Detailed Description
The endpoints of the ranges and any values disclosed herein are not limited to the precise range or value, and such ranges or values should be understood to encompass values close to those ranges or values. For ranges of values, between the endpoints of each of the ranges and the individual points, and between the individual points may be combined with each other to give one or more new ranges of values, and these ranges of values should be considered as specifically disclosed herein.
The conductive metal layer with the holes is arranged on the surface of the metal support, and the conductive metal layer and the metal support are integrated, so that the defect that metal powder is easy to agglomerate and is difficult to uniformly disperse in adhesive glue due to the fact that metal powder is mixed in the adhesive glue and the adhesive glue mixed with the metal powder is coated on the surface of the metal support to form the conductive metal layer in the prior art is overcome. In addition, the bonding process is simple, a metal net does not need to be bonded, the problem that the edge angle position of the metal net is easy to tilt so as to influence the coating of bonding glue is solved, and a third metal layer does not need to be sprayed on the bonding surface of the carbon sliding plate.
Based on the above findings, the first aspect of the present invention provides a collector shoe carbon ski comprising a metal support, a conductive metal layer located on a surface of the metal support and integral with the metal support, and a carbon ski located on a surface of the conductive metal layer;
the carbon sliding plate is connected with the metal support through the conductive metal layer and the bonding glue.
According to a preferred embodiment of the present invention, the conductive metal layer is preferably formed on the surface of the metal support by means of metallurgical bonding, for example, sintering, and the sintering condition is preferably such that the bonding strength between the conductive metal layer and the metal support is 0.5-1.0 MPa. The sintering conditions may include: the sintering temperature is 800-1000 ℃, and the sintering time is 2-5 h.
According to the present invention, the conductive metal layer may be formed of various metal powders known in the art that can be used for the collector shoe carbon skid, for example, copper powder, silver powder, a mixture of copper powder and silver powder, and the like. Preferably, the metal powder is copper powder, more preferably, the copper powder is atomized copper powder, and further preferably atomized copper powder with a particle size of 20 to 50 mesh, which can be obtained commercially. In this preferred case, the electrical resistance of the collector shoe carbon skid plate prepared is more uniform, the electrical resistance is smaller and the connection strength between the metal support and the carbon skid plate is higher.
According to the invention, the thickness of the conductive metal layer on the support can be selected within wide limits, preferably the thickness of the conductive metal layer is 0.3-0.9mm, for example 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9 mm. Under the preferable condition, the subsequent coating of the bonding glue is more facilitated, and the bonding glue is filled in the pores of the conductive metal layer, so that the uniformity of the resistance between the carbon sliding plate and the metal bracket and the connection strength between the metal bracket and the carbon sliding plate can be further improved.
According to a preferred embodiment of the present invention, the strength of the connection between the metal holder and the carbon skid plate is 7MPa or more, preferably 7 to 10 MPa.
According to a preferred embodiment of the invention, the electrical resistance between the metal support and the carbon slide is 0.1-0.5m Ω, for example 0.1m Ω, 0.2m Ω, 0.3m Ω, 0.4m Ω, 0.5m Ω.
According to the present invention, preferably, the aperture penetrates through the conductive metal layer (that is, a section of the aperture is open to the metal holder, and the other end of the aperture is open to the outer surface of the conductive metal layer), and the adhesive can contact the surface of the metal holder through the aperture penetrating through the conductive metal layer. According to a preferred embodiment of the invention, the porosity of the pores is between 40 and 70%, for example 40%, 45%, 50%, 55%, 60%, 65%, 70%. At the preferable porosity, the uniformity of the resistance between the carbon sliding plate and the metal support and the connection strength between the metal support and the carbon sliding plate can be further improved. Preferably, the pores of the conductive metal layer may further include pores located inside and/or on the surface of the conductive metal layer.
According to a preferred embodiment of the present invention, the adhesive glue connects the metal bracket and the carbon sliding plate by filling the pores of the conductive metal layer, and preferably, at least a part of the adhesive glue is attached to at least a part of the surface of the conductive metal layer to indirectly connect the metal bracket and the carbon sliding plate. Preferably, the adhesive paste attached to the surface of the conductive metal layer has a thickness of 20 μm or less, and may be, for example, 0 μm, 1 μm, 3 μm, 5 μm, 7 μm, 9 μm, 11 μm, 13 μm, 15 μm, 17 μm, 19 μm, or 20 μm.
According to the present invention, in order to further improve the connection strength between the metal bracket and the carbon sliding plate, preferably, the heat resistant temperature of the adhesive is 150 ℃ or higher, for example, 150-. Preferably, the adhesive paste is a heat-resistant epoxy resin system, and according to a preferred embodiment of the present invention, the adhesive paste contains novolac epoxy resin, bisphenol a epoxy resin, a silane coupling agent and a curing agent, that is, the novolac epoxy resin, the bisphenol a epoxy resin and the silane coupling agent in the adhesive paste bond the metal bracket and the carbon sliding plate and the conductive metal layer and the carbon sliding plate together by curing under the action of the curing agent. Further preferably, the content of the bisphenol a type epoxy resin is 20 to 80 parts by weight, preferably 40 to 60 parts by weight, the content of the silane coupling agent is 1 to 10 parts by weight, preferably 4 to 6 parts by weight, and the content of the curing agent is 10 to 20 parts by weight, preferably 14 to 17 parts by weight, relative to 100 parts by weight of the novolac epoxy resin.
Among them, the curing agent may be a curing agent capable of curing a novolac epoxy resin, a bisphenol a type epoxy resin, and a silane coupling agent, and preferably, the curing agent is imidazole.
According to the present invention, the metal bracket may be made of various materials conventionally used in the art, and may be made of stainless steel, for example.
According to a second aspect of the present invention, there is provided a method for manufacturing a collector shoe carbon sliding plate, the method comprising:
(1) forming a conductive metal layer with pores on the surface of the metal bracket, wherein the conductive metal layer is integrated with the metal bracket;
(2) filling bonding glue in the pores of the conductive metal layer, covering a carbon sliding plate on the surface of the conductive metal layer filled with the bonding glue, wherein the carbon sliding plate is connected with the metal bracket through the conductive metal layer and the bonding glue; and curing the adhesive to obtain the collector shoe carbon sliding plate.
According to a preferred embodiment of the present invention, in step (1), a metal powder is laid on the surface of a metal support and sintered to form a conductive metal layer having pores on the surface of the metal support, wherein the sintering conditions can be selected in a wide range, and the sintering conditions are preferably such that the bonding strength between the conductive metal layer and the metal support is 0.5-1.0 MPa; preferably, the sintering temperature is 800-1000 ℃, and the sintering time is 2-5 h. According to a further preferred embodiment of the present invention, the rate of temperature rise to the sintering temperature is 5-15 ℃/min, for example, 5 ℃/min, 6 ℃/min, 7 ℃/min, 8 ℃/min, 9 ℃/min, 10 ℃/min, 11 ℃/min, 12 ℃/min, 13 ℃/min, 14 ℃/min, 15 ℃/min. At the preferable temperature rising speed, the metal powder can be better attached to the surface of the metal support, more uniform conductivity is provided, the bonding strength between the conductive metal layer and the metal support can be improved, and the connection strength between the metal support and the carbon sliding plate can be improved.
According to the present invention, the sintering is preferably performed under an atmosphere of an inert gas, which is a gas that does not react with the metal holder and the metal powder at the sintering temperature, and may be, for example, nitrogen, argon, helium, a combination thereof, or the like.
According to the present invention, the metal powder may be any of various metal powders known in the art and applicable to a collector shoe carbon skid plate, for example, copper powder, silver powder, a mixture of copper powder and silver powder, and the like. Preferably, the metal powder is copper powder, more preferably, the copper powder is atomized copper powder, and further preferably atomized copper powder with a particle size of 20 to 50 mesh, which can be obtained commercially. In this preferred case, the electrical resistance of the collector shoe carbon skid plate prepared is more uniform, the electrical resistance is smaller and the connection strength between the metal support and the carbon skid plate is higher.
According to the present invention, the thickness of the conductive metal layer formed on the support may be selected within a wide range, and preferably, the thickness of the conductive metal layer is 0.3 to 0.9mm, for example, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9 mm. Under the preferable condition, the subsequent coating of the adhesive is more facilitated, and the adhesive is filled in the pores of the conductive metal layer and attached to the surface of the conductive metal layer, so that the uniformity of the resistance between the carbon sliding plate and the metal support and the connection strength between the metal support and the carbon sliding plate can be further improved.
According to the present invention, the pores penetrate through the conductive metal layer (i.e., one section of the pores is opened on the metal support, and the other end of the pores is opened on the outer surface of the conductive metal layer), and the adhesive can contact the surface of the metal support through the pores penetrating through the conductive metal layer. According to a preferred embodiment of the invention, the porosity of the pores is between 40 and 70%, for example 40%, 45%, 50%, 55%, 60%, 65%, 70%. At the preferable porosity, the uniformity of the resistance between the carbon sliding plate and the metal support and the connection strength between the metal support and the carbon sliding plate can be further improved. Preferably, the pores of the conductive metal layer obtained in step (1) may further include pores located inside and/or on the surface of the conductive metal layer.
According to the present invention, in the step (2), at least a part of the surface of the conductive metal layer is preferably coated with at least a part of an adhesive to indirectly connect the metal bracket and the carbon slider. Therefore, in the final product, the adhesive glue is further cured on at least part of the surface of the conductive metal layer, and preferably, the thickness of the adhesive glue cured on the surface of the conductive metal layer is less than or equal to 20 μm, and may be, for example, 0 μm, 1 μm, 3 μm, 5 μm, 7 μm, 9 μm, 11 μm, 13 μm, 15 μm, 17 μm, 19 μm, or 20 μm.
According to the present invention, in order to further improve the connection strength between the metal bracket and the carbon sliding plate, it is preferable that the heat resistant temperature of the adhesive is 150 ℃ or more, for example, 150-. The adhesive can penetrate into the pores of the conductive metal layer and can also be adhered to the surface of the conductive metal layer, and the amount and the type of the heat-resistant adhesive can be selected so that the connection strength between the metal bracket and the carbon sliding plate is above 7MPa, preferably 7-10 MPa.
Preferably, the adhesive glue is a heat-resistant epoxy resin system and consists of glue A and glue B, wherein the glue A is heat-resistant epoxy resin, and the glue B is a curing agent. In order to further improve the connection strength between the metal bracket and the carbon sliding plate, the glue A preferably contains novolac epoxy resin, bisphenol A epoxy resin and a silane coupling agent, and the glue B is a curing agent. When not in use, the glue A and the glue B are stored separately and then mixed when in use. And the phenolic epoxy resin, the bisphenol A epoxy resin and the silane coupling agent in the adhesive glue are used for connecting the metal bracket and the carbon sliding plate through curing under the action of a curing agent. Further preferably, the content of the bisphenol A type epoxy resin is 20 to 80 parts by weight and the content of the silane coupling agent is 1 to 10 parts by weight relative to 100 parts by weight of the novolac epoxy resin; the content of the glue B is 5-15 parts by weight relative to 100 parts by weight of the glue A. More preferably, the content of the bisphenol A type epoxy resin is 40 to 60 parts by weight and the content of the silane coupling agent is 4 to 6 parts by weight with respect to 100 parts by weight of the novolac epoxy resin; the content of the glue B is 8-12 parts by weight relative to 100 parts by weight of the glue A.
Among them, the curing agent may be a curing agent capable of curing a novolac epoxy resin, a bisphenol a type epoxy resin, and a silane coupling agent, and preferably, the curing agent is imidazole.
According to a preferred embodiment of the present invention, after the adhesive paste is applied, the metal bracket and the carbon sliding plate can be closely attached by applying an external force. Wherein the connection resistance between the metal holder and the carbon slide can be made 0.1-0.5m Ω, for example, 0.1m Ω, 0.2m Ω, 0.3m Ω, 0.4m Ω, 0.5m Ω by controlling the applied external force.
The conditions under which the adhesive is cured according to the present invention may be conventional in the art, for example, the curing temperature is 70-150 ℃ and the curing time is 4-8 hours. According to a preferred embodiment of the present invention, the curing is performed in 2 temperature stages, which can effectively reduce the resistance and improve the connection strength between the metal support and the carbon sliding plate. Specifically, the curing time can be first from 70 ℃ to 100 ℃ for 2 to 4 hours, and then from 100 ℃ to 150 ℃ for 2 to 4 hours.
According to the present invention, the metal bracket may be made of various materials conventionally used in the art, and may be made of stainless steel, for example.
According to a third aspect of the invention, a collector shoe carbon sliding plate prepared by the method is also provided.
According to a fourth aspect of the invention, there is also provided an electric power vehicle comprising a collector shoe carbon ski as described above.
The present invention will be described in detail below by way of examples.
In the following examples and comparative examples,
the method for measuring the porosity of the conductive metal layer comprises the following steps: firstly, calculating the corresponding particle size of atomized copper powder, wherein if the average particle size is 830 mu m in 20 meshes, the laying area of single-particle copper powder is S-pi r2=0.54mm2Volume of 0.299mm3The mass of the single-grain copper powder is 0.00266 g-2.66 x 10-6kg (density of copper 8.9 g/cm)3) That is, the number of copper powder particles per gram of copper powder is 1/0.00266-375, corresponding to a coverage area of 375 x 0.54mm2=203mm2=2.03*10-4m2The coverage area of 1kg of 20-mesh copper powder laid per square meter is 1000 x 2.03 x 10-4m2=0.203m2. Wherein the porosity (%) (area m of the metal stent)2-0.203 x amount of laying kg)/area of metal stent m2*100%。
The bonding strength of the conductive metal layer to the metal bracket is determined for the flexible material versus the rigid material with reference to the GB/T2790-.
The connection strength between the metal bracket and the carbon slide plate is referred to GB/T2790-.