CN110545950B - 用于产生扩散焊接连接的焊料成形件和用于产生焊料成形件的方法 - Google Patents

用于产生扩散焊接连接的焊料成形件和用于产生焊料成形件的方法 Download PDF

Info

Publication number
CN110545950B
CN110545950B CN201880026942.3A CN201880026942A CN110545950B CN 110545950 B CN110545950 B CN 110545950B CN 201880026942 A CN201880026942 A CN 201880026942A CN 110545950 B CN110545950 B CN 110545950B
Authority
CN
China
Prior art keywords
solder
phase
diffusion
particles
interface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201880026942.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN110545950A (zh
Inventor
C.谢伦伯格
J.斯特罗吉斯
K.威尔克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of CN110545950A publication Critical patent/CN110545950A/zh
Application granted granted Critical
Publication of CN110545950B publication Critical patent/CN110545950B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0233—Sheets or foils
    • B23K35/0238—Sheets or foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/302—Cu as the principal constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01323—Manufacture or treatment of die-attach connectors using local deposition in liquid form, e.g. by dispensing droplets or by screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01351—Changing the shapes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01365—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07355—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/324—Die-attach connectors having multiple side-by-side cores
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H10W72/3528—Intermetallic compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing & Machinery (AREA)
CN201880026942.3A 2017-04-25 2018-04-23 用于产生扩散焊接连接的焊料成形件和用于产生焊料成形件的方法 Active CN110545950B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102017206932.5A DE102017206932A1 (de) 2017-04-25 2017-04-25 Lotformteil zum Erzeugen einer Diffusionslötverbindung und Verfahren zum Erzeugen eines Lotformteils
DE102017206932.5 2017-04-25
PCT/EP2018/060296 WO2018197390A1 (fr) 2017-04-25 2018-04-23 Préformé de brasage pour produire une jonction brasée par diffusion et procédé destiné à produire un préformé de brasage

Publications (2)

Publication Number Publication Date
CN110545950A CN110545950A (zh) 2019-12-06
CN110545950B true CN110545950B (zh) 2022-09-16

Family

ID=62148306

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880026942.3A Active CN110545950B (zh) 2017-04-25 2018-04-23 用于产生扩散焊接连接的焊料成形件和用于产生焊料成形件的方法

Country Status (7)

Country Link
US (1) US11285568B2 (fr)
EP (1) EP3582928B1 (fr)
JP (1) JP6980029B2 (fr)
KR (1) KR102409338B1 (fr)
CN (1) CN110545950B (fr)
DE (1) DE102017206932A1 (fr)
WO (1) WO2018197390A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019134595A1 (de) * 2019-12-16 2021-06-17 Endress+Hauser SE+Co. KG Fügen von zwei Bauteilen eines Feldgeräts der Prozess- und Automatisierungstechnik
CN116675174B (zh) * 2023-04-26 2026-02-17 北京量子信息科学研究院 一种集成反应键合体系及制备方法
CN116825742B (zh) * 2023-08-28 2023-11-03 合肥阿基米德电子科技有限公司 一种预成型焊片及其制备方法与应用
KR102895346B1 (ko) * 2023-12-22 2025-12-04 주식회사 세미파워렉스 전력 반도체 소자 접합용 프리폼 및 이의 제조 방법

