CN110856364A - Immersion gold plating method for manufacturing rigid-flex board - Google Patents
Immersion gold plating method for manufacturing rigid-flex board Download PDFInfo
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- CN110856364A CN110856364A CN201911161846.2A CN201911161846A CN110856364A CN 110856364 A CN110856364 A CN 110856364A CN 201911161846 A CN201911161846 A CN 201911161846A CN 110856364 A CN110856364 A CN 110856364A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing of the conductive pattern
- H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing of the conductive pattern
- H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a gold immersion plating method for manufacturing a rigid-flex board, which comprises S1, primary blue gel silk-screen printing; s2, curing the blue gel for one time; s3, plasma cleaning; s4, electroplating gold; s5, removing the blue gel once; s6, secondary blue glue silk-screen printing; s7, secondary curing of blue gel; s8, depositing gold, and generating a nickel layer in a gold deposition area of the soft and hard combined board through oxidation reduction; s9, removing the blue glue for the second time, pulling up the blue glue from the rigid-flexible board at a constant speed, wherein the pulling-up angle is 15-30 degrees, checking whether the blue glue is residual or not, and wiping the residual blue glue if the blue glue is residual; step S10, lead region processing. The blue glue is adopted to shield the gold immersion area, then local gold plating is carried out, then the blue glue is removed, the blue glue is printed on the rigid-flex board again in a silk screen mode to shield the gold plating area, and then selective gold immersion is carried out, therefore, local gold electroplating is carried out firstly, then selective gold immersion is carried out, a punching lead design is adopted, gold removal is not needed to be carried out on the lead, the production efficiency can be improved, and the method is suitable for manufacturing the rigid-flex board on a large scale.
Description
Technical Field
The invention belongs to the technical field of circuit boards, and particularly relates to a gold immersion plating method for manufacturing a rigid-flex circuit board.
Background
With the development of FPC and PCB, the single product of FPC and PCB has failed to meet the functional requirements of the product, so that a Rigid-Flex board (rig-Flex PCB), which is also called as FPCB, has been produced. The rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board together according to process requirements in a fast pressing or combining manner. The rigid-flex circuit board has both flexible characteristics of the FPC and rigid characteristics of the PCB, so that the rigid-flex circuit board has both flexible regions and rigid regions. The rigid-flex board is widely applied to: aerospace, military equipment, computers, medical facilities, consumer electronics, and the like.
In the existing process for manufacturing the soft and hard combined board, a composite process combining local gold plating and selective gold immersion is generally adopted, and the first process comprises the following two processes, namely a former process, resistance welding inspection, gold immersion, characters, gold plating fingers/hard gold plating, secondary drilling and a next process; the second is the former process, resistance welding inspection, gold deposition, characters, gold plating fingers/hard gold plating, lead tearing by hand and the next process. In the prior art, gold immersion is firstly adopted, then gold plating is adopted, and then gold is manually removed from the lead, so that the production efficiency is low, and the soft and hard combined board is not suitable for mass production.
Disclosure of Invention
The invention mainly aims to provide an immersion gold plating method which improves the production efficiency and is suitable for manufacturing soft and hard combined plates in large scale.
In order to achieve the main purpose, the gold immersion plating method for manufacturing the rigid-flex board comprises S1, performing primary silk-screen printing of blue gel, wherein the blue gel is peelable blue gel, the blue gel is printed on the rigid-flex board by a 43T screen, the silk-screen printing speed is 4-5 grids, and the thickness of the blue gel is 50-100 microns; s2, primary curing of blue gel, and placing the rigid-flexible board in an oven, wherein the curing temperature of the oven is 150 ℃; s3, plasma cleaning, namely, flushing the rigid-flexible printed circuit board by using mixed gas to clean the surface and the holes of the rigid-flexible printed circuit board; s4, electroplating gold, namely immersing the rigid-flex board in an electroplating cylinder and applying current to generate a nickel-gold plating layer on the exposed copper surface of the rigid-flex board; s5, removing the blue glue once, pulling the blue glue from the rigid-flexible board at a constant speed, wherein the pulling angle is 15-30 degrees, checking whether the blue glue is residual, and if so, wiping the residual blue glue; s6, performing secondary silk-screen printing of blue gel, wherein the blue gel is peelable blue gel, and is printed on a rigid-flex board by using a 43T screen plate, the silk-screen printing speed is 4-5 grids, and the thickness of the blue gel is 50-100 mu m; s7, carrying out secondary curing on the blue glue, and placing the rigid-flexible board in an oven, wherein the curing temperature of the oven is 150 ℃; s8, depositing gold, and generating a nickel layer in a gold deposition area of the soft and hard combined board through oxidation reduction; s9, removing the blue glue for the second time, pulling up the blue glue from the rigid-flexible board at a constant speed, wherein the pulling-up angle is 15-30 degrees, checking whether the blue glue is residual or not, and wiping the residual blue glue if the blue glue is residual; in step S10, lead regions are processed by using a punching die.
