CN108564159A - A kind of double-interface smart card - Google Patents
A kind of double-interface smart card Download PDFInfo
- Publication number
- CN108564159A CN108564159A CN201810742438.5A CN201810742438A CN108564159A CN 108564159 A CN108564159 A CN 108564159A CN 201810742438 A CN201810742438 A CN 201810742438A CN 108564159 A CN108564159 A CN 108564159A
- Authority
- CN
- China
- Prior art keywords
- double
- antenna
- anisotropic conductive
- conductive adhesive
- interface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Details Of Aerials (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The present invention provides a kind of double-interface smart card, including antenna stack and double-interface card chip layer, the antenna stack includes day line card base and antenna, the double-interface card chip layer includes double-interface card base and double interface chips, double interface chips include chip body and circuit board, the circuit board includes positive electrode and negative electrode, it further include anisotropic conductive adhesive, the positive electrode and the upper surface of the anisotropic conductive adhesive are electrically connected, one end of the antenna and the lower surface of the anisotropic conductive adhesive are electrically connected, the negative electrode and the upper surface of the anisotropic conductive adhesive are electrically connected.Compared with prior art, the present invention can realize that positive electrode is connected with one end of antenna and negative electrode is connected with the other end of antenna respectively.By anisotropic conductive adhesive, positioning and be fixed in double-interface card base that double interface chips consolidate, it is not easy to fall off.
Description
Technical field
The present invention relates to a kind of technical field of intelligent card more particularly to a kind of double-interface smart cards.
Background technology
The prior art produce at present double-interface smart card production process generally comprise it is following：It is the system of antenna stack first
Make, be embedded to copper enameled wire using ultrasonic wave usually on antenna substrate, forms antenna stack.Since the both ends of antenna must have
Have suitable relative position, to adapt to two pads of double interface modules, so one end of antenna can from outer ring across inner ring to
Up at the other end of suitable position of antenna, and this structure be easy to cause short circuit, and therefore, the antenna of coiling must use
Enameled wire to avoid antenna circuit short circuit.Next it by other composition materials of card base, is superimposed, goes forward side by side according to this in sequence
Row lamination.A semi-finished product greatly after lamination are put into punch machine, are punched into the double-interface card card base of standard.In double-interface card card base
Double interface modules where place's progress groove milling, expose two rear line heads of antenna, using craft by the end of a thread of antenna ends from antenna
Choose in base material, and antenna is pulled out into certain length from antenna substrate, two sections of antennas of pull-out are trimmed to equal length simultaneously
Make it vertically upward.Upper tin processing is carried out to the pad of double interface modules, hot melt adhesive film is pasted in the place other than pad.Pass through hand
Work or automaton weld together the pad of double interface modules and antenna upright on double-interface card card base, and will be welded
Double interface modules be placed in the good slot of double-interface card card base milling.Using hot-press equipment by the hot melt adhesive film in double interface modules
After thawing, finally double interface modules and double-interface card base are bonded together.Shortcoming is：It is welded in above-mentioned the end of a thread by antenna
It is connected to during the pad of double interface modules, multiple step needs have been manually done, such as take-up head, bracing wire, vertical line, trimming thread ends, band
There is the double-interface card base of upright the end of a thread toward putting in equipment, causes low output, quality to be difficult to ensure, in addition these operation difficulties
Greatly, high rejection rate.
Invention content
A kind of double-interface smart card that the object of the invention proposes to solve the above-mentioned problems.
It is achieved through the following technical solutions above-mentioned purpose：
The present invention provides a kind of double-interface smart card, including antenna stack and double-interface card chip layer, the antenna stack include
Its line card base and antenna, the double-interface card chip layer include double-interface card base and double interface chips, double interface chip packets
Include chip body and circuit board, the circuit board includes positive electrode and negative electrode, further includes anisotropic conductive adhesive, the positive electrode with
The upper surface of the anisotropic conductive adhesive is electrically connected, and one end of the antenna and the lower surface of the anisotropic conductive adhesive electrically connect
It connects, the negative electrode and the upper surface of the anisotropic conductive adhesive are electrically connected, the other end of the antenna and the unilateal conduction
The lower surface of glue is electrically connected, and the upper surface of the anisotropic conductive adhesive is connect with the lower surface of double interface chips, the list
It is connect to the lower surface of conducting resinl with the upper surface of the day line card base.
Further, one end of the antenna is located at the underface of the positive electrode, and the other end of the antenna is located at institute
State the underface of negative electrode.
Further, one end peripheral surface of the antenna is equipped with the first plane, and the other end peripheral surface of the antenna is equipped with
Second plane, first plane is parallel with the lower surface of the anisotropic conductive adhesive, second plane and the unilateal conduction
The lower surface of glue is parallel.
Further, the half of one end of the antenna is implanted in the upper surface of the day line card base, the antenna
The half of the other end is implanted in the upper surface of the day line card base.
Further, the double-interface card base is equipped with the placement through-hole for accommodating double interface chips, double interface cores
Piece is placed in the placement through-hole.
Further, the day line card base is equipped with the first conductor wire of wave linear shape and the second conduction of wave linear shape
One end of line, first conductor wire is connect with one end of the antenna, and the Part portions of first conductor wire are positioned at described
It places the underface of through-hole and is connect with the lower surface of the anisotropic conductive adhesive, the Part portions of first conductor wire are located at institute
The underface of positive electrode is stated, one end of second conductor wire is connect with the other end of the antenna, second conductor wire
Part portions are located at the underface for placing through-hole and are connect with the lower surface of the anisotropic conductive adhesive, second conductor wire
Part portions be located at the underface of the negative electrode.
Further, the peripheral surface of the Part portions of first conductor wire is equipped with third plane, second conductor wire
Part portions peripheral surface be equipped with fourth plane, the third plane is parallel with the lower surface of the anisotropic conductive adhesive, described
Fourth plane is parallel with the lower surface of the anisotropic conductive adhesive.
Further, the half of first conductor wire is implanted in the upper surface of the day line card base, and described second leads
The half of electric wire is implanted in the upper surface of the day line card base.
The beneficial effects of the invention are as follows：The both ends of antenna are connected with double interface chips by anisotropic conductive adhesive, are unidirectionally led
Electric glue is conductive in compression aspect, and non-conductive perpendicular to pressure direction, or insulating perpendicular to pressure direction one
Class adhesive.In this way in same anisotropic conductive adhesive, can realize respectively positive electrode be connected with one end of antenna and negative electrode with
The other end of antenna is connected.By anisotropic conductive adhesive, the positioning and be fixed in double-interface card base that double interface chips consolidate are not allowed
It is easy to fall off.Compared with prior art, realize that the both ends of antenna are connected with double interface chips by anisotropic conductive adhesive, instead of existing
The end of a thread of antenna is welded to the pad of double interface modules in technology, and then is omitted in welding process by having been manually done process：
Such as take-up head, bracing wire, vertical line, trimming thread ends process, to improve production efficiency；In addition anisotropic conductive adhesive has bonding effect,
Other hot melt adhesive is not needed.
Description of the drawings
Fig. 1 is the antenna schematic diagram of a layer structure of first embodiment of the invention；
Fig. 2 is the structural schematic diagram that the antenna stack of first embodiment of the invention is closed with double-interface card basigamy；
Fig. 3 is the cross-sectional view of first embodiment of the invention；
Fig. 4 is the antenna schematic diagram of a layer structure of second embodiment of the invention；
Fig. 5 is the structural schematic diagram that the antenna stack of second embodiment of the invention is closed with double-interface card basigamy；
Fig. 6 is the cross-sectional view of second embodiment of the invention；
Fig. 7 is the antenna ends of first embodiment of the invention and the first conductor wire of second embodiment and the second conductor wire
Sectional view.
Specific implementation mode
Below in conjunction with attached drawing, present invention is further described in detail with specific implementation mode：
Fig. 1 to Fig. 3 is one embodiment of the present invention, and the present invention provides a kind of double-interface smart card, including antenna stack 1
With double-interface card chip layer, the antenna stack 1 includes day line card base 11 and antenna 12, and the antenna 12 is implanted in by line burying machine
In the upper surface of the day line card base 11, the double-interface card chip layer includes double-interface card base 21 and double interface chips 22, institute
It includes positive electrode 221 and negative electrode 222 to state double interface chips, further includes anisotropic conductive adhesive 3, the anisotropic conductive adhesive 3 is vertical
Anisotropic conductive adhesive 3 is referred to as anisotropic conductive film, abbreviation ACF (Anisotropic Conductive Film), institute
It states positive electrode 221 to be electrically connected with the upper surface of the vertical anisotropic conductive adhesive 3 by hot pressing, one end 121 of the antenna 12
It is electrically connected with the lower surface of the vertical anisotropic conductive adhesive 3 by hot pressing, one end 121 of the antenna 12 is located at the positive electricity
The underface of pole 221, the negative electrode 222 is electrically connected by hot pressing with the upper surface of the vertical anisotropic conductive adhesive 3, described
The other end 122 of antenna 12 is electrically connected by the lower surface of hot pressing and the vertical anisotropic conductive adhesive 3, the antenna 12 it is another
One end 122 is located at the underface of the negative electrode 222, and the upper surface of the vertical anisotropic conductive adhesive 3 passes through hot pressing and double interfaces
The lower surface bonds of card chip 22, the lower surface of the vertical anisotropic conductive adhesive 3 are upper by hot pressing and the day line card base 11
Surface is bonded, and the double-interface card base 21 is equipped with the placement through-hole 211 for accommodating double interface chips 22, double interface chips
22 are placed in the placement through-hole 211.By above structure, the both ends of antenna 12 are by anisotropic conductive adhesive 3 and double interface chips
22 conductings, anisotropic conductive adhesive 3 is conductive in compression aspect, and non-conductive perpendicular to pressure direction, or perpendicular to pressure
A kind of adhesive of force direction insulation.In this way in same anisotropic conductive adhesive 3, positive electrode 221 and antenna 12 can be realized respectively
The conducting of one end 121 and negative electrode 222 and antenna 12 the conducting of the other end 122.By the gumminess of anisotropic conductive adhesive 3, double boundaries
Face chip 22 is firmly secured in double-interface card base 21, it is not easy to be fallen off.
Preferably, shown in Fig. 7,121 peripheral surface of one end of the antenna 12 is equipped with the first plane 1211, the antenna 12
122 peripheral surface of the other end is equipped with the second plane 1221, and first plane 1211 and the lower surface of the anisotropic conductive adhesive 3 are flat
Row, second plane 1221 are parallel with the lower surface of the anisotropic conductive adhesive 3.By above structure, when progress hot pressing fitting
When, anisotropic conductive adhesive 3 is bonded more preferably with one end 121 of antenna 12 and the other end 122, and conductive effect is more preferably.
Preferably, the half of one end 121 of the antenna 12 is implanted in the upper surface of the day line card base 11, the day
The half of the other end 122 of line 12 is implanted in the upper surface of the day line card base 11.By above structure, when progress hot pressing patch
When conjunction, anisotropic conductive adhesive 3 is bonded more preferably with one end 121 of antenna 12 and the other end 122, and conductive effect is more preferably.
