CN109449727A - Optical module parameter configuration method, device, device and storage medium - Google Patents
Optical module parameter configuration method, device, device and storage medium Download PDFInfo
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- CN109449727A CN109449727A CN201811603013.2A CN201811603013A CN109449727A CN 109449727 A CN109449727 A CN 109449727A CN 201811603013 A CN201811603013 A CN 201811603013A CN 109449727 A CN109449727 A CN 109449727A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 162
- 238000000034 method Methods 0.000 title claims abstract description 62
- 238000003860 storage Methods 0.000 title claims abstract description 14
- 230000008033 biological extinction Effects 0.000 claims abstract description 22
- 238000012360 testing method Methods 0.000 claims abstract description 11
- 238000004590 computer program Methods 0.000 claims description 7
- 238000012216 screening Methods 0.000 claims description 7
- 238000013519 translation Methods 0.000 claims description 4
- 238000011056 performance test Methods 0.000 claims description 3
- 230000001360 synchronised effect Effects 0.000 claims description 3
- 238000012797 qualification Methods 0.000 abstract description 6
- 230000006870 function Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/0014—Monitoring arrangements not otherwise provided for
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/0014—Measuring characteristics or properties thereof
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- Optics & Photonics (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Abstract
The application discloses a method, a device, equipment and a storage medium for configuring parameters of an optical module, wherein the method comprises the following steps: placing the optical module in a high-temperature environment, and when the MCU temperature pointer reaches a target working temperature, adjusting a laser core temperature value, a bias current value and a VEA value to enable the optical power, the extinction ratio and the channel cost of the optical module to meet target values; dynamically updating the laser core temperature value and the VEA value in a local database by taking the MCU temperature pointer in the optical module as an index according to the corresponding relation between the laser core temperature value and the VEA value in the database prestored on the server and the adjusted laser core temperature value and VEA value; and respectively testing the optical power, the extinction ratio and the channel cost of the optical module at normal temperature and low temperature, and if the performance is normal, completing parameter configuration. According to the method, the optical module with the EML laser is debugged at a high temperature and tested at a normal temperature and a low temperature through the steps, and products with high yield and high qualification rate can be manufactured.
Description
Technical field
The present invention relates to photoelectric communication fields, more particularly to a kind of optical module parameter configuration method, device, equipment and deposit
Storage media.
Background technique
Electroabsorption Modulated Laser (Electlro-absorption Modulated Laser, EML) has been internally integrated light
The components such as isolator, backlight monitoring, TEC cooling piece, thermistor have the characteristics that integrated level is high, rate is high, isolation is high,
Applied in optical module.
The reverse bias voltage (Voltage Electro-absorption, VEA) of EML laser is to influence optical module
The key factor of optical power and channel cost, usually since the debugging of VEA causes optical power that cannot meet the requirements.Again due to EML
The TEC of laser is greater than refrigerating efficiency in heating efficiency, i.e. electric current required for TEC is heated is much smaller than required for TEC refrigeration
Electric current, when environment temperature be greater than laser target temperature when, TEC refrigeration, and more be greater than laser target temperature when, TEC
Operating current it is bigger, cause the refrigerating efficiency of TEC poorer, and when environment temperature be less than laser target temperature when, TEC system
Heat, and more be less than laser target temperature when, the operating current of TEC is bigger, causes the heating efficiency of TEC poorer, and then lead
Optical module power consumption in high temperature or low temperature is caused to sharply increase.
Currently, in the optical module parameter configuration method of existing band EML laser, using environment temperature as reference value, setting
VEA minimum initial value, then under the premise of EML laser works wavelength is met the requirements, adjustment light cross point of eye pattern, extinction ratio,
Temperature, the value of Automatic optical power control, so that the light cross point of eye pattern of EML laser, extinction ratio, Output optical power, work
Wavelength meets requirement；The maximum value whether VEA reaches the electric absorption reverse bias voltage range of setting is detected again, if otherwise
VEA value is gradually increased, until light cross point of eye pattern, extinction ratio, Output optical power, bias current and light eye figure surplus are all satisfied
The claimed range of setting, and the lower VEA of full temperature and laser. operating temperature are without modification.When this method is easy to produce high/low temperature, light
It is bad that the parameters such as optical power, the channel cost of module have bigger probability product occur.
