CN1112838C - 有复合布线结构的陶瓷基板及其制造方法 - Google Patents

有复合布线结构的陶瓷基板及其制造方法 Download PDF

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Publication number
CN1112838C
CN1112838C CN97181620A CN97181620A CN1112838C CN 1112838 C CN1112838 C CN 1112838C CN 97181620 A CN97181620 A CN 97181620A CN 97181620 A CN97181620 A CN 97181620A CN 1112838 C CN1112838 C CN 1112838C
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CN
China
Prior art keywords
ceramic substrate
network
electrical
thermal
ceramic
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Expired - Fee Related
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CN97181620A
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English (en)
Chinese (zh)
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CN1245629A (zh
Inventor
皮埃尔·L·德罗什蒙特
彼特·H·法默
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Individual
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Publication of CN1245629A publication Critical patent/CN1245629A/zh
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Publication of CN1112838C publication Critical patent/CN1112838C/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7438—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
CN97181620A 1996-12-30 1997-12-29 有复合布线结构的陶瓷基板及其制造方法 Expired - Fee Related CN1112838C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3398396P 1996-12-30 1996-12-30
US60/033,983 1996-12-30

Publications (2)

Publication Number Publication Date
CN1245629A CN1245629A (zh) 2000-02-23
CN1112838C true CN1112838C (zh) 2003-06-25

Family

ID=21873603

Family Applications (1)

Application Number Title Priority Date Filing Date
CN97181620A Expired - Fee Related CN1112838C (zh) 1996-12-30 1997-12-29 有复合布线结构的陶瓷基板及其制造方法

Country Status (5)

Country Link
EP (1) EP0948879A4 (fr)
JP (1) JP2001507867A (fr)
CN (1) CN1112838C (fr)
CA (1) CA2275972A1 (fr)
WO (1) WO1998030072A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102210844B (zh) * 2010-04-07 2012-10-31 北京亚东生物制药有限公司 一种治疗慢性肝炎的中药组合物及其制备方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6346743B1 (en) * 2000-06-30 2002-02-12 Intel Corp. Embedded capacitor assembly in a package
US6841857B2 (en) * 2001-07-18 2005-01-11 Infineon Technologies Ag Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chip
DE102008001414A1 (de) * 2008-04-28 2009-10-29 Robert Bosch Gmbh Substrat-Schaltungsmodul mit Bauteilen in mehreren Kontaktierungsebenen
CN102314526B (zh) * 2010-07-02 2013-09-25 中国科学院微电子研究所 一种优化集成电路版图热分布的方法
JP5488540B2 (ja) * 2011-07-04 2014-05-14 トヨタ自動車株式会社 半導体モジュール
CN111328189A (zh) * 2020-03-17 2020-06-23 万安裕维电子有限公司 一种耐盐雾型pcb板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676292A (en) * 1970-10-07 1972-07-11 Olin Corp Composites of glass-ceramic-to-metal,seals and method of making same
JPS6028296A (ja) * 1983-07-27 1985-02-13 株式会社日立製作所 セラミツク多層配線回路板
JPH02501179A (ja) * 1988-02-29 1990-04-19 ディジタル　イクイプメント　コーポレーション セラミック集積回路パッケージのリードを整列するシステム
US5336532A (en) * 1989-02-21 1994-08-09 Dow Corning Corporation Low temperature process for the formation of ceramic coatings
US5113315A (en) * 1990-08-07 1992-05-12 Cirqon Technologies Corporation Heat-conductive metal ceramic composite material panel system for improved heat dissipation
JP3026465B2 (ja) * 1992-03-10 2000-03-27 株式会社日立製作所 セラミック薄膜混成配線基板および製造方法
US5506755A (en) * 1992-03-11 1996-04-09 Kabushiki Kaisha Toshiba Multi-layer substrate
DE4222474A1 (de) * 1992-07-09 1994-01-13 Bosch Gmbh Robert Montageeinheit für Mehrlagenhybrid mit Leistungsbauelementen
US5444298A (en) * 1993-02-04 1995-08-22 Intel Corporation Voltage converting integrated circuit package
JPH06255019A (ja) * 1993-03-08 1994-09-13 Hitachi Ltd セラミック複合積層板とそれを用いた多層配線基板の製法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102210844B (zh) * 2010-04-07 2012-10-31 北京亚东生物制药有限公司 一种治疗慢性肝炎的中药组合物及其制备方法

Also Published As

Publication number Publication date
WO1998030072A1 (fr) 1998-07-09
CA2275972A1 (fr) 1998-07-09
EP0948879A4 (fr) 2003-08-27
JP2001507867A (ja) 2001-06-12
CN1245629A (zh) 2000-02-23
EP0948879A1 (fr) 1999-10-13

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20030625

Termination date: 20101229