CN111081663A - Bare die heat dissipation structure - Google Patents
Bare die heat dissipation structure Download PDFInfo
- Publication number
- CN111081663A CN111081663A CN202010005071.6A CN202010005071A CN111081663A CN 111081663 A CN111081663 A CN 111081663A CN 202010005071 A CN202010005071 A CN 202010005071A CN 111081663 A CN111081663 A CN 111081663A
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- China
- Prior art keywords
- heat dissipation
- die
- curved surface
- heat
- bare die
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明提供一种裸晶的散热结构，包括一散热单元及一裸晶，该散热单元具有一第一侧及一第二侧，于该第二侧凸设形成一接触部，该接触部一端呈一微凸曲面态样，该裸晶具有一上表面及一下表面，所述接触部一端与该上表面相接触贴合，并该上表面呈一微凹曲面态样以与所述接触部的微凸曲面态样相匹配。
The present invention provides a heat dissipation structure for a bare die, comprising a heat dissipation unit and a bare die. The heat dissipation unit has a first side and a second side, a contact portion is protruded from the second side, and one end of the contact portion is formed. In the shape of a slightly convex curved surface, the bare die has an upper surface and a lower surface, one end of the contact portion is in contact with the upper surface, and the upper surface is in the shape of a slightly concave curved surface to be in contact with the contact portion to match the microconvex surface morphology.
Description
Technical Field
The present invention relates to a heat dissipation structure of a bare die, and more particularly, to a heat dissipation structure of a bare die capable of greatly reducing thermal resistance and effectively improving heat dissipation efficiency.
Background
The semiconductor integrated circuit industry has experienced rapid growth, and technological advances in semiconductor integrated circuit materials and design have produced generations of semiconductor integrated circuits, each having smaller and more complex circuits than previous generations, however, these advances have also increased the complexity of processing and manufacturing semiconductor integrated circuits.
The traditional chip includes a bare chip (Die) and a package casing, the bare chip and the package casing are usually combined by indium soldering or other combination methods, however, the structural design can cause the interface thermal resistance of the bare chip and the package casing to be very large, therefore, in recent years, with the power becoming high and the heat flow density becoming large, in order to effectively improve the heat dissipation efficiency of the chip, the chip factory cancels the package casing element for wrapping the chip in design, and wants to reduce the thermal conduction thermal resistance of the package casing material body and the thermal resistance of the interface material, the design mode becomes the structure of the bare chip, the thermal conduction paste and the heat sink, but because the flatness, the weight and the buckling force of the heat sink of the bare chip silicon material of the design are relatively high, the bare chip can generate deformation when working at high temperature, so that the surface of the bare chip takes a slightly concave curved surface shape, and a gap is generated when the bare chip is contacted and jointed with the heat sink, and the thermal resistance problem, so that the heat of the bare die cannot be quickly carried away by the heat sink, and the improvement of the heat dissipation efficiency is very limited.
As described above, the prior art has the following disadvantages:
1. severe thermal resistance problems;
2. the heat dissipation efficiency is poor.
Therefore, how to solve the above-mentioned problems and disadvantages is a direction in which the inventors of the present invention and related manufacturers engaged in the industry need to research and improve.
Disclosure of Invention
Accordingly, the present invention has been made to solve the above problems, and it is an object of the present invention to provide a heat dissipating structure for a bare chip which can greatly reduce the thermal resistance problem.
A secondary objective of the present invention is to provide a heat dissipation structure of a bare die, which can greatly improve the heat dissipation efficiency.
To achieve the above object, the present invention provides a heat dissipation structure for a bare die, comprising:
the heat dissipation unit is provided with a first side and a second side, a contact part is convexly arranged on the second side, and one end of the contact part is a slightly convex curved surface; and
and the bare chip is provided with an upper surface and a lower surface, one end of the contact part is contacted and attached with the upper surface, and the upper surface is a slightly concave curved surface so as to be matched with the slightly convex curved surface of the contact part.
The heat radiation structure of bare die, wherein: a micro-gap is formed between the heat dissipation unit and the bare crystal, and a heat conduction coating is coated on the micro-gap.
The heat radiation structure of bare die, wherein: the contact part and the heat dissipation unit are integrally formed or non-integrally formed.
The heat radiation structure of bare die, wherein: the bending radian of the slightly convex curved surface and the slightly concave curved surface is between 0.05mm and 0.07 mm.
The heat radiation structure of bare die, wherein: the heat dissipation unit is also provided with a plurality of heat dissipation fins which are arranged on the first side at intervals.
The heat radiation structure of bare die, wherein: the lower surface of the bare chip is correspondingly arranged on a substrate.