Fig. 4 to fig. 6 be second embodiment, second embodiment and first embodiment difference lies in：The day line card base 11
Second conductor wire 14 of the first conductor wire 13 and wave linear shape equipped with wave linear shape, first conductor wire 13 and second
Conductor wire 14 is implanted in by line burying machine in the upper surface of the day line card base 11, one end of first conductor wire 13 with it is described
One end 121 of antenna 12 connects, the Part portions of first conductor wire 13 be located at the underface for placing through-hole 211 and with
The lower surface of the anisotropic conductive adhesive 3 connects, the Part portions of first conductor wire 13 be located at the positive electrode 221 just under
Side, one end of second conductor wire 14 are connect with the other end 122 of the antenna 12, the local portion of second conductor wire 13
Divide and is located at the underface for placing through-hole 211 and is connect with the lower surface of the anisotropic conductive adhesive 3, second conductor wire 14
Part portions be located at the underface of the negative electrode 222.Using the first conductor wire 13 and the second conductor wire 14 of wave linear shape,
When milling opens one and places through-hole, even if the first conductor wire 13 and the second conductor wire 14 have one section to be broken by milling, also other sections can
To contact conduction with anisotropic conductive adhesive 3, antenna 12 is set to be tended to remain on anisotropic conductive adhesive 3, stability is stronger.
Preferably, shown in Fig. 7, the peripheral surface of the Part portions of first conductor wire 13 is equipped with third plane 131, described
The peripheral surface of the Part portions of second conductor wire 14 is equipped with fourth plane 141, the third plane 131 and the anisotropic conductive adhesive
3 lower surface is parallel, and the fourth plane 141 is parallel with the lower surface of the anisotropic conductive adhesive 3.By above structure, when into
When row hot pressing is bonded, anisotropic conductive adhesive 3 is bonded more preferably with the first conductor wire 13 and the second conductor wire 14 respectively, and conductive effect is more
It is good.
Preferably, the half of first conductor wire 13 is implanted in the upper surface of the day line card base 11, and described second
The half of conductor wire 14 is implanted in the upper surface of the day line card base 11.It is single when carrying out hot pressing fitting by above structure
It is bonded more preferably with the first conductor wire 13 and the second conductor wire 14 respectively to conducting resinl 3, conductive effect is more preferably.
The above is only the preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-described embodiment,
All technical solutions belonged under thinking of the present invention all belong to the scope of protection of the present invention.It should be pointed out that for the art
For those of ordinary skill, several improvements and modifications without departing from the principles of the present invention should be regarded as the protection of the present invention
Range.
Claims (8)
1. a kind of double-interface smart card, which is characterized in that including antenna stack and double-interface card chip layer, the antenna stack includes day
Line card base and antenna, the double-interface card chip layer include double-interface card base and double interface chips, and double interface chips include
Chip body and circuit board, the circuit board include positive electrode and negative electrode, further include anisotropic conductive adhesive, the positive electrode and institute
The upper surface for stating anisotropic conductive adhesive is electrically connected, and one end of the antenna and the lower surface of the anisotropic conductive adhesive are electrically connected,
The negative electrode and the upper surface of the anisotropic conductive adhesive are electrically connected, the other end of the antenna and the anisotropic conductive adhesive
Lower surface is electrically connected, and the upper surface of the anisotropic conductive adhesive is connect with the lower surface of double interface chips, described unidirectionally to lead
The lower surface of electric glue is connect with the upper surface of the day line card base.
2. a kind of double-interface smart card according to claim 1, it is characterised in that：One end of the antenna be located at it is described just
The underface of electrode, the other end of the antenna are located at the underface of the negative electrode.
3. a kind of double-interface smart card according to claim 1 or 2, it is characterised in that：One end peripheral surface of the antenna
Equipped with the first plane, the other end peripheral surface of the antenna is equipped with the second plane, first plane and the anisotropic conductive adhesive
Lower surface it is parallel, second plane is parallel with the lower surface of the anisotropic conductive adhesive.
4. a kind of double-interface smart card according to claim 3, it is characterised in that：The half of one end of the antenna is implanted into
In the upper surface of the day line card base, the half of the other end of the antenna is implanted in the upper surface of the day line card base.
5. a kind of double-interface smart card according to claim 4, it is characterised in that：The double-interface card base, which is equipped with, accommodates institute
The placement through-hole of double interface chips is stated, double interface chips are placed in the placement through-hole.
