CN110012605A - A kind of thickness copper hollow out window FPC production method - Google Patents
A kind of thickness copper hollow out window FPC production method Download PDFInfo
- Publication number
- CN110012605A CN110012605A CN201910327050.3A CN201910327050A CN110012605A CN 110012605 A CN110012605 A CN 110012605A CN 201910327050 A CN201910327050 A CN 201910327050A CN 110012605 A CN110012605 A CN 110012605A
- Authority
- CN
- China
- Prior art keywords
- film
- hollow out
- copper
- dry film
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 63
- 239000010949 copper Substances 0.000 title claims abstract description 36
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000010408 film Substances 0.000 claims abstract description 83
- 239000011889 copper foil Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000013039 cover film Substances 0.000 claims abstract description 13
- 238000004381 surface treatment Methods 0.000 claims abstract description 5
- 241001232787 Epiphragma Species 0.000 claims abstract description 4
- 238000003490 calendering Methods 0.000 claims abstract description 4
- 239000011888 foil Substances 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 239000011800 void material Substances 0.000 claims description 2
- 238000005530 etching Methods 0.000 abstract description 11
- 238000005516 engineering process Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000003628 erosive effect Effects 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of thick copper hollow out window FPC production method, this method simple process and low cost be can use to produce the window board of copper thickness 4OZ or more, and thick copper window board volume production can be thus achieved without new equipment is increased.The present invention is the following steps are included: calendering or tough cathode foil of the thickness copper hollow out window FPC using wiring board demand；In two face paste dry film of pure copper foil, sticks the two sides film respectively on the dry film of two sides and carry out contraposition and two sides exposure；Etching: the copper foil in the region of no dry film protection will be etched.Armpit falls dry film: dry film armpit exposes the line pattern etched after falling；Epiphragma can be pasted after line pattern surface treatment is clean, two sides cover film pastes together；Normal press curing is pressed after cover film vacation patch is fixed；Cover film has been pre-machined, and the region overlay film for needing hollow out finger is removed.The present invention is applied to the technical field of printed circuit.
Description
Technical field
The present invention relates to a kind of hanging lead window boards of FPC industry, thick copper FPC manufacturing technology.
Background technique
FPC may require that welding dorsal surfaces of fingers cannot have base to guarantee soldering reliability and manufacturing technique requirent sometimes
Material support (substrate said herein can be PI, PET, PEN, LCP etc.), can only be one layer of copper foil.This FPC is known as window
Plate, hollowed-out board or hanging lead plate.If finger one end is vacant state at window, supported without PI, this hanging lead plate
It makes particularly difficult.
Since copper is too thick when being produced for thick copper (copper thickness 4OZ or more) using traditional technology, single side will be through multiple when etching
Etching could come out circuit etching.And it is repeatedly etched or when very slow etching speed coarse, route that will lead to line edges
Etching factor is too small, and route upper and lower surface difference is too many.Such case does not allow in some applications.
Summary of the invention
The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a kind of thick copper hollow out window
FPC production method, this method simple process and low cost can use to produce the window board of copper thickness 4OZ or more, without
Increasing new equipment can be thus achieved thick copper window board volume production, and the etching factor for avoiding traditional technology from occurring is small, the serious mistake of route
Lose or etch residual copper problem.
The technical scheme adopted by the invention is that: the present invention provides a kind of thick copper hollow out window FPC production method, the side
Method the following steps are included:
(1) calendering or tough cathode foil of the thickness copper hollow out window FPC using wiring board demand；
(2) it in the two face paste dry film of pure copper foil, sticks the two sides film respectively on the dry film of two sides and carries out contraposition and two sides exposure；
(3) etch: the copper foil in the region of no dry film protection will be etched, and become the gap between route, void area is only
There is air, without substrate；
(4) armpit falls dry film: dry film armpit exposes the line pattern etched after falling, and route does not have copper-clad plate substrate support at this time；
(5) epiphragma can be pasted after line pattern surface treatment is clean, two sides cover film pastes together；
(6) normal press curing is pressed after cover film vacation patch is fixed；
(7) cover film has been pre-machined, and the region overlay film for needing hollow out finger is removed.