The heat radiation structure of bare die, wherein: and one end of the contact part of the heat dissipation unit is made into a slightly convex curved surface in a grinding processing mode.
Through the design of the structure of the invention, when the bare chip starts to work, heat is generated, so that the upper surface of the bare chip can deform at a high temperature to present a slightly concave curved surface state, and the structure at one end of the contact part of the heat dissipation unit presents a slightly convex curved surface state, so that the upper surface of the bare chip can be completely contacted and attached with the contact part, the problem of thermal resistance is effectively reduced, the heat on the bare chip can be quickly carried away by the heat dissipation unit, and the heat dissipation efficiency is greatly improved.
Drawings
Fig. 1 is an exploded view of a heat dissipating structure of a bare die of the present invention;
fig. 2 is an enlarged schematic view of a heat dissipation structure of a bare die of the present invention.
Description of reference numerals: a heat dissipation unit 2; a first side 20; heat dissipating fins 200; a second side 21; a contact portion 210; a bare crystal 3; an upper surface 30; a lower surface 31; a thermally conductive coating 32; a substrate 4.
Detailed Description
The above objects, together with the structural and functional features thereof, are accomplished by the preferred embodiments according to the accompanying drawings.
Referring to fig. 1 and 2, which are an exploded view and an enlarged schematic view of a heat dissipation structure of a bare die of the present invention, as shown in the figure, the heat dissipation structure of a bare die includes a heat dissipation unit 2 and a bare die 3, the heat dissipation unit 2 is a heat dissipation element such as a heat sink, a heat dissipation base, a temperature equalization plate, etc., and has a first side 20 and a second side 21, a plurality of heat dissipation fins 200 are formed on the first side 20, a contact portion 210 is formed on the second side 21 in a protruding manner (i.e., the contact portion 210 is formed on the protruding surface of the second side 21 of the heat dissipation unit), one end of the contact portion 210 is in a slightly convex curved surface shape, in this embodiment, the contact portion 210 and the heat dissipation unit 2 are integrally formed, but not limited thereto, a user can make the contact portion 210 and the heat dissipation unit 2 be non-integrally formed according to the usage requirement, and the contact portion 210 and the heat dissipation unit 2 are selected from silver, or, The contact portion 210 and the heat dissipating unit 2 may be made of the same material or different materials, as will be described in the first paragraph.
The bare die 3 has an upper surface 30 and a lower surface 31, one end of the contact portion 210 contacts and adheres to the upper surface 30, the upper surface 30 is a slightly concave curved surface so as to match with the slightly convex curved surface of the contact portion 210, and the lower surface 31 is correspondingly mounted on a substrate 4.
Referring to fig. 2, a micro gap (not shown) is further formed between the contact surfaces of the heat dissipation unit 2 and the bare die 3, the micro gap is correspondingly coated with a thermal conductive coating 32, the thermal conductive coating 32 is a thermal conductive paste (thermal), a thermal conductive adhesive, and a thermal conductive pad (pad), and the thermal conductive coating 32 is used to more closely fill the micro gap to avoid the generation of thermal resistance due to the formation of the micro gap.
Therefore, through the design of the structure of the present invention, when the bare die 3 starts working, heat will be generated to gradually raise the temperature of the bare die 3, and due to the material of the bare die 3 itself and the manufacturing process thereof, the bare die 3 will deform at a high temperature, i.e. the center of the upper surface 30 of the bare die 3 deforms and gradually sinks to present a slightly concave curved surface pattern, at this time, the structure at one end of the contact portion 210 of the heat dissipation unit 2 presents a slightly convex curved surface pattern, and the shapes of the slightly convex curved surface pattern and the slightly concave curved surface pattern are completely matched, so that the contact portion 210 and the upper surface 30 of the bare die 3 are completely contacted and attached, thus, the gap generated when the contact interface of the existing heat dissipation unit presents a plane shape and the deformed upper surface of the bare die when contacted and attached can be improved, and the present invention effectively improves the thermal resistance problem of the existing structure, thereby, the heat on the die 3 can be rapidly carried away by the heat dissipation unit 2, and the heat dissipation efficiency is greatly improved.
It should be noted that, since the deformation (micro-concave curve pattern) generated on the upper surface 30 of the bare die 3 is very small, the deformation amount is usually in the unit of micrometer (μm) and the bending radian of the deformation is between 50 μm and 70 μm, and the diagram shown in the present invention is illustrated by being magnified several times, so as to clarify the structural design of the present invention, the bending radian of the micro-convex curve pattern of the contact portion 210 of the heat dissipation unit 2 is very small, and the bending radian in the micrometer (μm) is also the bending radian, so that the second side 21 of the heat dissipation unit 2 is usually selected to make the contact portion 210 be a micro-convex curve pattern by grinding, however, the manufacturing method of the micro-convex CNC curve pattern is not limited to grinding, but can also be selected to use grinding, shaving or other processing methods.
As described above, the present invention has the following advantages over the prior art:
1. the thermal resistance problem is greatly reduced;
2. the heat dissipation efficiency is greatly improved.
The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (7)
1. A heat dissipation structure of a bare die, comprising:
the heat dissipation unit is provided with a first side and a second side, a contact part is convexly arranged on the second side, and one end of the contact part is a slightly convex curved surface; and
and the bare chip is provided with an upper surface and a lower surface, one end of the contact part is contacted and attached with the upper surface, and the upper surface is a slightly concave curved surface so as to be matched with the slightly convex curved surface of the contact part.
2. The heat dissipating structure of a die as set forth in claim 1, wherein: a micro-gap is formed between the heat dissipation unit and the bare crystal, and a heat conduction coating is coated on the micro-gap.
3. The heat dissipating structure of a die as set forth in claim 1, wherein: the contact part and the heat dissipation unit are integrally formed or non-integrally formed.
4. The heat dissipating structure of a die as set forth in claim 1, wherein: the bending radian of the slightly convex curved surface and the slightly concave curved surface is between 0.05mm and 0.07 mm.
5. The heat dissipating structure of a die as set forth in claim 1, wherein: the heat dissipation unit is also provided with a plurality of heat dissipation fins which are arranged on the first side at intervals.
6. The heat dissipating structure of a die as set forth in claim 1, wherein: the lower surface of the bare chip is correspondingly arranged on a substrate.
7. The heat dissipating structure of a die as set forth in claim 1, wherein: and one end of the contact part of the heat dissipation unit is made into a slightly convex curved surface in a grinding processing mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010005071.6A CN111081663A (en) | 2020-01-03 | 2020-01-03 | Bare die heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010005071.6A CN111081663A (en) | 2020-01-03 | 2020-01-03 | Bare die heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111081663A true CN111081663A (en) | 2020-04-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010005071.6A Pending CN111081663A (en) | 2020-01-03 | 2020-01-03 | Bare die heat dissipation structure |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09321468A (en) * | 1996-05-30 | 1997-12-12 | Toshiba Corp | Heat dissipation device |
| CN2664186Y (en) * | 2003-09-22 | 2004-12-15 | 威盛电子股份有限公司 | Thermal mechanism to protect die package |
| US20070086168A1 (en) * | 2005-10-13 | 2007-04-19 | International Business Machines Corporation | Method and apparatus for optimizing heat transfer with electronic components |
| JP2010040846A (en) * | 2008-08-06 | 2010-02-18 | Yamaha Corp | Semiconductor device and method of manufacturing the same |
| CN202713872U (en) * | 2011-07-19 | 2013-01-30 | 冠鼎科技有限公司 | Heat conductor structure |
| CN202816904U (en) * | 2012-05-24 | 2013-03-20 | 中兴通讯股份有限公司 | Encapsulation structure of naked-die device |
| CN105764302A (en) * | 2014-12-18 | 2016-07-13 | 中兴通讯股份有限公司 | Heat conduction pad, radiator and heat dissipation assembly |
| CN206584917U (en) * | 2017-02-27 | 2017-10-24 | 奥肯思（北京）科技有限公司 | A kind of gastight ceramic packaging body of upside-down mounting welding core |
-
2020
- 2020-01-03 CN CN202010005071.6A patent/CN111081663A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09321468A (en) * | 1996-05-30 | 1997-12-12 | Toshiba Corp | Heat dissipation device |
| CN2664186Y (en) * | 2003-09-22 | 2004-12-15 | 威盛电子股份有限公司 | Thermal mechanism to protect die package |
| US20070086168A1 (en) * | 2005-10-13 | 2007-04-19 | International Business Machines Corporation | Method and apparatus for optimizing heat transfer with electronic components |
| JP2010040846A (en) * | 2008-08-06 | 2010-02-18 | Yamaha Corp | Semiconductor device and method of manufacturing the same |
| CN202713872U (en) * | 2011-07-19 | 2013-01-30 | 冠鼎科技有限公司 | Heat conductor structure |
| CN202816904U (en) * | 2012-05-24 | 2013-03-20 | 中兴通讯股份有限公司 | Encapsulation structure of naked-die device |
| CN105764302A (en) * | 2014-12-18 | 2016-07-13 | 中兴通讯股份有限公司 | Heat conduction pad, radiator and heat dissipation assembly |
| CN206584917U (en) * | 2017-02-27 | 2017-10-24 | 奥肯思（北京）科技有限公司 | A kind of gastight ceramic packaging body of upside-down mounting welding core |
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