CN107201190A - A kind of electronics paster packaging film material and preparation method thereof, application - Google Patents
A kind of electronics paster packaging film material and preparation method thereof, application Download PDFInfo
- Publication number
- CN107201190A CN107201190A CN201710568717.XA CN201710568717A CN107201190A CN 107201190 A CN107201190 A CN 107201190A CN 201710568717 A CN201710568717 A CN 201710568717A CN 107201190 A CN107201190 A CN 107201190A
- Authority
- CN
- China
- Prior art keywords
- glue
- resin
- line
- hexamethylene
- polyurethane resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
- C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2423/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2423/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2423/10—Homopolymers or copolymers of propene
- C08J2423/12—Polypropene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2453/00—Presence of block copolymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to a kind of electronics paster packaging film material and preparation method thereof, application.The electronics paster packaging film material, successively including pet layer, polyolefin layer, the first glue-line, the second glue-line；The polyolefin layer is selected from：Any one or a few mixing in polyethylene, polypropylene, polybutene；First glue-line at least includes：SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent, hexamethylene；Weight ratio between the SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent, hexamethylene is：5：1：2：0.5：0.1：8；Second glue-line at least includes：Polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder；Weight ratio between the polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder is：3：1：1：5：1.
Description
Technical field
The present invention relates to electronic device material packaging field, more particularly to a kind of patch electronics product thinner package membrane material
Material and preparation method thereof, application.
Background technology
The encapsulation braid of electronic device delivery conveying (electronics zero, component transporting body) is by automatic taping-machine etc., by electricity
Sub- spare part is inserted in the groove on the carrier band coordinated with original paper, one layer of plastic thickness is covered above carrier band micro- in 50-65
A kind of tearability upper capping film of rice, allows a kind of Tearable cover tape with carrier band sealing one by the hot knife on automatic taping-machine
Tool sealing is played, electronic device is lain in carrier band groove, is unlikely to come off, while must being fulfilled for being placed in carrier band groove
In the epiphragma that can not above be covered with it of electronic device produce property, when SMT pasters processs, guarantee will not be by when peeling off epiphragma
Electronic device is sticked up in the lump, and is rolled into plate-like and is transported.What this technology was typically carried out using full-automatic braider.Using
, it is necessary to which the electronic components of strip disc dress will be rolled into during electronic components, by SMT post-chips machine by the tearability lid of one kind
The automatic stripping of band, then the electronic components being placed in inside the groove of carrier band are taken out with robotic arm, installed on circuit boards,
This automated installation of system turns into the main trend of this industry.
Thus, miniaturization, automation trend with electronic product, the standard encapsulated to product packaging of electronic device
Change and propose requirements at the higher level；The improvement by technique is now needed, to develop a viscosity and the highly stable encapsulation of peeling force
Product, with the reliability realized security of the electronic device in packed and transported and used.
The content of the invention
In order to solve the above-mentioned technical problem, the first aspect of the invention provides a kind of electronics paster thinner package membrane material
Material, successively including pet layer, polyolefin layer, the first glue-line, the second glue-line；
The polyolefin layer is selected from：Any one or a few mixing in polyethylene, polypropylene, polybutene；
First glue-line at least includes：SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent,
Hexamethylene；Weight ratio between the SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent, hexamethylene
For：5：1：2：0.5：0.1：8；
Second glue-line at least includes：Polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder；It is described
Weight ratio between polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder is：3：1：1：5：1.
As a kind of preferred technical scheme of the present invention, the electronics paster packaging film material, successively including pet layer,
Polyolefin layer, the first glue-line, the second glue-line；
The polyolefin layer is polypropylene layer；
First glue-line at least includes：SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent,
Hexamethylene；Weight ratio between the SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent, hexamethylene
For：5：1：2：0.5：0.1：8；
Second glue-line at least includes：Polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder；It is described
Weight ratio between polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder is：3：1：1：5：1.
As a kind of preferred technical scheme of the present invention, the SEBS is acrylic acid-grafted SEBS resins.
As a kind of preferred technical scheme of the present invention, the polypropylene is maleic anhydride modified polypropylene.
As a kind of preferred technical scheme of the present invention, also include lignosulfonate in first glue-line.
As a kind of preferred technical scheme of the present invention, the silane coupler is selected from：3- glycidoxypropyls three
Methoxy silane, 3- glycidoxypropyls triethoxysilane, 3- glycidoxypropyls diethoxy silane,
3- glycidoxypropyls dimethoxysilane, 2- (3,4- expoxycyclohexyls) ethyl trimethoxy silane, 2- (3,
4- expoxycyclohexyls) ethyl triethoxysilane, 3-mercaptopropyi trimethoxy silane, 3- mercaptopropyi triethoxysilicanes
Any one or a few mixing in alkane, 3- mercaptopropyi dimethoxymethylsilanes.
As a kind of preferred technical scheme of the present invention, the diluent is selected from：1,6- hexanediyl ester, three hydroxyls
Propane tri, trimethylol-propane trimethacrylate, polyethyleneglycol diacrylate, isobomyl acrylate
Ester, lauryl methacrylate, tetrahydrofuran acrylate, THFMA, ethoxylation trihydroxy methyl third
Alkane triacrylate, BDO diacrylate, cyclohexyl methacrylate, TEGDMA, first
Any one or a few mixing in base octadecyl acrylate.
As a kind of preferred technical scheme of the present invention, the polyurethane resin is polyurethane resin and end carboxyl super branched
The mixing of polyester resin；Wherein, the weight ratio of polyurethane resin and end carboxyl super branched polyester resin is 100：1.
As a kind of preferred technical scheme of the present invention, in second glue-line, in addition to graphene/chitosan be combined it is micro-
Capsule.
The second aspect of the invention provides the preparation method of electronics paster packaging film material, at least including following step
Suddenly：
(1) PET, polyolefin are provided；
(2) the first glue-line is prepared：Weigh the SEBS of corresponding parts by weight, it is polyurethane resin, terpene phenolic resin, silane coupled
Agent, diluent, hexamethylene, SEBS, polyurethane resin, terpene phenolic resin are added in hexamethylene, temperature is increased into 60
DEG C, after stirring and dissolving, silane coupler, diluent are added, continues to stir 2~5h, is cooled to room temperature, obtains the first glue-line；
(3) the second glue-line is prepared：Weigh polyurethane resin, chlorinated polypropylene, rosin resin, the hexamethylene of corresponding parts by weight
Alkane, wax powder, polyurethane resin, chlorinated polypropylene, rosin resin are added in hexamethylene, and temperature is increased into 80 DEG C, stirring
After dissolving, wax powder is added, continues to stir, is cooled to room temperature, the second glue-line is obtained；
(4) laminating process：Polyolefin layer is coated on pet layer, the first glue-line, are then respectively coated on polyolefin layer
Electronics paster packaging film material is obtained after two glue-lines, drying.
