CN110012603A - The method for die cutting and flexible circuit board of flexible circuit board - Google Patents
The method for die cutting and flexible circuit board of flexible circuit board Download PDFInfo
- Publication number
- CN110012603A CN110012603A CN201811613540.1A CN201811613540A CN110012603A CN 110012603 A CN110012603 A CN 110012603A CN 201811613540 A CN201811613540 A CN 201811613540A CN 110012603 A CN110012603 A CN 110012603A
- Authority
- CN
- China
- Prior art keywords
- flexible circuit
- circuit board
- punched
- hole
- die cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000004080 punching Methods 0.000 claims abstract description 21
- 238000005728 strengthening Methods 0.000 claims abstract description 21
- 238000003475 lamination Methods 0.000 claims description 9
- 239000002356 single layer Substances 0.000 claims description 8
- 239000010410 layer Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 230000003014 reinforcing effect Effects 0.000 description 23
- 239000000758 substrate Substances 0.000 description 11
- 230000002787 reinforcement Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention provides the method for die cutting of flexible circuit board and flexible circuit boards, the method for die cutting of the flexible circuit board is used to be punched formation with flexible circuit board ontology and flexible circuit board ontology front portion is covered with the flexible circuit board of strengthening course, the method for die cutting of flexible circuit board includes: to correspond to be punched into advance at the step edge of flexible circuit board ontology and strengthening course on flexible circuit boards half-finished product to keep away a hole positioned at the flexible circuit board two sides, encloses the edge for being set as that the side for keeping away a hole is the flexible circuit board ontology；The external periphery outline that flexible circuit board is corresponded on flexible circuit boards half-finished product is punched into the flexible circuit board.The present invention is punched in advance by the intersection of the outline edge at edge and flexible circuit board ontology in strengthening course and keeps away a hole, so that strengthening course edge is not tearable when direct punching flexible circuit board shape.
Description
[technical field]
The present invention relates to flexible circuit board field more particularly to the method for die cutting and flexible circuit board of flexible circuit board.
[background technique]
When the prior art makes flexible circuit board, first passes through interior casement and be punched on flexible circuit boards half-finished product in formation
Hole, then be punched on flexible circuit boards half-finished product by epimorph and form flexible circuit board shape, flexible circuit boards half-finished product packet
It includes and is attached at flexible circuit board for being punched to be formed for being punched to form the substrate of flexible circuit board ontology and be attached on substrate
The reinforcing film of strengthening course on ontology, it is whole to flexible circuit board by epimorph since there are high and low fall with substrate for reinforcing film
When a punching, reinforcing film edge is easy to tear.
Therefore, it is necessary to provide a kind of method for die cutting of flexible circuit board to solve the above problems.
[summary of the invention]
The flexibility that reinforcing film is torn when punching flexible circuit board shape is avoided one of the objects of the present invention is to provide a kind of
The method for die cutting of circuit board.
Technical scheme is as follows: a kind of method for die cutting of flexible circuit board, has flexible electrical for being punched to be formed
Road plate ontology and flexible circuit board ontology front portion are covered with the flexible circuit board of strengthening course, comprising:
It is corresponded on flexible circuit boards half-finished product and is punched into position in advance at the step edge of flexible circuit board ontology and strengthening course
A hole is kept away in the flexible circuit board two sides, encloses the side for being set as that the side for keeping away a hole is the flexible circuit board ontology
Edge；
The external periphery outline that flexible circuit board is corresponded on flexible circuit boards half-finished product is punched into the flexible circuit board.
Preferably, the method for die cutting of the flexible circuit board further includes being punched into flexible electrical on flexible circuit boards half-finished product
The inner hole of road plate；The inner hole punching and a hole of keeping away are punched while carrying out.
Preferably, the inner hole and a hole of keeping away are punched to be formed by the first blanking die, and first blanking die has
The first cutting head of the inner hole is formed and for being punched the second cutting head for keeping away a hole described in formation for being punched.
Preferably, the shape of the flexible circuit board is punched to be formed by the second blanking die, and first blanking die has
For being punched the third cutting head for forming the external periphery outline of flexible circuit board.
Preferably, a hole of keeping away includes single layer cut hole and lamination cut hole, and the single layer cut hole is corresponding flexible circuit board
The local external periphery outline of ontology is punched to be formed, and lamination cut hole is that correspondence is superimposed by strengthening course with what flexible circuit board ontology was constituted
The local external periphery outline of layer is punched to be formed.