Further, the copper thickness is 3OZ or more.
Further, the minimum feature and line spacing of the thick copper hollow out window FPC is in 0.2mm or more.
Further, the film for the really same route that the two sides dry film in step (2) uses, is only comparable in line
Top and bottom, the top surface film then want mirror image to make by positive production, the bottom surface film.
Further, in step (2) two sides film aligning method are as follows: the top surface film and the copper foil for posting dry film are substantially right
Position, the bottom surface film are carefully aligned with the top surface film again；Or by the two sides film first carefully to good position, then will using adhesive tape or rivet etc.
The film of good position is fixed on one side, then filling in the copper foil that front posts dry film between the film of two sides can expose；Or
By some location holes of copper foil subdrilling Double-face adhesive dry film again, the film also gets location hole in corresponding position, and when film aligning passes through this
A little location holes are aligned with tool fixture.
Further, the copper thickness is 4-6OZ.
The beneficial effects of the present invention are: compared with prior art, the present invention has following advantage: present invention process letter
It is single, it is at low cost, it can use to produce the window board of copper thickness 4OZ or more, thick copper can be thus achieved without new equipment is increased
Window board volume production, the etching factor for avoiding traditional technology from occurring is small, the serious mistake of route is lost or etches residual copper problem.
Detailed description of the invention
Fig. 1 is the window board hollow out finger signal for being suitble to this technology；
Fig. 2 is pure copper foil schematic diagram used in window board；
Fig. 3 is to paste dry film schematic diagram in pure copper foil；
Fig. 4 is patch film exposure schematic diagram；
Fig. 5 is to post dry film post-exposure development schematic diagram；
Fig. 6 is to etch schematic diagram after developing；
Fig. 7 is schematic diagram after fading away dry film；
Fig. 8 is schematic diagram after pressing cover film；
Fig. 9 is hollow out finger longitudal section schematic diagram.
Specific embodiment
In the present embodiment, as shown in Fig. 2, calendering or tough cathode foil, copper thickness using wiring board demand meet
Project drawing requirement.The production of the thick copper foil project of 4OZ or more may be implemented in this technology, is not suitable for 3OZ or less thin copper foil project
Production.The desirably 4-6OZ thickness copper foil project construction, minimum feature and line spacing are in 0.2mm or more.
As shown in figure 3, first copper foil surface is handled completely before pasting dry film in two face paste dry film of pure copper foil.
It is aligned and is exposed as shown in figure 4, sticking the two sides film respectively on the dry film of two sides:
1), the film for the really same route that two sides uses, is only comparable to the top and bottom in line, therefore the top surface film
It is made by forward direction, the bottom surface film then wants mirror image to make.
2), can a face film substantially aligned with the copper foil for posting dry film, the another side film is careful with this face film again
Contraposition.This two sides film aligning is accurate.
3), can also be first carefully to good position by the two sides film, then the film of good position will be fixed using adhesive tape or rivet etc.
Good one side, then filling in the copper foil that front posts dry film between the film of two sides can expose.
It 4), can (copper foil increases a little sawing sheets to Double-face adhesive dry film, in order to avoid keep off when patch dry film again with some location holes of copper foil subdrilling
Position location hole), the film also gets location hole in corresponding position.It is aligned by these location holes with tool fixture when film aligning.
Such as Fig. 5, after dry film exposure development, the figure of project demand has been transferred on dry film.
Such as Fig. 6, after etching, the copper foil in the region of no dry film protection will be etched, and become the gap between route.It is empty
Gap region only has air, without any FPC substrate such as PI.After the line width of 4OZ or more copper foil and 0.2mm or more make etching
Route has enough rigidity, and support entire route will not deform.Certainly it needs carefully to protect in order to avoid destroying route in operation.