Therefore, how to solve in high/low temperature, the parameter of optical module has greater probability the bad problem of product occur, is this
Field technical staff technical problem urgently to be resolved.
Summary of the invention
In view of this, the purpose of the present invention is to provide a kind of optical module parameter configuration method, device, equipment and storages to be situated between
Matter, by debugging and room temperature low-temperature test, available high yield rate, qualification rate the optical module with EML laser through high temperature
High product.Its concrete scheme is as follows:
A kind of optical module parameter configuration method, comprising:
Optical module is placed under high temperature environment, when MCU temperature pointer reaches targeted operating temperature in the optical module,
EML laser DIE Temperature value, bias plasma flow valuve and VEA value are adjusted, the optical power, extinction ratio, channel generation of the optical module are made
Valence meets target value；
It is index with MCU temperature pointer in the optical module, keeps bias plasma flow valuve constant, according to depositing in advance on server
Pair of EML laser DIE Temperature value, VEA value in the database of storage after EML laser DIE Temperature value, VEA value and adjusting
It should be related to, dynamic updates EML laser DIE Temperature value, VEA value in local data base；
According to the parameter in updated local data base, the light function of the optical module is tested respectively under room temperature and low temperature
Rate, extinction ratio and channel cost complete parameter configuration if performance is normal.
Preferably, it in above-mentioned optical module parameter configuration method provided in an embodiment of the present invention, is placed on by optical module
Before under hot environment, further includes:
It is index, the parameter being arranged in pre-stored database in download server with MCU temperature pointer in optical module
Value, initial EML laser DIE Temperature value, bias plasma flow valuve and VEA value are arranged according to the parameter value downloaded.
Preferably, in above-mentioned optical module parameter configuration method provided in an embodiment of the present invention, in adjustment process, EML
When stepping reduces, VEA value is synchronous to be increased laser DIE Temperature value.
Preferably, in above-mentioned optical module parameter configuration method provided in an embodiment of the present invention, dynamic updates local data
EML laser DIE Temperature value, the VEA value stored in library, specifically includes:
EML laser DIE Temperature value, VEA value in database pre-stored on the server downloaded are subjected to data
Dynamic translation is to update local data base.
Preferably, in above-mentioned optical module parameter configuration method provided in an embodiment of the present invention, the MCU temperature in optical module
Spending pointer is index, and the parameter value being arranged in pre-stored database in download server is set according to the parameter value downloaded
Initial EML laser DIE Temperature value is set, before bias current and VEA value, further includes:
The MCU of optical module is configured in pre-stored database in download server, screens the light eye figure of the optical module
Crosspoint parameter；
If the smooth cross point of eye pattern parameter filtered out within the set range, is not adjusted the MCU.
Preferably, pre- in download server in above-mentioned optical module parameter configuration method provided in an embodiment of the present invention
The MCU of optical module is configured in the database first stored, before the light cross point of eye pattern parameter for screening the optical module, further includes:
According to the parameter that EML laser dispatches from the factory, screening meets the EML laser of operation wavelength requirement；
The EML laser filtered out is integrated in optical module.
Preferably, in above-mentioned optical module parameter configuration method provided in an embodiment of the present invention, the hot environment is quotient
70 degree of industry grade, 85 degree of technical grade.
The embodiment of the invention also provides a kind of optical module parameter configuration devices, comprising:
High temperature adjustment module, for placing optical module under high temperature environment, when MCU temperature pointer reaches in the optical module
When to targeted operating temperature, EML laser DIE Temperature value, bias plasma flow valuve and VEA value are adjusted, the light function of the optical module is made
Rate, extinction ratio, channel cost meet target value；
Database update module keeps bias plasma flow valuve not for being index with MCU temperature pointer in the optical module
Become, according to the EML laser after EML laser DIE Temperature value, VEA value and adjusting in database pre-stored on server
The corresponding relationship of DIE Temperature value, VEA value, dynamic update EML laser DIE Temperature value, VEA value in local data base；
Performance test module, for being surveyed respectively under room temperature and low temperature according to the parameter in updated local data base
The optical power, extinction ratio and channel cost for trying the optical module complete parameter configuration if performance is normal.
The embodiment of the invention also provides a kind of optical module parameters to configure equipment, including processor and memory, wherein institute
It states when processor executes the computer program saved in the memory and realizes such as above-mentioned optical module provided in an embodiment of the present invention
Method for parameter configuration.
