CN107683031B - Processing method for solving film falling problem in outer-layer circuit manufacturing of rigid-flex printed circuit board - Google Patents
Processing method for solving film falling problem in outer-layer circuit manufacturing of rigid-flex printed circuit board Download PDFInfo
- Publication number
- CN107683031B CN107683031B CN201711085795.0A CN201711085795A CN107683031B CN 107683031 B CN107683031 B CN 107683031B CN 201711085795 A CN201711085795 A CN 201711085795A CN 107683031 B CN107683031 B CN 107683031B
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- rigid
- prepreg
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000003672 processing method Methods 0.000 title claims abstract description 8
- 239000002390 adhesive tape Substances 0.000 claims description 78
- 238000000034 method Methods 0.000 claims description 20
- 238000005520 cutting process Methods 0.000 claims description 19
- 238000003825 pressing Methods 0.000 claims description 13
- 238000003698 laser cutting Methods 0.000 claims description 6
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 238000003475 lamination Methods 0.000 description 21
- 239000010408 film Substances 0.000 description 14
- 238000005530 etching Methods 0.000 description 10
- 238000003801 milling Methods 0.000 description 9
- 238000003384 imaging method Methods 0.000 description 8
- 238000007689 inspection Methods 0.000 description 6
- 238000010030 laminating Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000741 silica gel Substances 0.000 description 5
- 229910002027 silica gel Inorganic materials 0.000 description 5
- 238000004080 punching Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- -1 removing Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a processing method for solving film falling in manufacturing of an outer-layer circuit of a rigid-flex printed board, and relates to the field of manufacturing of printed circuit boards.
Description
Technical Field
The invention relates to the field of PCB manufacturing, in particular to a processing method for solving film falling in manufacturing of an outer-layer circuit of a rigid-flex printed circuit board.
Background
With the development of a Printed Circuit Board (PCB) toward a small size, a light weight, a three-dimensional mounting and a high connection reliability, a flexible PCB is rapidly developed and starts to be developed toward a rigid-flex Printed Circuit Board, which is one of the main growth points of the PCB industry in the future.
At present, the manufacturing method of the rigid-flex printed board in the industry mainly adopts the structure manufacturing of a rigid core board, a prepreg, a flexible core board, the prepreg and the rigid core board, wherein the flexible core board is arranged in the middle and the rigid core board is arranged at two sides, the number of the rigid core boards can be more than that of the flexible core boards, the number of the flexible core boards can also be more than that of the flexible core boards, namely, the number of layers can be 3-N, and generally, the minimum layers are three layers, namely, a rigid layer, the prepreg, a flexible layer, the prepreg and a rigid layer.
At present, the rigid-flex printed circuit board is usually manufactured in a depth-controlled uncovering mode in the industry, namely, prepregs in a pure-flexibility area are milled off before a rigid core board and a flexible core board are laminated, then the rigid core board on a flexible layer is pre-controlled to a certain depth, finally, the rigid core board is uncovered in a depth-controlled manner from a top layer and a bottom layer on the reverse side during forming, the pure-flexibility area is exposed, and the rigid-flex printed circuit board is obtained after forming.
According to the conventional method, the prepreg in the pure flexible area is routed before lamination, so that the prepreg is lower than other positions during lamination, the thickness of the prepreg is smaller than that of other positions during lamination because the prepreg is routed, and if the laminated plate is a plate formed by combining a plurality of flexible core plates and a plurality of prepregs, the thickness of the prepreg is smaller than that of the other positions during lamination at the position, and the number of layers is higher, and the rigid-flex combined plate with more flexible layers is more obvious. The unevenness of the board surface during lamination can not effectively and uniformly bear the lamination pressure, so that the rigid-flex board needs to be coated with a silica gel or PE film during lamination, the silica gel or PE film can be softened and melted in a high-temperature lamination state, and under the condition of certain pressure, the silica gel or PE film can directly flow into a position with a lower board surface during lamination to fill the board surface, so that the board surface is uniformly pressed during lamination, and the lamination of the rigid-flex board is completed. After pressing, because the silica gel or PE film is coated, when the pressure is fixed, the silica gel or PE film is extruded at the position, no prepreg is supported between the rigid core board and the flexible core board, the rigid core board can be sunken towards the flexible core board, the sunken position extends from the rigid-flexible joint to the middle area of the prepreg windowing, the higher the layer number is, the thicker the flexible core board is, and the more the prepregs are, the more obvious the flexible core board is.