The third aspect of the invention provides application of the electronics paster packaging film material in packaging field.
The above-mentioned of the application and other features, aspect and advantage is more readily understood with reference to described further below.
Embodiment
The participation in the election detailed description of the invention below for being preferable to carry out method and including embodiment this hair can be more easily understood
Bright content.Unless otherwise defined, all technologies used herein and scientific terminology have common with art of the present invention
The identical implication that technical staff is generally understood that.When there is contradiction, the definition in this specification is defined.
As used herein term " by ... prepare " it is synonymous with "comprising".Term "comprising" used herein, " comprising ",
" having ", " containing " or its any other deformation, it is intended that cover including for non-exclusionism.For example, the combination comprising listed elements
Thing, step, method, product or device are not necessarily limited to those key elements, but can include not expressly listed other key elements or
Such a composition, step, method, product or the intrinsic key element of device.
Conjunction " Consists of " excludes any key element do not pointed out, step or component.If be used in claim, this
Phrase will make claim be closed, it is not included the material in addition to materials of those descriptions, but relative normal
Except rule impurity.When being rather than immediately following in the clause that phrase " Consists of " appears in claim main body after theme,
It is only limited to the key element described in the clause；Other key elements are not excluded outside as the overall claim.
Equivalent, concentration or other values or parameter are excellent with scope, preferred scope or a series of upper limit preferred values and lower limit
During the Range Representation that choosing value is limited, this, which is appreciated that, specifically discloses by any range limit or preferred value and any scope
All scopes that any pairing of lower limit or preferred value is formed, regardless of whether whether the scope separately discloses.For example, when open
During scope " 1 to 5 ", described scope should be interpreted as including scope " 1 to 4 ", " 1 to 3 ", " 1 to 2 ", " 1 to 2 and 4 to
5 ", " 1 to 3 and 5 " etc..When number range is described herein, unless otherwise indicated, otherwise the scope is intended to include its end
Value and all integers and fraction within the range.
Singulative includes plural number and object is discussed, unless the context clearly dictates otherwise." optional " or it is " any
It is a kind of " refer to that the item or event that describe thereafter may or may not occur, and the description include situation that event occurs and
The situation that event does not occur.
Approximate term in specification and claims is used for modifying quantity, represents that the present invention is not limited to this specific
Quantity, includes the part of the amendment of the acceptable change without cause related basic function close to the quantity.Phase
Answer, modify a numerical value with " about ", " about " etc., mean that the invention is not restricted to the exact numerical.In some examples, approximately
Term likely corresponds to the precision of the instrument of measured value.In present specification and claims, scope is limited can be with
Combine and/or exchange, these scopes include all subranges contained therebetween if not stated otherwise.
In addition, the indefinite article " one kind " and " one " before key element of the present invention or component are to key element or the quantitative requirement of component
(i.e. occurrence number) unrestriction.Therefore " one " or " one kind " should be read as including one or at least one, and odd number
The key element or component of form also include plural form, unless the obvious purport of the quantity refers to singulative.
" polymer " means by the polymerizable compound prepared by the monomer that polymerize identical or different type.Generic term
" polymer " includes term " homopolymer ", " copolymer ", " terpolymer " and " EVA ".
" EVA " means by polymerizeing polymer prepared by least two different monomers.Generic term " EVA " includes
(its is general with term " terpolymer " for term " copolymer " (it is typically to refer to the polymer prepared by two kinds of different monomers)
To refer to the polymer prepared by three kinds of different monomers).It also includes the polymerization planted monomer by polymerization four or more and manufactured
Thing." blend " means two or more polymer by polymerizeing formed by physics or chemistry method jointly mixing
Thing.
Term " band " refers to relatively long, the relatively thin construction of banding.
As used herein, term " can be torn with hand " refers to that tear strength is 65 newton (N) or smaller material.
In order to solve the above-mentioned technical problem, the first aspect of the invention provides a kind of electronics paster thinner package membrane material
Material, successively including pet layer, polyolefin layer, the first glue-line, the second glue-line；
The polyolefin layer is selected from：Any one or a few mixing in polyethylene, polypropylene, polybutene；
First glue-line at least includes：SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent,
Hexamethylene；Weight ratio between the SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent, hexamethylene
For：5：1：2：0.5：0.1：8；
Second glue-line at least includes：Polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder；It is described
Weight ratio between polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder is：3：1：1：5：1.
As a kind of preferred technical scheme of the present invention, the electronics paster packaging film material, successively including pet layer,
Polyolefin layer, the first glue-line, the second glue-line；
The polyolefin layer is polypropylene layer；
First glue-line at least includes：SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent,
Hexamethylene；Weight ratio between the SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent, hexamethylene
For：5：1：2：0.5：0.1：8；
Second glue-line at least includes：Polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder；It is described
Weight ratio between polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder is：3：1：1：5：1.
Pet layer
In the application, the PET refers to polyethylene terephthalate, predominantly commercially available to obtain.
Polyolefin layer
In the application, the polyolefin layer is selected from：Any one or a few mixed in polyethylene, polypropylene, polybutene
Close.
As a kind of preferred technical scheme of the present invention, the polypropylene is maleic anhydride modified polypropylene.
In the application, the maleic anhydride modified polypropylene obtains to be commercially available, is purchased from the modest limited public affairs of three chemical science and technology in Guangzhou
Department.
First glue-line
In the application, first glue-line at least includes：It is SEBS, polyurethane resin, terpene phenolic resin, silane coupled
Agent, diluent, hexamethylene；The SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent, hexamethylene it
Between weight ratio be：5：1：2：0.5：0.1：8.
In one embodiment, the preparation method of first glue-line is：Weigh SEBS, the polyurethane of corresponding parts by weight
Resin, terpene phenolic resin, silane coupler, diluent, hexamethylene, SEBS, polyurethane resin, terpene phenolic resin are added
Into hexamethylene, temperature is increased to 60 DEG C, after stirring and dissolving, silane coupler, diluent is added, continues to stir 2~5h,
Room temperature is cooled to, the first glue-line is obtained.