Preferably, frontal projected area and the lamination cut hole of the single layer cut hole on the flexible circuit boards half-finished product
The frontal projected area on the flexible circuit boards half-finished product it is equal.
Preferably, a hole of keeping away is in rectangle.
Preferably, the method for die cutting of the flexible circuit board for rushing simultaneously on a flexible circuit boards half-finished product
Cut out multiple flexible circuit boards.
The second object of the present invention is to provide a kind of flexible circuit board, including flexible circuit board ontology and is affixed on described soft
Property circuit board body on strengthening course, the flexible circuit board using flexible circuit board as described above method for die cutting be made.
Preferably, thickness 0.3mm ± 0.05mm of reinforcing film.
The beneficial effects of the present invention are: before the external periphery outline of punching flexible circuit board, first correspond to reinforcing film
It is punched into advance at the edge step of edge and flexible circuit board ontology and keeps away a hole, in this way, in the shape of punching flexible circuit board,
Stress can be reduced, effectively prevents leading to reinforcement film edge due to reinforcing film and flexible circuit board ontological existence high and low fall
The phenomenon that being torn at step.
[Detailed description of the invention]
Fig. 1 is the floor map of flexible circuit boards half-finished product of the present invention, and dotted line indicates piercing edge line in figure；
Fig. 2 is the partial enlarged view in Fig. 1 at A；
Fig. 3 is the floor map of flexible circuit board of the invention；
Fig. 4 is the flow chart of the method for die cutting of flexible circuit board of the embodiment of the present invention.
100, flexible circuit boards half-finished product；1, substrate；2, reinforcing film；10, flexible circuit board；101, inner hole；11, flexible electrical
Road plate ontology；12, strengthening course；20, a hole is kept away；201, single layer cut hole；202, lamination cut hole.
[specific embodiment]
The invention will be further described for 1-2 and embodiment with reference to the accompanying drawing.
Fig. 1-Fig. 4 is please referred to, flexible circuit board 10 includes flexible circuit board ontology 11 and is affixed on flexible circuit board ontology 11
On strengthening course 12, strengthening course 12 is used to reinforce the intensity of 11 major part of flexible circuit board ontology, flexible circuit boards half-finished product
100 include for be punched formed flexible circuit board ontology 11 substrate 1 and be attached on substrate 1 for be punched form strengthening course
12 reinforcing film 2, there are high and low fall with substrate 1 for reinforcing film 2.Inner hole 101, several inner holes are offered on flexible circuit board 10
101 are located on the region for needing reinforcement on flexible circuit board 10, and several inner holes 101, which are located on flexible circuit board 10, does not need reinforcement
Region on, the method for die cutting of flexible circuit board 10 are as follows:
S11, the inner hole 101 for being punched into flexible circuit board 10 on flexible circuit boards half-finished product 100 simultaneously and corresponding flexibility
It is punched into advance at circuit board body 11 and the edge step of reinforcing film 2 and keeps away a hole 20 positioned at 10 two sides of flexible circuit board, keep away position
The side in hole 20 is the edge of flexible circuit board ontology 11；；
S12, the external periphery outline that flexible circuit board 10 is corresponded on flexible circuit boards half-finished product 100 are punched into the flexibility
Circuit board 10.
In the present embodiment, before the external periphery outline of punching flexible circuit board 10, first correspond to the edge of strengthening course 12 with
It is punched into advance at the edge step of flexible circuit board ontology 11 and keeps away a hole 20 positioned at 10 two sides of flexible circuit board, in this way, rushing
When cutting the shape of flexible circuit board 10, stress can be reduced, effectively prevents depositing due to reinforcing film 2 and flexible circuit board ontology 11
Lead to the phenomenon that tearing at 2 edge step of reinforcing film in high and low fall.Inner hole 101 is punched and keeps away a hole 20 and is punched together
Shi Jinhang can save process, effectively improve processing efficiency.It of courses, in concrete application, inner hole 101 and keeps away a hole 20 and can also divide
Step punching is formed, as long as guaranteeing that keep away the punching of a hole 20 carries out before the external periphery outline punching of flexible circuit board 10,
A hole 20 is kept away for example, can first be punched inner hole 101 and be punched again, can also be first punched and be kept away a hole 20 and be punched inner hole 101 again.
Preferably, it inner hole 101 and keeps away a hole 20 and is punched to be formed by the first blanking die, the first blanking die includes for being punched
First cutting head of inner hole 101 and for being punched the second cutting head for keeping away a hole 20, i.e., inner hole 101 and keep away a hole 20 pass through it is same
A blanking die is punched to be formed, in this way, pre- punching increases a blanking die without additional, and without adjusting the first cutting head and second
The mutual contraposition of cutting head, further increases processing efficiency.First cutting head and the second cutting head can also be set to different blankings
On film.
