CN108543732A - A kind of tin outputting mouth automatic flushing device and its cleaning method - Google Patents

Abstract

The invention discloses a kind of tin outputting mouth automatic flushing device, including solder furnace, solder furnace is equipped with an at least tin outputting mouth, including oxide layer removes brush, is correspondingly arranged with tin outputting mouth, for removing the oxide layer at tin outputting mouth；Scaling powder feeding device, built-in fluxing agent, and brush connection is removed with oxide layer, to realize that scaling powder, which is transported to oxide layer, to be removed at brush；XY delivery platforms are drivingly connected with solder furnace, are removed at brush for driving solder furnace movement to be moved to oxide layer, and remove brush with oxide layer and carry out relative motion, to realize removing oxide layer；This programme checks tin wave when tin outputting mouth works, by tin wave detection device, and removes brush using oxide layer and clearly automatically wash the oxide layer at tin outputting mouth, instead of manually cleaning, not only efficiently, but also support personnel's safety.

Description

An automatic cleaning device and cleaning method for tin nozzle

technical field

The invention relates to the technical field of SMT welding equipment, in particular to an automatic cleaning device for a tin nozzle and a cleaning method thereof.

Background technique

SMT is Surface Mount Technology, known as Surface Mount or Surface Mount Technology. It is the most popular technology and process in the electronic assembly industry.

It is a circuit assembly technology that mounts non-lead or short-lead surface mount components on the surface of a printed circuit board or other substrates, and solders and assembles them by reflow soldering or dip soldering.

However, in existing selective wave soldering, the tin nozzle part is in long-term contact with high-temperature liquid tin, and an oxide layer is formed at the outlet of the tin nozzle; the work of removing the oxide layer is manually removed, not only the removal efficiency is low, but also if the operation is improper, the staff will There is a high risk factor for severe burns; therefore improvements are necessary.

Contents of the invention

Aiming at the deficiencies in the prior art, the object of the present invention is to provide an automatic tin nozzle cleaning device which can automatically clean the tin nozzle regularly.

In order to achieve the above object, the technical solution adopted in the present invention is:

An automatic cleaning device for tin outlets, including a solder furnace, at least one tin outlet is provided on the solder furnace, including an oxide layer removal brush, which is arranged correspondingly to the tin outlet, and is used to remove the oxide layer at the tin outlet; The feeding device is equipped with flux and is connected with the oxide layer removal brush to deliver the flux to the oxide layer removal brush; the XY conveying platform is connected with the solder furnace drive to drive the solder furnace to move to the oxide layer Remove the brush and move relative to the oxide layer removal brush to remove the oxide layer; the control system is electrically connected with the flux supply device and the XY conveying platform to control the movement of the XY conveying platform and transfer the output of the solder furnace The tin nozzle is transported to the oxide layer removal brush, and the oxide layer at the tin nozzle is cleaned out. During the cleaning process, the flux feeding device is controlled to continuously deliver flux to the oxide layer removal brush.

In a further technical solution, the oxide layer removal brush is a stainless steel brush.

In a further technical solution, a brush fixing frame is included, and the oxidation layer removal brush is fixed or movably inserted in the brush fixing frame, and a descending device connected to it is set above the brush fixing frame to realize driving and fixing the brush The frame and the oxide layer removal brush are lowered and come into contact with the tin nozzle.

In a further technical solution, the descending device is a stroke cylinder.

In a further technical solution, the flux supply device is connected to the oxide layer removal brush through a pipeline.

In a further technical solution, the pipeline is a Teflon pipeline.

Another object of the present invention is to provide a cleaning method based on an automatic cleaning device for tin nozzles

In order to achieve the above object, the technical solution adopted in the present invention is:

A cleaning method for a tin nozzle automatic cleaning device, characterized in that it comprises the following steps:

A. When it is manually or electronically detected that the height of the solder paste at the product does not meet the process requirements, the XY conveying platform drives the solder furnace to move directly below the oxide layer removal brush;

B. The descending device drives the oxide layer removal brush to move vertically downward, so that the oxide layer removal brush drops to 3mm below the tin nozzle plane;

C. The XY conveying platform drives the solder furnace to move back and forth, so that the oxide layer removal brush of the tin nozzle and the tin nozzle rub against each other to remove the oxide layer at the tin nozzle. During the cleaning process, the flux feeding device continuously provides resistance. Flux to oxide layer removal brush.

After adopting the above structure and method, the present invention has the advantages compared with the prior art: when the tin tip is working, the tin wave is checked by the tin wave detection device, and the oxide layer is used to remove the brush to automatically remove the tin wave. The oxide layer at the tin nozzle is cleaned to replace manual cleaning, which is not only efficient, but also ensures the safety of personnel.

Description of drawings

The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

Fig. 1 is a schematic structural view of the present invention.

Detailed ways

The following are only preferred embodiments of the present invention, and therefore do not limit the protection scope of the present invention.

As shown in Figure 1, a kind of tin nozzle cleaning device comprises solder furnace 1, is provided with at least one tin nozzle 11 on the solder furnace 1, comprises oxide layer removal brush 2, is set correspondingly with tin nozzle 11, is used for cleaning The oxide layer at the tin nozzle 11; the flux feeding device 3 is equipped with flux, and is connected with the oxide layer removal brush 2, so as to transport the flux to the oxide layer removal brush 2; the XY delivery platform is connected with the solder Furnace 1 is driven and connected, used to drive soldering furnace 1 to move to oxide layer removal brush 2, and perform relative movement with oxide layer removal brush 2 to realize oxide layer removal; control system, with flux feeding device 3 and XY The conveying platform is electrically connected to realize the control of the movement of the XY conveying platform, and the tin nozzle 11 on the solder furnace 1 is transported to the oxide layer removal brush, and the oxide layer at the tin nozzle 11 is cleaned, and the flux 1 is controlled during the cleaning process. The feeding device continuously sends flux to the oxide layer removal 2 brush.

Corresponding to the tin nozzle 11 on the solder furnace 1, an oxide layer removal brush 2 is set. Before the operation or when the height sensor detects that the thickness of the oxide layer at the tin nozzle 11 is too large, the control system will control the actuator to stop the execution. Processing action, and control the XY conveying platform to drive the solder furnace 1 to move to the oxide layer removal brush 2, so that the tin nozzle 11 is in contact with the oxide layer removal brush 2, and the XY conveying platform drives the solder furnace 1 to reciprocate back and forth, and the flux is supplied at the same time The device 3 provides flux for the oxide layer removal brush 2, and the tin nozzle 11 rubs against the oxide layer removal brush 2 to achieve the purpose of removing the oxide layer, instead of manual cleaning, which is efficient and safe.

The oxide layer removal brush 2 is made of a plastic brush or a stainless steel brush. In this embodiment, the oxide layer removal brush 2 is made of a stainless steel brush. Due to the high hardness of the stainless steel brush, when rubbing with the tin outlet 11, the removal effect of the oxide layer is better and the efficiency is higher.

In this embodiment, a hairbrush holder 4 is included, and the oxide layer removal brush 2 is fixed or movably inserted in the hairbrush holder 4, and the top of the hairbrush holder 4 is provided with a descending device 5 driven and connected to it, so as to realize Drive hairbrush fixed frame 4 and oxide layer removal brush 2 to descend, contact with tin outlet nozzle 11. By arranging the brush fixing frame 4 on the brush, the brush is further fixed, which not only improves the stability of the device, but also improves the service life of the oxide layer removal brush 2 . When the oxide layer removal brush 2 removes the oxide layer, the lowering device 5 can adjust the position of the oxide layer removal brush 2. Specifically, the oxide layer brush is lowered to 3mm below the tin outlet nozzle 11 plane, and the oxide layer removal effect is the best.