SEBS
In the application, the SEBS refers to styrene-butadiene-styrene.
As a kind of preferred technical scheme of the present invention, the SEBS is acrylic acid-grafted SEBS resins.
In a preferred embodiment, the SEBS is as follows for the preparation method of acrylic acid-grafted SEBS resins：
In the three neck round bottom flask with agitator, condenser pipe and nitrogen access tube, 10.0g SEBS and 80mL are added
After toluene, fully dissolving, the acrylic acid and 0.5g BPO for adding 5.0g react 6h at 90 DEG C, and reactant mixture is injected into a large amount of
In the boiling distillated water being stirred vigorously, filtering precipitates to obtain crude product.By crude product be twisted into after slice distilled water boil twice, with
Remove part homo-polypropylene acid.Then crude product is extracted to constant, reaction product vacuum in Soxhlet extraction device with distilled water
Dry to constant, obtain acrylic acid-grafted SEBS resins.
In the application, the polyurethane resin obtains to be commercially available, is purchased from Qingdao Ju Bang new materials Co., Ltd.
In the application, the terpene phenolic resin uses the terpene phenolic resin that the trade mark is 803L.
In the application, the silane coupler is not particularly limited.
In a preferred embodiment, the silane coupler is epoxy silane coupling, hydrosulphonyl silane coupling
Any one or a few mixing in agent.
The epoxy silane coupling, what can be enumerated has：3- glycidoxypropyltrimewasxysilanes, 3- contractings
Water glycerine epoxide propyl-triethoxysilicane, 3- glycidoxypropyls diethoxy silane, 3- glycidoxypropyls
Hydroxypropyl methyl dimethoxysilane, 2- (3,4- expoxycyclohexyls) ethyl trimethoxy silane, 2- (3,4- epoxycyclohexyethylSiOis
Base) ethyl triethoxysilane etc..
The mercaptosilane coupling agents, what can be enumerated has：3-mercaptopropyi trimethoxy silane, the second of 3- mercaptopropyis three
TMOS, 3- mercaptopropyi dimethoxymethylsilanes.
In the application, what the diluent can be enumerated has：1,6- hexanediyl ester, trimethylolpropane tris third
Olefin(e) acid ester, trimethylol-propane trimethacrylate, polyethyleneglycol diacrylate, isobornyl acrylate, metering system
Sour lauryl, tetrahydrofuran acrylate, THFMA, the acrylic acid of ethoxylated trimethylolpropane three
Ester, BDO diacrylate, cyclohexyl methacrylate, TEGDMA, methacrylic acid ten
Octaester etc..
In a preferred embodiment, the diluent is selected from：1,6- hexanediyl ester, trihydroxy methyl third
Alkane triacrylate, trimethylol-propane trimethacrylate, polyethyleneglycol diacrylate, isobornyl acrylate, first
Base lauryl acrylate, tetrahydrofuran acrylate, THFMA, ethoxylated trimethylolpropane 3 third
Olefin(e) acid ester, BDO diacrylate, cyclohexyl methacrylate, TEGDMA, metering system
Any one or a few mixing in sour octadecyl ester.
As a kind of preferred technical scheme of the present invention, in first glue-line, in addition to lignosulfonate.
Second glue-line
In the application, second glue-line at least includes：Polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene,
Wax powder；Weight ratio between the polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder is：3：1：1：5：1.
In the application, the polyurethane resin obtains to be commercially available, is purchased from Qingdao Ju Bang new materials Co., Ltd.
As a kind of preferred technical scheme of the present invention, the polyurethane resin is polyurethane resin and end carboxyl super branched
The mixing of polyester resin；Wherein, the weight ratio of polyurethane resin and end carboxyl super branched polyester resin is 100：1.
Wherein, the end carboxyl super branched polyester resin is purchased from Wuhan hyperbranched resin Co., Ltd.
The chlorinated polypropylene is the PP803MWS chlorinated polypropylenes that Nippon Paper is produced.
The wax powder is polyethylene glycol wax powder, is purchased from Du Dao joints Chemical Co., Ltd..
In one embodiment, the preparation method of second glue-line is：
The polyurethane resins of corresponding parts by weight, chlorinated polypropylene, rosin resin, hexamethylene, wax powder are weighed, by polyurethane tree
Fat, chlorinated polypropylene, rosin resin are added in hexamethylene, and temperature is increased into 80 DEG C, after stirring and dissolving, wax powder is added,
Continue to stir, be cooled to room temperature, obtain the second glue-line.
As a kind of preferred technical scheme of the present invention, in second glue-line, in addition to graphene/chitosan be combined it is micro-
Capsule.
In the application, the same Application No. of synthesis preparation method of the graphene/chitosan composite micro-capsule
CN201510124373.4, specific preparation process is as follows：
(1) in the acetum for adding chitosan into 0.2mol/L, 2h is stirred at room temperature, is gathered with fully dissolving shell
1h is stood after sugar, stirring, to eliminate the bubble in solution, chitosan solution concentration is obtained for 2wt%；
(2) 100mg graphene oxides ultrasonic disperse is weighed in 30mL 0.05mol/L NaOH solutions, is then added to
In the 100mL 5mg/mL2- HACC aqueous solution, reaction 2h is stirred at room temperature, then uses what is configured
0.1mol/LNaOH solution adjusts above-mentioned mixed solution pH value to after 10, adds the hydrazine hydrate that 0.4g mass concentrations are 85%, room
Temperature reaction 20min, 2h is reacted under the conditions of at the uniform velocity stirring and temperature is 80 DEG C；Reaction solution is finally passed through into the mixed of 0.22 μm of aperture
Condensating fiber element ester filter membrane is filtered by vacuum, and, by gained filter cake in 50 DEG C of dry 36h, obtains with deionized water cyclic washing repeatedly
The graphene modified to chitosan quaternary ammonium salt.
(3) graphene dispersion for modifying 10mg chitosan quaternary ammonium salts obtains chitosan quaternary ammonium salt modification in 50mL water
Graphene dispersing solution, the graphene dispersing solution for then modifying chitosan quaternary ammonium salt and chitosan solution are by 1：15 volume ratio
Mixing, ultrasonic oscillation makes it be uniformly dispersed, obtains mixed dispersion liquid；
(4) mixed dispersion liquid is drawn into disposable syringe as interior phase solution, passes through LP215 type micro-injection pumps
Control is passed into the circular capillaries of micro fluidic device, and inert gas is passed into circular and square capillary as external fluid phase
Gap in, micro fluidic device is disposed vertically, due to the effect of gas-liquid shearing force, and chitosan solution exports to form single point in device
Scattered chitosan/graphene mixing microlayer model, and be added dropwise in the sodium dodecyl sulfate solution being placed on immediately below it, obtain
Graphene/chitosan composite micro-capsule；Wherein, interior phase solution flow rate is 3mL/h, and the flow velocity of gas is in 1.0L/min.