6. a kind of double-interface smart card according to claim 5, it is characterised in that：The day line card base is equipped with wave linear shape
The first conductor wire and wave linear shape the second conductor wire, one end of first conductor wire and one end of the antenna connect
Connect, the Part portions of first conductor wire be located at the underface for placing through-hole and with the lower surface of the anisotropic conductive adhesive
Connection, the Part portions of first conductor wire are located at the underface of the positive electrode, one end of second conductor wire and institute
State the other end connection of antenna, the Part portions of second conductor wire be located at the underface for placing through-hole and with the list
It is connected to the lower surface of conducting resinl, the Part portions of second conductor wire are located at the underface of the negative electrode.
7. a kind of double-interface smart card according to claim 6, it is characterised in that：The Part portions of first conductor wire
Peripheral surface be equipped with third plane, the peripheral surfaces of the Part portions of second conductor wire is equipped with fourth plane, and the third is flat
Face is parallel with the lower surface of the anisotropic conductive adhesive, and the fourth plane is parallel with the lower surface of the anisotropic conductive adhesive.
8. a kind of double-interface smart card according to claim 7, it is characterised in that：The half of first conductor wire is implanted into
In the upper surface of the day line card base, the half of second conductor wire is implanted in the upper surface of the day line card base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810742438.5A CN108564159B (en) | 2018-07-09 | 2018-07-09 | Double-interface smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810742438.5A CN108564159B (en) | 2018-07-09 | 2018-07-09 | Double-interface smart card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108564159A true CN108564159A (en) | 2018-09-21 |
| CN108564159B CN108564159B (en) | 2023-11-24 |
Family
ID=63555691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810742438.5A Active CN108564159B (en) | 2018-07-09 | 2018-07-09 | Double-interface smart card |
Country Status (1)
| Country | Link |
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| CN (1) | CN108564159B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026011762A1 (en) * | 2024-07-12 | 2026-01-15 | 紫光同芯微电子有限公司 | Dual-interface smart card substrate layer, and dual-interface smart card |
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| TW200709069A (en) * | 2005-08-26 | 2007-03-01 | Gd Teco | Chip card and antenna structure |
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| US20080283615A1 (en) * | 2007-05-17 | 2008-11-20 | Advanced Microelectronic And Automation Technology Ltd. | Dual interface inlays |
| CN101420069A (en) * | 2008-11-20 | 2009-04-29 | 北京握奇数据系统有限公司 | Connection method for antenna and intelligent card and double interface smart card |
| JP2009205338A (en) * | 2008-02-27 | 2009-09-10 | Toppan Printing Co Ltd | Method of manufacturing dual interface ic card and dual interface ic card |
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| CN105453115A (en) * | 2013-06-07 | 2016-03-30 | 格马尔托股份有限公司 | Method for making crack-resistant electronic devices |
| CN208421876U (en) * | 2018-07-09 | 2019-01-22 | 东莞市芯安智能科技有限公司 | A kind of double-interface smart card |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040245347A1 (en) * | 2003-04-10 | 2004-12-09 | Sony Corporation | Method for making IC card |
| CN1969287A (en) * | 2004-06-16 | 2007-05-23 | 韩国造币公社 | Composite card and manufacturing method thereof |
| TW200709069A (en) * | 2005-08-26 | 2007-03-01 | Gd Teco | Chip card and antenna structure |
| US20080283615A1 (en) * | 2007-05-17 | 2008-11-20 | Advanced Microelectronic And Automation Technology Ltd. | Dual interface inlays |
| JP2009205338A (en) * | 2008-02-27 | 2009-09-10 | Toppan Printing Co Ltd | Method of manufacturing dual interface ic card and dual interface ic card |
| CN101420069A (en) * | 2008-11-20 | 2009-04-29 | 北京握奇数据系统有限公司 | Connection method for antenna and intelligent card and double interface smart card |
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| WO2026011762A1 (en) * | 2024-07-12 | 2026-01-15 | 紫光同芯微电子有限公司 | Dual-interface smart card substrate layer, and dual-interface smart card |
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| Publication number | Publication date |
|---|---|
| CN108564159B (en) | 2023-11-24 |
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