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5118029A (en) * 1989-11-30 1992-06-02 The Furukawa Electric Co., Ltd. Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board
JPH06232188A (ja) * 1993-01-29 1994-08-19 Nec Corp 半田材の製造方法
KR100548114B1 (ko) * 2000-12-21 2006-02-02 가부시키가이샤 히타치세이사쿠쇼 땜납 박 및 반도체 장치 및 전자 장치
JP2004174522A (ja) * 2002-11-25 2004-06-24 Hitachi Ltd 複合はんだ、その製造方法および電子機器
US10081852B2 (en) * 2005-09-15 2018-09-25 Senju Metal Industry Co., Ltd. Solder preform and a process for its manufacture
US7800230B2 (en) * 2006-04-28 2010-09-21 Denso Corporation Solder preform and electronic component
US20100291399A1 (en) * 2006-09-01 2010-11-18 Rikiya Kato Lid for a functional part and a process for its manufacture
US20090004500A1 (en) 2007-06-26 2009-01-01 Daewoong Suh Multilayer preform for fast transient liquid phase bonding
US20090008431A1 (en) * 2007-07-03 2009-01-08 Kossi Zonvide Solderable EMI Gasket and Grounding Pad
JP5700504B2 (ja) * 2010-08-05 2015-04-15 株式会社デンソー 半導体装置接合材
TWI461252B (zh) * 2010-12-24 2014-11-21 村田製作所股份有限公司 A bonding method, a bonding structure, an electronic device, an electronic device manufacturing method, and an electronic component
JP5990758B2 (ja) * 2012-04-02 2016-09-14 株式会社弘輝 はんだ材及びその製造方法
JP2014180690A (ja) * 2013-03-19 2014-09-29 Nippon Steel Sumikin Materials Co Ltd シート状高温はんだ接合材およびこれを用いたダイボンディング方法
DE102013219642A1 (de) 2013-09-27 2015-04-02 Siemens Aktiengesellschaft Verfahren zum Diffusionslöten unter Ausbildung einer Diffusionszone als Lötverbindung und elektronische Baugruppe mit einer solchen Lötverbindung
JP6172573B2 (ja) * 2013-11-29 2017-08-02 日立金属株式会社 はんだ接合材料とその製造方法、及びはんだ接合用部材、並びに太陽電池モジュール
DE112015003845T5 (de) * 2014-08-22 2017-05-18 Kabushiki Kaisha Toyota Jidoshokki Bondaufbau, Bondmaterieal und Bondverfahren
US9564409B2 (en) * 2015-01-27 2017-02-07 Semiconductor Components Industries, Llc Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel
US9780067B2 (en) * 2015-06-04 2017-10-03 Advanced Micro Devices, Inc. Semiconductor chip metal alloy thermal interface material
US20180102464A1 (en) * 2016-10-06 2018-04-12 Alpha Assembly Solutions Inc. Advanced Solder Alloys For Electronic Interconnects
JP6144440B1 (ja) * 2017-01-27 2017-06-07 有限会社 ナプラ 半導体封止用プリフォーム

Also Published As

Publication number Publication date
US20200147731A1 (en) 2020-05-14
US11285568B2 (en) 2022-03-29
JP6980029B2 (ja) 2021-12-15
EP3582928B1 (fr) 2023-10-11
CN110545950A (zh) 2019-12-06
KR102409338B1 (ko) 2022-06-14
KR20190129955A (ko) 2019-11-20
EP3582928C0 (fr) 2023-10-11
JP2020518457A (ja) 2020-06-25
WO2018197390A1 (fr) 2018-11-01
DE102017206932A1 (de) 2018-10-25
EP3582928A1 (fr) 2019-12-25

Similar Documents

Publication Publication Date Title
CN110545950B (zh) 用于产生扩散焊接连接的焊料成形件和用于产生焊料成形件的方法
US10008394B2 (en) Method for mounting an electrical component, wherein a hood is used, and hood suitable for use in said method
TWI564979B (zh) 用於多重回流應用之低空洞焊接
JP2014097529A (ja) 発泡金属による接合方法、半導体装置の製造方法、半導体装置
US11424170B2 (en) Method for mounting an electrical component in which a hood is used, and a hood that is suitable for use in this method
WO2014148425A1 (fr) Procédé de fabrication de corps collé et procédé de fabrication de substrat de module de puissance
CN105706224A (zh) 通过将扩散区设计为钎焊连接部的扩散钎焊方法和带这种钎焊连接部的电子组件
JP6443568B2 (ja) 接合材、それを用いた接合方法及び接合構造
JP2016171094A (ja) セラミックパッケージ、電子部品装置、およびその製造方法
JP2007335538A (ja) 半導体装置の製法
US20120028025A1 (en) Electrical or electronic composite component and method for producing an electrical or electronic composite component
JP6904094B2 (ja) 絶縁回路基板の製造方法
KR102226143B1 (ko) 확산 솔더링을 위한 솔더 프리폼, 솔더 프리폼의 생성을 위한 방법, 및 솔더 프리폼의 어셈블리를 위한 방법
JP2011119584A (ja) パワーモジュール用基板およびその製造方法
JP5314370B2 (ja) セラミック部品の製造方法
JP4682889B2 (ja) パワーモジュール用基板およびパワーモジュール並びにパワーモジュール用基板の製造方法
JP6383208B2 (ja) 半導体装置の製造方法、接合材および接合材の形成方法
JP6757006B2 (ja) 半導体装置及びその製造方法
JP5604995B2 (ja) 半導体装置の製造方法
CN111699067B (zh) 用于制造结构单元的方法以及用于连接构件与这种结构单元的方法
JP6859787B2 (ja) はんだ接合体およびその製造方法
CN110870394A (zh) 在陶瓷制成的载体层中制造过孔的方法和含过孔的载体层
JP2017010981A (ja) 配線基板の製造方法
JP5351267B2 (ja) 半導体部品、半導体ウェハ部品、半導体部品の製造方法、及び、接合構造体の製造方法
JP2015119118A (ja) 半導体装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant