CN110398295A - Connection assembly with temperature detection device - Google Patents

Abstract

The invention provides a connection assembly with a temperature detection device inside, including a substrate, at least one temperature-measuring component for conducting current, at least one heat-conducting shrapnel for contacting the temperature-measuring component, at least one temperature As for the detection device, the heat conduction shrapnel and the temperature detection device are respectively arranged on different surfaces of the substrate, there is a heat conduction part between the heat conduction shrapnel and the temperature detection device, and there is an insulation part between the heat conduction part and the temperature detection device. The invention can detect the temperature of the parts to be measured in the socket in real time, and the heat transfer speed is fast and the effect is good. The measurement error caused by the low heat conduction efficiency of the printed board is reduced through the heat conduction part, the measurement accuracy is improved, and the temperature difference between different ambient temperatures is reduced. measurement error. At the same time, the two methods provided by the present invention both solve the insulation problem between the sensor and the charged temperature-conducting component to be measured, and the insulation effect is good. Since the sensor is welded on the circuit board, the efficiency of automatic production is greatly improved.

Description

Connection assembly with temperature detection device

technical field

The invention belongs to the technical field of electrical components and relates to a connection assembly with a temperature detection device.

Background technique

In recent years, with the rapid development of the electric vehicle industry, the safety requirements for electric vehicle charging equipment are also getting higher and higher. Among them, on the charging socket on the electric vehicle (the connection assembly referred to in the present invention is the charging socket), the problem of temperature rise caused by the large current passing through the contactor during charging cannot be ignored. Therefore, many manufacturers have developed a temperature detection solution in the car charging socket, that is, a temperature sensor is arranged in the charging socket to measure the temperature of the contactor, and the detected signal is transmitted to the charging control system.

In the current temperature detection scheme, one is to wrap the sensor with insulating material, and then fix the sensor on the connector terminal in the socket to measure the temperature of the contactor. The disadvantage of this method is that most of the sensors need to be Manual installation greatly increases the manufacturing cost. Another solution is that the circuit board and the terminal are in contact with the elastic copper sheet, the sensor is welded on the circuit board, and keeps a certain distance from the copper sheet, the heat is conducted to the circuit board, and the sensor measures the temperature rise of the circuit board in the socket. The disadvantage is that the thermal conductivity of the circuit board is poor, and the change of the ambient temperature has a great influence on the temperature measurement result. The sensor cannot accurately measure the temperature of the terminal on the circuit board. Risk of electrical conduction, while further reducing measurement accuracy if it is too far away.

Contents of the invention

In order to solve the above problems, the present invention provides a connection assembly with a temperature detection device inside, which conducts heat to the sensor through the heat transfer structure provided inside the shrapnel and the circuit board to improve the measurement accuracy. Set on both sides of the circuit board, the insulation effect is good.

In order to achieve the above object, the present invention provides the following technical solutions:

A connection assembly with a temperature detection device, including a substrate, at least one temperature-measuring component for conducting current, at least one heat-conducting shrapnel for contacting the temperature-measuring component, at least one temperature detection device, and the heat-conducting shrapnel and temperature The detection devices are respectively arranged on different surfaces of the substrate. There is a heat conduction part between the heat conduction shrapnel and the temperature detection device, and an insulation part between the heat conduction part and the temperature detection device.

Further, the substrate is a circuit board, and the side of the circuit board provided with the heat-conducting shrapnel is provided with several blind holes, the blind holes are directly or indirectly connected to the heat-conducting shrapnel, and the inner wall of the blind hole is covered with a heat-conducting layer.

Further, the substrate is made of thermally conductive material, and an insulating layer is provided between the temperature detection device and the substrate.

Further, the heat conducting shrapnel is stretched or squeezed during installation and has elastic recovery force.

Further, the heat conducting shrapnel is an elastic copper sheet.

Further, the temperature detection device is fixed on the reverse side of the substrate corresponding to the position of the heat conducting shrapnel.

Further, a first pad is provided between the thermally conductive shrapnel and the substrate, and a second pad is provided between the temperature detection device and the substrate.

Further, the temperature detection device is a temperature sensor.

Further, the component to be measured is a terminal.

Further, it also includes at least one electrical component to be tested and at least one conductive elastic piece fixed on the substrate, and the conductive elastic piece is in contact with the electrical component to be tested.

Further, an insulating layer is arranged between the bottom of the blind hole and the temperature detection device, and a layer of copper foil is arranged between the insulating layer and the bottom of the blind hole.

Further, the heat conducting layer is copper plating.

Further, the heat conducting material is metal or ceramics.

Compared with the prior art, the present invention has the following advantages and beneficial effects:

The invention can detect the temperature of the temperature-measuring parts in the socket in real time, has a fast heat transfer speed and good effect, and reduces the heat transfer caused by the low heat conduction efficiency of the printed board through the conductive part (several blind holes are copper-plated for heat conduction or directly adopts a metal substrate). The measurement error is improved, the measurement accuracy is improved, and the measurement error at different ambient temperatures is reduced. At the same time, both methods provided by the present invention are provided with an insulating part between the temperature detection device and the conductive part, which also solves the insulation problem between the sensor and the charged conductive part to be measured, and the insulation effect is good. Since the sensor is welded on the circuit board, the efficiency of automatic production is greatly improved.

Description of drawings

Fig. 1 is a schematic diagram of the overall structure of the connection assembly provided by the present invention with a temperature detection device.

Fig. 2 is a side sectional view of the circuit board part.

FIG. 3 is a perspective view of the circuit board, wherein the viewing angle is viewed from the reverse side of the circuit board to the front side.

Fig. 4 is a side cross-sectional view of the circuit board part of the connection assembly with the temperature detection device provided by the second embodiment.

Explanation of reference signs:

Housing 1, temperature-measuring component 2, thermal shrapnel 3, circuit board 4, temperature detection device 5, electrical component to be tested 6, sensor circuit 7, conductive circuit 8, blind hole 9, copper foil 10, conductive shrapnel 11, insulation Plate 12 , first pad 13 , second pad 14 , insulating layer 15 , and metal substrate 16 .

Detailed ways

The technical solutions provided by the present invention will be described in detail below in conjunction with specific examples. It should be understood that the following specific embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention.

Embodiment one:

As shown in FIGS. 1-3 , the connection assembly with a temperature detection device provided by the present invention is a charging socket in this example, including a circuit board 4 , a temperature-measuring component 2 , a heat-conducting shrapnel 3 , and a temperature detection device 5 . Wherein, the temperature-measuring component is used to conduct current, and in this example is a terminal, which is fixed on the socket housing 1, and the heat-conducting shrapnel is in contact with the terminal. The upper side of the circuit board is the front side, and the lower side is the back side), and the temperature detection device adopts a temperature sensor, which is arranged on the back side of the circuit board. The temperature sensor is used to detect the temperature of the circuit board, and its position should preferably correspond to the position of the heat conduction shrapnel, that is, it should be placed directly below or directly above the heat conduction shrapnel, so that the heat conduction path is the shortest, and the heat conducted from the temperature-measuring component can be obtained quickly and measure its temperature. Generally, there are multiple terminals, therefore, multiple sets of heat-conducting shrapnel and corresponding temperature detection devices can also be provided to measure the temperature of each terminal. A number of blind holes 9 are provided on the front of the circuit board (as shown in Figure 2, there are 3 blind holes in this example). The component is indirectly connected to the thermal shrapnel. The inner wall of the blind hole is covered with a heat conduction layer. In this example, the inner wall of the blind hole is plated with copper. According to the needs or with the development of technology, other heat conduction materials with higher thermal conductivity can also be used to make the heat conduction layer. The heat-conducting shrapnel is made of elastic copper sheet, which has fast heat conduction speed and good toughness, and can also be made of other heat-conducting materials. The heat conduction material referred to in the present invention should be selected with a material whose thermal conductivity is much higher than that of ordinary printed boards, preferably a material with a thermal conductivity >4W/m·K.

In this example, the thermal shrapnel and the temperature detection device are fixed on the circuit board by welding, so the heat transfer is stable and it is convenient for automatic production. Therefore, the thermal conductive shrapnel is connected to the circuit board through the first pad 13 , and the temperature detection device is connected to the circuit board through the second pad 14 . The welding method can also be replaced by other fixing methods as required. As shown in Fig. 2, the first pad 13 is arranged at the blind hole, therefore, the heat conducting shrapnel is connected with the blind hole through the first pad.

Specifically, as shown in Figure 2, the blind hole extends from the front of the circuit board to a layer of copper foil 10 closest to the reverse side of the circuit board (because there may be multiple layers of copper foil in the circuit board, the penetration of the blind hole is closer to the circuit board There are several layers of copper foil on the front, and the layer of copper foil closest to the back of the circuit board is still retained to improve the heat transfer effect), and the blind hole with a heat conduction layer has a good heat transfer effect (it can be called a heat conduction component), and due to the use of multiple The thin blind hole design has many heat transfer channels, which further improves the heat conduction effect. There is also a layer of extremely thin insulating sheet 12 (thickness much smaller than the thickness of the circuit board) and a layer of copper foil between the bottom of the blind hole (the side close to the reverse side of the circuit board) and the reverse side of the circuit board to achieve good electrical isolation effect, but at the same time improves the thermal conductivity, as shown in Figure 3, so that the surface where the heat-conducting shrapnel is located is insulated from the surface where the sensor and sensor circuit 7 are located, improving safety and reliability.

The thermal shrapnel is in contact with the temperature-measuring part, and it is in a state of being stretched by the temperature-measuring part or squeezed by the temperature-measuring part during installation, so it has elastic recovery force. The offset of the components causes the thermal shrapnel to be out of contact with the temperature-measuring component. One end of the heat-conducting shrapnel is connected to the temperature-measuring component, and the other end is connected to the circuit board. It is welded to the circuit board and/or to the temperature-measuring component as described above, which can exert a good heat conduction effect.