The sunken position of this department is when outer circuit of external light formation of image preparation, because of the face unevenness, pastes insecure at sunken marginal position after the dry film laminating, and is unsettled in the middle of sunken, and sunken juncture (rigid-flex combination department) position is because of the dry film pastes insecure, during outer circuit preparation, exposes counterpoint development back, and here dry film is washed away by developer solution, and copper-plated tin preparation back, tin is gone up to the position that tin need not be gone up to this place, and the residual copper in this place after the etching leads to the short circuit.
When the situation is met in the industry at present, the customer design is generally recommended, and no wiring is designed in the area of 5mm nearby, but most of the board customers cannot agree with the method, the wiring space is seriously designed, and the method is not feasible. In another method, most manufacturers adopt a filling method, filling blocks (FR 4 light plates are adopted for through windows) are placed in a prepreg windowing region when pressing is carried out, but an appropriate FR4 light plate with the thickness consistent with that of the prepreg is difficult to find, and the manufactured effect is that the filling blocks are too high, the plate is broken after pressing, or the plate is too low, and the plate is also sunken after pressing. The method also has a disadvantage that the filling block needs to be milled when being manufactured, or the milling shape is consistent with the window opening of the prepreg, or the milling shape is smaller than the window opening area of the prepreg. When the size of the filling block is consistent with that of the window opening area of the prepreg, the size of the window opening area of the filling block and the size of the prepreg are different due to the expansion and contraction of the plate and the like, and the filling block is difficult to fill during pressing. When the window opening area of the filling block is smaller than that of the prepreg, the filling block is displaced after lamination, so that the recess also exists after lamination, and the development film falling abnormity can not be solved as long as the whole is changed into a local part.
Disclosure of Invention
In view of the above, the invention discloses a processing method for solving the problem of membrane falling in the manufacturing of an outer-layer circuit of a rigid-flex printed circuit board, which adopts a new filling manufacturing process, can solve the problems of difficult alignment, pressing displacement and the like of an FR4 filling block, and has the advantages of cost saving, simplicity in operation, high working efficiency and the like.
The invention solves the problems through the following technical means:
a processing method for solving film falling in manufacturing of an outer-layer circuit of a rigid-flex printed circuit board is characterized in that an adhesive tape is filled in a windowing area of a prepreg of the rigid-flex printed circuit board, and the rigid-flex printed circuit board filled with the adhesive tape is pressed.
Further, the method specifically comprises the following steps:
a1) gluing with an adhesive tape: the rigid-flex printed circuit board is close to the whole rigid board surface of the prepreg and is pasted with an adhesive tape;
a2) cutting the adhesive tape: according to the position and the size of the window area of the prepreg, cutting the adhesive tape by using laser to form an adhesive tape filling block capable of filling the window area of the prepreg;
a3) removing edges of the adhesive tape: tearing off the edge of the adhesive tape along the laser cutting track, and reserving the adhesive tape filling blocks;
a4) and (3) pressing the adhesive tape filling blocks: and pressing the rigid-flex board adhered with the adhesive tape filling block.
Further, the tape cutting step specifically includes: and cutting the adhesive tape by using laser according to the position and the size of the window area of the prepreg to form an adhesive tape filling block capable of filling the window of the prepreg, wherein the side length of the adhesive tape filling block is 0.04-0.06mm shorter than the corresponding side length of the window area of the prepreg. The four sides of the tape filling block are shorter than the window area of the prepreg, so that the tape filling block can be directly pressed into the window area of the prepreg.
