preparation method of polyurethane adhesive according to claim 1, it is characterised in that combine molten in the step 2
Agent includes the composition of dichloromethane and ethyl ketone, and the mass ratio of wherein dichloromethane and ethyl ketone is：4~8:1.
4. the preparation method of polyurethane adhesive according to claim 1, it is characterised in that isocyanic acid in the step 3
Ester includes the composition of toluene di-isocyanate(TDI) and methyl diphenylene diisocyanate, wherein toluene di-isocyanate(TDI) and diphenyl
The mass ratio of methane diisocyanate is：10~15:1.
5. the preparation method of polyurethane adhesive according to claim 1, it is characterised in that chain extender in the step 3
Including one kind in 1,4- butanediols, ethylene glycol, diglycol, ethylenediamine, diethylene diamine and triethylene tetramine or many
The combination planted.
6. the preparation method of polyurethane adhesive according to claim 1, it is characterised in that catalyst in the step 3
For 2,2- dimorpholine base Anaesthetie Ethers or dibutyltin dilaurate.
7. a kind of polyurethane adhesive prepared according to any one of claim 1 to 6 preparation method.
8. a kind of heat-conducting glue band, for the connection between each electronic building brick in electronic device, it is characterised in that it includes substrate layer
And the adhesive linkage of the substrate layer one or both sides is stacked at, the adhesive linkage is as the polyurethane adhesive described in claim 7
The substrate layer is sprayed to be made.
9. heat-conducting glue band according to claim 8, it is characterised in that the substrate layer is polyester film.
10. heat-conducting glue band according to claim 9, it is characterised in that the heat-conducting glue band also includes mould release membrance, described viscous
Layer is connect to be located between the substrate layer and the mould release membrance.
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