According to the scheme, the blue glue is adopted to shield the gold immersion area, then local gold plating is carried out, then the blue glue is removed, the blue glue is printed on the soft and hard combined board again in a silk screen mode to shield the gold plating area, and then selective gold immersion is carried out.
Preferably, if only blue gel needs to be fixedly attached to one side of the rigid-flex board, the step S1 is performed on the one side of the rigid-flex board, the curing time in the step S2 is 30 minutes, the rigid-flex board cured in 30 minutes is taken out of the oven and then checked for copper leakage, and if yes, the steps S1 and S2 are repeated.
Preferably, if the blue glue needs to be fixedly attached to both sides of the rigid-flex board, step S1 is performed on the first side of the rigid-flex board, and step S2 includes:
step S21, curing the first surface, wherein the curing temperature of the oven is 150 ℃, the curing time is 10 minutes, taking the rigid-flex board cured for 10 minutes out of the oven, checking whether the rigid-flex board leaks copper, and if so, repeating the steps S1 and S21;
step S22, silk-screen printing is carried out on the second surface, the blue glue is printed on the second surface of the soft and hard combined board by a 43T screen plate, the silk-screen printing speed is 4-5 grids, and the thickness of the blue glue is 50-100 mu m;
and S23, curing the second surface, namely placing the rigid-flexible printed circuit board in an oven, wherein the curing temperature of the oven is 150 ℃, the curing time is 30 minutes, taking the rigid-flexible printed circuit board cured for 30 minutes out of the oven, and checking whether the rigid-flexible printed circuit board leaks copper, if so, repeating the steps S22 and S23.
Further, steps S5 and S9 both include: soaking the dust-free cloth or the dust-free paper in alcohol, and wiping the residual blue glue by using the dust-free cloth or the dust-free paper.
Drawings
The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived on the basis of the following drawings without inventive effort.
Fig. 1 is a schematic flow chart of an immersion gold plating method for manufacturing a rigid-flex board according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, the gold immersion plating method for manufacturing the rigid-flex board of the embodiment includes S1, performing primary screen printing of blue gel, where the blue gel is peelable blue gel, printing the blue gel on the rigid-flex board by using a 43T screen, and continuously brushing 2 blades, where the screen printing speed is 4-5 grids, and the thickness of the blue gel is 50-100 μm; s2, primary curing of blue gel, and placing the rigid-flexible board in an oven, wherein the curing temperature of the oven is 150 ℃; s3, plasma cleaning, namely flushing the rigid-flex board by using mixed gas to clean the surface and the holes of the rigid-flex board, wherein the mixed gas comprises at least two of nitrogen, oxygen or carbon tetrafluoride; s4, electroplating gold, namely immersing the rigid-flex board in an electroplating cylinder and applying current to generate a nickel-gold plating layer on the exposed copper surface of the rigid-flex board; s5, removing the blue glue once, pulling the blue glue from the rigid-flexible board at a constant speed, wherein the pulling angle is 15-30 degrees, checking whether the blue glue is residual, and if so, wiping the residual blue glue; s6, performing secondary silk-screen printing of blue gel, wherein the blue gel is peelable blue gel, and is printed on a rigid-flex board by using a 43T screen plate, the silk-screen printing speed is 4-5 grids, and the thickness of the blue gel is 50-100 mu m; s7, carrying out secondary curing on the blue glue, and placing the rigid-flexible board in an oven, wherein the curing temperature of the oven is 150 ℃; s8, depositing gold, and generating a nickel layer in a gold deposition area of the soft and hard combined board through oxidation reduction; s9, removing the blue glue for the second time, pulling up the blue glue from the rigid-flexible board at a constant speed, wherein the pulling-up angle is 15-30 degrees, checking whether the blue glue is residual or not, and wiping the residual blue glue if the blue glue is residual; in step S10, lead regions are processed by using a punching die. The oven is a tunnel oven.