The second aspect of the invention provides the preparation method of electronics paster packaging film material, at least including following step
Suddenly：
(1) PET, polyolefin are provided；
(2) the first glue-line is prepared：Weigh the SEBS of corresponding parts by weight, it is polyurethane resin, terpene phenolic resin, silane coupled
Agent, diluent, hexamethylene, SEBS, polyurethane resin, terpene phenolic resin are added in hexamethylene, temperature is increased into 60
DEG C, after stirring and dissolving, silane coupler, diluent are added, continues to stir 2~5h, is cooled to room temperature, obtains the first glue-line；
(3) the second glue-line is prepared：Weigh polyurethane resin, chlorinated polypropylene, rosin resin, the hexamethylene of corresponding parts by weight
Alkane, wax powder, polyurethane resin, chlorinated polypropylene, rosin resin are added in hexamethylene, and temperature is increased into 80 DEG C, stirring
After dissolving, wax powder is added, continues to stir, is cooled to room temperature, the second glue-line is obtained；
(4) laminating process：Polyolefin layer is coated on pet layer, the first glue-line, are then respectively coated on polyolefin layer
Electronics paster packaging film material is obtained after two glue-lines, drying.
The third aspect of the invention provides application of the electronics paster packaging film material in packaging field.
The present invention is specifically described below by embodiment.It is necessarily pointed out that, following examples are only used
In the invention will be further described, it is impossible to be interpreted as limiting the scope of the invention, professional and technical personnel in the field
Some the nonessential modifications and adaptations made according to the content of the invention described above, still fall within protection scope of the present invention.
In addition, if without other explanations, it is raw materials used be all it is commercially available, be purchased from traditional Chinese medicines chemical reagent.
Embodiment 1：
Embodiments of the invention 1 provide a kind of electronics paster packaging film material, successively including pet layer, polyolefin layer,
First glue-line, the second glue-line；
The polyolefin layer is selected from：Polypropylene；
First glue-line at least includes：SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent,
Hexamethylene；Weight ratio between the SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent, hexamethylene
For：5：1：2：0.5：0.1：8；
The SEBS, the trade mark is C-5001, is purchased from the special polymer Co., Ltd of Ningbo ALLRED；
The polyurethane resin is purchased from Qingdao Ju Bang new materials Co., Ltd；
The terpene phenolic resin is 803L terpene phenolic resin；
The silane coupler is 3-mercaptopropyi trimethoxy silane；
The diluent is 1,6- hexanediyl esters；
Second glue-line at least includes：Polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder；It is described
Weight ratio between polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder is：3：1：1：5：1.
The polyurethane resin is purchased from Qingdao Ju Bang new materials Co., Ltd；
The chlorinated polypropylene is the PP803MWS chlorinated polypropylenes that Nippon Paper is produced.
The rosin resin is purchased from Shanghai three and connects Industrial Co., Ltd., and product grade is TF-100.
The wax powder is polyethylene glycol wax powder, is purchased from Du Dao joints Chemical Co., Ltd..
The preparation method of second glue-line is：
The polyurethane resins of corresponding parts by weight, chlorinated polypropylene, rosin resin, hexamethylene, wax powder are weighed, by polyurethane tree
Fat, chlorinated polypropylene, rosin resin are added in hexamethylene, and temperature is increased into 80 DEG C, after stirring and dissolving, wax powder is added,
Continue to stir, be cooled to room temperature, obtain the second glue-line.
The preparation method of electronics paster packaging film material, at least comprises the following steps：
(1) PET, polyolefin are provided；
(2) the first glue-line is prepared；
(3) the second glue-line is prepared；
(4) laminating process：Polyolefin layer is coated on pet layer, the first glue-line, are then respectively coated on polyolefin layer
Electronics paster packaging film material is obtained after two glue-lines, drying.
Embodiment 2：
Embodiments of the invention 2 provide a kind of electronics paster packaging film material, successively including pet layer, polyolefin layer,
First glue-line, the second glue-line；
The polyolefin layer is selected from：Polypropylene；
First glue-line at least includes：SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent,
Hexamethylene；Weight ratio between the SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent, hexamethylene
For：5：1：2：0.5：0.1：8；
The SEBS is acrylic acid-grafted SEBS resins；
The preparation method of the acrylic acid-grafted SEBS resins is：
In the three neck round bottom flask with agitator, condenser pipe and nitrogen access tube, 10.0g SEBS and 80mL are added
After toluene, fully dissolving, the acrylic acid and 0.5g BPO for adding 5.0g react 6h at 90 DEG C, and reactant mixture is injected into a large amount of
In the boiling distillated water being stirred vigorously, filtering precipitates to obtain crude product.By crude product be twisted into after slice distilled water boil twice, with
Remove part homo-polypropylene acid.Then crude product is extracted to constant, reaction product vacuum in Soxhlet extraction device with distilled water
Dry to constant, obtain acrylic acid-grafted SEBS resins.
The polyurethane resin is purchased from Qingdao Ju Bang new materials Co., Ltd；
The terpene phenolic resin is 803L terpene phenolic resin；
The silane coupler is 3-mercaptopropyi trimethoxy silane；
The diluent is 1,6- hexanediyl esters；
Second glue-line at least includes：Polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder；It is described
Weight ratio between polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder is：3：1：1：5：1.
The polyurethane resin is purchased from Qingdao Ju Bang new materials Co., Ltd；
The chlorinated polypropylene is the PP803MWS chlorinated polypropylenes that Nippon Paper is produced.
The rosin resin is purchased from Shanghai three and connects Industrial Co., Ltd., and product grade is TF-100.
The wax powder is polyethylene glycol wax powder, is purchased from Du Dao joints Chemical Co., Ltd..
The preparation method of second glue-line is：
The polyurethane resins of corresponding parts by weight, chlorinated polypropylene, rosin resin, hexamethylene, wax powder are weighed, by polyurethane tree
Fat, chlorinated polypropylene, rosin resin are added in hexamethylene, and temperature is increased into 80 DEG C, after stirring and dissolving, wax powder is added,
Continue to stir, be cooled to room temperature, obtain the second glue-line.