The embodiment of the invention also provides a kind of computer readable storage mediums, for storing computer program, wherein institute
It states and realizes such as above-mentioned optical module parameter configuration method provided in an embodiment of the present invention when computer program is executed by processor.
It can be seen from the above technical proposal that a kind of optical module parameter configuration method provided by the present invention, device, equipment
And storage medium, this method comprises: optical module is placed under high temperature environment, when MCU temperature pointer reaches target in optical module
When operating temperature, adjust EML laser DIE Temperature value, bias plasma flow valuve and VEA value, make the optical power of optical module, extinction ratio,
Channel cost meets target value；It is index with MCU temperature pointer in optical module, keeps bias plasma flow valuve constant, according to server
EML laser DIE Temperature value in upper pre-stored database, VEA value and EML laser DIE Temperature value after adjusting,
The corresponding relationship of VEA value, dynamic update EML laser DIE Temperature value, VEA value in local data base；According to updated
Parameter in ground database tests the optical power, extinction ratio and channel cost of optical module, if performance respectively under room temperature and low temperature
Normally, then parameter configuration is completed.
The application debugs the optical module with EML laser at high temperature, by reading MCU temperature pointer in optical module,
Ensure product without abnormal, later by the parameter in database pre-stored on the server downloaded and after high temperature is debugged
Parameter be fitted to update local data base, the survey of room temperature low temperature is carried out according to the parameter in updated local data base
Examination can make high yield rate and the high product of qualification rate, greatly reduce the manufacturing cost of enterprise.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is one of the flow chart of optical module parameter configuration method provided in an embodiment of the present invention；
Fig. 2 is the two of the flow chart of optical module parameter configuration method provided in an embodiment of the present invention；
Fig. 3 is the structural schematic diagram of optical module parameter configuration device provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The present invention provides a kind of optical module parameter configuration method, as shown in Figure 1, comprising the following steps:
S101, optical module is placed under high temperature environment, when MCU temperature pointer reaches targeted operating temperature in optical module
When, EML laser DIE Temperature value, bias plasma flow valuve and VEA value are adjusted, the optical power, extinction ratio, channel cost of optical module are made
Meet target value；
S102, with MCU temperature pointer in optical module be index, keep bias plasma flow valuve it is constant, according on server in advance
EML laser DIE Temperature value in the database of storage, VEA value and EML laser DIE Temperature value after adjusting, VEA value
Corresponding relationship, dynamic update EML laser DIE Temperature value, VEA value in local data base；
S103, according to the parameter in updated local data base, test the light of optical module respectively under room temperature and low temperature
Power, extinction ratio and channel cost complete parameter configuration if performance is normal.
In above-mentioned optical module parameter configuration method provided in an embodiment of the present invention, optical module is placed on high temperature ring first
Under border, when MCU temperature pointer reaches targeted operating temperature in optical module, EML laser DIE Temperature value, bias current are adjusted
Value and VEA value, make the optical power, extinction ratio, channel cost of optical module meet target value；Then referred to MCU temperature in optical module
Needle is index, keeps bias plasma flow valuve constant, according to EML laser DIE Temperature in database pre-stored on server
The corresponding relationship of EML laser DIE Temperature value, VEA value after value, VEA value and adjusting, dynamic update EML in local data base
Laser DIE Temperature value, VEA value；Finally according to the parameter in updated local data base, under room temperature and low temperature respectively
Optical power, extinction ratio and the channel cost of test optical module complete parameter configuration if performance is normal.Pass through above-mentioned step in this way
Suddenly the optical module with EML laser is debugged at high temperature, by reading MCU temperature pointer in optical module, it is ensured that product does not have
It is abnormal, the parameter in database pre-stored on the server downloaded and the parameter after high temperature is debugged are intended later
It closes to update local data base, room temperature low-temperature test is carried out according to the parameter in updated local data base, can be fabricated to
Product rate height and the high product of qualification rate, greatly reduce the manufacturing cost of enterprise.
It should be noted that hot environment can be set to 70 degree of business level, 85 degree of technical grade.In addition, pre- on server
The database first stored is online database, and database pre-stored on the server downloaded can be used as local data
Library.
Further, in the specific implementation, in above-mentioned optical module parameter configuration method provided in an embodiment of the present invention,
Before execution step S101 places optical module under high temperature environment, as shown in Fig. 2, can also include:
S201, with MCU temperature pointer in optical module it is index, is arranged in download server in pre-stored database
Initial EML laser DIE Temperature value, bias plasma flow valuve and VEA value are arranged according to the parameter value downloaded for parameter value.
That is, the parameter value for needing to be arranged in pre-stored database in download server in advance, so that optical mode
Block is before adjustment parameter, and first by EML laser DIE Temperature value, bias plasma flow valuve and VEA value are set as in local data base
Initial value, convenient for later update operation.
In the specific implementation, in above-mentioned optical module parameter configuration method provided in an embodiment of the present invention, in adjustment process
In, one timing of optical power, EML laser DIE Temperature value and VEA value are linear, specifically, EML laser DIE Temperature
When stepping reduces, VEA value is synchronous to be increased value.
Further, in the specific implementation, in above-mentioned optical module parameter configuration method provided in an embodiment of the present invention, step
Rapid S102 dynamic updates EML laser DIE Temperature value, the VEA value stored in local data base, can specifically include: will download
EML laser DIE Temperature value, the VEA value stored in pre-stored database on good server carries out data dynamic translation
With more new database.
Assuming that MCU temperature pointer is selected as 1-100, EML laser DIE Temperature in pre-stored database on server
Value is 101-200；In practical applications, as index when being selected as 1 using MCU temperature pointer, after high temperature debugging, after adjusting
EML laser DIE Temperature value is 106, then according to EML laser DIE Temperature value in database pre-stored on server
With the corresponding relationship of the EML laser DIE Temperature value after adjusting, by the EML laser DIE Temperature value stored in database into
Row data dynamic translation, EML laser DIE Temperature value is 106-205 in updated local data base at this time.Similarly, VEA
Value is also such.
It should be noted that with the variation of EML laser DIE Temperature value, in low temperature, EML laser DIE Temperature
The difference of value and the running temperature of optical module reduces, and TEC power consumption can be reduced, to reduce the power consumption of optical module.
Further, in the specific implementation, in above-mentioned optical module parameter configuration method provided in an embodiment of the present invention,
It is index that step S201, which is executed, with MCU temperature pointer in optical module, is arranged in pre-stored database in download server
Parameter value, is arranged initial EML laser DIE Temperature value according to the parameter value downloaded, before bias current and VEA value, such as
Shown in Fig. 2, can also include:
The MCU of optical module is configured in pre-stored database on S301, download server, screens the light eye figure of optical module
Crosspoint parameter；If the light cross point of eye pattern parameter filtered out within the set range, is not adjusted MCU.
Further, in the specific implementation, in above-mentioned optical module parameter configuration method provided in an embodiment of the present invention,
In order to avoid leading to product bad phenomenon due to EML laser itself, as shown in Fig. 2, in the case where executing step S301
The MCU for carrying optical module in pre-stored database on server is configured, before the light cross point of eye pattern parameter for screening optical module,
Can also include:
S401, the parameter dispatched from the factory according to EML laser, screening meet the EML laser of operation wavelength requirement；It will filter out
EML laser be integrated in optical module.
Based on the same inventive concept, the embodiment of the invention also provides a kind of optical module parameter configuration devices, due to the light
The principle that module parameter configuration device solves the problems, such as is similar to a kind of aforementioned optical module parameter configuration method, therefore the optical module is joined
The implementation of number configuration device may refer to the implementation of optical module parameter configuration method, and overlaps will not be repeated.
In the specific implementation, optical module parameter configuration device provided in an embodiment of the present invention, as shown in figure 3, specifically including:
High temperature adjustment module 11, for placing optical module under high temperature environment, when MCU temperature pointer reaches in optical module
When targeted operating temperature, EML laser DIE Temperature value, bias plasma flow valuve and VEA value are adjusted, makes the optical power of optical module, disappear
Light ratio, channel cost meet target value；
Database update module 12, for being index with MCU temperature pointer in optical module, holding bias plasma flow valuve is constant,
According to the EML laser core after EML laser DIE Temperature value, VEA value and adjusting in database pre-stored on server
The corresponding relationship of heart temperature value, VEA value, dynamic update EML laser DIE Temperature value, the VEA value stored in local data base；
Performance test module 13, for being distinguished under room temperature and low temperature according to the parameter in updated local data base
Optical power, extinction ratio and the channel cost of test optical module complete parameter configuration if performance is normal.