In the present embodiment, 12 thickness pair of strengthening course of reinforcing film 2 formed with a thickness of 0.3mm ± 0.05mm, final punching
It should also be 0.3mm ± 0.05mm, of course, in concrete application, the thickness of reinforcing film 2 and strengthening course 12 can also be other numerical value.
When punching keeps away hole 20, outside the boundary of the second cutting head face reinforcing film 2, flexible circuit board ontology 11, second
Relatively, the partial die cut opposite with substrate 1 goes out single layer and cuts a part of cutting head for opposite, another part and reinforcing film 2 with substrate 1
The lamination cut hole 202 that hole 201, the partial die cut reinforcing film 2 opposite with reinforcing film 2 and substrate 1 are formed, i.e. lamination cut hole 202 are
It is punched and is formed by the local external periphery outline of the corresponding superimposed layer being made of reinforcing film 2 with flexible circuit board ontology 11, preferably
The frontal projected area of two parts on substrate 1 is equal, is rectangle, in this way, suffered stress when being punched at the step of reinforcing film 2
More evenly, it is certainly not limited to as rectangle, two-part area can also be unequal, is punched before 10 shape of punching flexible circuit board
Junction region.
The shape of flexible circuit board 10 is punched to be formed by the second blanking die, the second blanking die have for be punched formed it is soft
The third cutting head of the external periphery outline of property circuit board 10.
It can be punched to form multiple flexible circuit boards 10 on flexible circuit boards half-finished product 100, be punched the flexible circuit board of formation
10 can be following arrangement mode: two rows of flexible circuit boards 10 are oppositely arranged, and the part of reinforcement is needed to alternate setting, such as
This, can be punched multiple flexible circuit boards 10 simultaneously, manufacture conducive to the mass production of flexible circuit board 10, improve processing efficiency.
The present invention by the edge step of reinforcing film 2, punching be located at flexible circuit board sheet it is external keep away a hole, by platform
It is first made at rank, when punching flexible circuit board 10, that is, it can avoid reinforcing film 2 and tear.
Above-described is only embodiments of the present invention, it should be noted here that for those of ordinary skill in the art
For, without departing from the concept of the premise of the invention, improvement can also be made, but these belong to protection model of the invention
It encloses.
Claims (10)
1. a kind of method for die cutting of flexible circuit board has flexible circuit board ontology and the flexible circuit board for being punched to be formed
Ontology front portion is covered with the flexible circuit board of strengthening course characterized by comprising
It corresponds on flexible circuit boards half-finished product and is punched into advance at the step edge of flexible circuit board ontology and strengthening course positioned at institute
That states flexible circuit board two sides keeps away a hole, encloses the edge for being set as that the side for keeping away a hole is the flexible circuit board ontology；
The external periphery outline that flexible circuit board is corresponded on flexible circuit boards half-finished product is punched into the flexible circuit board.
2. the method for die cutting of flexible circuit board according to claim 1, it is characterised in that: the punching of the flexible circuit board
Method further includes the inner hole that flexible circuit board is punched on flexible circuit boards half-finished product；The inner hole punching keeps away a hole with described
It is punched while carrying out.
3. the method for die cutting of flexible circuit board according to claim 2, it is characterised in that: the inner hole and described keep away a hole
It is punched to be formed by the first blanking die, first blanking die has for being punched the first cutting head and use that form the inner hole
Second cutting head in hole is kept away described in being formed in punching.
4. the method for die cutting of flexible circuit board according to any one of claims 1 to 3, it is characterised in that: the flexible electrical
The shape of road plate is punched to be formed by the second blanking die, and second blanking die, which has, forms the outer of flexible circuit board for being punched
The third cutting head of edge contour.
5. the method for die cutting of flexible circuit board according to any one of claims 1 to 3, it is characterised in that: described to keep away a hole
Including single layer cut hole and lamination cut hole, the single layer cut hole is the local external periphery outline punching shape of corresponding flexible circuit board ontology
At the lamination cut hole is the local external periphery outline of the corresponding superimposed layer being made of strengthening course and the stacking of flexible circuit board ontology
Punching is formed.
6. the method for die cutting of flexible circuit board according to claim 5, it is characterised in that: the single layer cut hole is described soft
The orthographic projection on the flexible circuit boards half-finished product of frontal projected area and the lamination cut hole on property circuit boards half-finished product
Area equation.
