CN110171069A - A kind of manufacturing method removing tile corner material - Google Patents

A kind of manufacturing method removing tile corner material Download PDF

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Publication number
CN110171069A
CN110171069A CN201910331871.4A CN201910331871A CN110171069A CN 110171069 A CN110171069 A CN 110171069A CN 201910331871 A CN201910331871 A CN 201910331871A CN 110171069 A CN110171069 A CN 110171069A
Authority
CN
China
Prior art keywords
tile
ceramic tile
ceramic
tiles
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910331871.4A
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Chinese (zh)
Inventor
黄佳生
夏智勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Keda Clean Energy Co Ltd
Original Assignee
Keda Clean Energy Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Keda Clean Energy Co Ltd filed Critical Keda Clean Energy Co Ltd
Priority to CN201910331871.4A priority Critical patent/CN110171069A/en
Publication of CN110171069A publication Critical patent/CN110171069A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/26Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by impact tools, e.g. by chisels or other tools having a cutting edge
    • B28D1/28Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by impact tools, e.g. by chisels or other tools having a cutting edge without cutting edge, e.g. chiseling machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The present invention relates to a kind of manufacturing methods for removing tile corner material, comprising the following steps: S1, is cut into a dent in the upper surface of ceramic tile using cutter device;S2, a dent is cut into the lower surface of ceramic tile using cutter device;S3, a stress trace is marked at the dent of ceramic tile upper surface and/or at the dent of lower surface using a stroke cutter mechanism;S4, disjunction ceramic tile and its leftover pieces by way of thrusting or breaking, obtain required ceramic tile.The manufacturing method of removal tile corner material provided by the invention, by the way that dent is arranged in ceramic tile upper and lower surface and then stress trace is arranged on dent, last disjunction leftover pieces and ceramic tile, obtain the ceramic tile of required specification, and cutter device need not cut off ceramic tile, it is lost small, energy consumption is small.No matter all ceramic tile specifications, removal leftover pieces pass through above-mentioned several steps, are convenient for continuous productive process, high production efficiency.