The descending device 5 mainly realizes the purpose of driving the oxidation layer removal brush 2 to descend, and can be driven by the cooperation of a servo motor and a screw mandrel. In this embodiment, the descending device 5 uses a stroke cylinder, and the formula for driving the descending purpose is achieved. The cost is lower.

In this embodiment, the flux feeding device 3 is connected to the oxide layer cleaning brush 2 through a Teflon pipeline; during the process of removing the oxide layer, the flux is continuously transported to the oxide layer cleaning brush through the Teflon pipeline , the transportation method is simple, and the Teflon pipeline has good corrosion resistance, and there will be no leakage.

Working principle: When the tin nozzle automatic cleaning device needs to clean the tin nozzle, it includes the following steps: A. When it is detected manually or electronically that the height of the solder paste at the product does not meet the process requirements, the XY conveying platform drives The solder furnace moves to directly below the oxide layer removal brush; B. The descending device drives the oxide layer removal brush to move vertically downwards, so that the oxide layer removal brush drops to 3mm below the tin nozzle plane; C. XY conveying platform Drive the solder furnace to move back and forth, so that the oxide layer removal brush of the tin nozzle and the tin nozzle rub against each other to remove the oxide layer at the tin nozzle. During the cleaning process, the flux supply device continuously provides solder resist until the oxide layer is removed. brush office.

The above content is only a preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation and application scope. limits.

Claims (7)

1. An automatic cleaning device for tin nozzles, including a solder furnace, at least one tin nozzle is provided on the solder furnace, and it is characterized in that: it includes an oxide layer removal brush, which is set corresponding to the tin nozzle, and is used to remove the tin nozzle. the oxide layer; The flux feeding device is equipped with flux and is connected with the oxide layer removal brush to deliver the flux to the oxide layer removal brush; The XY conveying platform is connected with the drive of the solder furnace, which is used to drive the solder furnace to move to the oxide layer removal brush, and make relative movement with the oxide layer removal brush to remove the oxide layer; The control system is electrically connected with the flux feeding device and the XY conveying platform to realize the control of the movement of the XY conveying platform, transport the tin nozzle on the solder furnace to the oxide layer removal brush, and clean the oxide layer at the tin nozzle. During the cleaning process, the flux supply device is controlled to continuously deliver flux to the oxide layer removal brush. 2. The automatic tin nozzle cleaning device according to claim 1, characterized in that: the oxide layer removal brush is a stainless steel brush. 3. A tin nozzle automatic cleaning device according to claim 1 or 2, characterized in that: it includes a brush holder, the oxide layer removal brush is fixed or movably inserted in the brush holder, and the brush is fixed The top of the frame is provided with a lowering device driven and connected to it, so as to realize the lowering of the driving brush fixing frame and the oxide layer removal brush, and contact with the tin nozzle. 4. An automatic tin nozzle cleaning device according to claim 3, characterized in that: the descending device is a stroke cylinder. 5. The automatic tin nozzle cleaning device according to claim 1, characterized in that the flux supply device is connected to the oxide layer removal brush through a pipeline. 6. The automatic tin nozzle cleaning device according to claim 5, wherein the pipeline is a Teflon pipeline. 7. A cleaning method of an automatic cleaning device for tin nozzles as claimed in claim 3, characterized in that, comprising the following steps: A. When it is manually or electronically detected that the height of the solder paste at the product does not meet the process requirements, the XY conveying platform drives the solder furnace to move directly below the oxide layer removal brush; B. The descending device drives the oxide layer removal brush to move vertically downward, so that the oxide layer removal brush drops to 3mm below the tin nozzle plane; C. The XY conveying platform drives the solder furnace to move back and forth, so that the oxide layer removal brush of the tin nozzle and the tin nozzle rub against each other to remove the oxide layer at the tin nozzle. During the cleaning process, the flux feeding device continuously provides resistance. Flux to oxide layer removal brush.