Further, the adhesive tape is a high-temperature-resistant PI adhesive tape.
Further, the thickness of the high-temperature-resistant PI adhesive tape is 0.05-0.3 mm.
The processing method for solving the problem of film falling in the outer-layer circuit manufacturing of the rigid-flex printed circuit board has the following beneficial effects:
the invention adopts a new filling manufacturing process, before the rigid-flex board is pressed, the cut and molded adhesive tape is used for filling the windowing area of the prepreg, the adhesive tape is filled in the windowing area of the prepreg of the rigid-flex board, and the rigid-flex board filled with the adhesive tape is pressed, which specifically comprises the steps of adhesive tape attaching, adhesive tape cutting, adhesive tape edge removing, adhesive tape filling block pressing and the like, the method ensures that the PP windowing area is filled with the adhesive tape with the same thickness, the board surface is flat after pressing, and the outer layer circuit can be normally manufactured.
1. FR4 filling block cost is higher, and need etch off surperficial copper sheet before the pressfitting to gong out through the mode of gong appearance, the PI sticky tape can directly paste on the rigidity board that needs the pressfitting, adopts the mode of laser, cuts out the position figure that needs still remain the sticky tape, all the other positions tear remove can, and high temperature resistant PI sticky tape cost is lower, and processing cost is minimum also.
2. The high-temperature-resistant PI adhesive tape is used for filling the windowing area of the prepreg, laser direct forming can be adopted, an FR4 filling block is not needed for alignment, the steps of expanding and shrinking the board, repeatedly putting and fixing the filling block in the operation process and the like are not needed to be considered, the process is simple to operate, and the efficiency is higher.
3. The traditional FR4 filling block still has the counterpoint difficulty because of the board harmomegathus in the pressfitting process, can't effectively fill with shift etc. unusual, can have local sunken after filling, can't effectively solve the external light formation of image and develop the back and fall the membrane problem, the yield is lower, uses high temperature resistant PI sticky tape can effectively fill, falls the membrane unusual and can stop completely.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment.
In the figure: 1-rigid plate, 2-prepreg, 3-flexible plate, 4-high temperature resistant PI adhesive tape, 5-cover film and 6-through hole.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
The present invention will be described in detail below with reference to the accompanying drawings.
The structure shown in figure 1 is a six-layer plate structure, the number of the rigid-flexible combined plate is larger than six layers, the rigid-flexible combined plate is required to be tested according to three-level IPC standard, the requirement that the laminated medium layer is larger than or equal to 90um is required, the national military standard (GJB-3062A) is not layered, and the thickness of all types of plates is larger than or equal to 90um after the medium is laminated. Therefore, when a general manufacturer designs a rigid-flex printed circuit board, two prepregs are usually used for lamination, most manufacturers adopt 1080+106 type prepregs to control glue overflow, the total thickness is about 0.13mm,
the technical scheme provided by the invention adopts the high-temperature-resistant PI adhesive tape 4 which can resist the temperature of 250 ℃, does not fall off and deform at the temperature, has the thickness of 0.05-0.3mmmm, is manufactured by adopting the adhesive tape with the thickness of 0.13mm according to the conventional lamination, and can be effectively filled, wherein the thickness is matched with the windowing thickness of the prepreg. And the adhesive tape is wholly pasted on the rigid plate 1 needing to be laminated before lamination by using the viscosity of the adhesive, laser information is made, the adhesive tape at the position where the prepreg needs to be filled is formed by windowing in a laser mode, the shape of the adhesive tape is 0.05mm smaller than the shape of the windowing area, after the laser, the adhesive tape at the position of the rest area is torn off, the adhesive tape at the windowing area of the prepreg is reserved and then is normally laminated, the outer-layer circuit is normally manufactured after lamination, and the adhesive tape filling manufacturing effect is good and is free from abnormity.