The preparation method of electronics paster packaging film material, at least comprises the following steps：
(1) PET, polyolefin are provided；
(2) the first glue-line is prepared；
(3) the second glue-line is prepared；
(4) laminating process：Polyolefin layer is coated on pet layer, the first glue-line, are then respectively coated on polyolefin layer
Electronics paster packaging film material is obtained after two glue-lines, drying.
Embodiment 3：
Embodiments of the invention 3 provide a kind of electronics paster packaging film material, successively including pet layer, polyolefin layer,
First glue-line, the second glue-line；
The polyolefin layer is selected from：Maleic anhydride modified polypropylene；
The maleic anhydride modified polypropylene is purchased from modest three Chemical Industry Science Co., Ltd in Guangzhou.
First glue-line at least includes：SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent,
Hexamethylene；Weight ratio between the SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent, hexamethylene
For：5：1：2：0.5：0.1：8；
The SEBS is acrylic acid-grafted SEBS resins；
The preparation method of the acrylic acid-grafted SEBS resins is：
In the three neck round bottom flask with agitator, condenser pipe and nitrogen access tube, 10.0g SEBS and 80mL are added
After toluene, fully dissolving, the acrylic acid and 0.5g BPO for adding 5.0g react 6h at 90 DEG C, and reactant mixture is injected into a large amount of
In the boiling distillated water being stirred vigorously, filtering precipitates to obtain crude product.By crude product be twisted into after slice distilled water boil twice, with
Remove part homo-polypropylene acid.Then crude product is extracted to constant, reaction product vacuum in Soxhlet extraction device with distilled water
Dry to constant, obtain acrylic acid-grafted SEBS resins.
The polyurethane resin is purchased from Qingdao Ju Bang new materials Co., Ltd；
The terpene phenolic resin is 803L terpene phenolic resin；
The silane coupler is 3-mercaptopropyi trimethoxy silane；
The diluent is 1,6- hexanediyl esters；
Second glue-line at least includes：Polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder；It is described
Weight ratio between polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder is：3：1：1：5：1.
The polyurethane resin is purchased from Qingdao Ju Bang new materials Co., Ltd；
The chlorinated polypropylene is the PP803MWS chlorinated polypropylenes that Nippon Paper is produced.
The rosin resin is purchased from Shanghai three and connects Industrial Co., Ltd., and product grade is TF-100.
The wax powder is polyethylene glycol wax powder, is purchased from Du Dao joints Chemical Co., Ltd..
The preparation method of second glue-line is：
The polyurethane resins of corresponding parts by weight, chlorinated polypropylene, rosin resin, hexamethylene, wax powder are weighed, by polyurethane tree
Fat, chlorinated polypropylene, rosin resin are added in hexamethylene, and temperature is increased into 80 DEG C, after stirring and dissolving, wax powder is added,
Continue to stir, be cooled to room temperature, obtain the second glue-line.
The preparation method of electronics paster packaging film material, at least comprises the following steps：
(1) PET, polyolefin are provided；
(2) the first glue-line is prepared；
(3) the second glue-line is prepared；
(4) laminating process：Polyolefin layer is coated on pet layer, the first glue-line, are then respectively coated on polyolefin layer
Electronics paster packaging film material is obtained after two glue-lines, drying.
Embodiment 4：
Embodiments of the invention 4 provide a kind of electronics paster packaging film material, successively including pet layer, polyolefin layer,
First glue-line, the second glue-line；
The polyolefin layer is selected from：Maleic anhydride modified polypropylene；
The maleic anhydride modified polypropylene is purchased from modest three Chemical Industry Science Co., Ltd in Guangzhou.
First glue-line at least includes：SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent,
Hexamethylene；Also include lignosulfonate in first glue-line.
The SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent, hexamethylene, lignosulfonate
Between weight ratio be：5：1：2：0.5：0.1：8：0.5；
The SEBS is acrylic acid-grafted SEBS resins；
The preparation method of the acrylic acid-grafted SEBS resins is：
In the three neck round bottom flask with agitator, condenser pipe and nitrogen access tube, 10.0g SEBS and 80mL are added
After toluene, fully dissolving, the acrylic acid and 0.5g BPO for adding 5.0g react 6h at 90 DEG C, and reactant mixture is injected into a large amount of
In the boiling distillated water being stirred vigorously, filtering precipitates to obtain crude product.By crude product be twisted into after slice distilled water boil twice, with
Remove part homo-polypropylene acid.Then crude product is extracted to constant, reaction product vacuum in Soxhlet extraction device with distilled water
Dry to constant, obtain acrylic acid-grafted SEBS resins.
The polyurethane resin is purchased from Qingdao Ju Bang new materials Co., Ltd；
The terpene phenolic resin is 803L terpene phenolic resin；
The silane coupler is 3-mercaptopropyi trimethoxy silane；
The diluent is 1,6- hexanediyl esters；
Second glue-line at least includes：Polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder；It is described
Weight ratio between polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder is：3：1：1：5：1.
The polyurethane resin is purchased from Qingdao Ju Bang new materials Co., Ltd；
The chlorinated polypropylene is the PP803MWS chlorinated polypropylenes that Nippon Paper is produced.
The rosin resin is purchased from Shanghai three and connects Industrial Co., Ltd., and product grade is TF-100.
The wax powder is polyethylene glycol wax powder, is purchased from Du Dao joints Chemical Co., Ltd..
The preparation method of second glue-line is：
The polyurethane resins of corresponding parts by weight, chlorinated polypropylene, rosin resin, hexamethylene, wax powder are weighed, by polyurethane tree
Fat, chlorinated polypropylene, rosin resin are added in hexamethylene, and temperature is increased into 80 DEG C, after stirring and dissolving, wax powder is added,
Continue to stir, be cooled to room temperature, obtain the second glue-line.
The preparation method of electronics paster packaging film material, at least comprises the following steps：
(1) PET, polyolefin are provided；
(2) the first glue-line is prepared；
(3) the second glue-line is prepared；
(4) laminating process：Polyolefin layer is coated on pet layer, the first glue-line, are then respectively coated on polyolefin layer
Electronics paster packaging film material is obtained after two glue-lines, drying.
