CN111663127A - 一种低温化学镀低钖青铜镀液 - Google Patents
一种低温化学镀低钖青铜镀液 Download PDFInfo
- Publication number
- CN111663127A CN111663127A CN201910260652.1A CN201910260652A CN111663127A CN 111663127 A CN111663127 A CN 111663127A CN 201910260652 A CN201910260652 A CN 201910260652A CN 111663127 A CN111663127 A CN 111663127A
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- China
- Prior art keywords
- tin
- plating solution
- low
- plating
- plating bath
- Prior art date
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- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 38
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 title claims abstract description 17
- 229910000906 Bronze Inorganic materials 0.000 title claims abstract description 15
- 239000010974 bronze Substances 0.000 title claims abstract description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims description 20
- 229910052718 tin Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 12
- 239000010410 layer Substances 0.000 claims description 9
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000008139 complexing agent Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000003381 stabilizer Substances 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 229910000375 tin(II) sulfate Inorganic materials 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 2
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical group [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims description 2
- 230000002378 acidificating effect Effects 0.000 claims description 2
- 229910052927 chalcanthite Inorganic materials 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 239000011247 coating layer Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 3
- 229910001431 copper ion Inorganic materials 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- -1 Cu and Sn alloy Chemical compound 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 238000007323 disproportionation reaction Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
本发明为化学镀低饧青铜镀液，其特点是：镀液工作温度为20℃以上，镀液长期稳定，调整容易，镀液工作时无气体产生。本发明镀液镀出的镀层呈淡黄色，光亮细致，孔隙率极低，是一种理想的装饰镀底层。
Description
说明书
“一种低温化学镀低钖青铜镀液”，本发明属化学镀技术领域。
本发明化学镀低钖青铜镀液既是化学镀铜钖合金镀液。
本发明化学镀低钖青铜镀液其特点是：镀液工作温度为 20℃以上，镀液长期稳定，调整容易，镀液工作时无气体产生。本发明镀液镀出的镀层呈淡黄色，光亮细致，孔隙率极低，是一种理想的装饰镀底层。
本发明是由主盐、络合剂、稳定剂和少许HF和H2SO4组成。
本发明主盐是CuSO4·5H2O、SnSO4·2H2O、络合剂的 H3C6H5O7·2H2O，稳定剂为CH3COONa·3H2O、H2SO4和少许HF、光亮剂组成。
化学镀铜钖合金镀液形成镀层时：
铜离子歧化反应：2Cu+-→Cu2++Cu0表面镀出一个Cu0就会产生两个一价铜离子，一价铜离子易和氧相结合生成Cu2O (即谓之铜粉)，其反应式：
降低或消除一价铜离子产生采取下列措施：
1、镀液加大H2SO4的含量：2Cu++1/2O2+2H+-→ 2Cu2++H2O。
2、镀液中增加铜盐络合剂H3C6H5O7·2H2O的含量。
3、曝气搅动镀液：在足够量H2SO4下，2Cu+氧化成二价铜离子。
4、加SnSO4·2H2O(镀低钖青铜需要的主盐)
形成低钖青铜原理：钢件浸入含铜钖的酸性镀液中，初始阶段钢铁工件表面形成一层铜、钖接触层，即Cu、Sn合金属。
化学镀低钖青铜镀液配比(以配10升为例)：
少许光亮剂。
Claims (4)
1.一种低温化学镀低钖青铜镀液，其特征在于工作温度为20℃以上，由铜、钖主盐、络合剂、稳定剂、H2SO4和少许HF光亮剂组成。
2.根据权利要求1所述的化学镀低钖青铜镀液其特点在于由主盐是CuSO4·5H2O、SnSO4·2H2O、络合剂的H3C6H5O7·2H2O，稳定剂为CH3COONa·3H2O、H2SO4和少许HF、光亮剂组成。
3.根据权利要求2所述的化学镀低钖青铜镀液，其配方(以配10升为例)：
4.根据权利要求3所述的一种化学镀低钖青铜镀液其形成低钖青铜的原理：钢铁件浸入含铜、钖的酸性镀液中。初始阶段钢铁工件表面形成一层铜、钖接触层，即Cu、Sn合金层。
还原镀液中Cu+、Cu2+，随之Sn自身也沉积。铜主要靠自行催化的特性加厚镀层，由于镀液中含钖盐少，沉积的Sn也少，形成了含Cu多，含Sn少的低钖青铜层。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910260652.1A CN111663127A (zh) | 2019-03-06 | 2019-03-06 | 一种低温化学镀低钖青铜镀液 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910260652.1A CN111663127A (zh) | 2019-03-06 | 2019-03-06 | 一种低温化学镀低钖青铜镀液 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111663127A true CN111663127A (zh) | 2020-09-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910260652.1A Pending CN111663127A (zh) | 2019-03-06 | 2019-03-06 | 一种低温化学镀低钖青铜镀液 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111663127A (zh) |
-
2019
- 2019-03-06 CN CN201910260652.1A patent/CN111663127A/zh active Pending
Non-Patent Citations (1)
| Title |
|---|
| 张允诚等: "《化学镀理论及实践》", 中国科学技术大学出版社 * |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200915 |
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| RJ01 | Rejection of invention patent application after publication |