In above-mentioned optical module parameter configuration device provided in an embodiment of the present invention, the phase of above three module can be passed through
Interaction can make high yield rate and qualification rate by three high temperature debugging, more new database, room temperature low-temperature test steps
High product greatly reduces the manufacturing cost of enterprise.
Corresponding contents disclosed in previous embodiment can be referred to about the more specifical course of work of above-mentioned modules,
This is no longer repeated.
Correspondingly, the embodiment of the invention also discloses a kind of optical module parameters to configure equipment, including processor and memory；
Wherein, optical module parameter configuration side disclosed in previous embodiment is realized when processor executes the computer program saved in memory
Method.
It can be with reference to corresponding contents disclosed in previous embodiment, herein no longer about the more specifical process of the above method
It is repeated.
Further, the invention also discloses a kind of computer readable storage mediums, for storing computer program；It calculates
Machine program realizes aforementioned disclosed optical module parameter configuration method when being executed by processor.
It can be with reference to corresponding contents disclosed in previous embodiment, herein no longer about the more specifical process of the above method
It is repeated.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with it is other
The difference of embodiment, same or similar part may refer to each other between each embodiment.For being filled disclosed in embodiment
It sets, for equipment, storage medium, since it is corresponded to the methods disclosed in the examples, so be described relatively simple, correlation
Place is referring to method part illustration.
Professional further appreciates that, unit described in conjunction with the examples disclosed in the embodiments of the present disclosure
And algorithm steps, can be realized with electronic hardware, computer software, or a combination of the two, in order to clearly demonstrate hardware and
The interchangeability of software generally describes each exemplary composition and step according to function in the above description.These
Function is implemented in hardware or software actually, the specific application and design constraint depending on technical solution.Profession
Technical staff can use different methods to achieve the described function each specific application, but this realization is not answered
Think beyond scope of the present application.
To sum up, a kind of optical module parameter configuration method, device, equipment and storage medium provided in an embodiment of the present invention, should
Method includes: to place optical module under high temperature environment, when MCU temperature pointer reaches targeted operating temperature in optical module, is adjusted
EML laser DIE Temperature value, bias plasma flow valuve and VEA value are saved, the optical power, extinction ratio, channel cost of optical module are met
Target value；It is index with MCU temperature pointer in optical module, keeps bias plasma flow valuve constant, according to pre-stored on server
The corresponding pass of EML laser DIE Temperature value, VEA value and EML laser DIE Temperature value, VEA value after adjusting in database
System, dynamic update EML laser DIE Temperature value, the VEA value stored in local data base；According to updated local data base
In parameter, test the optical power, extinction ratio and channel cost of optical module respectively under room temperature and low temperature, if performance is normal,
Complete parameter configuration.The optical module with EML laser is debugged at high temperature in this way, is referred to by reading MCU temperature in optical module
Needle, it is ensured that product is without abnormal, later by the parameter in database pre-stored on the server downloaded and through high temperature tune
Parameter after examination is fitted to update local data base, carries out room temperature low temperature according to the parameter in updated local data base
Test can make high yield rate and the high product of qualification rate, greatly reduce the manufacturing cost of enterprise.
Finally, it is to be noted that, herein, relational terms be used merely to by an entity or operation with it is another
A entity or operation distinguish, and without necessarily requiring or implying between these entities or operation, there are any this actual
Relationship or sequence.Moreover, the terms "include", "comprise" or any other variant thereof is intended to cover non-exclusive inclusion,
So that the process, method, article or equipment for including a series of elements not only includes those elements, but also including not having
The other element being expressly recited, or further include for elements inherent to such a process, method, article, or device.Do not having
There is the element limited in the case where more limiting by sentence "including a ...", it is not excluded that in the mistake including the element
There is also other identical elements in journey, method, article or equipment.
Optical module parameter configuration method, device, equipment and storage medium provided by the present invention have been carried out in detail above
It introduces, used herein a specific example illustrates the principle and implementation of the invention, the explanation of above embodiments
It is merely used to help understand method and its core concept of the invention；At the same time, for those skilled in the art, according to this
The thought of invention, there will be changes in the specific implementation manner and application range, in conclusion the content of the present specification is not answered
It is interpreted as limitation of the present invention.
Claims (10)
1. a kind of optical module parameter configuration method characterized by comprising
Optical module is placed under high temperature environment, when MCU temperature pointer reaches targeted operating temperature in the optical module, is adjusted
EML laser DIE Temperature value, bias plasma flow valuve and VEA value keep the optical power, extinction ratio, channel cost of the optical module full
Foot-eye value；
It is index with MCU temperature pointer in the optical module, keeps bias plasma flow valuve constant, according to pre-stored on server
The corresponding pass of EML laser DIE Temperature value, VEA value and EML laser DIE Temperature value, VEA value after adjusting in database
System, dynamic update EML laser DIE Temperature value, VEA value in local data base；
According to the parameter in updated local data base, tested respectively under room temperature and low temperature the optical module optical power,
Extinction ratio and channel cost complete parameter configuration if performance is normal.
2. optical module parameter configuration method according to claim 1, which is characterized in that optical module is being placed on high temperature ring
Before under border, further includes:
It is index, the parameter value being arranged in pre-stored database in download server, root with MCU temperature pointer in optical module
Initial EML laser DIE Temperature value, bias plasma flow valuve and VEA value are set according to the parameter value downloaded.
3. optical module parameter configuration method according to claim 1, which is characterized in that in adjustment process, EML laser
When stepping reduces, VEA value is synchronous to be increased DIE Temperature value.
4. optical module parameter configuration method according to claim 2, which is characterized in that dynamic updates in local data base
EML laser DIE Temperature value, VEA value, specifically include:
EML laser DIE Temperature value, VEA value in database pre-stored on the server downloaded are subjected to data dynamic
Translation is to update local data base.
5. optical module parameter configuration method according to claim 2, which is characterized in that MCU temperature refers in optical module
Needle is index, and the parameter value being arranged in pre-stored database in download server is arranged just according to the parameter value downloaded
The EML laser DIE Temperature value of beginning, before bias current and VEA value, further includes:
The MCU of optical module is configured in pre-stored database in download server, and the light eye figure for screening the optical module intersects
Point parameter；
If the smooth cross point of eye pattern parameter filtered out within the set range, is not adjusted the MCU.
6. optical module parameter configuration method according to claim 5, which is characterized in that be stored in advance in download server
Database in optical module MCU configuration, before the light cross point of eye pattern parameter for screening the optical module, further includes:
According to the parameter that EML laser dispatches from the factory, screening meets the EML laser of operation wavelength requirement；
The EML laser filtered out is integrated in optical module.
7. optical module parameter configuration method according to claim 1, which is characterized in that the hot environment is business level 70
Degree, 85 degree of technical grade.
8. a kind of optical module parameter configuration device characterized by comprising
High temperature adjustment module, for placing optical module under high temperature environment, when MCU temperature pointer reaches mesh in the optical module
When marking operating temperature, adjust EML laser DIE Temperature value, bias plasma flow valuve and VEA value, make the optical module optical power,
Extinction ratio, channel cost meet target value；
Database update module keeps bias plasma flow valuve constant, root for being index with MCU temperature pointer in the optical module
According to the EML laser core after EML laser DIE Temperature value, VEA value and adjusting in database pre-stored on server
The corresponding relationship of temperature value, VEA value, dynamic update EML laser DIE Temperature value, VEA value in local data base；
Performance test module, for testing institute respectively under room temperature and low temperature according to the parameter in updated local data base
The optical power, extinction ratio and channel cost for stating optical module complete parameter configuration if performance is normal.
9. a kind of optical module parameter configures equipment, which is characterized in that including processor and memory, wherein the processor is held
Optical module parameter configuration as described in any one of claim 1 to 7 is realized when the computer program saved in the row memory
Method.
10. a kind of computer readable storage medium, which is characterized in that for storing computer program, wherein the computer journey
Optical module parameter configuration method as described in any one of claim 1 to 7 is realized when sequence is executed by processor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811603013.2A CN109449727B (en) | 2018-12-26 | 2018-12-26 | Optical module parameter configuration method, device, equipment and storage medium |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811603013.2A CN109449727B (en) | 2018-12-26 | 2018-12-26 | Optical module parameter configuration method, device, equipment and storage medium |
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| Publication Number | Publication Date |
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| CN109449727A true CN109449727A (en) | 2019-03-08 |
| CN109449727B CN109449727B (en) | 2020-11-10 |
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