Embodiment 5：
Embodiments of the invention 5 provide a kind of electronics paster packaging film material, successively including pet layer, polyolefin layer,
First glue-line, the second glue-line；
The polyolefin layer is selected from：Maleic anhydride modified polypropylene；
The maleic anhydride modified polypropylene is purchased from modest three Chemical Industry Science Co., Ltd in Guangzhou.
First glue-line at least includes：SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent,
Hexamethylene；Also include lignosulfonate in first glue-line.
The SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent, hexamethylene, lignosulfonate
Between weight ratio be：5：1：2：0.5：0.1：8：0.5；
The SEBS is acrylic acid-grafted SEBS resins；
The preparation method of the acrylic acid-grafted SEBS resins is：
In the three neck round bottom flask with agitator, condenser pipe and nitrogen access tube, 10.0g SEBS and 80mL are added
After toluene, fully dissolving, the acrylic acid and 0.5g BPO for adding 5.0g react 6h at 90 DEG C, and reactant mixture is injected into a large amount of
In the boiling distillated water being stirred vigorously, filtering precipitates to obtain crude product.By crude product be twisted into after slice distilled water boil twice, with
Remove part homo-polypropylene acid.Then crude product is extracted to constant, reaction product vacuum in Soxhlet extraction device with distilled water
Dry to constant, obtain acrylic acid-grafted SEBS resins.
The polyurethane resin is purchased from Qingdao Ju Bang new materials Co., Ltd；
The terpene phenolic resin is 803L terpene phenolic resin；
The silane coupler is 3-mercaptopropyi trimethoxy silane；
The diluent is 1,6- hexanediyl esters；
Second glue-line at least includes：Polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder；It is described
Weight ratio between polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder is：3：1：1：5：1.
The polyurethane resin is the mixing of polyurethane resin and end carboxyl super branched polyester resin；Wherein, polyurethane tree
The weight ratio of fat and end carboxyl super branched polyester resin is 100：1.
The end carboxyl super branched polyester resin is purchased from Wuhan hyperbranched resin Co., Ltd；
The chlorinated polypropylene is the PP803MWS chlorinated polypropylenes that Nippon Paper is produced.
The rosin resin is purchased from Shanghai three and connects Industrial Co., Ltd., and product grade is TF-100.
The wax powder is polyethylene glycol wax powder, is purchased from Du Dao joints Chemical Co., Ltd..
The preparation method of second glue-line is：
The polyurethane resins of corresponding parts by weight, chlorinated polypropylene, rosin resin, hexamethylene, wax powder are weighed, by polyurethane tree
Fat, chlorinated polypropylene, rosin resin are added in hexamethylene, and temperature is increased into 80 DEG C, after stirring and dissolving, wax powder is added,
Continue to stir, be cooled to room temperature, obtain the second glue-line.
The preparation method of electronics paster packaging film material, at least comprises the following steps：
(1) PET, polyolefin are provided；
(2) the first glue-line is prepared；
(3) the second glue-line is prepared；
(4) laminating process：Polyolefin layer is coated on pet layer, the first glue-line, are then respectively coated on polyolefin layer
Electronics paster packaging film material is obtained after two glue-lines, drying.
Embodiment 6：
Embodiments of the invention 6 provide a kind of electronics paster packaging film material, successively including pet layer, polyolefin layer,
First glue-line, the second glue-line；
The polyolefin layer is selected from：Maleic anhydride modified polypropylene；
The maleic anhydride modified polypropylene is purchased from modest three Chemical Industry Science Co., Ltd in Guangzhou.
First glue-line at least includes：SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent,
Hexamethylene；Also include lignosulfonate in first glue-line.
The SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent, hexamethylene, lignosulfonate
Between weight ratio be：5：1：2：0.5：0.1：8：0.5；
The SEBS is acrylic acid-grafted SEBS resins；
The preparation method of the acrylic acid-grafted SEBS resins is：
In the three neck round bottom flask with agitator, condenser pipe and nitrogen access tube, 10.0g SEBS and 80mL are added
After toluene, fully dissolving, the acrylic acid and 0.5g BPO for adding 5.0g react 6h at 90 DEG C, and reactant mixture is injected into a large amount of
In the boiling distillated water being stirred vigorously, filtering precipitates to obtain crude product.By crude product be twisted into after slice distilled water boil twice, with
Remove part homo-polypropylene acid.Then crude product is extracted to constant, reaction product vacuum in Soxhlet extraction device with distilled water
Dry to constant, obtain acrylic acid-grafted SEBS resins.
The polyurethane resin is purchased from Qingdao Ju Bang new materials Co., Ltd；
The terpene phenolic resin is 803L terpene phenolic resin；
The silane coupler is 3-mercaptopropyi trimethoxy silane；
The diluent is 1,6- hexanediyl esters；
Second glue-line at least includes：Polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder；
In second glue-line, in addition to graphene/chitosan composite micro-capsule.
The polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder, graphene/chitosan are combined micro- glue
Weight ratio between capsule is：3：1：1：5：1：0.1.
The polyurethane resin is the mixing of polyurethane resin and end carboxyl super branched polyester resin；Wherein, polyurethane tree
The weight ratio of fat and end carboxyl super branched polyester resin is 100：1.
The end carboxyl super branched polyester resin is purchased from Wuhan hyperbranched resin Co., Ltd；
The chlorinated polypropylene is the PP803MWS chlorinated polypropylenes that Nippon Paper is produced.
The rosin resin is purchased from Shanghai three and connects Industrial Co., Ltd., and product grade is TF-100.
The wax powder is polyethylene glycol wax powder, is purchased from Du Dao joints Chemical Co., Ltd..
The graphene/specific preparation process of chitosan composite micro-capsule is as follows：
(1) in the acetum for adding chitosan into 0.2mol/L, 2h is stirred at room temperature, is gathered with fully dissolving shell
1h is stood after sugar, stirring, to eliminate the bubble in solution, chitosan solution concentration is obtained for 2wt%；
(2) 100mg graphene oxides ultrasonic disperse is weighed in 30mL 0.05mol/L NaOH solutions, is then added to
In the 100mL 5mg/mL2- HACC aqueous solution, reaction 2h is stirred at room temperature, then uses what is configured
0.1mol/LNaOH solution adjusts above-mentioned mixed solution pH value to after 10, adds the hydrazine hydrate that 0.4g mass concentrations are 85%, room
Temperature reaction 20min, 2h is reacted under the conditions of at the uniform velocity stirring and temperature is 80 DEG C；Reaction solution is finally passed through into the mixed of 0.22 μm of aperture
Condensating fiber element ester filter membrane is filtered by vacuum, and, by gained filter cake in 50 DEG C of dry 36h, obtains with deionized water cyclic washing repeatedly
The graphene modified to chitosan quaternary ammonium salt.
