CN106978588B - An evaporation cover, an evaporation source, an evaporation device and an evaporation method - Google Patents

Abstract

The embodiment of the present invention provides an evaporation cover, an evaporation source, an evaporation device, and an evaporation method, which relate to the field of vacuum evaporation coating, and can solve the problem that the existing point evaporation source needs to be evaporated on the evaporation substrate to be evaporated during the evaporation process. The problem of uneven thickness of the evaporated film layer at different positions in the area. Includes: Support shaft. The adjustment cover, the side of the adjustment cover is set on the support shaft, the adjustment cover includes a hollow area, the evaporation material in the evaporation state can pass through the hollow area, and the transmittance of the evaporation material on the adjustment cover gradually increases from the center to the edge . Wherein, the supporting shaft is rotatable to drive the adjustment cover to move and cover the outlet of the vapor deposition source. By rotating the support shaft, the position of the adjustment cover fixed on the support shaft through the side is moved, so that the adjustment cover can cover the outlet of the evaporation source, so as to direct the evaporation material evaporated from the outlet of the evaporation source to the substrate to be evaporated. The evaporation rate at each location is adjusted.

Description

An evaporation cover, an evaporation source, an evaporation device and an evaporation method

technical field

The invention relates to the field of vacuum evaporation coating, in particular to an evaporation cover, an evaporation source, an evaporation device and an evaporation method.

Background technique

Vacuum evaporation coating refers to the process of condensing or depositing the material to be filmed on the surface of a low-temperature workpiece or substrate after heating, evaporating or sublimating in a vacuum environment to form a coating. After the material to be filmed is heated, evaporated or sublimated inside the evaporation crucible, it rises and emits through the evaporation hole above the evaporation crucible. The substrate to be evaporated passes through the outlet of the evaporation hole at a uniform speed, and the evaporated material to be filmed leaves the evaporation hole. After the crucible is heated, the temperature is gradually lowered, and the speed of the evaporation movement is also gradually reduced, and finally a film layer is deposited on the surface of the substrate to be evaporated.

The evaporation sources of the evaporation device can be divided into point evaporation sources, line evaporation sources and surface evaporation sources according to the number and arrangement of evaporation holes. The point evaporation source has only one evaporation hole above the evaporation crucible, and the film forming area is a small area centered on the evaporation hole, which is usually applied to the evaporation and film formation of small-sized film layers. The line evaporation source refers to the linear arrangement of multiple evaporation holes above the evaporation crucible. When the substrate to be evaporated is stationary, the area where the film layer is formed on the substrate to be evaporated by the line evaporation source is also a straight line. shape. The surface evaporation source refers to arranging a plurality of evaporation holes on the entire surface above the evaporation crucible, so that the area where the film layer is formed is the entire area corresponding to the entire surface of the evaporation holes.

For the small-generation lines of small and medium-sized organic display devices, point evaporation sources are usually used for evaporation, and the small and medium-sized substrates to be evaporated are rotated at a constant speed during the evaporation process to balance the distance from the point evaporation source and the point evaporation. The difference in evaporation rate at positions near the source improves the uniformity of the evaporation film layer at different positions on the substrate to be evaporated. But this can only balance the uniformity of the film layer in the same circumferential area on the substrate to be evaporated, and the difference in evaporation rate between other different positions cannot be adjusted in balance. There is a problem of poor film thickness uniformity.

Contents of the invention

Embodiments of the present invention provide an evaporation cover, an evaporation source, an evaporation device, and an evaporation method, which can solve the problems of the existing point evaporation sources at different positions of the evaporation area on the evaporation substrate to be evaporated during the evaporation process. The problem of uneven coating thickness.

In order to achieve the above object, embodiments of the present invention adopt the following technical solutions:

An aspect of the embodiments of the present invention provides an evaporation cover, including: a support shaft. The adjustment cover, the side of the adjustment cover is set on the support shaft, the adjustment cover includes a hollow area, the evaporation material in the evaporation state can pass through the hollow area, and the transmission rate of the evaporation material on the adjustment cover gradually increases from the center to the edge . Wherein, the supporting shaft is rotatable to drive the adjustment cover to move and cover the outlet of the vapor deposition source.

Further, the adjustment cover is a cover plate including a plurality of through holes, and the proportion of the area of the through holes per unit area on the cover plate gradually increases from the center to the edge. Among them, the apertures of the multiple through holes are the same, and the distribution density of the through holes per unit area on the cover plate gradually increases from the center to the edge; or, the distribution density of the multiple through holes per unit area on the cover plate is the same, and the multiple through holes The diameter of the through hole gradually increases from the center to the edge.

Further, the evaporation cover in the embodiment of the present invention further includes a shielding cover, the sides of the shielding cover are arranged on the support shaft, and the support shaft is rotatable to drive the shielding cover to move and cover the outlet of the evaporation source.

Preferably, the support shaft includes a main shaft and a first strut and a second strut connected to the main shaft in a plane perpendicular to the axis of the main shaft, the side of the shield cover is connected to the main shaft through the first strut, and the side of the adjustment cover It is connected with the main shaft through the second support rod.