7. the method for die cutting of flexible circuit board according to any one of claims 1 to 3, it is characterised in that: described to keep away a hole
In rectangle.
8. the method for die cutting of flexible circuit board according to any one of claims 1 to 3, it is characterised in that: the flexible electrical
The method for die cutting of road plate is used to be punched into multiple flexible circuit boards simultaneously on a flexible circuit boards half-finished product.
9. a kind of flexible circuit board, including flexible circuit board ontology and the strengthening course being affixed on the flexible circuit board ontology,
Be characterized in that: the flexible circuit board uses the method for die cutting of flexible circuit board as claimed in any of claims 1 to 8 in one of claims
It is made.
10. flexible circuit board according to claim 9, it is characterised in that: thickness 0.3mm ± 0.05mm of strengthening course.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811613540.1A CN110012603A (en) | 2018-12-27 | 2018-12-27 | The method for die cutting and flexible circuit board of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811613540.1A CN110012603A (en) | 2018-12-27 | 2018-12-27 | The method for die cutting and flexible circuit board of flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110012603A true CN110012603A (en) | 2019-07-12 |
Family
ID=67165286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811613540.1A Pending CN110012603A (en) | 2018-12-27 | 2018-12-27 | The method for die cutting and flexible circuit board of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110012603A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112060200A (en) * | 2020-08-27 | 2020-12-11 | 韶关市华思迅飞信息科技有限公司 | Flexible circuit board structure and punching device thereof |
| TWI745823B (en) * | 2019-12-31 | 2021-11-11 | 頎邦科技股份有限公司 | Stiffener structure of flexible print circuit board |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04254391A (en) * | 1991-02-06 | 1992-09-09 | Nec Corp | Printed wiring board |
| US5233754A (en) * | 1990-06-26 | 1993-08-10 | Nippon Cmk Corp. | Method for forming perforations on a printed circuit board |
| JP3465901B1 (en) * | 2003-01-22 | 2003-11-10 | 太平電子工業有限会社 | Mounting board |
| CN101175375A (en) * | 2006-10-31 | 2008-05-07 | 比亚迪股份有限公司 | A method of manufacturing a flexible circuit board |
| CN103517563A (en) * | 2013-10-16 | 2014-01-15 | 镇江华印电路板有限公司 | Flexible printed circuit board reinforcement steel piece pasting method |
| CN105960112A (en) * | 2016-05-31 | 2016-09-21 | 广东欧珀移动通信有限公司 | Manufacturing method of flexible circuit board jigsaw |
| CN108124385A (en) * | 2017-12-21 | 2018-06-05 | 上达电子（深圳）股份有限公司 | Flexible circuitry panel forming method and mold |
| CN108617074A (en) * | 2018-04-02 | 2018-10-02 | 深圳市新宇腾跃电子有限公司 | A kind of flexible circuitry board machining process |
-
2018
- 2018-12-27 CN CN201811613540.1A patent/CN110012603A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5233754A (en) * | 1990-06-26 | 1993-08-10 | Nippon Cmk Corp. | Method for forming perforations on a printed circuit board |
| JPH04254391A (en) * | 1991-02-06 | 1992-09-09 | Nec Corp | Printed wiring board |
| JP3465901B1 (en) * | 2003-01-22 | 2003-11-10 | 太平電子工業有限会社 | Mounting board |
| CN101175375A (en) * | 2006-10-31 | 2008-05-07 | 比亚迪股份有限公司 | A method of manufacturing a flexible circuit board |
| CN103517563A (en) * | 2013-10-16 | 2014-01-15 | 镇江华印电路板有限公司 | Flexible printed circuit board reinforcement steel piece pasting method |
| CN105960112A (en) * | 2016-05-31 | 2016-09-21 | 广东欧珀移动通信有限公司 | Manufacturing method of flexible circuit board jigsaw |
| CN108124385A (en) * | 2017-12-21 | 2018-06-05 | 上达电子（深圳）股份有限公司 | Flexible circuitry panel forming method and mold |
| CN108617074A (en) * | 2018-04-02 | 2018-10-02 | 深圳市新宇腾跃电子有限公司 | A kind of flexible circuitry board machining process |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI745823B (en) * | 2019-12-31 | 2021-11-11 | 頎邦科技股份有限公司 | Stiffener structure of flexible print circuit board |
| CN112060200A (en) * | 2020-08-27 | 2020-12-11 | 韶关市华思迅飞信息科技有限公司 | Flexible circuit board structure and punching device thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190712 |
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| RJ01 | Rejection of invention patent application after publication |