If only the blue glue needs to be fixedly attached to the single surface of the rigid-flex board, the step S1 is performed on the single surface of the rigid-flex board, the curing time in the step S2 is 30 minutes, the rigid-flex board cured for 30 minutes is taken out of the oven, and then whether the rigid-flex board leaks copper is checked, if yes, the steps S1 and S2 are repeated.
When the blue glue is required to be fixedly attached to the two sides of the rigid-flex board, step S1 is performed on the first side of the rigid-flex board, and step S2 includes:
step S21, curing the first surface, wherein the curing temperature of the oven is 150 ℃, the curing time is 10 minutes, taking the rigid-flex board cured for 10 minutes out of the oven, checking whether the rigid-flex board leaks copper, and if so, repeating the steps S1 and S21;
step S22, silk-screen printing is carried out on the second surface, the blue glue is printed on the second surface of the soft and hard combined board by a 43T screen plate, 2 knives are continuously brushed, the silk-screen printing speed is 4-5 grids, and the thickness of the blue glue is 50-100 mu m;
and S23, curing the second surface, namely placing the rigid-flexible printed circuit board in an oven, wherein the curing temperature of the oven is 150 ℃, the curing time is 30 minutes, taking the rigid-flexible printed circuit board cured for 30 minutes out of the oven, and checking whether the rigid-flexible printed circuit board leaks copper, if so, repeating the steps S22 and S23.
Both step S5 and step S9 include: soaking the dust-free cloth or the dust-free paper in alcohol, and wiping the residual blue glue by using the dust-free cloth or the dust-free paper.
Before step S1, the following steps are performed in order:
cutting, namely cutting main materials and auxiliary materials meeting the size requirement according to the cutting size on the MI flow card designed by engineering, and manufacturing a product by a production process;
drilling once, wherein the drilling machine is used for drilling through the drill bit adjusting data matched with the drilling machine, and the drilling can conduct a circuit, thereby facilitating mechanical assembly, production, identification, inspection and the like;
the first hole blacking is carried out, so that the non-conductor part on the hole wall is subjected to hole conduction, a metal hole wall which is conductive enough or welded is formed in the following copper electroplating process, the circuit between the inner layer and the outer layer is conducted, and a complete circuit is formed after etching;
one-time VCP copper plating is carried out, so that copper ions are deposited on the surface of the circuit board and in the hole wall through current and liquid medicine, the copper plating is carried out on the whole circuit board, the hole copper and the surface copper are thickened, the reliability of the circuit board is ensured, and the conduction between layers of the circuit board is realized;
the dry film is pasted at one time, and a layer of water film can be formed on the surface of the copper foil by wet pasting, so that the fluidity of the dry film under pressure can be increased, the viscosity of the dry film is reduced, and the filling effect of the dry film is improved;
exposing for the first time, attaching a film negative film on the board, and carrying out polymerization reaction on a resist monomer of the dry film under the photosynthesis to finish the second pattern transfer and manufacture a circuit pattern on the substrate;
the first development, the resist monomer which does not have polymerization reaction is washed away by weak base, and the resist polymer which has polymerization reaction is left on the copper surface to form a resist film because the resist polymer can not be dissolved in the weak base solution;
etching for the first time, wherein the exposed copper is etched by etching liquid medicine, and the copper protected by the dry film is left to form a required circuit;
primary stripping, namely dissolving the resist film which is polymerized during photoinduced reaction by using a strong alkali solution to expose the finished circuit;
carrying out primary chemical cleaning to clean and protect the finished circuit against oxidation;
AOI inspection, namely, performing electronic scanning inspection by using AOI equipment to confirm the defective products of the circuits through engineering manufacturing data;
primary sand blasting/cleaning, namely a process of coarsening and then cleaning the surface of the product through sand blasting;
the copper surface is protected by one-time lamination, oxidation is prevented, and an insulation effect is achieved; the materials are combined and superposed layer by layer according to the requirements so as to meet different requirements;
pressing once, namely pressing the product which is completely laminated to enable the product to be completely combined with the material;
the first curing, namely curing the pressed product to enable the product to be better combined with the material, so as to avoid the influence of other factors during the operation of the subsequent process;
grinding/cleaning, namely, treating glue stains or dust on the surface of the copper layer by a grinding brush and cleaning;
the base materials are stacked at a time, the materials are combined and stacked layer by layer according to requirements so as to meet different requirements, and the auxiliary materials with different functions are stacked on the product so as to realize the functions of reinforcement, bonding and the like;
curing again, namely curing the pressed product to enable the product to be better combined with the material, so as to avoid the influence of other factors during the operation of the subsequent process;
the secondary lamination of base materials, namely, the materials are combined and laminated layer by layer according to requirements so as to meet different requirements, and auxiliary materials with different functions are arranged and laminated on a product so as to realize the functions of reinforcement, bonding and the like;
thirdly, curing, namely curing the pressed product to enable the product to be better combined with the material, so as to avoid the influence of other factors during the operation of the subsequent process;
performing one-time target punching, namely performing target punching treatment on the position required to be hit according to the MI flow indicator card, wherein the hole of the target punching is used for positioning;
secondary drilling, wherein the drilling is carried out through the drill bit adjusting data matched with the drilling machine, and the drilling can conduct the circuit, thereby facilitating mechanical assembly, production, identification, inspection and the like;
plasma cleaning by using N2/O2/CF4Cleaning the surface and the holes of the product by mixing and impacting the gas;
trimming, namely trimming redundant waste edges at the edge of the plate according to the plate trimming machine, so as to prevent unnecessary resource waste caused by the waste edges;
secondary black hole, to make the non-conductor part on the hole wall conduct the hole, so as to form a metal hole wall which is conductive enough or welded in the following copper electroplating process, to make the circuit between the inner layer and the outer layer conducted, and to form a complete circuit after etching;
secondary VCP copper plating, so that copper ions are deposited on the board surface and in the hole wall through current and liquid medicine, the whole board is plated with copper, the hole copper and the surface copper are thickened, the reliability is ensured, and the conduction between layers of the circuit board is realized;
the dry film is pasted for the second time, and a layer of water film can be formed on the surface of the copper foil by wet pasting, so that the fluidity of the dry film under pressure can be increased, the viscosity of the dry film is reduced, and the filling effect of the dry film is improved;
secondary exposure, attaching a film negative film on the board, and carrying out polymerization reaction on a resist monomer of the dry film under the photosynthesis to finish secondary pattern transfer and manufacture a circuit pattern on the substrate;
secondary development, the resist monomer which does not undergo polymerization reaction is washed away by weak base, and the resist polymer which has undergone polymerization reaction is remained on the copper surface to form a resist film because the resist polymer cannot be dissolved in the weak base solution;
etching for the second time, wherein the exposed copper is etched by etching liquid medicine, and the copper protected by the dry film is left to form a required circuit;
secondary stripping, namely dissolving the resist film which is polymerized during photoinduced process by using a strong alkaline solution to expose the finished circuit;
secondary chemical cleaning, cleaning and antioxidant protection are carried out on the finished circuit;
testing, namely performing functional test on the board produced in the previous process to prevent unqualified functional products from leaking into the hands of a client;
grinding/cleaning, namely, treating glue stains or dust on the surface of the copper layer by a grinding brush and cleaning;
the outer layer solder mask is subjected to silk-screen printing, and because the windowing is too small, the covering film is not easy to attach, so that the solder mask ink is used for production and manufacturing, the surface of the circuit base material which does not need to be welded is covered, the position needing windowing is removed through film exposure and development, then solidification is carried out, and a good insulation effect is provided;
and four times of curing, namely curing the pressed product to enable the product to be better combined with the material, and avoiding the influence of other factors during the operation of the subsequent process.
The blue glue is adopted to shield the gold immersion area, then local gold plating is carried out, then the blue glue is removed, the blue glue is printed on the rigid-flex board again in a silk screen mode to shield the gold plating area, and then selective gold immersion is carried out, therefore, local gold electroplating is carried out firstly, then selective gold immersion is carried out, a punching lead design is adopted, gold removal is not needed to be carried out on the lead, the production efficiency can be improved, and the method is suitable for manufacturing the rigid-flex board on a large scale.