Further, the first support rod can rotate around the circumference of the main shaft.

Further, the second support rod can rotate around the circumference of the main shaft.

Preferably, both the first pole and the second pole are fixedly connected to the main shaft, the main shaft can rotate around its axis, and the angle between the orthographic projection of the first pole and the orthographic projection of the second pole is 30°-120° .

Another aspect of the embodiments of the present invention provides an evaporation source, including any one of the above-mentioned evaporation covers, and also includes an evaporation crucible, an evaporation source outlet is arranged on the evaporation crucible, and the evaporation cover can be rotated so that The shielding cover and/or the adjusting cover cover the outlet of the evaporation source.

Still another aspect of the embodiments of the present invention provides an evaporation device, which includes the above-mentioned evaporation source, and further includes a controller connected to the support shaft to control the rotation of the support shaft.

Still another aspect of the embodiments of the present invention provides an evaporation method, which is applied to the above-mentioned evaporation device, including heating the evaporation crucible to vaporize the evaporation material in the evaporation crucible; controlling the rotation of the support shaft to Driven by the support shaft, the shield cover and/or the adjustment cover move to cover the outlet of the evaporation source. Wherein, the support shaft includes a main shaft and a first strut and a second strut connected to the main shaft in a plane perpendicular to the axis of the main shaft, the side of the shielding cover is connected to the main shaft through the first strut, and the side of the adjustment cover is passed through The second support rod is connected with the main shaft, and controlling the rotation of the support shaft includes: controlling the circumferential rotation of the first support rod around the main shaft, or respectively controlling the circumferential rotation of the first support rod and the second support rod around the main shaft. When both the first support rod and the second support rod are fixedly connected to the main shaft, the main shaft is rotatable, and the angle between the orthographic projections of the first support rod and the second support rod is 30°-120°, controlling the rotation of the support shaft includes: Controls the rotation of the spindle around its axis.

An embodiment of the present invention provides an evaporation cover, an evaporation source, an evaporation device, and an evaporation method, including: a support shaft. The adjustment cover, the side of the adjustment cover is set on the support shaft, the adjustment cover includes a hollow area, the evaporation material in the evaporation state can pass through the hollow area, and the transmission rate of the evaporation material on the adjustment cover gradually increases from the center to the edge . Wherein, the supporting shaft is rotatable to drive the adjustment cover to move and cover the outlet of the vapor deposition source. By rotating the support shaft, the position of the adjustment cover fixed on the support shaft through the side is moved, so that the adjustment cover can cover the outlet of the evaporation source, so as to direct the evaporation material evaporated from the outlet of the evaporation source to the substrate to be evaporated. The evaporation rate at each location is adjusted.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

Fig. 1 is a schematic structural diagram of an evaporation cover provided by an embodiment of the present invention;

Figure 2 is a top view of Figure 1 (excluding the substrate to be evaporated and the evaporation mask);

Fig. 3 is a schematic structural diagram of an evaporation cover provided by an embodiment of the present invention, which also includes a shielding cover;

Fig. 4 is a top view of an adjustment cover in an evaporation cover provided by an embodiment of the present invention;

Fig. 5 is a schematic structural diagram of a first pole and a second pole provided in an evaporation cover provided by an embodiment of the present invention;

Fig. 6 is a schematic structural diagram of a first support rod in an evaporation cover provided by an embodiment of the present invention that can rotate around the main shaft;

Fig. 7 is a structural schematic diagram of a first support rod and a second support rod in an evaporation cover provided by an embodiment of the present invention, which can respectively rotate around the main shaft;

Fig. 8 is a schematic structural diagram of a main shaft in an evaporation hood that can rotate around its axis according to an embodiment of the present invention;

Figure 9a is one of the top views of Figure 8;

Fig. 9b is the second top view of Fig. 8;

Fig. 10 is a schematic structural diagram of an evaporation source provided by an embodiment of the present invention;

FIG. 11 is one of the flowcharts of an evaporation method provided by an embodiment of the present invention;

FIG. 12 is the second flow chart of an evaporation method provided by an embodiment of the present invention;

Fig. 13 is the third flowchart of an evaporation method provided by an embodiment of the present invention;

FIG. 14 is the fourth flowchart of an evaporation method provided by an embodiment of the present invention.

Reference signs:

00-evaporation cover; 01-controller; 10-support shaft; 11-spindle; 12-first support rod; 13-second support rod; 20-regulating cover; 21-cover plate; 30-evaporation crucible; 40-substrate to be evaporated; 50-evaporation mask; 60-shielding mask; A-unit area; A1, A2, A3-enumerate the first, second, third unit area; X-hollow area; a- Evaporation source outlet; b-through hole; c-spindle axis; α-angle between the orthographic projection of the first pole and the orthographic projection of the second pole; Ⅰ, Ⅱ, Ⅲ-evaporation material to the substrate to be evaporated Path arrows deposited at different locations.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

An embodiment of the present invention provides an evaporation cover, as shown in FIG. 1 , including: a support shaft 10 . The adjustment cover 20, the side of the adjustment cover 20 is set on the support shaft 10, the adjustment cover 20 includes a hollow area X, the evaporation material in the evaporation state can pass through the hollow area X, and the transmittance of the evaporation material on the adjustment cover 20 Gradually increases from the center to the edge. Wherein, the supporting shaft 10 is rotatable, so as to drive the adjustment cover 20 to move and cover the outlet a of the evaporation source.

It should be noted that, firstly, as shown in FIG. 1 , the adjustment cover 20 includes at least one hollowed-out area X, and the hollowed-out area X is located above the corresponding outlet a of the evaporation source a of the evaporation crucible 30 . The above refers to the orthographic projection of the hollow area X including the evaporation source outlet a, and the evaporation material evaporated through the evaporation source outlet a will evaporate upwards and then pass through the corresponding positions on the hollow area X and then further evaporate upwards . The evaporation material in the evaporated state is shown by the arrow in Figure 1. After evaporating upward from the evaporation source outlet a of the evaporation crucible 30, by adjusting the hollow area X on the cover 20, it can finally pass through the evaporation mask plate 50 in the area to be evaporated. An evaporation film layer with a specific evaporation pattern is formed on the plating substrate 40 .

Second, the adjustment cover 20 is used to adjust the evaporation rate of the evaporation material evaporated from the evaporation source outlet a of the evaporation crucible 30. Therefore, the penetration of the evaporation material everywhere in the hollow area X on the adjustment cover 20 Rates are not the same. For example, as shown in FIG. 1 , the substrate to be evaporated 40 and the evaporation reticle 50 are located above the outlet a of the evaporation source. As shown by the arrow in Fig. 1 within a certain period of time, the vapor-deposited film layer at the position of the arrow Ⅰ corresponding to the center of the vapor-deposition source outlet a on the substrate 40 to be vapor-deposited is the thickest. Nearly, the vapor-deposited film layer is relatively thick, while the distance from the center of the outlet a of the vapor-deposition source at the position indicated by arrow III is relatively thin, so that the thickness of the vapor-deposited film layer on the substrate 40 to be vapor-deposited is uneven. For making an evaporation film layer on the substrate to be evaporated 40 by a point evaporation source, usually the substrate to be evaporated 40 and the evaporation mask 50 covering one side of the evaporation surface of the substrate to be evaporated 40 are formed during the evaporation process. Driven by the driving device to rotate at a constant speed, to improve the thickness uniformity of the film layer around the vapor deposition film layer made on the substrate 40 to be vapor deposition, so that the substrate 40 to be vapor deposition and the vapor deposition mask plate 50 are centered on the substrate 40 to be vapor deposition. (as shown by the dotted line in FIG. 1, ) is the uniform rotation of the center of rotation. In one rotation period of the substrate to be evaporated 40, the center position of the substrate to be evaporated 40 always maintains the evaporation rate at the position of arrow II to form thicker vapor-deposited film layer, and the same circumferential area at the edge of the substrate 40 to be vapor-deposited passes through the arrow III position and the arrow II position sequentially within one rotation cycle, and the film layer that can be formed is relatively thin, so it is unavoidable , the evaporated film layer formed by the evaporated material in the central area of the substrate 40 to be evaporated will still be thicker than the evaporated film layer formed in the peripheral area of the substrate 40 to be evaporated, and the substrate 40 to be evaporated and the evaporation mask 50 rotate at a constant speed Also, the above-mentioned difference in film thickness cannot be reduced. Therefore, the transmittance of the evaporation material with the adjustment cover 20 gradually increases from the center to the edge, and the evaporation material evaporated from the evaporation source outlet a of the evaporation crucible 30 passes through the hollow area X on the adjustment cover 20 , By adjusting the role of the cover 20 in regulating the transmittance of the vapor deposition material, the difference in the deposition rate of the vapor deposition material between the central region and the peripheral region of the substrate to be vapor deposited 40 is reduced, thereby improving the efficiency of the vapor deposition film layer on the substrate to be vapor deposited 40. Thickness uniformity.

Third, in the evaporation cover of the embodiment of the present invention, there is no specific limitation on the shape of the adjustment cover 20 and the hollow area X on the adjustment cover 20, as long as the adjustment cover 20 can be completely covered after it is installed on the support shaft 10. Above the vapor deposition source outlet a of the vapor deposition crucible 30 may be sufficient. For example, as shown in Figure 2, both the adjustment cover 20 and the hollowed-out area X on the adjustment cover 20 are circular, and one side edge of the circular adjustment cover 20 is fixed on the support shaft 10, so that the hollow area X is completely covered. The position above the vapor deposition source outlet a (shown by the dotted circle in FIG. 2 ) of the vapor deposition crucible 30 .

Fourth, the support shaft 10 is rotatable, and the adjustment cover 20 can be driven by the rotation of the support shaft 10 to rotate in the same horizontal plane with the support shaft 10 as the center, so that when needed, the adjustment cover 20 can be rotated to cover the evaporation The position above the evaporation source outlet a of the crucible 30 , and when not in use, the rotating adjustment cover 20 is away from the position above the evaporation source outlet a of the evaporation crucible 30 .

An embodiment of the present invention provides an evaporation cover, including: a support shaft. The adjustment cover, the side of the adjustment cover is set on the support shaft, the adjustment cover includes a hollow area, the evaporation material in the evaporation state can pass through the hollow area, and the transmission rate of the evaporation material on the adjustment cover gradually increases from the center to the edge . Wherein, the supporting shaft is rotatable to drive the adjustment cover to move and cover the outlet of the vapor deposition source. By rotating the support shaft, the position of the adjustment cover fixed on the support shaft through the side is moved, so that the adjustment cover can cover the outlet of the evaporation source, so as to direct the evaporation material evaporated from the outlet of the evaporation source to the substrate to be evaporated. The evaporation rate at each location is adjusted.

Further, as shown in FIG. 3 , the evaporation cover of the embodiment of the present invention also includes a shielding cover 60 , the side of the shielding cover 60 is set on the support shaft 10 , and the support shaft 10 is rotatable to drive the shielding cover 60 to move and cover the evaporation cover 60 . Plating source outlet a.

Before the evaporation of the film layer on the substrate 40 to be evaporated, or after the evaporation of the substrate 40 to be evaporated, the support shaft 10 is rotated, as shown in FIG. Above, to prevent the vapor deposition material in the vapor deposition crucible 30 from evaporating outward, so that when replacing the substrate 40 to be vapor deposited during the vapor deposition process, only need to rotate the support shaft 10 to move the shield 60 to cover the vapor deposition Above the evaporation source outlet a of the plating crucible 30, close the evaporation source outlet a to prevent the evaporation material from evaporating outward. When the evaporation substrate 40 to be replaced is completed and the evaporation starts, the support shaft 10 is then rotated to move the adjustment cover 20 Covering the evaporation source outlet a of the evaporation crucible 30 , the evaporation rate of the evaporation material evaporated from the evaporation source outlet a deposited on the substrate 40 to be evaporated is adjusted.

It should be noted that the shielding cover 60 is generally a whole metal plate (such as an iron plate). When the metal plate covers the evaporation source outlet a of the evaporation crucible 30, the evaporation material is completely closed and cannot be released by the evaporation source. Evaporate outward at the outlet a. In addition, a grid-shaped metal wire is also provided on the side of the metal sheet close to the evaporation crucible 30, that is, when the metal sheet covers the evaporation source outlet a of the evaporation crucible 30, the evaporation The vapor deposition material blocked on the surface of the metal plate can be absorbed and collected by the metal wire, reducing the possibility of the blocked vapor deposition material falling into the vapor deposition crucible 30 during the process of shielding the vapor deposition source outlet a by the shielding cover 60 .

Further, the adjustment cover 20 is a cover plate 21 including a plurality of through holes b with the same diameter, and the proportion of the area of the through holes b in the unit area A of the cover plate 21 gradually increases from the center to the edge. Wherein, as shown in FIG. 4 , a plurality of through holes b have the same diameter, and the distribution density of the through holes b in the unit area A on the cover plate 21 gradually increases from the center to the edge; or, the plurality of through holes b in the cover plate 21 The distribution density in the upper unit area A is the same, and the apertures of the plurality of through holes b gradually increase from the center to the edge.

For example, as shown in Figure 4, there are a plurality of through-holes b with the same aperture on the cover plate 21 of the adjustment cover 20, and the density of the through-holes b in the unit area A determines the density of the evaporation material in the unit area A. The transmission rate, the greater the density of the through holes b in the unit area A, the greater the transmission rate of the evaporation material in the unit area A, and vice versa, the lower the transmission rate. For example, in the unit areas A1, A2, and A3 arranged from the center to the edge of the cover plate 21, 1, 4, and 9 through holes b are included respectively, so that when the regulating cover 20 covers the evaporation crucible 30 Above the evaporation source outlet a, after the evaporation material evaporated from the evaporation source outlet a passes through the regulating cover 20, the ratio of the material evaporated from the central area to the material evaporated from the edge area is 1:4:9 , by adjusting the distribution density of the through holes b in the unit area A at different positions on the cover plate 21, the change of the evaporation rate of the evaporation material deposited on the substrate 40 to be evaporated through the adjustment cover 20 from the central area to the peripheral area can be adjusted span.

In addition, the distribution density of the plurality of through holes b in the unit area A of the cover plate 21 can also be set to be the same, and the apertures of the plurality of through holes b gradually increase from the center to the edge. The aperture of hole b is smaller, and the aperture of the through hole closer to the edge part is larger. When the adjustment cover 20 covers the evaporation source outlet a of the evaporation crucible 30, the evaporation material evaporated from the evaporation source outlet a After passing through the adjusting cover 20, the material evaporated in the central area is less, and gradually toward the edge area, the material evaporated gradually increases. The variation span of the evaporation rate of the evaporation material deposited on the substrate to be evaporated 40 from the central area to the peripheral area. Alternatively, the above-mentioned adjustment of the distribution density of the through holes b in the unit area A on the cover plate 21 may be combined with the adjustment of the aperture sizes of the multiple through holes b at different positions on the cover plate 21, so as to jointly control the vapor deposition material from the center. The variation span of the evaporation rate from the region to the surrounding region is adjusted.

Preferably, for a plurality of through holes b with the same diameter, and the distribution density of the through holes b in the unit area A on the cover plate 21 gradually increases from the center to the edge, adjust the number of the through holes b in the unit area A on the cover 20 The ratio of the distribution density at the center of the cover plate 21 to the edge is in the range of 7:10-9:10.

In this way, when the point evaporation source is evaporating material on the substrate 40 to be evaporated, due to the difference in the deposition path of the evaporation material to the central area and the peripheral area of the substrate 40 to be evaporated The defect that the deposited film layer in the central area of the substrate 40 is thicker than the deposited film layer in the peripheral area of the substrate 40 to be evaporated is adjusted and compensated, so as to balance the thickness of the deposited film layer in the central area and peripheral area of the substrate 40 to be evaporated. If the ratio range of the distribution density of the through-holes b in the unit area A of the adjustment cover 20 at the center position of the cover plate 21 to the edge position is less than 7:10, it may be due to excessive adjustment compensation, so that a central area is generated on the substrate 40 to be evaporated. The thickness of the deposited film layer is less than the problem of the thickness of the deposited film layer in the peripheral area; if the distribution density of the through holes b in the unit area A on the adjustment cover 20 is greater than 9:10 at the center position of the cover plate 21 and at the edge position, then Possibly due to the weak adjustment and compensation ability, after the adjustment and compensation, the thickness of the deposited film in the central area on the substrate 40 to be evaporated is still greater than the thickness of the deposited film in the peripheral area.

Preferably, as shown in FIG. 5 , the support shaft 10 includes a main shaft 11 and a first strut 12 and a second strut 13 connected to the main shaft 11 in a plane perpendicular to the axis c of the main shaft 11, and the side of the shield 60 passes through The first strut 12 is connected to the main shaft 11 , and the side of the adjustment cover 20 is connected to the main shaft 11 through the second strut 13 .

In this way, the positions of the shade cover 60 and the adjustment cover 20 can be determined by the first pole 12 and the second pole 13, so that when the support shaft 10 rotates to a certain position, the shade cover 60 or the adjustment cover 20 can be fully adjusted. Covering the vapor deposition source outlet a of the evaporation crucible 30, avoiding the part where the side of the shielding cover 60 or the adjusting cover 20 is connected to the supporting shaft 10 when the shielding cover 60 or the adjusting cover 20 is directly fixed on the supporting shaft 10 It cannot be used to cover the problem of evaporation source outlet a.

Further, as shown in FIG. 6 , the first support rod 12 can rotate around the circumference of the main shaft 11 .

As shown in Figure 6, the first pole 12 and the second pole 13 can be arranged in the same vertical plane, wherein the first pole 12 and the shield cover 60 connected with the first pole 12 are located below, and the second The support rod 13 and the adjustment cover 20 connected with the second support rod 13 are located above. When the evaporation operation is not performed, the shield cover 60 covers the evaporation source outlet a of the evaporation crucible 30, and the adjustment cover 20 is located at the top of the shield cover 60. Vertically above, due to the shielding effect of the shielding cover 60 , the evaporation material cannot evaporate outward from the outlet a of the evaporation source. When the evaporation operation needs to be performed on the substrate 40 to be evaporated, the first support rod 12 rotates around the circumference of the main shaft, so that the shield cover 60 is far away from the evaporation source outlet a of the evaporation crucible 30, so that the evaporation material can be Evaporate outward through the evaporation source outlet a, and after the evaporation rate is adjusted by the adjustment cover 2- located above the evaporation source outlet a of the evaporation crucible, it is evenly deposited on the substrate to be evaporated 40 to form an evaporation film layer. After the evaporation of the film layer is completed, the shielding cover 60 can be moved to cover the evaporation source outlet a of the evaporation crucible 30 by rotating the first support rod 12 in the circumferential direction around the main shaft, so that there is no need to move the adjustment cover 20, The closing and opening of the evaporation source outlet a can be realized, and when the evaporation source outlet a is opened, the evaporation material evaporated by the evaporation source outlet a is directed to each position on the substrate 40 to be evaporated by the adjustment cover 20 Adjustment of evaporation rate.

Further, as shown in FIG. 7 , the second support rod 13 can rotate around the circumference of the main shaft 11 .

As shown in Figure 7, the first pole 12 and the second pole 13 can respectively rotate around the circumference of the main shaft 11, so that the shield cover 60 and the adjustment cover 20 pass through the first pole 12 and the second pole respectively. The setting position of the rod 13 on the main shaft 11 is more flexible, it can be set above the outlet a of the evaporation source at the same time, or both can be set above the outlet a of the evaporation source, and the corresponding support rod can be rotated when it needs to be used Move the shielding cover 60 or the adjusting cover 20 above the outlet a of the evaporation source.

Preferably, as shown in FIG. 8 , both the first pole 12 and the second pole 13 are fixedly connected to the main shaft 11 , and the main shaft 11 can rotate around its axis c. As shown in Fig. 9a, the first strut 12 and the second strut 13 are not in the same vertical plane.

In this way, as shown in Figure 9a, both the first strut 12 and the second strut 13 are fixedly connected to the main shaft 11, and the first strut 12 and the second strut 13 are not in the same vertical plane, thereby blocking The projections of the cover 60 and the adjusting cover 20 also do not overlap. The main shaft 11 can rotate around its axis c. By rotating the main shaft 11, the shielding cover 60 or the adjustment cover 20 can be rotated to the top of the evaporation source outlet a covering the evaporation crucible 30. Plating material for blocking or rate regulation.

Preferably, the angle α between the orthographic projection of the first pole 12 and the orthographic projection of the second pole 13 is 30°-120°.

As shown in FIG. 9 a , the angle α between the orthographic projection of the first pole 12 and the orthographic projection of the second pole 13 is about 120°. If the angle α between the orthographic projection of the first strut 12 and the orthographic projection of the second strut 13 is less than 30°, the shield cover 60 fixed on the first strut 12 and the second strut 13 will The overlapping projections between the adjustment covers 20 on the top affect the speed adjustment effect of the adjustment covers 20. In order to prevent the projections between the shielding cover 60 and the adjustment cover 20 from overlapping, it is necessary to extend the length of the first pole 12 and the second pole 13. Thus, on the one hand, the volume of the evaporation cover is increased, and on the other hand, the power consumption of the rotation of the main shaft 11 is also increased; if the angle α between the orthographic projection of the first pole 12 and the orthographic projection of the second pole 13 is greater than 120°, then The replacement time of the shielding cover 60 and the adjustment cover 20 is increased, and the evaporation material is wasted during the replacement process.

Preferably, as shown in FIG. 9 b , the angle α between the orthographic projection of the first strut 12 and the orthographic projection of the second strut 13 is 90°. In this way, on the one hand, without extending the length of the first pole 12 and the second pole 13, it can ensure that the orthographic projections between the shielding cover 60 and the adjustment cover 20 do not overlap, so as to avoid affecting the evaporation of the adjustment cover 20. Plating rate adjustment effect; on the other hand, the distance between the mask 60 and the adjustment cover 20 is not far, and the exchange between the mask 60 and the adjustment cover 20 can be quickly completed during the evaporation process.

Another aspect of the embodiment of the present invention provides an evaporation source, as shown in FIG. 10 , including any one of the above-mentioned evaporation cover 00, and also includes an evaporation crucible 30, and an evaporation source is arranged on the evaporation crucible 30 Outlet a, the evaporation cover 00 can be rotated so that the shielding cover 60 and/or the adjustment cover 20 covers the evaporation source outlet a.

As shown in FIG. 10 , the vapor deposition material is heated in the vapor deposition crucible 30 to an evaporation or sublimation state, and the vapor deposition crucible 30 is provided with an vapor deposition source outlet a, and the evaporated vapor deposition material evaporates outward through the vapor deposition source outlet a, The evaporation cover 00 can rotate and cover the shielding cover 60 and/or the adjustment cover 20 at the position of the evaporation source outlet a, when the shielding cover 60 covers the evaporation source outlet a, or the shielding cover 60 and the adjustment cover 20 When located above the evaporation source outlet a, the evaporation material is blocked and cannot evaporate outward from the evaporation source outlet a; when the regulating cover 20 is located above the evaporation source outlet a, the evaporation crucible 30 passes through the evaporation source outlet a The evaporation material evaporated outward is adjusted by adjusting the speed of the cover 20 , so that an evaporation film layer can be formed on the substrate 40 to be evaporated more uniformly.

Another aspect of the embodiment of the present invention provides an evaporation device, as shown in Figure 10, including the above-mentioned evaporation source, and also includes a controller 01, the controller 01 is connected to the support shaft 10, and controls the rotation of the support shaft 10 .

The rotation of the support shaft 10 is controlled by the controller 01. When the main shaft 11 of the support shaft 10 rotates and the first pole 12 and the second pole 13 are fixedly connected to the main shaft 11, the controller 01 is connected to the main shaft 11, Control the rotation time and direction of rotation of the main shaft 11. When the main shaft 11 of the supporting shaft 10 is fixed, the first pole 12 rotates along the circumference of the main shaft 11, or the first pole 12 and the second pole 13 rotate along the circumference of the main shaft 11 respectively. When rotating in the opposite direction, the controller 01 is connected with the first strut 12 or with the first strut 12 and the second strut 13 respectively, and controls the first strut 12 or respectively controls the first strut 12 and the second strut 13 along the The time and direction of the circumferential rotation of the main shaft 11.

When using the evaporation device of the embodiment of the present invention to evaporate a film layer on the substrate to be evaporated 40, the substrate to be evaporated 40 and the evaporation mask 50 covering the substrate to be evaporated 40 are arranged above the outlet a of the evaporation source , the evaporation material evaporated through the evaporation source outlet a is evaporated upwards and deposited on the evaporation mask 50, at the hollow position on the evaporation mask 50, the evaporation material is deposited on the surface to be evaporated through the evaporation mask 50 On the substrate 40 , after the evaporation is completed, after the evaporation mask 50 is removed, an evaporation film layer matching the pattern on the evaporation mask 50 is formed on the substrate 40 to be evaporated. An evaporation cover 00 is arranged above the outlet a of the evaporation source, and an adjustment cover 20 is arranged on the evaporation cover 00. When the adjustment cover 20 covers the outlet a of the evaporation source, the evaporation material can pass through the hollow area on the adjustment cover 20 X is further evaporated upwards, and at the same time, the transmittance of the evaporation material passing through the hollow area X gradually increases from the center to the edge. The rate of the film is adjusted and compensated, so that the uniformity of the evaporated film layer formed on the substrate to be evaporated 40 is improved, thereby improving the display effect of the manufactured display panel.

In the above description of the evaporation cover and the evaporation source, the structure, working principle and working state of the evaporation device including the above evaporation cover and the evaporation source have been described in detail, and will not be repeated here.

Still another aspect of the embodiments of the present invention provides an evaporation method, which is applied to the above-mentioned evaporation device, as shown in FIG. 11 , including, S101. Heating the evaporation crucible 30 to make the evaporation material Heated gasification. S102 , controlling the rotation of the support shaft 10 so that the shield cover 60 and/or the adjustment cover 20 moves to cover the evaporation source outlet a driven by the support shaft 10 .

It should be noted that, in the vapor deposition method of the embodiment of the present invention, there is no limitation on the order of step S101 and step S102, step S101 can be performed first and then step S102 can be performed, or step S102 can be performed first, and then step S101 can be performed , and, step S102 may be performed once or multiple times according to process requirements. In addition, when the structure of the vapor deposition device is such that only the first pole 12 connected to the shield cover 60 can rotate along the circumference of the main shaft 11, in the initial state of evaporation, the shield cover 60 and the adjustment cover are both located at the outlet a of the vapor deposition source. Corresponding to the upper side, when the film layer evaporation on the substrate 40 to be evaporated is started, step S102 is performed, and the shielding cover 60 is kept away from the outlet a of the evaporation source by rotating the first support rod 12. The adjustment cover connected to the second support rod 13 20 is always located above the outlet a of the vapor deposition source, and there is no need to move it.

For example, when step S101 is performed first, the evaporation crucible 30 is first heated, so that the evaporation material in the evaporation crucible 30 is heated and vaporized, and the vaporized evaporation material evaporates upwards and evaporates outward through the outlet a of the evaporation source. If the shielding cover 60 covers the evaporation source outlet a, the evaporation material is covered in the evaporation crucible 30, and the evaporation mask 50 covering the substrate 40 to be evaporated and the substrate 40 to be evaporated is set at a predetermined position. When the vapor deposition position is at the vapor deposition position, proceed to step S102, control the rotation of the support shaft 10, keep the shielding cover 60 that originally covered the vapor deposition source outlet a away, and rotate the adjustment cover 20 to the top of the vapor deposition source outlet a, at this time through the vapor deposition The material is deposited on the substrate to be evaporated 40 after being adjusted by the adjusting cover 20 to form an evaporated film layer. After the evaporation of the film layer on the substrate 40 to be evaporated is completed, step 102 is performed again, the rotation of the support shaft 10 is controlled, the adjustment cover 20 is kept away from the outlet a of the evaporation source, and the shielding cover 60 is covered on the outlet a of the evaporation source, to stop the evaporation on the substrate 40 to be evaporated.

Further, the support shaft 10 includes a main shaft 11 and a first strut 12 and a second strut 13 connected to the main shaft 11 in a plane perpendicular to the axis c of the main shaft 11, and the side of the shielding cover 60 passes through the first strut 12 and The main shaft 11 is connected, and the side of the adjustment cover 20 is connected with the main shaft 11 through the second support rod 13. As shown in FIG. 12 , controlling the rotation of the support shaft 11 includes: S201. turn. Alternatively, as shown in FIG. 13 , controlling the rotation of the support shaft 11 includes: S201 ′, separately controlling the circumferential rotation of the first support rod 12 and the second support rod 13 around the main shaft 11 .

When the first support rod 12 in the evaporation device can rotate around the main shaft 11, as shown in FIG. In this way, the adjustment cover 20 connected by the second support rod 13 can always be located above the outlet a of the evaporation source, and then the first support rod 12 rotates around the main shaft 11 in the circumferential direction to control the shield cover 60 to block or move away from the evaporation source. Source outlet a. When the shielding cover 60 blocks the evaporation source outlet a, the evaporation material is blocked from evaporating outward. The rate of evaporation everywhere on the plated substrate 40.

When the second pole 13 in the evaporation device can also rotate around the circumference of the main shaft 11, as shown in Figure 13, the rotation of the supporting shaft 11 is controlled as S201', and the first pole 12 and the second pole are respectively controlled 13 rotates around the circumference of the main shaft 11. In this way, the shielding cover 60 connected by the first pole 12 and the adjustment cover 20 connected by the second pole 13 can be located at any position in the circumferential direction of the main shaft 11 in the initial state, and the evaporation source outlet a needs to be blocked. Or when adjusting the evaporation rate of the evaporation material evaporated from the outlet a of the evaporation source, correspondingly control the circumferential rotation of the first pole 12 or the second pole 13 around the main shaft 11, and adjust the shielding cover 60 or the adjustment cover 20 Move to above the vapor deposition source outlet a.

Further, both the first pole 12 and the second pole 13 are fixedly connected to the main shaft 11, the main shaft 11 is rotatable, and the first pole 12 and the second pole 13 are not in the same vertical plane, as shown in FIG. 14 , Controlling the rotation of the support shaft 11 includes: S301, controlling the rotation of the main shaft 11 around its axis c.

When the main shaft 11 rotates to drive the first strut 12 and the second strut 13 fixedly connected to the main shaft 11, as shown in FIG. The included angle between the orthographic projection of the first pole 12 and the orthographic projection of the second pole 13 is set between 30°-120°. In this way, it is necessary to block the evaporation source outlet a or adjust the outlet a of the evaporation source a. When the evaporation rate of the evaporation material evaporates outward, it is sufficient to control the rotation of the main shaft 11 around its axis c so that the shield cover 60 or the adjustment cover 20 moves above the outlet a of the evaporation source.

The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.

Claims (9)

1. a kind of vapor deposition cover characterized by comprising

Support shaft；

Cover is adjusted, adjusting cover side is arranged in the support shaft, includes hollowed out area on the adjusting cover, evaporates shape The evaporation material of state can pass through the hollowed out area, and the evaporation material transmitance adjusted on cover gradually increases from center to edge Greatly；

Wherein, the support shaft can be rotated, to drive the adjusting cover is mobile to be covered in evaporation source outlet；

It is described to adjust cover as the cover board that includes multiple through-holes, on the cover board ratio shared by unit area inner via hole area by Center is gradually increased to edge；

Wherein, the multiple through-hole aperture is identical, and on the cover board unit area inner via hole distribution density from center to side Edge is gradually increased；Alternatively, distribution density of the multiple through-hole on the cover board in unit area is identical, and the multiple logical The aperture in hole is gradually increased from center to edge.

2. vapor deposition cover according to claim 1, which is characterized in that further include hood for protecting rider, the hood for protecting rider side setting exists In the support shaft, the support shaft be can be rotated, to drive the hood for protecting rider is mobile to be covered in evaporation source outlet.

3. vapor deposition according to claim 2 cover, which is characterized in that the support shaft includes main shaft and in the spindle shaft The first strut and the second strut being connected in the vertical plane of line with the main shaft, the side of the hood for protecting rider pass through described the One strut is connected with the main shaft, and the side for adjusting cover is connected by second strut with the main shaft.

4. vapor deposition cover according to claim 3, which is characterized in that first strut can turn around the circumferential direction of the main shaft It is dynamic.

5. vapor deposition cover according to claim 4, which is characterized in that first strut and second strut can be around institutes State circumferentially rotating for main shaft.

6. vapor deposition according to claim 3 cover, which is characterized in that first strut and second strut with it is described Main shaft is fixedly connected, and the main shaft can be rotatable around its axis；

Angle is 30 ° -120 ° between first strut and the orthographic projection of second strut.

7. a kind of evaporation source, which is characterized in that covered including vapor deposition as claimed in any one of claims 1 to 6, further include vapor deposition earthenware Crucible, is provided with evaporation source outlet on the vapor deposition crucible, and the vapor deposition cover can be rotated and make hood for protecting rider and/or adjust cover to cover It is exported in the evaporation source.

8. a kind of evaporation coating device, which is characterized in that it further include controller including evaporation source as claimed in claim 7, the control Device and the support axis connection, control the rotation of the support shaft.

9. a kind of evaporation coating method is applied to evaporation coating device according to any one of claims 8, which is characterized in that including,

Heating vapor deposition crucible makes the evaporation material in the vapor deposition crucible by thermal evaporation；

Support shaft rotation is controlled, so that hood for protecting rider and/or adjusting, which cover on movement under the drive of the support shaft, is covered in vapor deposition Source outlet；

Wherein, support shaft includes main shaft and be connected in the vertical plane of the main-shaft axis with the main shaft first The side of bar and the second strut, hood for protecting rider is connected by first strut with the main shaft, and the side for adjusting cover passes through institute It states the second strut to be connected with the main shaft, the control support shaft rotation includes:

The first strut circumferentially rotating around the main shaft is controlled, alternatively, controlling first strut and described second respectively Strut is circumferentially rotated around the main shaft；

First strut and second strut are fixedly connected with the main shaft, and the main shaft can be rotated, and described first Angle is 30 ° -120 ° between strut and the orthographic projection of second strut, and the control support shaft rotation includes:

It is rotatable around its axis to control the main shaft.