Traditional technology is single side exposure single side etching, and 4OZ is etched away due to liquid medicine lateral erosion or thicker copper foil is several
Can not, line edges slope can be made very big and influence performance.This technology uses inventive method, and the same route is using double
Face exposure, two-sided engraving method reduce single side etch quantity.Substantially reduce route lateral erosion.
Such as Fig. 7, dry film armpit, which falls, just exposes the line pattern etched afterwards, and route is that substrate branch of no copper-clad plate at this time
Support, therefore the transhipment standardized is helpful to product qualification rate is improved.
Such as Fig. 8, epiphragma can be pasted after line pattern surface treatment is clean, two sides cover film pastes together.As a same reason
Since the route of product is the hollow out state of not substrate support, need to select suitable surface treatment mode, in case route becomes
Shape is scrapped.Normal press curing is pressed after cover film vacation patch is fixed.
Cover film has been pre-machined, and the region overlay film for needing hollow out finger has been removed.
Fig. 9 is the longitudinal sectional figure of product, it is seen that hollow out finger is the two-sided full engraved structure for being all not covered with film.
In conclusion the present invention provides the production technology of thick copper hollow out window FPC a kind of, can solve copper thickness 4OZ with
The production of upper project, so that batch production is smooth.
The Applicant declares that the present invention is explained by the above embodiments method detailed of the invention, but the present invention not office
Be limited to above-mentioned method detailed, that is, do not mean that the invention must rely on the above detailed methods to implement.Technical field
Technical staff it will be clearly understood that any improvement in the present invention, equivalence replacement and auxiliary element to each raw material of product of the present invention
Addition, selection of concrete mode etc., all of which fall within the scope of protection and disclosure of the present invention.
Claims (6)
1. a kind of thickness copper hollow out window FPC production method, it is characterised in that: a kind of thick copper hollow out window FPC production method
Include the following steps:
(1) calendering or tough cathode foil of the thickness copper hollow out window FPC using wiring board demand；
(2) it in the two face paste dry film of pure copper foil, sticks the two sides film respectively on the dry film of two sides and carries out contraposition and two sides exposure；
(3) etch: the copper foil in the region of no dry film protection will be etched, and become the gap between route, void area is only
There is air, without substrate；
(4) armpit falls dry film: dry film armpit exposes the line pattern etched after falling, and route does not have copper-clad plate substrate support at this time；
(5) epiphragma can be pasted after line pattern surface treatment is clean, two sides cover film pastes together；
(6) normal press curing is pressed after cover film vacation patch is fixed；
(7) cover film has been pre-machined, and the region overlay film for needing hollow out finger is removed.
2. a kind of thick copper hollow out window FPC production method according to claim 1, it is characterised in that: the copper thickness
For 3OZ or more.
3. a kind of thick copper hollow out window FPC production method according to claim 1, it is characterised in that: the thickness copper hollow out
The minimum feature and line spacing of window FPC is in 0.2mm or more.
4. a kind of thick copper hollow out window FPC production method according to claim 1, it is characterised in that: two in step (2)
The film for the really same route that face dry film uses only is comparable to the top and bottom in line, and the top surface film is by positive system
Make, the bottom surface film then wants mirror image to make.
5. a kind of thick copper hollow out window FPC production method according to claim 1, it is characterised in that: two sides in step (2)
The method of film aligning are as follows: the top surface film is substantially aligned with the copper foil for posting dry film, and the bottom surface film is careful with the top surface film again
Contraposition；Or the two sides film is first carefully to good position, then on one side, then the film of good position will be fixed using adhesive tape or rivet etc.
The copper foil that front posts dry film, which is filled between the film of two sides, to expose；Or by some location holes of copper foil subdrilling Double-face adhesive again
Dry film, the film also get location hole in corresponding position, and when film aligning is aligned by these location holes with tool fixture.
6. a kind of thick copper hollow out window FPC production method according to claim 1, it is characterised in that: the copper thickness
For 4-6OZ.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910327050.3A CN110012605A (en) | 2019-04-23 | 2019-04-23 | A kind of thickness copper hollow out window FPC production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910327050.3A CN110012605A (en) | 2019-04-23 | 2019-04-23 | A kind of thickness copper hollow out window FPC production method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110012605A true CN110012605A (en) | 2019-07-12 |
Family
ID=67173584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910327050.3A Pending CN110012605A (en) | 2019-04-23 | 2019-04-23 | A kind of thickness copper hollow out window FPC production method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110012605A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110769607A (en) * | 2019-10-16 | 2020-02-07 | 广州兴森快捷电路科技有限公司 | Circuit board and manufacturing method thereof |
| CN112105155A (en) * | 2020-08-20 | 2020-12-18 | 瑞声新能源发展(常州)有限公司科教城分公司 | Chip FPC and manufacturing method thereof |
| CN113747684A (en) * | 2021-07-30 | 2021-12-03 | 珠海中京元盛电子科技有限公司 | Technology for manufacturing fully-suspended finger FPC |
| CN114786329A (en) * | 2022-05-26 | 2022-07-22 | 大连吉星电子股份有限公司 | High-leveling-degree flexible circuit board and preparation method thereof |
| CN116471714A (en) * | 2023-04-28 | 2023-07-21 | 西安微电子技术研究所 | Processing method of graphene heating film |
| CN117500171A (en) * | 2023-12-11 | 2024-02-02 | 士丰电子科技(昆山)有限公司 | FPC antenna and production process thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101730389A (en) * | 2008-10-15 | 2010-06-09 | 比亚迪股份有限公司 | Method for manufacturing single-side hollow out flexible circuit board |
| CN103687321A (en) * | 2013-12-06 | 2014-03-26 | 中国航空工业集团公司第六三一研究所 | Machining method for hollow metal graph |
| CN106612591A (en) * | 2015-10-21 | 2017-05-03 | 上海和辉光电有限公司 | Method for making flexible printed circuit board |
-
2019
- 2019-04-23 CN CN201910327050.3A patent/CN110012605A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101730389A (en) * | 2008-10-15 | 2010-06-09 | 比亚迪股份有限公司 | Method for manufacturing single-side hollow out flexible circuit board |
| CN103687321A (en) * | 2013-12-06 | 2014-03-26 | 中国航空工业集团公司第六三一研究所 | Machining method for hollow metal graph |
| CN106612591A (en) * | 2015-10-21 | 2017-05-03 | 上海和辉光电有限公司 | Method for making flexible printed circuit board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110769607A (en) * | 2019-10-16 | 2020-02-07 | 广州兴森快捷电路科技有限公司 | Circuit board and manufacturing method thereof |
| CN112105155A (en) * | 2020-08-20 | 2020-12-18 | 瑞声新能源发展(常州)有限公司科教城分公司 | Chip FPC and manufacturing method thereof |
| CN113747684A (en) * | 2021-07-30 | 2021-12-03 | 珠海中京元盛电子科技有限公司 | Technology for manufacturing fully-suspended finger FPC |
| CN114786329A (en) * | 2022-05-26 | 2022-07-22 | 大连吉星电子股份有限公司 | High-leveling-degree flexible circuit board and preparation method thereof |
| CN116471714A (en) * | 2023-04-28 | 2023-07-21 | 西安微电子技术研究所 | Processing method of graphene heating film |
| CN117500171A (en) * | 2023-12-11 | 2024-02-02 | 士丰电子科技(昆山)有限公司 | FPC antenna and production process thereof |
| CN117500171B (en) * | 2023-12-11 | 2024-05-07 | 士丰电子科技(昆山)有限公司 | FPC antenna and production process thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190712 |