(3) graphene dispersion for modifying 10mg chitosan quaternary ammonium salts obtains chitosan quaternary ammonium salt modification in 50mL water
Graphene dispersing solution, the graphene dispersing solution for then modifying chitosan quaternary ammonium salt and chitosan solution are by 1：15 volume ratio
Mixing, ultrasonic oscillation makes it be uniformly dispersed, obtains mixed dispersion liquid；
(4) mixed dispersion liquid is drawn into disposable syringe as interior phase solution, passes through LP215 type micro-injection pumps
Control is passed into the circular capillaries of micro fluidic device, and inert gas is passed into circular and square capillary as external fluid phase
Gap in, micro fluidic device is disposed vertically, due to the effect of gas-liquid shearing force, and chitosan solution exports to form single point in device
Scattered chitosan/graphene mixing microlayer model, and be added dropwise in the sodium dodecyl sulfate solution being placed on immediately below it, obtain
Graphene/chitosan composite micro-capsule；Wherein, interior phase solution flow rate is 3mL/h, and the flow velocity of gas is in 1.0L/min.
The preparation method of second glue-line is：
The polyurethane resins of corresponding parts by weight, chlorinated polypropylene, rosin resin, hexamethylene, wax powder are weighed, by polyurethane tree
Fat, chlorinated polypropylene, rosin resin are added in hexamethylene, and temperature is increased into 80 DEG C, after stirring and dissolving, wax powder is added,
Continue to stir, be cooled to room temperature, obtain the second glue-line.
The preparation method of electronics paster packaging film material, at least comprises the following steps：
(1) PET, polyolefin are provided；
(2) the first glue-line is prepared；
(3) the second glue-line is prepared；
(4) laminating process：Polyolefin layer is coated on pet layer, the first glue-line, are then respectively coated on polyolefin layer
Electronics paster packaging film material is obtained after two glue-lines, drying.
Comparative example 1：
The be the same as Example 1 of comparative example 1 of the present invention, difference is, not including the first glue-line.
Comparative example 2：
The be the same as Example 1 of comparative example 2 of the present invention, difference is, not including the second glue-line.
Comparative example 3：
The be the same as Example 1 of comparative example 3 of the present invention, difference is, silane coupler is not included in first glue-line.
Comparative example 4：
The be the same as Example 7 of comparative example 4 of the present invention, difference is, the graphene/chitosan composite micro-capsule is only stone
Black alkene.
Comparative example 5：
The be the same as Example 7 of comparative example 5 of the present invention, difference is, the graphene/chitosan composite micro-capsule is only shell
Glycan.
Performance evaluation
1st, adhesive is without mobility
Electronics paster packaging film material is subjected to adhesive without fluidity testing.In each test, by deliberately making
Go out otch or a series of otch to check that the adhesive of sample is extruded/oozed out.If not observing that adhesive is extruded/oozed out,
Sample is considered as " qualified ", if it is observed that adhesive is extruded/oozed out, is then considered as " unqualified ".
Test 1：Otch is made to electronics paster packaging film material by sharp blade, at 100 DEG C, 48 are placed small
When, check that adhesive is extruded/oozed out.
Test 2：Otch is made to electronics paster packaging film material by sharp blade, at 100 DEG C, with 5 kilograms
Counterweight is placed on the top of electronics paster packaging film material, checks that adhesive is extruded/oozed out.
Test 3：By making otch in multiple positions of electronics paster packaging film material, band is run on laminated roller.
Check that adhesive is extruded/oozed out.
2nd, fluctuation is peeled off
Product in embodiment and comparative example is packaged on polystyrene carrier band, in 52 DEG C/95% relative humidity (RH)
Under conditions of the peeling force of 60 days by a definite date change fluctuation range,.
3rd, noise
Product in embodiment and comparative example is packaged on polystyrene carrier band, in 52 DEG C/95% relative humidity (RH)
Under conditions of, embodiment is torn with the product in comparative example, sound characteristic is judged.
The performance test results of table 1
Foregoing example is merely illustrative, some features for explaining the method for the invention.Appended right will
The scope as wide as possible for being intended to require to be contemplated that is sought, and embodiments as presented herein is implemented according to all possible
The explanation of the embodiment of the selection of the combination of example.Therefore, the purpose of applicant is that appended claim is not illustrated this hair
The selectional restriction of the example of bright feature.Some number ranges used also include sub- model within the claims
Enclose, the change in these scopes should be also construed to by appended claim covering in the conceived case.
Claims (10)
1. a kind of electronics paster packaging film material, it is characterised in that successively including pet layer, polyolefin layer, the first glue-line,
Two glue-lines；
The polyolefin layer is selected from：Any one or a few mixing in polyethylene, polypropylene, polybutene；
First glue-line at least includes：SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent, hexamethylene
Alkane；Weight ratio between the SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent, hexamethylene is：5：
1：2：0.5：0.1：8；
Second glue-line at least includes：Polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder；The poly- ammonia
Weight ratio between ester resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder is：3：1：1：5：1.
2. electronics paster packaging film material as claimed in claim 1, it is characterised in that successively including pet layer, polyolefin
Layer, the first glue-line, the second glue-line；
The polyolefin layer is polypropylene layer；
First glue-line at least includes：SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent, hexamethylene
Alkane；Weight ratio between the SEBS, polyurethane resin, terpene phenolic resin, silane coupler, diluent, hexamethylene is：5：
1：2：0.5：0.1：8；
Second glue-line at least includes：Polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder；The poly- ammonia
Weight ratio between ester resin, chlorinated polypropylene, rosin resin, hexamethylene, wax powder is：3：1：1：5：1.
3. the electronics paster packaging film material as described in claim 1~2 any one, it is characterised in that the SEBS is
Acrylic acid-grafted SEBS resins.
4. the electronics paster packaging film material as described in claim 1~2 any one, it is characterised in that the polypropylene
For maleic anhydride modified polypropylene.
5. the electronics paster packaging film material as described in claim 1~2 any one, it is characterised in that first glue
Also include lignosulfonate in layer.
6. the electronics paster packaging film material as described in claim 1~2 any one, it is characterised in that the silane is even
Connection agent is selected from：3- glycidoxypropyltrimewasxysilanes, 3- glycidoxypropyls triethoxysilane, 3- shrink
Glycerine epoxide hydroxypropyl methyl diethoxy silane, 3- glycidoxypropyls dimethoxysilane, 2- (3,4- epoxy radicals
Cyclohexyl) ethyl trimethoxy silane, 2- (3,4- expoxycyclohexyls) ethyl triethoxysilane, 3- mercaptopropyi trimethoxies
In base silane, 3- Mercaptopropyltriethoxysilanes, 3- mercaptopropyi dimethoxymethylsilanes any one or a few
Mixing.
7. the electronics paster packaging film material as described in claim 1~2 any one, it is characterised in that the polyurethane
Resin is the mixing of polyurethane resin and end carboxyl super branched polyester resin；Wherein, polyurethane resin and end carboxyl super branched poly-
The weight ratio of ester resin is 100：1.
8. the electronics paster packaging film material as described in claim 1~2 any one, it is characterised in that second glue
In layer, in addition to graphene/chitosan composite micro-capsule.
9. the preparation method of the electronics paster packaging film material described in claim 1~8, it is characterised in that at least including with
Lower step：
(1) PET, polyolefin are provided；
(2) the first glue-line is prepared：Weigh the SEBS of corresponding parts by weight, polyurethane resin, terpene phenolic resin, silane coupler,
Diluent, hexamethylene, SEBS, polyurethane resin, terpene phenolic resin are added in hexamethylene, and temperature is increased into 60 DEG C,
After stirring and dissolving, silane coupler, diluent are added, continues to stir 2~5h, is cooled to room temperature, obtains the first glue-line；
(3) the second glue-line is prepared：Weigh polyurethane resin, chlorinated polypropylene, rosin resin, hexamethylene, the wax of corresponding parts by weight
Powder, polyurethane resin, chlorinated polypropylene, rosin resin are added in hexamethylene, and temperature is increased into 80 DEG C, stirring and dissolving
Afterwards, wax powder is added, continues to stir, is cooled to room temperature, the second glue-line is obtained；
(4) laminating process：Polyolefin layer is coated on pet layer, the first glue-line, the second glue are then respectively coated on polyolefin layer
Electronics paster packaging film material is obtained after layer, drying.
10. application of the electronics paster packaging film material in packaging field described in claim 1~8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710568717.XA CN107201190B (en) | 2017-07-13 | 2017-07-13 | Electronic patch packaging thin film material and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710568717.XA CN107201190B (en) | 2017-07-13 | 2017-07-13 | Electronic patch packaging thin film material and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107201190A true CN107201190A (en) | 2017-09-26 |
| CN107201190B CN107201190B (en) | 2020-07-17 |
Family
ID=59910841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710568717.XA Active CN107201190B (en) | 2017-07-13 | 2017-07-13 | Electronic patch packaging thin film material and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107201190B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106795393A (en) * | 2015-02-04 | 2017-05-31 | 株式会社Lg化学 | pressure sensitive adhesive composition |
-
2017
- 2017-07-13 CN CN201710568717.XA patent/CN107201190B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106795393A (en) * | 2015-02-04 | 2017-05-31 | 株式会社Lg化学 | pressure sensitive adhesive composition |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107201190B (en) | 2020-07-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104769061A (en) | Acrylic emulsion adhesive composition comprising nano sized latex particles having a mono-modal particle size distribution, and production method for same | |
| JP2001512508A (en) | Antistatic latex adhesive | |
| CN104673111B (en) | Formula and preparation method of epoxy resin based anisotropic conductive adhesive film | |
| TW200916549A (en) | Thermosetting encapsulation adhesive sheet | |
| CN113667340A (en) | Corrosion inhibition material and application thereof | |
| CN102134466B (en) | Reactive water-borne adhesive and preparation method thereof | |
| CN113089380B (en) | Heat-sealing self-adhesive high-strength medical dialyzing paper and processing method thereof | |
| CN105401481B (en) | A kind of surface treated electronic carrier tape dedicated raw paper and preparation method thereof | |
| CN102803937B (en) | copper bromide humidity indicating card | |
| CN106833502A (en) | Peelable organic pressure-sensitive gel, pressure sensitive adhesive product and preparation method thereof | |
| CN107201190A (en) | A kind of electronics paster packaging film material and preparation method thereof, application | |
| CN104804687B (en) | Conductive die bond bonding glue, conductive die bond Gumming glue film, preparation method and application | |
| KR100900863B1 (en) | Epoxy resin composition and die bonding material comprising the composition | |
| CN112126003A (en) | Thermoplastic acrylate emulsion and preparation method and application thereof | |
| KR101399711B1 (en) | (meth)acrylate polymer, resin composition, and molded article | |
| JPH03247683A (en) | Acrylic adhesive composition | |
| CN104559516B (en) | It is adapted to thermoplastic coating that tinplate is sealed with aluminium foil and preparation method thereof | |
| CN106351063A (en) | Dispersed copolymer of organic boron composite crosslinking agent and cationic polymer, and preparation method thereof and application, papermaking method | |
| CN106957626A (en) | A kind of peelable blue glue of volatile-type and preparation method thereof | |
| CN106221547A (en) | Random distribution has the transferable coating of fiber and the antifalsification label containing this coating | |
| CN107245191A (en) | A kind of rare earth modified plastics and preparation method thereof | |
| CN101314707A (en) | A water-based adhesive | |
| CN109837030A (en) | Processing procedure heat-releasable conductive tape and preparation method thereof | |
| CN102391807A (en) | Preparation method of rapidly solidified anisotropic conductive adhesive | |
| CN117659916A (en) | Conductive adhesive and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200421 Address after: 518101 Guangdong, Shenzhen, Baoan District Shajing Street Sha 1 community Changxin science and Technology Park 16, four floor. Applicant after: SHENZHEN XCY ELECTRICAL PARTS Co.,Ltd. Address before: 237400 Anhui city of Lu'an province Huoqiu County Ma Dian Zhen Cha an Cun Yang Qiao group Applicant before: Li Kejun |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518101 Guangdong, Shenzhen, Baoan District Shajing Street Sha 1 community Changxin science and Technology Park 16, four floor. Patentee after: Shenzhen xinchuangyuan Precision Intelligent Manufacturing Co.,Ltd. Address before: 518101 Guangdong, Shenzhen, Baoan District Shajing Street Sha 1 community Changxin science and Technology Park 16, four floor. Patentee before: SHENZHEN XCY ELECTRICAL PARTS Co.,Ltd. |