The through holes 6 in fig. 1 are used for conducting the inner layers, so that the layers are conducted, that is, the device is required to be inserted on the circuit board, the pins are inserted into the through holes, then the solder paste is soldered, and finally the performance of the circuit is formed. The through hole can be inserted with a device.
It should be noted that, the high temperature resistant PI tape 4 is used as a filling material to effectively replace the conventional FR4 material, and meanwhile, a laminating and laminating manner is used to fill the window opening area of the prepreg with the high temperature tape, the lamination can be shown in fig. 1, and the specific production process is as follows:
the flexible board 3: cutting, internal light imaging, internal layer etching inspection, matching center and flow.
Covering film 5: cutting-cutting/laser cutting-auxiliary material matching.
Prepreg 2: cutting, hole milling and auxiliary material matching, and the description is as follows: the hole milling is to undercut the prepreg that is not needed for the flex area.
High-temperature resistant PI adhesive tape 4: cutting-cutting/laser cutting-auxiliary material matching.
The manufacturing process of the rigid plate 1 can be divided into two types: the single surface of a flexible plate 3 is 1-2 layers of rigidity or a multilayer rigid plate 1, the number of layers of the multilayer rigid plate is generally more than or equal to 2, and the manufacturing flow of the 1-2 layers of rigid plate 1 is as follows:
rigid plate 1(1-2 layers): cutting, internal light imaging, punching, inner layer etching inspection, milling a blind groove, sticking an adhesive tape, matching a center and performing a process. The tape is a PI tape 4 with a high temperature resistance locally attached, and the above process is a process of locally attaching a tape. The adhesive tape can be made in two ways, namely a whole-plate adhesive tape and a local adhesive tape. If the whole plate is pasted, the high-temperature resistant PI adhesive tape 4 flow is not needed.
Rigid plate 1(1-2 layers): cutting, internal light imaging, punching, inner layer etching detection, adhesive tape pasting, laser cutting, blind groove milling, matching center and flow. It should be noted that the tape is a whole board with a high temperature resistant PI tape 4, and the laser cutting is a laser data cutting of the high temperature resistant PI tape 4.
Rigid plate 1(≧ 2 layers):
1-2 layer flow: cutting, internal light imaging, punching, internal layer etching inspection, matching center and process
3-4 layer flow: cutting, internal light imaging, punching, internal layer etching inspection, matching center and process
1-4 layers of rigid plates, namely laminating 1-2 layers and 3-4 layers: laminating, drilling, internal light imaging, internal layer etching detection, tape pasting, laser cutting, blind groove milling, center matching and flow. It should be noted that: the tape sticking refers to sticking the high-temperature-resistant PI tape 4 on the whole board, the laser cutting refers to cutting the high-temperature-resistant PI tape 4 by using laser data, and the process is a whole board tape sticking process.
1-4 layer flow, which means that 1-2 layers and 3-4 layers are laminated: laminating, drilling, internal light imaging, inner layer etching detection, blind groove milling, adhesive tape pasting, matching center and process. The adhesive tape can be made in two ways, namely a whole-plate adhesive tape and a local adhesive tape. If the whole plate is pasted, the high-temperature resistant PI adhesive tape 4 flow is not needed. The adhesive tape is formed by partially adhering the high-temperature-resistant PI adhesive tape 4, and the above-described process is performed by partially adhering the adhesive tape.
CS-SS flow, i.e. the flow in which eventually all core boards are pressed together: pressing, drilling, copper deposition, plate surface electroplating, external light imaging, copper tin plating, alkaline etching, outer layer etching inspection, solder resistance, character treatment, surface treatment, edge milling, testing, final inspection, packaging and finished product delivery.
