CN110012133A - A cover plate and its preparation method and lamination method - Google Patents
A cover plate and its preparation method and lamination method Download PDFInfo
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- CN110012133A CN110012133A CN201910161683.1A CN201910161683A CN110012133A CN 110012133 A CN110012133 A CN 110012133A CN 201910161683 A CN201910161683 A CN 201910161683A CN 110012133 A CN110012133 A CN 110012133A
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 238000003475 lamination Methods 0.000 title description 26
- 239000011521 glass Substances 0.000 claims abstract description 80
- 229910045601 alloy Inorganic materials 0.000 claims description 15
- 239000000956 alloy Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 10
- 229910001000 nickel titanium Inorganic materials 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 229910001285 shape-memory alloy Inorganic materials 0.000 abstract description 97
- 238000010030 laminating Methods 0.000 abstract description 8
- 238000005452 bending Methods 0.000 description 8
- 239000003292 glue Substances 0.000 description 6
- 238000001816 cooling Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
- H04M1/0268—Details of the structure or mounting of specific components for a display module assembly including a flexible display panel
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
- H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
技术领域technical field
本申请涉及柔性盖板技术领域，尤其涉及一种盖板、盖板的制备方法及一种贴合方法。The present application relates to the technical field of flexible cover plates, and in particular, to a cover plate, a preparation method of the cover plate, and a bonding method.
背景技术Background technique
随着显示技术的发展，柔性显示产品越来越成为众多手机厂商追捧的产品。在柔性显示器的生产过程中，需要将盖板与显示面板贴合在一起。With the development of display technology, flexible display products have become more and more sought after by many mobile phone manufacturers. In the production process of the flexible display, the cover plate and the display panel need to be bonded together.
现有技术方案中，将盖板与显示面板进行贴合采用的技术是直接将曲面状的盖板与显示面板进行贴合，由于曲面状的盖板设计到弯曲弧度，而盖板与显示面板进行贴合需要二者紧密贴合，这无疑使得贴合难度较大，贴合效率低。In the prior art solution, the technology used for laminating the cover plate and the display panel is to directly attach the curved cover plate to the display panel. Since the curved cover plate is designed to be curved, the cover plate and the display panel Fitting requires a close fit between the two, which undoubtedly makes the fit more difficult and the fit efficiency is low.
综上分析，现有技术方案中缺少一种贴合效率高的盖板及其制备方法、贴合方法。To sum up, there is a lack of a cover plate with high lamination efficiency and a preparation method and lamination method thereof in the prior art solutions.
发明内容SUMMARY OF THE INVENTION
本申请实施例提供一种盖板及其制备方法、贴合方法，以解决现有技术方案中盖板的贴合效率低的问题。The embodiments of the present application provide a cover plate and a preparation method and a lamination method thereof, so as to solve the problem of low lamination efficiency of the cover plate in the prior art solution.
第一方面，根据本发明实施例提供的一种盖板，包括：In a first aspect, a cover plate provided according to an embodiment of the present invention includes:
柔性玻璃板；flexible glass plate;
记忆合金框，位于所述柔性玻璃板内，所述记忆合金框包括初始状态和形变状态，处于初始状态的记忆合金框带动所述柔性玻璃板保持在曲面状，处于形变状态的记忆合金框带动所述柔性玻璃板保持在平面状。The memory alloy frame is located in the flexible glass plate. The memory alloy frame includes an initial state and a deformed state. The memory alloy frame in the initial state drives the flexible glass plate to maintain a curved shape, and the memory alloy frame in the deformed state drives the flexible glass plate. The flexible glass sheet remains flat.
在一个实施例中，所述柔性玻璃板包括主视面，在所述柔性玻璃板呈曲面状时，所述主视面包括相对设置的两个曲面区以及位于所述两个曲面区之间的平面区。In one embodiment, the flexible glass plate includes a main view surface, and when the flexible glass plate is in a curved shape, the main view surface includes two curved surface areas disposed opposite to each other and located between the two curved surface areas flat area.
在一个实施例中，所述两个曲面区的面积相等。In one embodiment, the areas of the two curved regions are equal.
在一个实施例中，对称设置于所述平面区的两侧。In one embodiment, the two sides of the plane area are symmetrically arranged.
在一个实施例中，所述平面区呈长方形，所述曲面区连接所述平面区的长边。In one embodiment, the flat area is rectangular, and the curved area connects the long sides of the flat area.
在一个实施例中，所述记忆合金框为圆角矩形框。In one embodiment, the memory alloy frame is a rounded rectangular frame.
在一个实施例中，所述记忆合金框的厚度小于所述柔性玻璃板的厚度。In one embodiment, the thickness of the memory alloy frame is less than the thickness of the flexible glass plate.
在一个实施例中，所述记忆合金框的材质为镍钛合金。In one embodiment, the memory alloy frame is made of nickel-titanium alloy.
第二方面，根据本发明实施例提供的上述盖板的制备方法，包括：In the second aspect, the method for preparing the above-mentioned cover plate provided according to the embodiment of the present invention includes:
控制记忆合金框保持在形变状态；Control the memory alloy frame to remain in a deformed state;
将保持在形变状态的记忆合金框嵌入柔性玻璃板，形成盖板。The memory alloy frame kept in the deformed state is embedded in a flexible glass plate to form a cover plate.
第二方面，根据本发明实施例提供的上述盖板的贴合方法，其特征在于，包括：In the second aspect, the above-mentioned method for laminating a cover plate provided according to an embodiment of the present invention is characterized in that, comprising:
将呈平面状的盖板贴合至显示面板，构成一贴合体，此时，盖板内的记忆合金框处于形变状态；The flat cover plate is attached to the display panel to form a fitting body, at this time, the memory alloy frame in the cover plate is in a deformed state;
控制所述记忆合金框恢复至初始状态，控制所述盖板保持在曲面状。The memory alloy frame is controlled to return to the initial state, and the cover plate is controlled to remain in a curved shape.
本申请实施例采用的上述至少一个技术方案能够达到以下有益效果：The above-mentioned at least one technical solution adopted in the embodiments of the present application can achieve the following beneficial effects:
本申请实施例提供的一种盖板及其制备方法、贴合方法，所述盖板包括柔性玻璃板和记忆合金框，其中，记忆合金框位于所述柔性玻璃板内，所述记忆合金框包括初始状态和形变状态，处于初始状态的记忆合金框带动所述柔性玻璃板保持在曲面状，处于形变状态的记忆合金框带动所述柔性玻璃板保持在平面状。通过本技术方案提供的盖板，可以将曲面盖板的贴合转化为平面盖板的贴合，降低贴合难度，提高了贴合效率。Embodiments of the present application provide a cover plate, a preparation method, and a laminating method thereof, wherein the cover plate includes a flexible glass plate and a memory alloy frame, wherein the memory alloy frame is located in the flexible glass plate, and the memory alloy frame is located in the flexible glass plate. It includes an initial state and a deformed state. The memory alloy frame in the initial state drives the flexible glass plate to maintain a curved surface, and the memory alloy frame in the deformed state drives the flexible glass plate to maintain a plane shape. With the cover plate provided by the technical solution, the lamination of the curved cover plate can be converted into the lamination of the flat cover plate, the difficulty of lamination is reduced, and the lamination efficiency is improved.
附图说明Description of drawings
此处所说明的附图用来提供对本申请的进一步理解，构成本申请的一部分，本申请的示意性实施例及其说明用于解释本申请，并不构成对本申请的不当限定。在附图中：The drawings described herein are used to provide further understanding of the present application and constitute a part of the present application. The schematic embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation of the present application. In the attached image:
图1为本申请实施例中一种盖板的结构示意图；1 is a schematic structural diagram of a cover plate in an embodiment of the application;
图2为本申请实施例中盖板的制备方法的流程图；2 is a flowchart of a method for preparing a cover plate in an embodiment of the application;
图3为本申请实施例中盖板的贴合方法的流程图；3 is a flowchart of a method for laminating a cover plate in an embodiment of the application;
图4-图5为本申请实施例中盖板与发光器件的贴合过程的结构示意图。4-5 are schematic structural diagrams of the lamination process of the cover plate and the light-emitting device in the embodiments of the present application.
具体实施方式Detailed ways
为使本申请的目的、技术方案和优点更加清楚，下面将结合本申请具体实施例及相应的附图对本申请技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。In order to make the objectives, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be clearly and completely described below with reference to the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.
以下结合附图，详细说明本申请各实施例提供的技术方案。The technical solutions provided by the embodiments of the present application will be described in detail below with reference to the accompanying drawings.
实施例1Example 1
参见图1所示，本申请实施例公开一种盖板，所述盖板包括柔性玻璃板11和记忆合金框12。记忆合金框12位于所述柔性玻璃板内，所述记忆合金框12包括初始状态和形变状态，处于初始状态的记忆合金框带动所述柔性玻璃板保持在曲面状，处于形变状态的记忆合金框带动所述柔性玻璃板保持在平面状。Referring to FIG. 1 , an embodiment of the present application discloses a cover plate, and the cover plate includes a flexible glass plate 11 and a memory alloy frame 12 . The memory alloy frame 12 is located in the flexible glass plate. The memory alloy frame 12 includes an initial state and a deformed state. The memory alloy frame in the initial state drives the flexible glass plate to maintain a curved surface, and the memory alloy frame in the deformed state The flexible glass plate is driven to maintain a plane shape.
在本发明实施例中，记忆合金框包括的两种状态(初始状态和形变状态，)在嵌入记忆合金框的盖板为平面状时，可通过使嵌入柔性玻璃板内的记忆合金框恢复初始状态从而带动柔性玻璃板的形状变为曲面状。记忆合金框可以为矩形框，也可以为“日”字型，本发明不对其具体形状做出限制，只要能带动柔性玻璃板的形状变为曲面状即可。In the embodiment of the present invention, when the memory alloy frame includes two states (initial state and deformed state), when the cover plate embedded in the memory alloy frame is flat, the memory alloy frame embedded in the flexible glass plate can be restored to its original state The state thus drives the shape of the flexible glass plate to become a curved surface. The memory alloy frame can be a rectangular frame or a "Sun" shape, and the present invention does not limit its specific shape, as long as the shape of the flexible glass plate can be driven to become a curved surface.
在此指出，嵌入柔性玻璃板的记忆合金框的初始状态为弯曲状态，而形变状态为平面状态，如此，在记忆合金框处于形变状态下嵌入柔性玻璃板之后，通过预设的处理方案，使得记忆合金框恢复初始状态，则记忆合金框通过恢复形变的力带动柔性玻璃板形成弯曲状态，因此，通过本方案，可在柔性玻璃板处于平面状态下实现盖板的贴合，基于平面状易于贴合，因此可以有效保障贴合的合格率；而当完成平面状的盖板贴合之后，通过预设的处理工艺，使得记忆合金框由形变状态恢复至初始状态，则通过记忆合金框的恢复形变的力带动盖板的形状变为曲面状。It is pointed out here that the initial state of the memory alloy frame embedded in the flexible glass plate is a curved state, and the deformation state is a planar state. In this way, after the memory alloy frame is embedded in the flexible glass plate in a deformed state, the preset processing scheme makes the When the memory alloy frame returns to the initial state, the memory alloy frame drives the flexible glass plate to form a bending state by restoring the deformation force. Therefore, through this solution, the cover plate can be attached when the flexible glass plate is in a flat state. Therefore, it can effectively ensure the qualified rate of lamination; and after the flat cover plate is attached, the memory alloy frame is restored from the deformed state to the initial state through the preset processing process, and the memory alloy frame The force of restoring the deformation causes the shape of the cover to become curved.
具体地，可以使记忆合金框的初始状态的主视面的大小为满足预设要求的曲面状态，再对初始状态的记忆合金框进行低温机械处理后发生形变，形成平面状态；将形成的平面状的记忆合金框嵌入柔性玻璃板之后，对其再次进行加热，当再次加热的温度高于预设温度后，所述合金框便可再次形成满足预设要求的曲面状态，同时带动柔性玻璃板发生形变。Specifically, the size of the main view surface of the initial state of the memory alloy frame can be a curved surface state that meets the preset requirements, and then the initial state of the memory alloy frame is deformed after low-temperature mechanical treatment to form a flat state; After the shape memory alloy frame is embedded in the flexible glass plate, it is heated again. When the reheating temperature is higher than the preset temperature, the alloy frame can again form a curved surface that meets the preset requirements, and at the same time drives the flexible glass plate. deformed.
在本发明实施例中，所述柔性玻璃板包括主视面，在所述柔性玻璃板呈曲面状时，所述主视面包括相对设置的两个曲面区以及位于所述两个曲面区之间的平面区。In the embodiment of the present invention, the flexible glass plate includes a main view surface, and when the flexible glass plate is in a curved shape, the main view surface includes two curved surface areas disposed opposite to each other and a surface located between the two curved surface areas. flat area between.
进一步地，在本发明实施例中，柔性玻璃板呈曲面形状时，位于平面区域两侧的两个曲面区的面积相同。Further, in the embodiment of the present invention, when the flexible glass plate is in the shape of a curved surface, the areas of the two curved surface regions located on both sides of the plane region are the same.
在本发明实施例中，所述相对设置的两个曲面区的面积相同，或者是相对设置的两个曲面区的形状相同，如此，使平面区两侧的两个曲面区对称。In the embodiment of the present invention, the two oppositely arranged curved surface regions have the same area, or the two oppositely arranged curved surface regions have the same shape, so that the two curved surface regions on both sides of the plane region are symmetrical.
进一步地，所述平面区呈长方形，所述曲面区连接所述平面区的长边。Further, the flat area is rectangular, and the curved area is connected to the long sides of the flat area.
在本发明实施例中，所述记忆合金框为圆角矩形框。In the embodiment of the present invention, the memory alloy frame is a rounded rectangular frame.
在本发明实施例中，所述记忆合金框的形状为矩形，而矩形的四个角均为圆角，如此能较好的吻合智能终端的圆角，有较高的适用性。In the embodiment of the present invention, the shape of the memory alloy frame is a rectangle, and the four corners of the rectangle are rounded corners, which can better match the rounded corners of the smart terminal, and has high applicability.
在本发明实施例中，所述记忆合金框的厚度小于所述柔性玻璃板的厚度。In the embodiment of the present invention, the thickness of the memory alloy frame is smaller than the thickness of the flexible glass plate.
在本申请实施例中，记忆合金框12嵌入柔性玻璃板11中，为了保持柔性玻璃板表面的平整，优选设置记忆合金框的厚度小于柔性玻璃板的厚度，如此，柔性玻璃板在厚度范围内可完全容纳记忆合金框，嵌入记忆合金框后，依然可以保持柔性玻璃板表面的平整，如可设置记忆合金框的厚度为0.5mm，柔性玻璃板的厚度为0.7mm。In the embodiment of the present application, the memory alloy frame 12 is embedded in the flexible glass plate 11. In order to keep the surface of the flexible glass plate flat, the thickness of the memory alloy frame is preferably set to be smaller than the thickness of the flexible glass plate. In this way, the flexible glass plate is within the thickness range. The memory alloy frame can be completely accommodated, and the surface of the flexible glass plate can still be kept flat after the memory alloy frame is embedded. For example, the thickness of the memory alloy frame can be set to 0.5mm, and the thickness of the flexible glass plate can be set to 0.7mm.
在本发明实施例中，所述记忆合金框的材质为镍钛合金。In the embodiment of the present invention, the material of the memory alloy frame is a nickel-titanium alloy.
在本申请实施例中，记忆合金框的初始状态在预设温度下形成，在此指出，根据记忆合金框的材质的不同，其形成的温度也有差异，在本申请实施例中，优选，记忆合金框的材质为镍钛合金，根据镍钛合金的性质，预设温度为38-42摄氏度，如38摄氏度、40摄氏度或者42摄氏度。In the embodiment of the present application, the initial state of the memory alloy frame is formed at a preset temperature. It is pointed out here that the temperature at which the memory alloy frame is formed is also different according to the different materials of the memory alloy frame. The material of the alloy frame is a nickel-titanium alloy. According to the properties of the nickel-titanium alloy, the preset temperature is 38-42 degrees Celsius, such as 38 degrees Celsius, 40 degrees Celsius or 42 degrees Celsius.
在本申请实施例中，记忆合金框12嵌入柔性玻璃板11的曲面区，作为一种优选的方式，可以将记忆合金框12镶嵌在柔性玻璃板11的曲面区的中间位置，可以有效带动所述柔性玻璃板发生有效弯折。In the embodiment of the present application, the memory alloy frame 12 is embedded in the curved area of the flexible glass plate 11. As a preferred method, the memory alloy frame 12 can be embedded in the middle of the curved area of the flexible glass plate 11, which can effectively drive all the The flexible glass plate is effectively bent.
在本申请实施例中，所述记忆合金框在预设温度下形成初始状态的曲面状，而被冷却机械处理后嵌入柔性玻璃板中，之后再加热至高于所述预设温度，则记忆合金框可消除在冷却机械处理时发生的形变，恢复其原来的形状，而恢复形变的力带动柔性玻璃板发生弯曲，具体为：In the embodiment of the present application, the memory alloy frame is formed into a curved shape in an initial state at a preset temperature, and is embedded in a flexible glass plate after being cooled and mechanically processed, and then heated to a temperature higher than the preset temperature, the memory alloy frame is The frame can remove the deformation that occurs during the cooling mechanical treatment and restore its original shape, and the force of the restored deformation causes the flexible glass sheet to bend, specifically:
1)将原始状态为曲面形状的记忆合金框11，经过冷却机械处理后，变为平面状的形变状态；1) The original state of the memory alloy frame 11 in the shape of a curved surface is transformed into a planar deformation state after cooling mechanical treatment;
2)将平面状的记忆合金框11嵌入柔性玻璃板；2) Embed the planar memory alloy frame 11 into the flexible glass plate;
3)加热嵌入记忆合金框之后的柔性玻璃板至超过预设温度，则记忆合金框恢复形变的力带动柔性玻璃板发生形变。在本申请实施例中，记忆合金框在被加热至预设温度后，发生形变，经过冷却机械处理，变为平面形状的记忆合金框，嵌入柔性玻璃板之后，再次被加热至高于所述预设温度，则记忆合金框恢复至初始状态(曲面状态)，因此，当将盖板与发光器件(可以但比仅限于柔性OLED)贴合时，可以先将平面状的盖板与发光器件贴合，当完成平面间的贴合后，再加热至超过预设温度，以形成曲面状的显示屏，因此，本方案提供的盖板可以有效简化贴合工艺，将弯曲盖板的贴合转化为平面盖板的贴合，降低了盖板的贴合难度，提高了贴合效率，同时有效提高了产品的良率。3) Heating the flexible glass plate embedded in the memory alloy frame to a temperature exceeding the preset temperature, the force of the memory alloy frame restoring deformation drives the flexible glass plate to deform. In the embodiment of the present application, after being heated to a preset temperature, the memory alloy frame is deformed, and after mechanical cooling, it becomes a memory alloy frame with a flat shape, and after being embedded in a flexible glass plate, it is heated again to a temperature higher than the predetermined temperature. If the temperature is set, the memory alloy frame will return to the initial state (curved state). Therefore, when the cover plate is attached to the light-emitting device (which can be but limited to flexible OLED), the flat cover plate and the light-emitting device can be attached first. After the lamination between the planes is completed, it is heated to a temperature exceeding the preset temperature to form a curved display screen. Therefore, the cover plate provided by this solution can effectively simplify the lamination process and convert the lamination of curved cover plates into For the lamination of the flat cover, the difficulty of lamination of the cover is reduced, the lamination efficiency is improved, and the yield of the product is effectively improved.
实施例2Example 2
基于上述实施例阐述的盖板，本申请实施例提供上述盖板的制备方法，具体可包括如下步骤：Based on the cover plates described in the foregoing embodiments, the embodiments of the present application provide a method for preparing the foregoing cover plates, which may specifically include the following steps:
步骤S21、控制记忆合金框保持在形变状态，所述处于形变状态的记忆合金框呈平整状，所述记忆合金框还包括呈弯曲状的初始状态；Step S21, controlling the memory alloy frame to be kept in a deformed state, the memory alloy frame in the deformed state is in a flat shape, and the memory alloy frame further includes an initial state in a curved shape;
在本申请实施例中，控制记忆合金框保持在形变状态，所述处于形变状态的记忆合金框呈平整状，所述记忆合金框还包括呈弯曲状的初始状态。In the embodiment of the present application, the control memory alloy frame is kept in a deformed state, the memory alloy frame in the deformed state is in a flat shape, and the memory alloy frame further includes an initial state in a curved shape.
具体地，在本申请实施例中，可通过加热所述记忆合金框，如加热至38-42摄氏度，如38摄氏度、40摄氏度或42摄氏度；之后，对所述记忆合金框进行冷却机械处理，将记忆合金框冷却至15-20摄氏度(如15摄氏度、17.5摄氏度或者20摄氏度)后，再进行机械处理，如施加外力进行压制，弯曲状的合金框再次变为平面状的合金框。使记忆合金框保持在形变状态，即平整状态；而记忆合金框的初始状态为满足后续弯曲角度的弯曲状态。Specifically, in the embodiment of the present application, the memory alloy frame can be heated, for example, heated to 38-42 degrees Celsius, such as 38 degrees Celsius, 40 degrees Celsius, or 42 degrees Celsius; After cooling the memory alloy frame to 15-20 degrees Celsius (such as 15 degrees Celsius, 17.5 degrees Celsius or 20 degrees Celsius), and then performing mechanical treatment, such as applying external force to press, the curved alloy frame becomes a flat alloy frame again. The memory alloy frame is kept in a deformed state, that is, a flat state; and the initial state of the memory alloy frame is a bending state that satisfies the subsequent bending angle.
在此指出，所述柔性玻璃板的尺寸要大于预设贴合的发光器件的尺寸，优选地，主视面的平面区的尺寸要大于要贴合的发光器件的尺寸，如此，能保证在贴合后发光器件产生的图像不被遮挡，从而均能有效显示。其中，柔性玻璃板，可以是在薄玻璃板的外侧贴附一层透明塑料构成，此方法制备的柔性玻璃版可以得到满足预设要求的弯曲的技术效果。It is pointed out here that the size of the flexible glass plate should be larger than the size of the light-emitting device to be bonded. The images generated by the light-emitting devices after the lamination are not blocked, so that they can be effectively displayed. The flexible glass plate can be formed by attaching a layer of transparent plastic to the outer side of the thin glass plate, and the flexible glass plate prepared by this method can obtain the technical effect of bending that meets the preset requirements.
步骤S23、将保持在形变状态的记忆合金框嵌入柔性玻璃板，形成盖板。Step S23, embedding the memory alloy frame kept in the deformed state into the flexible glass plate to form a cover plate.
在本发明实施例中，将保持在形变状态(即“平整状态”)的记忆合金框嵌入柔性玻璃板，相比于嵌入初始形态(弯曲状态)的记忆合金框而言，本方案较容易嵌入，且可有效保证嵌入记忆合金框之后的柔性玻璃板的性能。本方案为了简化嵌入的难度且保持柔性玻璃板表面的平整，可设置记忆合金框的厚度小于柔性玻璃板的厚度，如此，可在厚度方向上使得记忆合金框完全被嵌入柔性玻璃板的内部，从而可有效保证柔性玻璃板表面的平整，在本申请实施例中，记忆合金框的厚度为0.45mm，柔性玻璃板的厚度为0.65mm等。In the embodiment of the present invention, the memory alloy frame kept in the deformed state (ie, "flat state") is embedded in the flexible glass plate. Compared with the memory alloy frame embedded in the initial shape (bending state), this solution is easier to embed. , and can effectively ensure the performance of the flexible glass plate embedded in the memory alloy frame. In this solution, in order to simplify the difficulty of embedding and keep the surface of the flexible glass plate flat, the thickness of the memory alloy frame can be set to be smaller than the thickness of the flexible glass plate. In this way, the memory alloy frame can be completely embedded in the interior of the flexible glass plate in the thickness direction. Therefore, the surface of the flexible glass plate can be effectively guaranteed to be flat. In the embodiment of the present application, the thickness of the memory alloy frame is 0.45 mm, and the thickness of the flexible glass plate is 0.65 mm.
在此指出，列举记忆合金框的厚度及柔性玻璃板的厚度仅仅是为了描述二者之间的关系，并非对记忆合金框的厚度或者柔性玻璃板的厚度的具体限定。It is pointed out here that listing the thickness of the memory alloy frame and the thickness of the flexible glass plate is only to describe the relationship between the two, and does not specifically limit the thickness of the memory alloy frame or the thickness of the flexible glass plate.
在本申请实施例中，在柔性玻璃板上预设记忆合金框的贴合区域，其中，贴合区域的尺寸可以根据要贴合的发光器件的尺寸的不同而不同，也可以根据设置的屏幕的大小的不同而不同，在此对其不做具体限定。In the embodiment of the present application, the bonding area of the memory alloy frame is preset on the flexible glass plate, wherein the size of the bonding area can be different according to the size of the light-emitting device to be bonded, or according to the set screen It varies with the size, and is not specifically limited here.
在本申请实施例中，将所述记忆合金框嵌入所述柔性玻璃板的贴合区域，具体方法可为：In the embodiment of the present application, the memory alloy frame is embedded in the bonding area of the flexible glass plate, and the specific method may be:
1)在所述贴合区域设置深度大于所述记忆合金框的厚度的凹槽；1) A groove with a depth greater than the thickness of the memory alloy frame is arranged in the bonding area;
本申请实施例中，在柔性玻璃板的贴合区域设置的凹槽的深度大于所述记忆合金框的厚度，以供记忆合金框可以完全嵌入在柔性玻璃板中。In the embodiment of the present application, the depth of the groove provided in the bonding area of the flexible glass plate is greater than the thickness of the memory alloy frame, so that the memory alloy frame can be completely embedded in the flexible glass plate.
2)在所述凹槽内涂覆胶材质；2) Coating glue material in the groove;
在上述步骤设置的凹槽内涂覆胶材质，作为一种优选的实施方式，所述胶材质为透明的胶材质。涂覆的胶材质的厚度不小于记忆合金框的厚度与凹槽的深度的差值，如此，可有效保证柔性玻璃板表面的平整。A glue material is coated in the grooves set in the above steps. As a preferred embodiment, the glue material is a transparent glue material. The thickness of the coated glue material is not less than the difference between the thickness of the memory alloy frame and the depth of the groove, so that the surface of the flexible glass plate can be effectively guaranteed to be flat.
3)将平面状的记忆合金框放置于所述胶材质，并压合。3) Place the planar memory alloy frame on the glue material and press it together.
在本申请实施例中，优选，将记忆合金框压合在所述凹槽的底部，如此，记忆合金框到柔性玻璃板的上、下表面的距离差别不大，利于后续通过记忆合金框恢复形变的力带动柔性玻璃板发生形变。In the embodiment of the present application, it is preferable to press the memory alloy frame to the bottom of the groove, so that the distance between the memory alloy frame and the upper and lower surfaces of the flexible glass plate is not much different, which is conducive to subsequent recovery through the memory alloy frame The deforming force drives the flexible glass plate to deform.
采用本申请实施例所描述的方法制备的盖板，在与发光器件贴合时，直接采用平面状的盖板与发光器件贴合，在贴合完成之后，对由盖板与发光器件形成的贴合体加热至超过预设温度，则在记忆合金框的“记忆”作用下，贴合体的平面状的盖板的弯折区域弯曲至预设角度，即形成曲面状的柔性显示屏。When the cover plate prepared by the method described in the embodiments of the present application is attached to the light-emitting device, a flat cover plate is directly attached to the light-emitting device. When the bonding body is heated to a temperature exceeding the preset temperature, under the "memory" effect of the memory alloy frame, the bending area of the flat cover plate of the bonding body is bent to a preset angle, that is, a curved flexible display screen is formed.
采用本申请所描述的方法制备的盖板，将现有技术方案中的曲面贴合技术转化为平面贴合技术，贴合方法简单，贴合效率高，有效提高了贴合良率。The cover plate prepared by the method described in this application converts the curved surface lamination technology in the prior art solution into a flat lamination technology, the lamination method is simple, the lamination efficiency is high, and the lamination yield is effectively improved.
实施例3Example 3
基于上述实施例阐述的盖板及盖板的制备方法，本申请实施例提供一种贴合方法，用于将上述盖板或者上述制备方法制备的盖板贴合至发光器件上，参见图3所示，本申请实施例公开的贴合方法包括：Based on the cover plate and the preparation method of the cover plate described in the above embodiments, the embodiment of the present application provides a bonding method for bonding the above cover plate or the cover plate prepared by the above preparation method to a light-emitting device, see FIG. 3 . As shown, the bonding methods disclosed in the embodiments of the present application include:
步骤S31、将呈平面状的盖板贴合至显示面板，此时，盖板内的记忆合金框处于形变状态；Step S31, attaching the flat cover plate to the display panel, at this time, the memory alloy frame in the cover plate is in a deformed state;
在本申请实施例中，将平面状的盖板贴合至显示面板，形成参见图4所示的结构示意图，具体地，贴合位置具体可为：In the embodiment of the present application, the planar cover plate is attached to the display panel to form the schematic structural diagram shown in FIG. 4 . Specifically, the attachment position may be:
呈平面状的盖板的中心与显示面板的中心重叠，如此贴合，可有效保障显示面板被有效贴合在柔性玻璃板的中心区域。The center of the flat cover plate overlaps with the center of the display panel, and such bonding can effectively ensure that the display panel is effectively bonded to the center area of the flexible glass plate.
在本申请实施例中，采用平面状的盖板与显示面板贴合，由于盖板与显示面板均为平面状，因此可以直接采用两平面直接贴合的贴合方式，从而更易于保证贴合效率，且较容易实施。In the embodiment of the present application, a flat cover plate is used for bonding with the display panel. Since the cover plate and the display panel are both flat, a bonding method in which two planes are directly bonded can be directly used, thereby making it easier to ensure bonding Efficient and easier to implement.
步骤S33、控制所述记忆合金框恢复至初始状态，控制所述盖板保持在曲面状。Step S33 , controlling the memory alloy frame to return to the initial state, and controlling the cover plate to remain in a curved shape.
具体的，在本申请实施例中，可通过加热所述记忆合金框，从而使其恢复至初始状态。具体的，被加热至的温度为42-48摄氏度，如42摄氏度、45摄氏度或者48摄氏度。Specifically, in the embodiments of the present application, the memory alloy frame can be heated to restore it to the initial state. Specifically, the temperature to be heated is 42-48 degrees Celsius, such as 42 degrees Celsius, 45 degrees Celsius or 48 degrees Celsius.
在本申请实施例中，盖板的中镶嵌有记忆合金框，所述记忆合金框对其在预设温度下发生的形变具有“记忆”的能力，因此，当盖板与显示面板贴合形成的贴合体被加热至预设温度设置超过预设温度时，记忆合金框恢复其初始状态，即弯曲状态，同时带动盖板的弯折区域弯曲至预设角度，以形成包括盖板和显示面板的柔性曲面结构，参见图5所示的结构示意图。In the embodiment of the present application, a memory alloy frame is embedded in the cover plate, and the memory alloy frame has the ability to “remember” its deformation at a preset temperature. Therefore, when the cover plate is attached to the display panel to form When the bonding body is heated to a preset temperature and exceeds the preset temperature, the memory alloy frame returns to its initial state, that is, the bending state, and at the same time drives the bending area of the cover plate to bend to a preset angle, so as to form a cover plate and a display panel. The flexible curved surface structure, see the schematic diagram of the structure shown in Figure 5.
本申请实施例提供的贴合方法，利用平面状的盖板中镶嵌的记忆合金框对其在预设温度下发生的形变的“记忆”作用，使得曲面盖板与平面发光器件的贴合由曲面贴合转化为平面贴合，提高了贴合效率，提高了产品的良率。The bonding method provided in the embodiment of the present application utilizes the "memory" effect of the memory alloy frame embedded in the flat cover plate on its deformation at a preset temperature, so that the bonding between the curved cover plate and the flat light-emitting device is achieved by The surface lamination is converted into a flat lamination, which improves the lamination efficiency and improves the product yield.
本领域内的技术人员应明白，本申请的实施例可提供为盖板、制备方法及忒和方法同样可以适用于非显示器件的盖板、制备方法及其贴合方法。与此同时，本申请实施例中的发光器件可以但不仅限为柔性OLED。Those skilled in the art should understand that the embodiments of the present application can be provided as a cover plate, a preparation method, and the method can also be applied to a cover plate of a non-display device, a preparation method and a bonding method thereof. Meanwhile, the light-emitting device in the embodiments of the present application may be, but not limited to, a flexible OLED.
对本申请所公开的实施例的上述说明，使本领域技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此，本发明将不会被限制于本文所示的这些实施例，而使要符合与本文所公开的原理和新颖特定相一致的最宽的范围。The above description of the embodiments disclosed in this application enables any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
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Application publication date: 20190712 Assignee: YUNGU (GU'AN) TECHNOLOGY Co.,Ltd.|KUNSHAN GO-VISIONOX OPTO-ELECTRONICS Co.,Ltd.|KUNSHAN NEW FLAT PANEL DISPLAY TECHNOLOGY CENTER Co.,Ltd. Assignor: BAZHOU YUNGU ELECTRONIC TECHNOLOGY Co.,Ltd. Contract record no.: X2019990000154 Denomination of invention: Cover plate and preparation method and laminating method thereof License type: Common License Record date: 20191030 |
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