Description

Manufacturing method for removing leftover materials of ceramic tiles
Technical Field
The invention relates to the technical field of manufacturing methods of ceramic tiles, in particular to a manufacturing method for removing leftover materials of ceramic tiles.
Background
After the ceramic tile sintering shaping, the leftover bits need to be got rid of for the specification and size of ceramic tile satisfies the actual production demand, and current ceramic tile leftover bits are got rid of and are driven the emery wheel through the motor and rotate, utilize the marginal contact of pivoted emery wheel and adobe, thereby realize getting rid of adobe leftover bits. Although the removal mode can meet the production requirement, the removal mode has the advantages of high energy consumption of equipment, high use cost and high loss of the grinding tool. Different grinding apparatus need be used to different cutting requirements, is unfavorable for unified assembly line operation, and the user use is loaded down with trivial details. . Therefore, it is not necessary to provide a new method for removing the leftover materials of the ceramic tiles to solve the above problems.
The invention provides a manufacturing method for removing leftover materials of ceramic tiles, which cuts dents on the upper and lower surfaces of the ceramic tiles, and then performs scribing and breaking, so that the service life of a grinding tool is prolonged, and the production line operation is facilitated.
Disclosure of Invention
The invention aims to solve the technical problem of providing a manufacturing method for removing leftover materials of ceramic tiles, which improves the service life of a grinding tool and facilitates streamlined operation by cutting dents on the upper and lower surfaces of the ceramic tiles and then marking and breaking the ceramic tiles.
In order to solve the technical problem, the invention provides a manufacturing method for removing ceramic tile leftover materials, which comprises the following steps:
s1, cutting a dent on the upper surface of the ceramic tile by using a cutting device;
the cutting device comprises a ceramic tile mounting position, a cutting motor and a cutting tool connected with the cutting motor, wherein the cutting motor drives the cutting tool to rotate, and the cutting tool is in contact with the upper surface of the ceramic tile so as to cut a dent on the upper surface of the ceramic tile;
s2, cutting a dent on the lower surface of the ceramic tile by using a cutting device;
the positions of the dents on the upper surface of the ceramic tile are opposite to the positions of the dents on the lower surface of the ceramic tile;
s3, marking a stress mark on the dent of the upper surface and/or the dent of the lower surface of the tile by using a marking knife mechanism;
and S4, breaking the ceramic tile and the leftover materials thereof in a punching or pressing way to obtain the required ceramic tile.
Preferably, in the working process, the ceramic tile always moves along one direction, and the direction perpendicular to the surface where the ceramic tile is located is a Z axis;
the direction parallel to the running direction of the ceramic tiles on the surface of the ceramic tiles is an X axis;
the direction on the surface of the ceramic tile, which is vertical to the X axis, is the Y axis; wherein,
the cutting tool can be adjusted up and down along the Z axis, and the cutting tool can also be adjusted back and forth along the Y axis.
Preferably, the number of the cutting tools is at least two, at least one is positioned above the ceramic tile, and at least one is positioned below the ceramic tile;
the upper surface and the lower surface of the ceramic tile are respectively cut by the cutting tools positioned at the upper side and the lower side of the ceramic tile, so that the upper surface and the lower surface of the ceramic tile are respectively cut into a dent.
Preferably, in the step S3, the scribing mechanism includes a scribing wheel, and a stress mark is scribed at the dent by the scribing wheel.
Preferably, the scribing wheel is an alloy scribing wheel.
Preferably, the utility model also comprises a fixing mechanism and a swing arm mechanism arranged on the fixing mechanism, the utility model is characterized in that the utility model is fixed at the tail end of the swing arm mechanism, and the utility model drives the utility model to move through the swing of the swing arm mechanism.
Preferably, in the step S4, when the tile and the leftover material thereof are cut by punching, a punching device is used for punching;
the punching device comprises a workbench, a mounting plate, a punching plate, a guide shaft connected with the punching plate and the mounting plate, and a cylinder driving the punching plate to move.
Preferably, the ceramic tile is positioned on the workbench, leftover materials of the ceramic tile are suspended on one side of the workbench, the cylinder drives the punching plate to move towards the direction close to the ceramic tile, and the leftover materials of the ceramic tile are punched, so that the leftover materials of the ceramic tile and the ceramic tile are separated from each other;
wherein, the punching plate and the stress mark are positioned at the same side of the ceramic tile.
Preferably, in the step S4, when the tile and the leftover material thereof are cut by pressing, a pressing device is used for pressing;
the pressure breaking device comprises a support table and at least two pressing wheels, and the positions of the pressing wheels are adjustable.
Preferably, the height of the pressing wheel is smaller than the sum of the thicknesses of the support table and the ceramic tile;
the leftover materials of the ceramic tiles are suspended on one side of the supporting strips, and the pressing wheel presses the ceramic tiles, so that the leftover materials of the ceramic tiles are broken.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the manufacturing method for removing the leftover materials of the ceramic tiles, the stress marks are arranged on the dents after the dents are arranged on the upper surface and the lower surface of the ceramic tiles, and finally the leftover materials and the ceramic tiles are cut off, so that the ceramic tiles with the required specification and size are obtained, the ceramic tiles are not required to be cut off by a cutting device, the loss is low, and the energy consumption is low. All the ceramic tiles are subjected to the steps of removing leftover materials no matter the specifications and the sizes, the flow process is convenient, and the production efficiency is high.
2. According to the manufacturing method for removing the leftover materials of the ceramic tiles, the cutting tool can be adjusted up and down and is used for cutting the dents with different depths, the cutting tool can also be adjusted back and forth and is used for cutting the ceramic tiles with different widths, the ceramic tiles with different sizes and thicknesses can be cut by the cutting device, and the manufacturing method is high in universality.
Drawings
FIG. 1 is a flow chart of a manufacturing method of the present invention for removing tile scrap;
FIG. 2 is a schematic structural view of the manufacturing method for removing leftover materials of ceramic tiles according to the present invention;
fig. 3 is a schematic structural view of another embodiment of the manufacturing method for removing tile scraps of the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings and preferred embodiments.
As shown in fig. 1-3, a manufacturing method for removing leftover bits and pieces of tiles comprises the following steps:
s1, cutting a dent on the upper surface of the ceramic tile 10 by using the cutting device 1, wherein the cutting device 1 comprises a ceramic tile installation position 11, a cutting motor 12 and a cutting tool 13 connected with the cutting motor 12, the ceramic tile installation position 11 is used for placing the ceramic tile 10, the positioning of the ceramic tile 10 is realized, and the position of the ceramic tile 10 in the cutting process is prevented from deviating and affecting the cutting quality. The cutting tool 13 is located on at least one side of the tile installation position 11, and is used for cutting a dent in an edge area of the tile 10, and when the cutting tool 13 is driven to rotate by the cutting motor 12, the cutting tool 13 is in contact with the upper surface of the tile 10, so that a dent is cut on the upper surface of the tile 10.
In the working process, the tile 10 always moves along one direction, the direction perpendicular to the surface where the tile 10 is located is defined as a Z axis, the direction parallel to the moving direction of the tile 10 on the surface where the tile 10 is located is an X axis, and the direction perpendicular to the X axis on the surface where the tile 10 is located is a Y axis.
In order to meet different cutting requirements, the cutting tool 13 can be adjusted up and down along the Z axis and used for cutting dents with different depths, the cutting tool 13 can also be adjusted back and forth along the Y axis and used for cutting tiles with different widths and ensuring that tiles with different sizes and thicknesses can be cut by adopting the cutting device disclosed by the invention, and the cutting device is strong in universality.
S2, cutting a dent on the lower surface of the tile by the cutting device 1, wherein the cutting device 1 may be the same as the cutting device in the step S1, two identical cutting devices 1 are respectively located at the upper and lower sides of the tile 10 for cutting, and the specific cutting method is the same as the cutting method in the step S1, and is not described herein again.
In other embodiments, the cutting device of this step is the same as the cutting device of step S1, wherein the number of the cutting tools 13 is at least two, at least one is located above the tile 10, and at least one is located below the tile 10, and the upper surface and the lower surface of the tile 10 are cut by the cutting tools 13 located at the upper side and the lower side of the tile 10, respectively, so that the upper surface and the lower surface of the tile 10 cut a dent respectively.
It should be noted that, in order to ensure the smooth completion of the following processes, the positions of the dents on the upper surface of the tile 10 are opposite to the positions of the dents on the lower surface of the tile 10, so that after the dents on the upper and lower surfaces of the tile are formed, the leftover bits can be removed by means of punching or pressing.
S3, marking a stress mark on the dent of the upper surface and/or the dent of the lower surface of the tile by using the marking knife mechanism 2, so that the broken mark after breaking is relatively neat, and the edge grinding amount in the later period is reduced.
The scribing cutter mechanism 2 comprises a scribing cutter wheel, a stress mark is scribed at the dent position through the scribing cutter wheel, and preferably, the scribing cutter wheel is an alloy scribing cutter wheel. Here, the scribing wheel can be moved manually, and can also be driven to move by adopting a mechanical structure, so that the stress mark can be scribed at the dent. In this embodiment, the utility model discloses a scriber mechanism 2 is including still including fixed establishment and install in swing arm mechanism on the fixed establishment, the scriber wheel is fixed in swing arm mechanism's end, drives the motion of scriber wheel through swing arm mechanism's swing, realizes full automatic production, improves production efficiency.
And S4, breaking the ceramic tile and the leftover materials thereof in a punching or pressing way to obtain the required ceramic tile.
The first implementation mode comprises the following steps: as shown in fig. 2, the tile and its leftover material are cut by means of punching, and the punching device 3 is used for punching, specifically, the punching device 3 comprises a worktable 31, a mounting plate 32, a punching plate 33, a guide shaft 34 connecting the punching plate 33 and the mounting plate 32, and a cylinder 35 driving the punching plate 33 to move, wherein the worktable 31 is used for placing the tile 10.
Wherein, the worktable 31 supports the part of the ceramic tile which is not needed to be broken, and the leftover material of the ceramic tile is suspended at one side of the worktable 31. The mounting panel 32 is used for realizing the fixed mounting of guide shaft 34, cylinder 35 and break plate 33, is convenient for realize breaking, break plate 33 is located ceramic tile leftover bits directly over or under, specifically sets for according to the position of stress mark, and break plate 33 and stress mark are located the homonymy of ceramic tile 10 promptly, if the two sides of ceramic tile 10 all are provided with the stress mark, then break plate 33 is located the top of ceramic tile or below all can realize breaking. The guide shaft 34 is used for guiding the movement track of the punching plate 33, and preventing the position deviation of the punching plate 33 from influencing the punching quality. The cylinder 35 is used for driving the punching plate 33 to move, so that punching is convenient to realize.
During operation, the ceramic tile is located workstation 31, and its leftover bits are unsettled in one side of workstation, and cylinder 35 drive punching sheet 33 is toward the direction motion that is close to ceramic tile 10, punching press ceramic tile leftover bits for ceramic tile leftover bits and ceramic tile alternate segregation can.
The second embodiment: as shown in fig. 3, the tile and the leftover material thereof are cut off by pressing, and the pressing and breaking device 4 is used for pressing and breaking, specifically, the pressing and breaking device 4 includes a supporting table 41 and at least two pressing wheels 42, the supporting table 41 is used for placing the tile 10, the leftover material of the tile is suspended on one side of the supporting table 41, the height of the pressing wheels 42 is smaller than the sum of the thicknesses of the supporting table 41 and the tile 10, and the pressing wheels press the tile 10, so that the leftover material of the tile is pressed and broken, and the tile leftover material and the tile are cut off to obtain the tile 10.
In order to meet the requirements of ceramic tiles with different thicknesses and ceramic tiles with different cutting widths, the position of the pressing wheel is adjustable, specifically, the pressing wheel can move in the direction of a central shaft of the ceramic tile and can also move in the direction close to or far away from the central shaft, and the ceramic tiles with various types and cutting widths can be cut.
According to the manufacturing method for removing the leftover materials of the ceramic tiles, the stress marks are arranged on the dents after the dents are arranged on the upper surface and the lower surface of the ceramic tiles 10, and finally the leftover materials and the ceramic tiles 10 are cut off, so that the ceramic tiles with required specifications and sizes are obtained, the cutting device 1 does not need to cut the ceramic tiles, the loss is small, and the energy consumption is small. All the ceramic tiles are subjected to the steps of removing leftover materials no matter the specifications and the sizes, the flow process is convenient, and the production efficiency is high.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.

Claims (10)

1. A manufacturing method for removing ceramic tile leftover materials is characterized by comprising the following steps:
s1, cutting a dent on the upper surface of the ceramic tile by using a cutting device;
the cutting device comprises a ceramic tile mounting position, a cutting motor and a cutting tool connected with the cutting motor, wherein the cutting motor drives the cutting tool to rotate, and the cutting tool is in contact with the upper surface of the ceramic tile so as to cut a dent on the upper surface of the ceramic tile;
s2, cutting a dent on the lower surface of the ceramic tile by using a cutting device;
the positions of the dents on the upper surface of the ceramic tile are opposite to the positions of the dents on the lower surface of the ceramic tile;
s3, marking a stress mark on the dent of the upper surface and/or the dent of the lower surface of the tile by using a marking knife mechanism;
and S4, breaking the ceramic tile and the leftover materials thereof in a punching or pressing way to obtain the required ceramic tile.
2. The manufacturing method for removing tile scraps as claimed in claim 1, wherein during operation, said tiles are always moved along one direction, and a direction perpendicular to a surface on which said tiles are located is a Z-axis;
the direction parallel to the running direction of the ceramic tiles on the surface of the ceramic tiles is an X axis;
the direction on the surface of the ceramic tile, which is vertical to the X axis, is the Y axis; wherein,
the cutting tool can be adjusted up and down along the Z axis, and the cutting tool can also be adjusted back and forth along the Y axis.
3. The manufacturing method for removing tile trimmings as claimed in claim 1, wherein the number of said cutting tools is at least two, at least one being located above the tile and at least one being located below the tile;
the upper surface and the lower surface of the ceramic tile are respectively cut by the cutting tools positioned at the upper side and the lower side of the ceramic tile, so that the upper surface and the lower surface of the ceramic tile are respectively cut into a dent.
4. The manufacturing method for removing tile scraps as claimed in claim 1, wherein the scribing mechanism comprises a scribing wheel by which a stress mark is scribed at the dent in the step of S3.
5. The manufacturing method for removing tile scraps as claimed in claim 4, wherein said scribing wheel is an alloy scribing wheel.
6. The manufacturing method for removing the leftover materials of the ceramic tiles according to claim 4, wherein the scribing cutter mechanism further comprises a fixing mechanism and a swing arm mechanism arranged on the fixing mechanism, the scribing cutter wheel is fixed at the tail end of the swing arm mechanism, and the scribing cutter wheel is driven to move through the swing of the swing arm mechanism.
7. The manufacturing method for removing tile scraps as claimed in claim 1, wherein in the step of S4, when the tile and the scraps thereof are cut by means of punching, the punching is performed by using a punching device;
the punching device comprises a workbench, a mounting plate, a punching plate, a guide shaft connected with the punching plate and the mounting plate, and a cylinder driving the punching plate to move.
8. The manufacturing method for removing the leftover bits and pieces of tiles as claimed in claim 7, wherein the tiles are placed on the worktable with the leftover bits suspended from one side of the worktable, the cylinder drives the punching plate to move in a direction close to the tiles to punch the leftover bits and pieces of tiles so that the leftover bits and pieces of tiles are separated from each other;
wherein, the punching plate and the stress mark are positioned at the same side of the ceramic tile.
9. The manufacturing method for removing tile scraps as claimed in claim 1, wherein in the step of S4, when the tile and its scraps are cut by press-breaking, press-breaking is performed by using a press-breaking device;
the pressure breaking device comprises a support table and at least two pressing wheels, and the positions of the pressing wheels are adjustable.
10. The method of claim 9, wherein the height of the press rollers is less than the sum of the thicknesses of the support platform and the tile;
the leftover materials of the ceramic tiles are suspended on one side of the supporting strips, and the pressing wheel presses the ceramic tiles, so that the leftover materials of the ceramic tiles are broken.
CN201910331871.4A 2019-04-24 2019-04-24 A kind of manufacturing method removing tile corner material Pending CN110171069A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910331871.4A CN110171069A (en) 2019-04-24 2019-04-24 A kind of manufacturing method removing tile corner material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910331871.4A CN110171069A (en) 2019-04-24 2019-04-24 A kind of manufacturing method removing tile corner material

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CN110171069A true CN110171069A (en) 2019-08-27

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111844477A (en) * 2020-06-28 2020-10-30 北新集团建材股份有限公司 A kind of plate processing device and processing method
CN116135503A (en) * 2021-11-18 2023-05-19 广东博智林机器人有限公司 Sheet cutting equipment

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61168547A (en) * 1985-01-17 1986-07-30 Kawaguchiko Seimitsu Kk Outerperiphery breaker
JPH03251391A (en) * 1990-03-01 1991-11-08 C T M:Kk Dividing of ceramic base plate
JPH0524036A (en) * 1991-07-18 1993-02-02 Rohm Co Ltd Parting method for ceramic base and parting device
CN101610870A (en) * 2007-10-16 2009-12-23 三星钻石工业股份有限公司 Method for processing U-shaped groove of brittle material substrate, and removing method, punching method, and chamfering method using the same
CN206273564U (en) * 2016-12-14 2017-06-23 浙江海洋大学 A kind of disjunction structure of building tile cutting device
CN107696303A (en) * 2017-09-22 2018-02-16 广东科达洁能股份有限公司 A kind of ceramic tile synchronization segmenting device and method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61168547A (en) * 1985-01-17 1986-07-30 Kawaguchiko Seimitsu Kk Outerperiphery breaker
JPH03251391A (en) * 1990-03-01 1991-11-08 C T M:Kk Dividing of ceramic base plate
JPH0524036A (en) * 1991-07-18 1993-02-02 Rohm Co Ltd Parting method for ceramic base and parting device
CN101610870A (en) * 2007-10-16 2009-12-23 三星钻石工业股份有限公司 Method for processing U-shaped groove of brittle material substrate, and removing method, punching method, and chamfering method using the same
CN206273564U (en) * 2016-12-14 2017-06-23 浙江海洋大学 A kind of disjunction structure of building tile cutting device
CN107696303A (en) * 2017-09-22 2018-02-16 广东科达洁能股份有限公司 A kind of ceramic tile synchronization segmenting device and method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111844477A (en) * 2020-06-28 2020-10-30 北新集团建材股份有限公司 A kind of plate processing device and processing method
CN111844477B (en) * 2020-06-28 2022-01-28 北新集团建材股份有限公司 Plate processing device and method
CN116135503A (en) * 2021-11-18 2023-05-19 广东博智林机器人有限公司 Sheet cutting equipment

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Application publication date: 20190827