Finally, it should be emphasized that the present invention is not limited to the above-described embodiments, but only the preferred embodiments of the invention have been described above, and the present invention is not limited to the above-described embodiments, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. An immersion gold plating method for manufacturing a rigid-flex board, the immersion gold plating method comprising:
s1, carrying out primary silk-screen printing of blue gel, wherein the blue gel is peelable blue gel, the blue gel is printed on the rigid-flex board by using a 43T screen, the silk-screen printing speed is 4-5 grids, and the thickness of the blue gel is 50-100 mu m;
s2, curing the blue gel once, and placing the rigid-flexible printed circuit board in an oven, wherein the curing temperature of the oven is 150 ℃;
s3, performing plasma cleaning, namely flushing the rigid-flex board by using mixed gas to clean the surface and the holes of the rigid-flex board;
s4, electroplating gold, namely immersing the rigid-flex board in an electroplating cylinder and applying current to generate a nickel-gold plating layer on the exposed copper surface of the rigid-flex board;
s5, removing the blue glue once, pulling the blue glue from the rigid-flexible printed circuit board at a constant speed, wherein the pulling angle is 15-30 degrees, checking whether the blue glue is residual, and if so, wiping the residual blue glue;
s6, performing secondary silk-screen printing on the blue glue, wherein the blue glue is peelable blue glue, the blue glue is printed on the rigid-flex board by using a 43T screen, the silk-screen printing speed is 4-5 grids, and the thickness of the blue glue is 50-100 mu m;
s7, carrying out secondary curing on the blue gel, and placing the rigid-flexible board in an oven, wherein the curing temperature of the oven is 150 ℃;
s8, depositing gold, and generating a nickel layer in the gold deposition area of the soft and hard combined board through oxidation reduction;
s9, removing the blue glue for the second time, pulling the blue glue from the rigid-flexible printed circuit board at a constant speed, wherein the pulling angle is 15-30 degrees, checking whether the blue glue is residual or not, and if so, wiping the residual blue glue;
and step S10, processing a lead area, and processing the lead area by using a punching die.
2. A method of immersion gold plating according to claim 1, wherein:
if only blue glue needs to be fixedly attached to one side of the rigid-flex board, the step S1 is performed on the one side of the rigid-flex board, the curing time in the step S2 is 30 minutes, the rigid-flex board cured in 30 minutes is taken out of the oven and then checked whether the rigid-flex board leaks copper, and if yes, the steps S1 and S2 are repeated.
3. A method of immersion gold plating according to claim 1, wherein:
if the blue glue needs to be fixedly attached to the two sides of the rigid-flex board, the step S1 is performed on the first side of the rigid-flex board, and the step S2 includes:
step S21, curing the first surface, wherein the curing temperature of the oven is 150 ℃, the curing time is 10 minutes, the rigid-flex board cured for 10 minutes is taken out of the oven, and then whether the rigid-flex board leaks copper is checked, if yes, the steps S1 and S21 are repeated;
step S22, performing silk-screen printing on the second surface, namely printing the blue glue on the second surface of the rigid-flex board by using a 43T screen plate, wherein the silk-screen printing speed is 4-5 grids, and the thickness of the blue glue is 50-100 mu m;
and S23, curing the second surface, namely placing the rigid-flexible printed circuit board in an oven, wherein the curing temperature of the oven is 150 ℃, the curing time is 30 minutes, taking the rigid-flexible printed circuit board cured for 30 minutes out of the oven, checking whether the rigid-flexible printed circuit board leaks copper, and if so, repeating the steps S22 and S23.
4. A method of immersion gold plating according to any one of claims 1 to 3, wherein:
the steps S5 and S9 each include: soaking the dust-free cloth or the dust-free paper in alcohol, and wiping the residual blue glue by using the dust-free cloth or the dust-free paper.
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| CN201911161846.2A CN110856364A (en) | 2019-11-21 | 2019-11-21 | Immersion gold plating method for manufacturing rigid-flex board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111315151A (en) * | 2020-04-01 | 2020-06-19 | 江苏苏杭电子有限公司 | Processing technology of leadless plug electrogilding and plate surface gilding printed circuit board |
| CN113766727A (en) * | 2021-09-03 | 2021-12-07 | 深圳市顺华智显技术有限公司 | Flexible circuit board and manufacturing method thereof |
| CN113825321A (en) * | 2021-09-03 | 2021-12-21 | 深圳市顺华智显技术有限公司 | Circuit board and manufacturing method and application thereof |
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| CN113825321A (en) * | 2021-09-03 | 2021-12-21 | 深圳市顺华智显技术有限公司 | Circuit board and manufacturing method and application thereof |
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Application publication date: 20200228 |