There are also electrical components 6 to be tested on the connection assembly, that is, a number of weak current terminals. At least one conductive shrapnel 11 is also fixed on the circuit board in the connection assembly of the present invention. The conductive shrapnel 11 is in contact with the electrical components to be tested for obtaining weak current signals. , and transmit electrical signals through the conductive line 8 . It is also preferably in a state of being stretched by the temperature-measuring part or squeezed by the temperature-measuring part during installation so as to have an elastic recovery force and play the same effect as the heat-conducting shrapnel. The conductive shrapnel is preferably made of elastic copper, and can also be made of other conductive materials.

When using this connection assembly, current passes through the component to be measured and heat is generated, and the heat passes through the heat-conducting shrapnel, the first pad pad, the blind hole, the copper foil at the bottom of the blind hole, the thin layer between the blind hole and the temperature detection device The circuit board, the second welding pad, and the transmission to the temperature detection device have fast heat transfer speed and good effect, improve measurement accuracy, and have good insulation effect.

Embodiment two:

This embodiment is similar to Embodiment 1. The heat-conducting shrapnel and the temperature detection device are respectively fixed on the front and back sides of the plate. The difference is that the circuit board in Embodiment 1 is replaced by a substrate with good thermal conductivity. Made of thermally conductive materials, its thermal conductivity is much higher than that of ordinary printed board materials (preferably materials with thermal conductivity >4W/m·K), and has good thermal conductivity. An insulating layer 16 is provided between the substrate 15 and the temperature detection device to avoid conduction. The base plate is preferably made of metal or ceramics, because the base plate itself has a good heat conduction effect, so there is no need to set blind holes on it. In this example, the thermal shrapnel is welded and fixed on the substrate, and the temperature detection device is welded and fixed on the insulating layer. When a metal substrate is used, it is preferable to use an aluminum substrate. All the other technical features are the same as in Embodiment 1 in this example.

The technical means disclosed in the solutions of the present invention are not limited to the technical means disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be pointed out that for those skilled in the art, some improvements and modifications can also be made without departing from the principle of the present invention, and these improvements and modifications are also considered as the protection scope of the present invention.

Claims (12)

1. with temperature-detecting device connection component, including substrate, at least one be used for conduct electric current to temperature-measuring part, extremely Few heat conducting spring plate, at least one temperature-detecting device for being in contact with to temperature-measuring part, it is characterised in that: described to lead Thermoelastic piece and temperature-detecting device are separately positioned in substrate different sides, are had between heat conducting spring plate and temperature-detecting device thermally conductive Portion has insulation division between heat-conducting part and temperature-detecting device.

2. the connection component according to claim 1 with temperature-detecting device, it is characterised in that: the substrate is route Plate, heat conducting spring plate is provided on wiring board is provided with several blind holes, blind hole and heat conducting spring plate direct or indirect connection on one side, blind Hole inner wall is covered with heat-conducting layer.

3. the connection component according to claim 1 with temperature-detecting device, it is characterised in that: the substrate is used and led Hot material is made, and has insulating layer between temperature-detecting device and substrate.

4. according to claim 1 with the connection component of temperature-detecting device described in any one of -3, it is characterised in that: peace The heat conducting spring plate is stretched or is extruded and has elastic restoring force when dress.

5. according to claim 1 with the connection component of temperature-detecting device described in any one of -3, it is characterised in that: institute Stating heat conducting spring plate is elastic copper sheet.

6. according to claim 1 with the connection component of temperature-detecting device described in any one of -3, it is characterised in that: temperature Degree detection device is fixed on substrate another side and heat conducting spring plate position corresponding section.

7. according to claim 1 with the connection component of temperature-detecting device described in any one of -3, it is characterised in that: institute Stating temperature-detecting device is temperature sensor.

8. according to claim 1 with the connection component of temperature-detecting device described in any one of -3, it is characterised in that: lead It is equipped with the first pad between thermoelastic piece and substrate, the second pad is equipped between temperature-detecting device and substrate.

9. according to claim 1 with the connection component of temperature-detecting device described in any one of -3, it is characterised in that: also Including at least one electrical components to be measured and at least one electroconductive elastic sheet being fixed on substrate, electroconductive elastic sheet and electrical components phase to be measured Contact.

10. the connection component according to claim 2 with temperature-detecting device, it is characterised in that: the blind via bottom It is provided with insulating layer between temperature-detecting device, one layer of copper foil is provided between the insulating layer and blind via bottom.

11. the connection component according to claim 2 with temperature-detecting device, it is characterised in that: the heat-conducting layer is Copper coating.

12. the connection component according to claim 3 with temperature-detecting device, it is characterised in that: the Heat Conduction Material For metal or ceramics.