According to the technical scheme provided by the invention, the high-temperature-resistant PI adhesive tape 4 is adopted, can resist the temperature of 250 ℃, does not fall off and deform at the temperature, can be selected within the thickness range of 0.05-0.3mm, is manufactured by adopting the adhesive tape with the thickness of 0.13mm according to the conventional lamination, and can be effectively filled, wherein the thickness is matched with the windowing thickness of the prepreg. And the adhesive tape is wholly pasted on the rigid plate 1 needing to be laminated before lamination by using the viscosity of the adhesive, laser information is made, the adhesive tape at the position where the prepreg needs to be filled is formed by windowing in a laser mode, the shape of the adhesive tape is 0.05mm smaller than the shape of the windowing area, after the laser, the adhesive tape at the position of the rest area is torn off, the adhesive tape at the windowing area of the prepreg is reserved and then is normally laminated, the outer-layer circuit is normally manufactured after lamination, and the adhesive tape filling manufacturing effect is good and is free from abnormity.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (1)
1. A processing method for solving film falling in the manufacturing of an outer layer circuit of a rigid-flex printed circuit board is characterized in that an adhesive tape is filled in a windowing area of a prepreg of the rigid-flex printed circuit board, and the rigid-flex printed circuit board filled with the adhesive tape is pressed; the method specifically comprises the following steps:
a1) gluing with an adhesive tape: adhering an adhesive tape to the whole rigid plate surface of the rigid-flex printed circuit board close to the prepreg;
a2) cutting the adhesive tape: according to the position and the size of the window area of the prepreg, cutting the adhesive tape by using laser to form an adhesive tape filling block capable of filling the window area of the prepreg;
a3) removing edges of the adhesive tape: tearing off the edge of the adhesive tape along the laser cutting track, and reserving the adhesive tape filling blocks;
a4) and (3) pressing the adhesive tape filling blocks: pressing the rigid-flex printed circuit board pasted with the adhesive tape filling block;
the adhesive tape cutting step specifically comprises: according to the position and the size of the window area of the prepreg, cutting the adhesive tape by using laser to form an adhesive tape filling block capable of filling the window of the prepreg, wherein the side length of the adhesive tape filling block is 0.04-0.06mm shorter than the corresponding side length of the window area of the prepreg; the adhesive tape is a high-temperature-resistant PI adhesive tape; the thickness of the high-temperature-resistant PI adhesive tape is 0.05-0.3 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711085795.0A CN107683031B (en) | 2017-11-07 | 2017-11-07 | Processing method for solving film falling problem in outer-layer circuit manufacturing of rigid-flex printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711085795.0A CN107683031B (en) | 2017-11-07 | 2017-11-07 | Processing method for solving film falling problem in outer-layer circuit manufacturing of rigid-flex printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107683031A CN107683031A (en) | 2018-02-09 |
| CN107683031B true CN107683031B (en) | 2020-11-10 |
Family
ID=61145938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711085795.0A Active CN107683031B (en) | 2017-11-07 | 2017-11-07 | Processing method for solving film falling problem in outer-layer circuit manufacturing of rigid-flex printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107683031B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112449508A (en) * | 2019-09-04 | 2021-03-05 | 深南电路股份有限公司 | Printed circuit board, manufacturing method thereof and electronic equipment applying printed circuit board |
| CN112654175A (en) * | 2020-11-12 | 2021-04-13 | 安徽四创电子股份有限公司 | Method for manufacturing solder resist PCB in blind groove by uncovering method |
| CN112911809B (en) * | 2021-01-19 | 2022-09-06 | 中国电子科技集团公司第二十九研究所 | Method and device for processing blind groove structure of multilayer printed circuit board |
| CN112888172A (en) * | 2021-01-19 | 2021-06-01 | 中国电子科技集团公司第二十九研究所 | Adhesive tape-assisted processing method and device for realizing blind slot of multilayer printed circuit board |
| CN113891583B (en) * | 2021-09-27 | 2023-07-07 | 九江明阳电路科技有限公司 | PCB uncovering plate layering-preventing pressing method |
| CN115397097B (en) * | 2022-08-18 | 2025-12-16 | 沪士电子股份有限公司 | Inner layer original plate, manufacturing method of inner layer original plate and printed circuit board |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04112594A (en) * | 1990-08-31 | 1992-04-14 | Sharp Corp | Bendable flexible board and machining method thereof |
| CN101695220B (en) * | 2009-10-21 | 2011-03-30 | 上海美维电子有限公司 | Method for manufacturing PCB with stepped groove |
| CN102548258B (en) * | 2011-12-28 | 2014-11-05 | 东莞生益电子有限公司 | Manufacturing method of stepped slot circuit board with through hole, solder resist and circuit pattern at slot bottom |
| CN102933042B (en) * | 2012-10-17 | 2015-01-14 | 无锡江南计算技术研究所 | Anti-gluing method for flexible board in groove region of rigid-flexible board |
| CN105722317B (en) * | 2014-12-03 | 2019-03-01 | 珠海方正科技高密电子有限公司 | Rigid-flexible combination printed circuit board and preparation method thereof |
| CN105392283B (en) * | 2015-10-16 | 2018-09-04 | 广州杰赛科技股份有限公司 | Realize laser milling side when figure on Non-carbon black process |
| CN105228370B (en) * | 2015-10-26 | 2018-08-10 | 江苏弘信华印电路科技有限公司 | A kind of different big rigid-flex combined board manufacture craft of two sides rigidity plate suqare |
| CN106604573A (en) * | 2016-12-12 | 2017-04-26 | 上海展华电子有限公司 | Rigid-flex board processing method avoiding serration at rigid-flex joint |
-
2017
- 2017-11-07 CN CN201711085795.0A patent/CN107683031B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN107683031A (en) | 2018-02-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103068185B (en) | The manufacture method of printed circuit board soft-hard combination substrate flexible area | |
| CN111901968B (en) | Micro LED flexible circuit board manufacturing method | |
| CN110839316B (en) | Three-layer layered soft board and manufacturing method thereof | |
| CN110678011A (en) | Manufacturing method of rigid-flex printed circuit board | |
| CN105722317B (en) | Rigid-flexible combination printed circuit board and preparation method thereof | |
| CN109462949B (en) | A kind of manufacturing method of metallized edging PCB | |
| CN114615830B (en) | Method for improving lamination glue overflow of copper-embedded circuit board | |
| CN103281864B (en) | A kind of static state is destroyed or force to yield the manufacture method of ladder wiring board | |
| CN116095971B (en) | Processing method of heat dissipation boss on laminated circuit board | |
| CN107683031A (en) | A kind of processing method for solving rigid-flex combined board outer-layer circuit and making film | |
| CN119997399B (en) | Preparation method of printed circuit board with blind grooves and printed circuit board | |
| CN111182743B (en) | Manufacturing method of ceramic-based circuit board | |
| CN109714901B (en) | Method for processing outer-layer flexible rigid-flex board by wet film pasting and rigid-flex board | |
| CN104427762A (en) | Buried resistance printed board and manufacturing method thereof | |
| CN107801309A (en) | The preparation method of six sandwich circuit boards and six sandwich circuit boards | |
| CN111465168A (en) | Method for improving deviation of pressed buried copper block | |
| CN114786370B (en) | A method for manufacturing a six-layer rigid-flexible board | |
| CN112261800A (en) | Manufacturing method of high-heat-dissipation PCB | |
| CN113286454A (en) | Method for improving Air-gap structure bonding of FPC (Flexible printed Circuit) board | |
| CN117835559A (en) | Single-sided four-layer heat dissipation substrate and manufacturing method thereof | |
| CN105828523A (en) | Rigid-flex combined circuit board and manufacturing method thereof | |
| CN211240272U (en) | Bendable substrate | |
| CN209845427U (en) | Single-layer or multi-layer die-cut flexible circuit board | |
| CN204466045U (en) | A Rigid-Flexible Board with Asymmetrical Structure | |
| CN113840461B (en) | Manufacturing method of backlight plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |