CN112088185A - Resin composition, sealing sheet, and sealing body - Google Patents

Abstract

The present invention is a resin composition containing the following (A) components, (B) components and (C) components, (A) component: a modified polyolefin resin, (B) component: a compound having a cyclic ether group, and (C) component: a photocationic polymerization initiator. According to the present invention, there is provided a resin composition excellent in sheet workability (film formability), and sealing with an adhesive layer formed using the resin composition excellent in adhesive strength, colorless transparency, and water vapor barrier properties A sheet, and a sealing body in which a to-be-sealed object is sealed using the sealing sheet.

Description

Resin composition, sealing sheet and sealing body

technical field

The present invention relates to a resin composition excellent in sheet workability (film formability), and a sealing sheet having an adhesive layer formed using the resin composition excellent in adhesive strength, colorless transparency, and water vapor barrier properties, and a sealing body formed by sealing a to-be-sealed object using the sealing sheet.

Background technique

In recent years, an organic EL element has attracted attention as a light-emitting element that can emit light with high brightness by low-voltage DC driving.

However, the organic EL element has a problem that light emission characteristics such as light emission luminance, light emission efficiency, and light emission uniformity tend to decrease with time.

As a cause of the problem of this reduction in light emission characteristics, it is thought that oxygen, moisture, etc. penetrate into the organic EL element to degrade electrodes and organic layers. Therefore, the organic EL element is sealed with a sealing material to prevent the penetration of oxygen and moisture.

In addition, when a sealing material such as an organic EL element is sealed with a sealing material, if outgassing occurs from the sealing material, the organic EL element or the like is degraded, and thus a sealing material with low outgassing properties has also been developed.

For example, Patent Document 1 describes a composition for sealing an organic EL element containing a specific cationic curable compound, a photocationic polymerization initiator, and a specific hydantoin compound.

In addition, Patent Document 1 also describes that since the cured product of the sealing composition has moisture resistance and low outgassing properties, deterioration of the organic EL element due to moisture or outgassing can be prevented.

prior art literature

Patent Literature

Patent Document 1: International Publication No. 2017/094809.

SUMMARY OF THE INVENTION

The problem to be solved by the invention

However, there are many cases where a to-be-sealed object such as an organic EL element is used under severe conditions such as outdoors or in a vehicle. Therefore, in addition to excellent moisture resistance and low outgassing properties, a sealing sheet excellent in adhesive strength, or a resin composition suitable for use as a raw material of such a sealing sheet, is desired. Moreover, the hardened|cured material of the composition for organic electroluminescent element sealing as described in patent document 1 is also desired to be excellent in colorless transparency because of its specific optical use.

However, Patent Document 1 does not describe the results of physical properties evaluation of the cured product of the organic EL element sealing composition or the colorless transparency.

An object of the present invention is to provide a resin composition excellent in sheet workability (film formability), and an adhesive bond layer formed using the resin composition excellent in adhesive strength, colorless transparency, and water vapor barrier properties The sealing sheet, and the sealing body formed by sealing the object to be sealed by using the sealing sheet.

means of solving problems

In order to solve the above-mentioned problems, the inventors of the present invention have conducted intensive research and found that:

(i) a resin composition containing a modified polyolefin-based resin, a compound having a cyclic ether group, and a photocationic polymerization initiator is excellent in sheet processability (film formability), and

(ii) A sealing sheet having an adhesive bond layer formed using the resin composition is excellent in adhesive strength, colorless transparency, and water vapor barrier properties;

Thus, the present invention has been completed.

Therefore, according to this invention, the resin composition of the following [1]-[10], the sealing sheet of [11]-[14], and the sealing body of [15] and [16] are provided.

[1] A resin composition containing the following (A) component, (B) component, and (C) component:

(A) component: modified polyolefin resin,

(B) component: a compound having a cyclic ether group,

(C)component: a photocationic polymerization initiator.

[2] The resin composition according to [1], wherein the component (A) is an acid-modified polyolefin resin.

[3] The resin composition according to [1] or [2], wherein the cyclic ether group of the component (B) is an oxiranyl group or an oxetanyl group.

[4] The resin composition according to any one of [1] to [3], wherein the content of the (B) component is 5 to 50 parts by mass relative to 100 parts by mass of the (A) component share.

[5] The resin composition according to any one of [1] to [4], wherein the component (C) is an aromatic sulfonium salt-based compound.

[6] The resin composition according to any one of [1] to [5], wherein the content of the (C) component with respect to 100 parts by mass of the (B) component is 0.04 to 2 mass parts share.

[7] The resin composition according to any one of [1] to [6], which further contains a tackifier.

[8] The resin composition according to [7], wherein the content of the tackifier is 1 to 200 parts by mass relative to 100 parts by mass of the component (A).

[9] The resin composition according to any one of [1] to [8], which further contains a silane coupling agent.

[10] The resin composition according to [9], wherein the content of the silane coupling agent is 0.01 to 10 parts by mass relative to 100 parts by mass of the component (A).

[11] A sealing sheet comprising a base material or a release film and an adhesive layer formed on the base material or release film, wherein

The adhesive layer is formed using the resin composition according to any one of [1] to [10].

[12] A sealing sheet consisting of two release films and an adhesive layer sandwiched between the two release films, wherein

The adhesive layer is formed using the resin composition according to any one of [1] to [10].

[13] A sealing sheet comprising a release film, a gas barrier film, and an adhesive layer sandwiched between the release film and the gas barrier film, wherein

The adhesive layer is formed using the resin composition according to any one of [1] to [10].

[14] The sealing sheet according to [13], wherein the gas barrier film is a metal foil, a resin-made film, or a thin-film glass.

[15] A sealing body obtained by sealing a to-be-sealed object using the sealing sheet according to any one of [11] to [14].

[16] The sealing body according to [15], wherein the object to be sealed is an electronic device.

effect of invention

According to the present invention, it is possible to provide a resin composition excellent in sheet workability (meaning that it can be easily molded into a sheet. Also referred to as "film-forming properties".), having the adhesive strength formed by using the resin composition, without A sealing sheet of an adhesive bond layer excellent in color transparency (high total light transmittance and very little coloration) and water vapor barrier properties, and a sealing body using the sealing sheet to seal a to-be-sealed object.

Detailed ways

Hereinafter, the present invention will be described in detail by dividing it into 1) resin composition, 2) sealing sheet, and 3) sealing body.

1) Resin composition

The resin composition of the present invention contains the following (A) component, (B) component and (C) component:

(A) Component: Modified polyolefin-based resin

(B) Component: a compound having a cyclic ether group

(C)component: a photocationic polymerization initiator.

[Component (A): Modified polyolefin resin]

The resin composition of this invention contains a modified polyolefin resin as (A) component.

By containing the modified polyolefin-based resin, a cured product of a resin composition that is more excellent in sheet workability (film-forming properties) and a resin composition that is more excellent in adhesive strength can be obtained. Moreover, by using the resin composition containing a modified polyolefin resin, the adhesive bond layer of the thickness mentioned later can be formed efficiently.

The modified polyolefin-based resin is a functional group-introduced polyolefin resin obtained by subjecting a polyolefin resin as a precursor to a modification treatment using a modifier.

The polyolefin resin refers to a polymer containing a repeating unit derived from an olefin-based monomer. The polyolefin resin may be a polymer composed of only one or two or more kinds of repeating units derived from olefin-based monomers, or may be composed of repeating units derived from olefin-based monomers and repeating units derived from olefin-based monomers. A polymer composed of repeating units of other monomers that are copolymerized.

As the olefin-based monomer, an α-olefin having 2 to 8 carbon atoms is preferable, ethylene, propylene, 1-butene, isobutylene, or 1-hexene is more preferable, and ethylene or propylene is still more preferable.

Vinyl acetate, (meth)acrylate, styrene, etc. are mentioned as another monomer which can be copolymerized with an olefin type monomer. Here, "(meth)acrylic acid" means acrylic acid or methacrylic acid (the same below).

Examples of polyolefin resins include very low density polyethylene (VLDPE), low density polyethylene (LDPE), medium density polyethylene (MDPE), high density polyethylene (HDPE), and linear low density polyethylene (LLDPE). ), polypropylene (PP), ethylene-propylene copolymer, olefin-based elastomer (TPO), ethylene-vinyl acetate copolymer (EVA), ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid Ester copolymers, etc.

The modifier used for the modification treatment of the polyolefin resin is a compound having a functional group in the molecule.

The functional group includes a carboxyl group, a carboxylic acid anhydride group, a carboxylate ester group, a hydroxyl group, an epoxy group, an amide group, an ammonium group, a nitrile group, an amino group, an imide group, an isocyanate group, an acetyl group, a thiol group, and an ether group. group, thioether group, sulfo group, phosphino group, nitro group, urethane group, alkoxysilyl group, silanol group, halogen atom and the like. Among them, a carboxyl group, a carboxylic acid anhydride group, a carboxylate group, a hydroxyl group, an ammonium group, an amino group, an imide group, an isocyanate group, and an alkoxysilyl group are preferable, a carboxylic acid anhydride group and an alkoxysilyl group are more preferable, and especially A carboxylic acid anhydride group is preferred.

The compound having a functional group may have two or more functional groups in the molecule.

Examples of the modified polyolefin-based resin include acid-modified polyolefin-based resins and silane-modified polyolefin-based resins, and acid-modified polyolefin-based resins are preferred from the viewpoint of obtaining more excellent effects of the present invention.

The acid-modified polyolefin-based resin refers to a substance obtained by graft-modifying a polyolefin resin with an acid. For example, those obtained by reacting an unsaturated carboxylic acid with a polyolefin resin and introducing a carboxyl group (graft modification) can be mentioned. In addition, in this specification, an acid contains the concept of an acid anhydride, an unsaturated carboxylic acid contains the concept of an unsaturated carboxylic anhydride, and a carboxyl group contains the concept of a carboxylic acid anhydride group.

Examples of the unsaturated carboxylic acid to be reacted with the polyolefin resin include maleic acid, fumaric acid, itaconic acid, citraconic acid, glutaric acid, tetrahydrophthalic acid, aconitic acid, maleic anhydride, Itaconic anhydride, glutaric anhydride, citraconic anhydride, aconitic anhydride, norbornene dianhydride, tetrahydrophthalic anhydride, etc.

These may be used individually by 1 type, or may be used in combination of 2 or more types. Among them, maleic anhydride is preferable because it is easy to obtain a cured product of a resin composition having more excellent sheet workability (film formability) and a resin composition having more excellent adhesive strength.

The amount of the unsaturated carboxylic acid to be reacted with the polyolefin resin is preferably 0.1 to 5 parts by mass, more preferably 0.2 to 3 parts by mass, and even more preferably 0.2 to 1 part by mass relative to 100 parts by mass of the polyolefin resin. The resin composition containing the acid-modified polyolefin-type resin obtained in this way is easy to obtain the hardened|cured material which is more excellent in adhesive strength.

As acid-modified polyolefin resin, a commercial item can also be used. Examples of commercial products include Admer (registered trademark) (manufactured by Mitsui Chemicals Corporation), Unistole (registered trademark) (manufactured by Mitsui Chemicals Corporation), BondyRam (manufactured by Polyram Corporation), orevac (registered trademark) (manufactured by ARKEMA Corporation) , Modic (registered trademark) (manufactured by Mitsubishi Chemical Corporation), etc.

The silane-modified polyolefin-based resin refers to a substance obtained by graft-modifying a polyolefin resin with an unsaturated silane compound. The silane-modified polyolefin-based resin has a structure in which an unsaturated silane compound as a side chain is graft-copolymerized to a polyolefin resin as a main chain. For example, silane-modified polyethylene resins and silane-modified ethylene-vinyl acetate copolymers are listed, and silane-modified low-density polyethylene, silane-modified ultra-low density polyethylene, and silane-modified linear low-density polyethylene are preferred. Silane-modified polyethylene resin such as ethylene.

As the unsaturated silane compound to be reacted with the above-mentioned polyolefin resin, a vinyl silane compound is preferable. Examples of vinylsilane compounds include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltripropoxysilane, vinyltriisopropoxysilane, vinyltributoxysilane, vinyl Tripentyloxysilane, vinyltriphenoxysilane, vinyltribenzyloxysilane, vinyltrimethylenedioxysilane, vinyltriethylenedioxysilane, vinylpropionyloxysilane , vinyl triacetoxysilane, vinyl tricarboxysilane, etc.

These may be used individually by 1 type, or may be used in combination of 2 or more types.

In addition, the conditions at the time of graft-polymerizing an unsaturated silane compound to the polyolefin resin which is a main chain can employ|adopt a well-known conventional method of graft-polymerization.

The amount of the unsaturated silane compound to be reacted with the polyolefin resin is preferably 0.1 to 10 parts by mass, more preferably 0.3 to 7 parts by mass, and even more preferably 0.5 to 5 parts by mass relative to 100 parts by mass of the polyolefin resin. The resin composition containing the silane-modified polyolefin-based resin obtained in this way can easily obtain a cured product with more excellent adhesive strength.

As a silane-modified polyolefin resin, a commercial item can also be used. As a commercial item, Linklon (registered trademark) (made by Mitsubishi Chemical Corporation) etc. is mentioned, for example. Among them, Linklon of low density polyethylene, Linklon of linear low density polyethylene, Linklon of ultra-low density polyethylene, and Linklon of ethylene-vinyl acetate copolymer can be preferably used.

Modified polyolefin-based resins may be used alone or in combination of two or more.

The number average molecular weight (Mn) of the modified polyolefin-based resin is preferably 10,000 to 2,000,000, and more preferably 20,000 to 1,500,000.

The number average molecular weight (Mn) of the modified polyolefin-based resin can be determined as a standard polystyrene-equivalent value by performing gel permeation chromatography (GPC) using tetrahydrofuran (THF) as a solvent.

[Component (B): Compound having a cyclic ether group]

The resin composition of this invention contains the compound which has a cyclic ether group as (B) component.

Since the compound having a cyclic ether group is excellent in compatibility with the component (A), by using this compound, a resin composition excellent in sheet processability (film-forming property), colorless transparency and water vapor resistance can be obtained A cured product of a resin composition with excellent fracture properties.

As a cyclic ether group, an oxirane group (epoxy group), an oxetanyl group (oxetanyl group), a tetrahydrofuranyl group, a tetrahydropyranyl group, etc. are mentioned.

The compound having a cyclic ether group refers to a compound having at least one or more cyclic ether groups in the molecule. Among them, those having an oxirane group or an oxetane group are preferred from the viewpoint of obtaining a cured product of a resin composition having better sheet workability (film formability) and a resin composition having better adhesive strength. The compound having an alkyl group is particularly preferably a compound having two or more ethylene oxide groups or oxetanyl groups in the molecule.

As a compound which has an oxirane group in a molecule|numerator, an aliphatic epoxy compound (excluding an alicyclic epoxy compound), an aromatic epoxy compound, an alicyclic epoxy compound, etc. are mentioned, for example.

Examples of the aliphatic epoxy compound include:

Monofunctional epoxy compounds such as glycidyl ethers of aliphatic alcohols and glycidyl esters of alkyl carboxylic acids,

Polyfunctional epoxy compounds such as polyglycidyl ether products of aliphatic polyols or their alkylene oxide adducts, polyglycidyl esters of aliphatic long-chain polybasic acids, and epoxy compounds having a triazine skeleton.

Representative compounds of these aliphatic epoxy compounds include:

Allyl glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, C12~13 mixed alkyl glycidyl ether, 1,4-butanediol diglycidyl ether, neopentyl glycol diglycidyl ether Glyceryl ether, triglycidyl ether of glycerin, triglycidyl ether of trimethylolpropane, tetraglycidyl ether of sorbitol, hexaglycidyl ether of dipentaerythritol, diglycidyl ether of polyethylene glycol, polypropylene glycol glycidyl ether of polyalcohols such as diglycidyl ether, dicyclopentadiene dimethanol diglycidyl ether, etc., or by adding one or more aliphatic polyols such as propylene glycol, trimethylolpropane, glycerin, etc. Polyglycidyl ethers of polyether polyols obtained from alkylene oxides, diglycidyl esters of aliphatic long-chain dibasic acids;

Monoglycidyl ethers of aliphatic higher alcohols or glycidyl esters of higher fatty acids, epoxidized soybean oil, octyl epoxystearate, butyl epoxystearate, epoxidized polybutadiene;

2,4,6-Tris(glycidyloxy)-1,3,5-triazine and the like.

Moreover, as an aliphatic epoxy compound, a commercial item can also be used. Commercially available products include:

Denacol EX-121, Denacol EX-171, Denacol EX-192, Denacol EX-211, Denacol EX-212, Denacol EX-313, Denacol EX-314, Denacol EX-321, Denacol EX-411, Denacol EX-421, Denacol EX-512, Denacol EX-521, Denacol EX-611, Denacol EX-612, Denacol EX-614, Denacol EX-622, Denacol EX-810, Denacol EX-811, Denacol EX-850, Denacol EX-851, Denacol EX-821, Denacol EX-830, Denacol EX-832, Denacol EX-841, Denacol EX-861, Denacol EX-911, Denacol EX-941, Denacol EX-920, Denacol EX-931 (the above are manufactured by NagaseChemteX Corporation ),

Epolight M-1230, Epolight 40E, Epolight 100E, Epolight 200E, Epolight 400E, Epolight 70P, Epolight 200P, Epolight 400P, Epolight 1500NP, Epolight 1600, Epolight 80MF, Epolight 100MF (the above are manufactured by Kyoeisha Chemical Co., Ltd.),

ADEKA GLYCILOL ED-503, ADEKA GLYCILOL ED-503G, ADEKA GLYCILOL ED-506, ADEKA GLYCILOL ED-523T, ADEKA RESIN EP-4088S, ADEKA RESIN EP-4088L, ADEKA RESIN EP-4080E (the above are manufactured by ADEKA),

TEPIC-FL, TEPIC-PAS, TEPIC-UC (the above are manufactured by Nissan Chemical Co., Ltd.), etc.

Examples of the aromatic epoxy compound include polyhydric phenols having at least one aromatic ring, such as phenol, cresol, and butylphenol, or mono/polyglycidyl ether products of alkylene oxide adducts thereof.

Representative compounds of these aromatic epoxy compounds include:

Glycidyl etherate or epoxy novolak resin of bisphenol A, bisphenol F or a compound obtained by adding an alkylene oxide to them,

Mono/polyglycidyl ether products of aromatic compounds having two or more phenolic hydroxyl groups such as resorcinol, hydroquinone, catechol,

Glycidyl ether products of aromatic compounds having two or more alcoholic hydroxyl groups, such as phenyldimethanol, phenyldiethanol, and phenyldibutanol,

Glycidyl esters of polybasic acid aromatic compounds having two or more carboxylic acids such as phthalic acid, terephthalic acid, trimellitic acid, etc., glycidyl esters of benzoic acid, rings of styrene oxide or divinylbenzene oxides, etc.

Moreover, as an aromatic epoxy compound, a commercial item can also be used. Commercially available products include:

Denacol EX-146, Denacol EX-147, Denacol EX-201, Denacol EX-203, Denacol EX-711, Denacol EX-721, Oncoat EX-1020, Oncoat EX-1030, Oncoat EX-1040, Oncoat EX-1050, Oncoat EX-1051, Oncoat EX-1010, Oncoat EX-1011, Oncoat 1012 (the above are manufactured by NagaseChemteX Corporation),

OGSOL PG-100, OGSOL EG-200, OGSOL EG-210, OGSOL EG-250 (the above are manufactured by Osaka GasChemicals Co., Ltd.),

HP4032, HP4032D, HP4700 (the above are manufactured by DIC Corporation),

ESN-475V (the above are manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd.),

JER (formerly EPIKOTE) YX8800 (Mitsubishi Chemical Corporation),

Marproof G-0105SA, Marproof G-0130SP (the above are manufactured by NOF Corporation),

EPICLON N-665, EPICLON HP-7200 (the above are manufactured by DIC Corporation),

EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, XD-1000, NC-3000, EPPN-501H, EPPN-501HY, EPPN-502H, NC-7000L (the above are manufactured by Nippon Kayaku Co., Ltd.),

ADEKA RESIN EP-4000, ADEKA RESIN EP-4005, ADEKA RESIN EP-4100, ADEKA RESINP-4901 (the above are manufactured by ADEKA),

TECHMORE VG-3101L (the above are manufactured by PRINTEC, INC.), etc.

Examples of the alicyclic epoxy compound include polyglycidyl ether products of polyhydric alcohols having at least one alicyclic structure, or epoxidizing compounds containing cyclohexene or cyclopentene rings with an oxidizing agent. The obtained compound containing cyclohexene oxide or cyclopentene oxide.

Typical compounds of these alicyclic epoxy compounds include hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate, and 3,4-epoxycyclohexylcarboxylate. 4-Epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexylcarboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3 ,4-Epoxycyclohexylcarboxylate, 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexylcarboxylate, 3,4-epoxy -5-Methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexylcarboxylate, bis(3,4-epoxycyclohexylmethyl)adipate, 3,4-cyclohexyl Oxy-6-methylcyclohexylcarboxylate, methylenebis(3,4-epoxycyclohexane), propane-2,2-diyl-bis(3,4-epoxycyclohexane), 2,2-bis(3,4-epoxycyclohexyl)propane, dicyclopentadiene diepoxide, ethylenebis(3,4-epoxycyclohexylcarboxylate), epoxyhexahydro-o Dioctyl phthalate, Di-2-ethylhexyl epoxyhexahydrophthalate, 1-epoxyethyl-3,4-epoxycyclohexane, 1,2-epoxy-2- Oxyethylcyclohexane, α-pinene oxide, limonene dioxide, etc.

Moreover, as an alicyclic epoxy compound, a commercial item can also be used. As a commercial item, Celloxide2021P, Celloxide 2081, Celloxide 2000, Celloxide 3000 (made by Daicel Corporation) etc. are mentioned.

Examples of compounds having an oxetanyl group in the molecule include 3,7-bis(3-oxetanyl)-5-oxa-nonane, 1,4-bis[(3-ethyl) yl-3-oxetanylmethoxy)methyl]benzene, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]ethane, 1 ,3-bis[(3-ethyl-3-oxetanylmethoxy)methyl]propane, ethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether , triethylene glycol bis (3-ethyl-3-oxetanyl methyl) ether, tetraethylene glycol bis (3-ethyl-3-oxetanyl methyl) ether, 1,4 -bis(3-ethyl-3-oxetanylmethoxy)butane, 1,6-bis(3-ethyl-3-oxetanylmethoxy)hexane, etc. Functional aliphatic oxetane compounds, 3-ethyl-3-[(phenoxy)methyl]oxetane, 3-ethyl-3-(hexyloxymethyl)oxetane Alkane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(hydroxymethyl)oxetane, 3-ethyl-3 Monofunctional oxetane compounds such as -(chloromethyl)oxetane, etc.

As a compound which has an oxetanyl group in a molecule|numerator, a commercial item can also be used. Commercially available products include:

2-hydroxyethyl vinyl ether, diethylene glycol monovinyl ether, 4-hydroxybutyl vinyl ether (the above are manufactured by Maruzen Petrochemical Co., Ltd.),

ARON OXETANE OXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211, OXT-212 (the above are manufactured by Toa Gosei Corporation),

ETERNACOLL OXBP, OXTP (the above are manufactured by Ube Industries Co., Ltd.), etc.

Among these compounds having a cyclic ether group, from the viewpoint of obtaining a cured product of a resin composition with better sheet workability (film-forming properties) and a resin composition with better adhesive strength, the temperature is preferably 25° C. The bottom is a liquid substance. In addition, those in which the cyclic ether group is an ethylene oxide group are preferred.

The molecular weight of the compound which has a cyclic ether group is 700-5000 normally, Preferably it is 1200-4000.

The cyclic ether equivalent of the compound having a cyclic ether group is preferably 100 g/eq or more and 500 g/eq or less, and more preferably 150 g/eq or more and 300 g/eq or less.

By using the resin composition in which the cyclic ether equivalent of the compound having a cyclic ether group is within the above range, a sealing material having strong adhesive strength and excellent curability can be effectively produced.

These compounds having a cyclic ether group may be used alone or in combination of two or more.

The cyclic ether equivalent in the present invention means a value obtained by dividing the molecular weight by the number of cyclic ether groups.

The content of the compound having a cyclic ether group is preferably 5 to 50 parts by mass, more preferably 5 to 40 parts by mass, and even more preferably 5 to 25 parts by mass relative to 100 parts by mass of the component (A).

By making content of the compound which has a cyclic ether group into the said range, it becomes easy to obtain the hardened|cured material of the resin composition which is more excellent in adhesive strength.

[Component (C): Photocationic Polymerization Initiator]

The resin composition of this invention contains a photocationic polymerization initiator as (C)component.

The photocationic polymerization initiator is a compound that generates cationic species by irradiation of light to initiate a curing reaction of the cationically curable compound, and is composed of a cationic part that absorbs light and an anionic part that is an acid generator.

Examples of photocationic polymerization initiators include sulfonium salt-based compounds, iodonium salt-based compounds, phosphonium salt-based compounds, ammonium salt-based compounds, antimonate-based compounds, diazonium salt-based compounds, selenium salt-based compounds, oxygen Onium salt-based compounds, bromine salt-based compounds, and the like. Among them, a sulfonium salt-based compound is preferable, and an aromatic sulfonium salt-based compound having an aromatic group is more preferable from the viewpoint of excellent compatibility with the component (B) and excellent storage stability of the obtained resin composition.

Examples of the sulfonium salt-based compound include triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium tetrakis(pentafluorophenyl)borate, 4,4'-bis[ Diphenylsulfonium]diphenylsulfide-bishexafluorophosphate, 4,4'-bis[bis(β-hydroxyethoxy)phenylsulfonium]diphenylsulfide-bishexafluoroantimonic acid Salt, 7-[bis(p-toluyl)sulfonium]-2-isopropylthioxanthene hexafluorophosphate, 7-[bis(p-toluyl)sulfonium]-2-isopropylthioxanthene Ketone Hexafluoroantimonate, 7-[Di(p-toluoyl)sulfonium]-2-isopropyltetrakis(pentafluorophenyl)borate, Phenylcarbonyl-4'-diphenylsulfonium- Diphenyl sulfide-hexafluorophosphate, phenylcarbonyl-4'-diphenylsulfonium-diphenylsulfide-hexafluoroantimonate, 4-tert-butylphenylcarbonyl-4'-diphenyl sulfonium-diphenylsulfide-hexafluorophosphate, 4-tert-butylphenylcarbonyl-4'-diphenylsulfonium-diphenylsulfide-hexafluoroantimonate, 4-tert-butyl Phenylcarbonyl-4'-diphenylsulfonium-diphenylsulfide-tetrakis(pentafluorophenyl)borate, thiophenyldiphenylsulfonium hexafluoroantimonate, thiophenyldiphenyl sulfonium hexafluorophosphate, 4-{4-(2-chlorobenzoyl)phenylthio}phenylbis(4-fluorophenyl)sulfonium hexafluoroantimonate, thiophenyldiphenylsulfonium hexa Halide of Fluoroantimonate, 4,4',4''-Tris(β-hydroxyethoxyphenyl)sulfonium Hexafluoroantimonate, 4,4'-Bis[diphenylsulfonium]diphenyl thioether-bishexafluoroantimonate, diphenyl[4-(phenylthio)phenyl]sulfonium trifluorotris(pentafluoroethyl)phosphate, tris[4-(4-acetylphenylthio) Alkyl)phenyl]sulfonium tris[(trifluoromethyl)sulfonyl]methanate and the like.

Examples of the iodonium salt-based compound include diphenyliodonium tetrakis(pentafluorophenyl)borate, diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroantimonate, bis(4 -Nonylphenyl) iodonium hexafluorophosphate, (tricumyl) iodonium tetrakis (pentafluorophenyl) borate, etc.

Examples of the phosphonium salt-based compound include tri-n-butyl(2,5-dihydroxyphenyl)phosphonium bromide, hexadecyltributylphosphonium chloride, and the like.

Examples of the ammonium salt-based compound include benzyltrimethylammonium chloride, phenyltributylammonium chloride, benzyltrimethylammonium bromide, and the like.

Examples of the antimonate-based compound include triphenylsulfonium hexafluoroantimonate, p-(phenylthio)phenyldiphenylsulfonium hexafluoroantimonate, and 4-chlorophenyldiphenylsulfonium hexafluoroantimonate acid salt, bis[4-(diphenylsulfonium)phenyl]sulfide bishexafluoroantimonate and diallyliodonium hexafluoroantimonate, etc.

These photocationic polymerization initiators may be used alone or in combination of two or more.

Moreover, as a photocationic polymerization initiator, a commercial item can also be used. Commercially available products include CYRACURE UVI-6970, CYRACURE UVI-6974, CYRACURE UVI-6990, CYRACURE UVI-950 (the above are manufactured by Union Carbide Corporation), Irgacure 250, Irgacure 261, and Irgacure 264 (the above are manufactured by Ciba Specialty Chemicals) Inc.), SP-150, SP-151, SP-170, OPTOMER SP-171 (the above are manufactured by ADEKA Corporation), CG-24-61 (manufactured by Ciba Specialty Chemicals Inc.), DAICAT II (manufactured by Daicel Corporation), UVAC1590, UVAC1591 (the above are manufactured by Daicel-Cytec Co., Ltd.), CI-2064, CI-2639, CI-2624, CI-2481, CI-2734, CI-2855, CI-2823, CI-2758, CIT -1682 (manufactured by Nippon Soda Corporation), PI-2074 (manufactured by Rhodia Corporation), FFC509 (manufactured by 3M Corporation), BBI-102, BBI-101, BBI-103, MPI-103, TPS-103, MDS- 103, DTS-103, NAT-103, NDS-103 (made by Midori Kagaku Co., Ltd. above), CD-1010, CD-1011, CD-1012 (made by Sartomer), CPI-100P, CPI-101A , CPI-200K, CPI-310B (the above are manufactured by San-Apro Ltd.), etc.

Content of a photocationic polymerization initiator is 0.02-2 mass parts normally with respect to 100 mass parts of said (B) components, Preferably it is 0.03-1 mass part, More preferably, it is 0.04-0.5 mass part.

By making content of a photocationic polymerization initiator into the said range, it becomes easy to obtain the hardened|cured material of the resin composition which is more excellent in adhesive strength.

When there is too much content of a photocationic polymerization initiator, the elastic modulus after hardening may become high too much, and there exists a possibility that the adhesive strength of the hardened|cured material of a resin composition may fall.

The resin composition of this invention may contain components other than the said (A) component, (B) component, and (C) component.

As components other than the said (A) component, (B) component, and (C) component, a tackifier, a silane coupling agent, a solvent, etc. are mentioned.

Examples of the tackifier include:

Rosin-based resins such as rosin resins, rosin-ester resins, and rosin-modified phenolic resins, and hydrogenated rosin-based resins obtained by hydrogenating these rosin-based resins;

Terpene resins such as terpene resins, aromatic modified terpene resins, terpene phenol resins, etc., hydrogenated terpene resins obtained by hydrogenating these terpene resins;

α-Methylstyrene homopolymer resin, α-methylstyrene/styrene copolymer resin, styrene monomer/aliphatic monomer copolymer resin, styrene monomer/α-methylbenzene Styrenic resins such as ethylene/aliphatic monomer copolymerization resins, styrene monomer homopolymerization resins, and styrene monomer/aromatic monomer copolymerization resins are obtained by hydrogenating these styrene resins Hydrogenated styrene resin;

A C5-based petroleum resin obtained by copolymerizing C5 fractions such as pentene, isoprene, piperine, and 1.3-pentadiene generated by thermal decomposition of naphtha, and a hydrogenated petroleum resin of the C5-based petroleum resin;

C9-based petroleum resins obtained by copolymerizing C9 fractions such as indene and vinyltoluene produced by thermal decomposition of naphtha, hydrogenated petroleum resins of the C9-based petroleum resins, and the like. Among them, styrene-based resins are preferred, and styrene-based monomer/aliphatic-based monomer copolymerized resins are more preferred.

These tackifiers may be used alone or in combination of two or more.

As a tackifier, a commercial item can also be used. Commercially available products include:

YS Resin P, A series, CLEARON (registered trademark) P series (manufactured by YASUHARA CHEMICAL CO., LTD.), Piccolyte A, C series (manufactured by PINOVA) and other terpene resins;

Quintone (registered trademark) A, B, R, CX series (made by Zeon Corporation) and other aliphatic petroleum resins;

Styrene resins such as FTR (registered trademark) series (manufactured by Mitsui Chemicals);

ARKON P, M series (manufactured by Arakawa Chemical Co., Ltd.), ESCOREZ (registered trademark) series (manufactured by ExxonMobil Chemical Company), EASTOTAC (registered trademark) series (manufactured by Eastman Chemical Company), IMARV (registered trademark) series (manufactured by Idemitsu Kosan Co., Ltd.) such as cycloaliphatic petroleum resins;

Foral series (manufactured by PINOVA), PENSEL (registered trademark) A series, ester resin, SUPER ESTER, PineCrystal (registered trademark) (manufactured by Arakawa Chemical Industry Co., Ltd.) and other ester resins.

From the viewpoint of imparting excellent adhesiveness, the weight average molecular weight of the tackifier is preferably 100 to 10,000, and more preferably 500 to 5,000.

From the viewpoint of imparting excellent adhesiveness, the softening point of the tackifier is preferably 50 to 160°C, more preferably 60 to 140°C, and further preferably 70 to 130°C.

When the resin composition of this invention contains a tackifier, 1-200 mass parts is preferable with respect to 100 mass parts of said (A) components, and its content is more preferably 10-150 mass parts.

By making content of a tackifier into the said range, it becomes easy to obtain the hardened|cured material of the resin composition which is more excellent in adhesive strength.

As the silane coupling agent, there can be mentioned:

3-Methacryloxypropylmethyldimethoxysilane, 3-Methacryloxypropyltrimethoxysilane, 3-Methacryloxypropylmethyldiethoxysilane , 3-methacryloyloxypropyltriethoxysilane, 3-acryloyloxypropyltrimethoxysilane and other silane coupling agents with (meth)acryloyl groups,

Vinyltrimethoxysilane, vinyltriethoxysilane, dimethoxymethylvinylsilane, diethoxymethylvinylsilane, trichlorovinylsilane, vinyltris(2-methoxysilane) Ethoxy) silane and other silane coupling agents with vinyl groups,

2-(3,4-Epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3- Silane coupling agents having epoxy groups such as glycidoxypropyltriethoxysilane,

Silane coupling agents with styryl groups such as p-styryltrimethoxysilane and p-styryltriethoxysilane,

N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, N-(2-aminoethyl) base)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1, 3-dimethylbutylene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane Silane coupling agents with amino groups such as hydrochloride,

Silane coupling agents with urea groups such as 3-ureidopropyltrimethoxysilane and 3-ureidopropyltriethoxysilane,

3-chloropropyltrimethoxysilane, 3-chloropropyltriethoxysilane and other silane coupling agents with halogen atoms,

Silane coupling agents with mercapto groups such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane,

Silane coupling agents with thioether groups such as bis(trimethoxysilylpropyl)tetrasulfide and bis(triethoxysilylpropyl)tetrasulfide,

Silane coupling agents with isocyanate groups such as 3-isocyanatopropyltrimethoxysilane and 3-isocyanatopropyltriethoxysilane,

Allyltrichlorosilane, allyltriethoxysilane, allyltrimethoxysilane and other silane coupling agents with allyl groups,

Silane coupling agents having a hydroxyl group, such as 3-hydroxypropyltrimethoxysilane and 3-hydroxypropyltriethoxysilane, and the like.

These silane coupling agents may be used alone or in combination of two or more.

When the resin composition of this invention contains a silane coupling agent, 0.01-10 mass parts is preferable with respect to 100 mass parts of said (A) components, and 0.02-5 mass parts is more preferable.

By making content of a silane coupling agent into the said range, it becomes easy to obtain the hardened|cured material of the resin composition which is more excellent in adhesive strength.

Examples of the solvent include:

Aliphatic hydrocarbon solvents such as n-hexane and n-heptane,

Aromatic hydrocarbon solvents such as toluene and xylene,

Dichloromethane, vinyl chloride, chloroform, carbon tetrachloride, 1,2-dichloroethane, monochlorobenzene and other halogenated hydrocarbon solvents,

Alcohol-based solvents such as methanol, ethanol, propanol, butanol, propylene glycol monomethyl ether, etc.

Acetone, methyl ethyl ketone, 2-pentanone, isophorone, cyclohexanone and other ketone solvents,

Ester solvents such as ethyl acetate and butyl acetate,

Cellosolve solvents such as ethyl cellosolve,

Ether-based solvents such as 1,3-dioxolane, etc.

These solvents may be used alone or in combination of two or more. The content of the solvent can be appropriately determined in consideration of coatability, film thickness, and the like.

Moreover, the resin composition of this invention may contain components other than the said tackifier, a silane coupling agent, and a solvent in the range which does not inhibit the effect of this invention.

Examples of components other than the tackifier, silane coupling agent, and solvent include antistatic agents, stabilizers, antioxidants, plasticizers, lubricants, coloring pigments, and the like. Their content can be appropriately determined according to the purpose.

The resin composition of the present invention can be prepared by appropriately mixing and stirring predetermined components according to a conventional method.

2) Sealing sheet

The sealing sheet of the present invention is the following sealing sheet (α), sealing sheet (β) or sealing sheet (γ).

Sealing sheet (α): A sealing sheet composed of a base material or a release film and an adhesive layer formed on the base material or release film, wherein the adhesive layer is formed using the resin composition of the present invention of.

Sealing sheet (β): A sealing sheet composed of two release films and an adhesive layer sandwiched between the two release films, wherein the adhesive layer is formed using the resin composition of the present invention.

Sealing sheet (γ): A sealing sheet composed of a release film, a gas barrier film, and an adhesive layer sandwiched between the release film and the gas barrier film, wherein the adhesive layer is the use of the present invention resin composition.

In addition, these sealing sheets show the state before use, and when using the sealing sheet of this invention, a peeling film is normally peeled and removed.

As a base material which comprises a sealing sheet (alpha), a resin film can be utilized normally.

Examples of the resin component of the resin film include polyimide, polyamide, polyamideimide, polyphenylene ether, polyether ketone, polyether ether ketone, polyolefin, polyester, polycarbonate, polysulfone, Polyethersulfone, polyphenylene sulfide, polyarylate, acrylic resin, cycloolefin polymer, aromatic polymer, polyurethane polymer, etc.

The thickness of the base material is not particularly limited, but is preferably 10 to 500 μm, more preferably 10 to 300 μm, and even more preferably 15 to 200 μm, from the viewpoint of thermal shrinkage or versatility of the adhesive layer in the drying step.

The release film constituting the sealing sheet (α) functions as a support in the production process of the sealing sheet (α), and also functions as a protective sheet for the adhesive layer until the sealing sheet (α) is used.

As the release film, a conventionally known material can be used. For example, the peeling film which has a peeling layer obtained by peeling process with a release agent on the base material for peeling films is mentioned.

Examples of the base material for the release film include paper base materials such as cellophane, coated paper, and high-quality paper, laminated paper obtained by laminating thermoplastic resins such as polyethylene on these paper base materials, and polyethylene terephthalate. Resin, polybutylene terephthalate resin, polyethylene naphthalate resin, polypropylene resin, polyethylene resin and other plastic films, etc.

Examples of the release agent include rubber-based elastomers such as silicone-based resins, olefin-based resins, isoprene-based resins, and butadiene-based resins, long-chain alkyl-based resins, alkyd-based resins, and fluorine-based resins. .

The thickness of the release film is not particularly limited, but is usually about 20 to 250 μm.

The preparation method of the sealing sheet (α) is not particularly limited. For example, the sealing sheet (α) can be prepared by a casting method.

In the case where the sealing sheet (α) is prepared by the casting method, the resin composition of the present invention can be coated on the peeling surface of the substrate or the peeling film by a known method, and the obtained coating film can be dried , thereby obtaining a sealing sheet (α).

Examples of methods for applying the resin composition include spin coating, spray coating, bar coating, blade coating, roll coating, blade coating, die coating, gravure coating, and the like. .

As a method of drying a coating film, conventionally known drying methods, such as hot air drying, hot roll drying, and infrared irradiation, are mentioned.

As conditions at the time of drying a coating film, it is 30 second - 5 minutes at 80-150 degreeC, for example.

The adhesive bond layer of the sealing sheet (α) can be formed by photocuring the coating film formed using the resin composition of the present invention.

The conditions at the time of photocuring are not particularly limited. The adhesive layer can be photocured by irradiation with active energy rays such as ultraviolet rays, visible rays, X rays, and electron beams.

In the present invention, from the viewpoint of obtaining a sealing sheet having excellent transparency, photocuring by ultraviolet irradiation is preferable.

As a specific example of the ultraviolet-ray source which irradiates an ultraviolet-ray, light sources, such as an ultra-high pressure mercury lamp, a high pressure mercury lamp, a low pressure mercury lamp, a carbon arc lamp, a black light fluorescent lamp, and a metal halide lamp, are mentioned, for example. In addition, as the wavelength of the ultraviolet rays to be irradiated, a wavelength range of 190 to 380 nm can be used.

The irradiation amount of the ultraviolet rays is preferably about 50 to 1000 mW/cm ² in illuminance and about 50 to 1000 mJ/cm ² in light intensity.

The irradiation time of ultraviolet rays is usually 0.1 to 1000 seconds, preferably about 1 to 500 seconds.

The thickness of the adhesive bond layer of a sealing sheet (alpha) is 1-50 micrometers normally, Preferably it is 5-30 micrometers. The adhesive bond layer whose thickness is in the said range is suitable as a sealing material.

The thickness of the adhesive bond layer can be measured according to JIS K 7130 (1999) using a known thickness gauge.

The adhesive bond layer of the sealing sheet of this invention is excellent in the adhesive strength.

When the 180° peel test is performed under the conditions of a temperature of 23° C. and a relative humidity of 50%, the adhesive strength of the adhesive layer is usually 1 to 20 N/25 mm, preferably 2.5 to 15 N/25 mm. This 180° peel test can be measured by the method described in the Examples.

The adhesive bond layer of the sealing sheet of this invention is excellent in colorless transparency.

The total light transmittance of the adhesive bond layer having a thickness of 20 μm after photocuring is preferably 85% or more, and more preferably 90% or more. The total light transmittance has no particular upper limit, but is usually 95% or less.

As described above, in the resin composition of the present invention, a modified polyolefin-based resin is used as the component (A), and a compound having a cyclic ether group having high compatibility with the component (A) is used as the component (B). Element. Therefore, the total light transmittance of the adhesive bond layer of the sealing sheet of this invention is high. This total light transmittance can be measured by the method described in an Example.

In addition, when the adhesive bond layer with a thickness of 20 μm obtained by the photocuring treatment was colorimetrically measured, L* in the CIE1976L*a*b* colorimetric system defined in JIS Z 8781-4 (2013) The value is 90~98. In addition, a* value is -2~2. In addition, the value of b* is -2~2.

In the L*a*b* color system, L* represents lightness, and a* and b* represent hue and chromaticity. When a* is a positive value, it represents the color and chromaticity in the red direction, when a* is a negative value, it represents the color and chromaticity in the green direction, and when b* is a positive value, it represents the color in the yellow direction and chromaticity, representing the color and chromaticity of the blue direction when b* is negative. It becomes colorless as the absolute values of a* and b* become smaller.

The L* value of the adhesive bond layer obtained by the photocuring process becomes like this. Preferably it is 92-98, More preferably, it is 94-98.

In addition, the a* value is usually -2 to 2, preferably -1 to 1, and more preferably -0.5 to 0.5.

In addition, the b* value is usually -2 to 2, preferably -1 to 1, and more preferably -0.5 to 0.5.

The adhesive layer obtained by the photocuring treatment has small shifts in the red direction (+a*), green direction (-a*), yellow direction (+b*), and blue direction (-b*).

A resin composition that can form an adhesive layer with L* in the above range and the color gamut of a* and b* in the above range is suitable for use as an organic EL element due to high total light transmittance and very little coloration and other sealing materials for light-emitting devices.

Therefore, the sealing sheet of this invention is suitable for optical applications, such as a sealing material of light-emitting devices, such as an organic electroluminescent element.

The L*a*b* value in the CIE1976 L*a*b* colorimetric system can be measured by the method described in the Examples.

The yellowness index (YI value) of the sealing sheet is usually 0.01 to 2, preferably 0.01 to 1. The yellowness index can be measured by the method described in the examples.

Moreover, the adhesive bond layer of the sealing sheet of this invention is excellent in the water vapor barrier property.

The water vapor transmission rate of the adhesive bond layer with a thickness of 20 μm obtained by the photocuring treatment is usually 0.1 to 200 g/m ² /day, preferably 0.1 to 150 g/m ² /day. The water vapor transmission rate can be measured by the method described in Examples.

As the release film and the adhesive layer constituting the sealing sheet (β), the same substances as those shown as the release film and the adhesive layer constituting the sealing sheet (α) can be exemplified, respectively.

The two peeling films in the sealing sheet (β) may be the same or different, but preferably the two peeling films have different peeling forces. Since the peeling force of the two peeling films is different, a problem is less likely to occur when the sealing sheet is used. That is, by making the peeling force of two peeling films different, the process of peeling a peeling film first can be performed more efficiently.

The preparation method of the sealing sheet (β) is not particularly limited.

For example, in the case where the sealing sheet (β) is produced by the casting method, the present invention is applied to the release-treated release surface of the release film by the same method as that shown in the production method of the sealing sheet (α). In the resin composition of the present invention, an adhesive layer with a release film is prepared by drying the obtained coating film and photocuring the coating film, and then another release film is superimposed on the adhesive layer, thereby A sealing sheet (β) can be obtained.

The release film and the adhesive layer constituting the sealing sheet (γ) include the same substances as those shown as the release film and the adhesive layer constituting the sealing sheet (α) or the sealing sheet (β), respectively.

The gas barrier film constituting the sealing sheet (γ) is not particularly limited as long as it has water vapor barrier properties.

The water vapor transmission rate of the gas barrier film in an environment with a temperature of 40° C. and a relative humidity of 90% (hereinafter abbreviated as “90% RH”.) is preferably 0.1 g/m ² /day or less, and more preferably 0.05 g/m ² /day or less, more preferably 0.005 g/m ² /day or less.

The water vapor transmission rate of the gas barrier film in an environment with a temperature of 40°C and 90% RH is 0.1 g/m ² /day or less, and the penetration of oxygen, moisture, etc. into an organic EL element formed on a substrate can be effectively suppressed. inside the element, thereby effectively suppressing the deterioration of electrodes or organic layers.

The permeability of water vapor or the like of the gas barrier film can be measured using a known gas permeability measuring device.

As a gas-barrier film, a metal foil, a thin film glass, a resin-made film, etc. are mentioned. Among them, a resin-made film is preferable, and a gas-barrier film having a base material and a gas-barrier layer is more preferable.

As a resin component which comprises a base material, the thing similar to the resin component which can be used as the resin film which comprises the base material of the said sealing sheet (alpha) is mentioned.

The thickness of the base material is not particularly limited, but from the viewpoint of ease of handling, it is preferably 0.5 to 500 μm, more preferably 1 to 200 μm, and even more preferably 5 to 100 μm.

The material of the gas barrier layer is not particularly limited as long as the desired gas barrier properties can be provided. Examples of the gas barrier layer include a gas barrier layer composed of an inorganic vapor-deposited film, a gas barrier layer containing a gas barrier resin, and a layer containing a polymer compound (hereinafter sometimes referred to as a "polymer layer".) modified Gas barrier layer obtained by treatment [In this case, the gas barrier layer refers not only to the region modified by ion implantation treatment or the like, but also to "a polymer layer containing the modified region". ]Wait.

Among them, a gas barrier layer formed of an inorganic vapor-deposited film or a gas barrier layer obtained by subjecting a polymer layer to modification treatment is preferable because a thin layer excellent in gas barrier properties can be efficiently formed. The gas barrier film may contain two or more of these gas barrier layers.

As an inorganic vapor-deposited film, the vapor-deposited film of an inorganic compound or a metal is mentioned.

Examples of raw materials for vapor-deposited films of inorganic compounds include:

Inorganic oxides such as silicon oxide, aluminum oxide, magnesium oxide, zinc oxide, indium oxide, tin oxide, zinc tin oxide, etc.

Inorganic nitrides such as silicon nitride, aluminum nitride, and titanium nitride,

Inorganic carbide, inorganic sulfide, silicon oxynitride and other inorganic nitrogen oxides,

Inorganic carbon oxides, inorganic carbonitrides, inorganic carbonitrides, etc.

As a raw material of the vapor-deposited film of a metal, aluminum, magnesium, zinc, tin, etc. are mentioned.

These may be used individually by 1 type, or may be used in combination of 2 or more types.

Among them, from the viewpoint of gas barrier properties, inorganic vapor-deposited films using inorganic oxides, inorganic nitrides, or metals as raw materials are preferred, and from the viewpoint of colorless transparency, inorganic oxides or inorganic nitrides are preferred as raw materials of inorganic vapor-deposited films. In addition, the inorganic vapor deposition film may be a single layer or a multilayer.

From the viewpoint of gas barrier properties and handleability, the thickness of the inorganic vapor deposition film is usually 1 nm or more and 2000 nm or less, preferably 3 nm or more and 1000 nm or less, more preferably 5 nm or more and 500 nm or less, and still more preferably 40 nm or more and 200 nm or less.

The method of forming the inorganic vapor deposition film is not particularly limited, and a known method can be used. Examples of the method for forming the inorganic vapor deposition film include PVD (physical vapor deposition) methods such as vacuum vapor deposition, sputtering, and ion plating, thermal CVD (chemical vapor deposition), plasma CVD, and optical CVD. CVD method, atomic layer deposition method (ALD method).

In the gas barrier layer containing the gas barrier resin, examples of the gas barrier resin used include polyvinyl alcohol or its partial saponification product, ethylene-vinyl alcohol copolymer, polyacrylonitrile, polyvinyl chloride, polyvinyl alcohol, and polyvinyl alcohol. Resins such as vinylidene chloride and polychlorotrifluoroethylene are difficult to transmit oxygen or water vapor.

From the viewpoint of gas barrier properties, the thickness of the gas barrier layer containing the gas barrier resin is usually 1 nm or more and 2000 nm or less, preferably 3 nm or more and 1000 nm or less, more preferably 5 nm or more and 500 nm or less, still more preferably 40 nm or more and 200nm or less.

As a method of forming a gas barrier layer containing a gas barrier resin, a method of applying a solution for forming a gas barrier layer containing a gas barrier resin on a substrate or other layers, and appropriately drying the obtained coating film can be exemplified. .

The coating method in particular of the solution for gas barrier layer formation is not restrict|limited, The method exemplified as the method of coating a resin composition mentioned above can be utilized.

The drying method of the coating film is not particularly limited, either, and the methods listed above as the method of drying the coating film of the resin composition can be used.

In the gas barrier layer obtained by modifying the surface of the polymer layer, the polymer compound to be used includes a silicon-containing polymer compound, polyimide, polyamide, polyamideimide, and polyphenylene. Ether, polyetherketone, polyetheretherketone, polyolefin, polyester, polycarbonate, polysulfone, polyethersulfone, polyphenylene sulfide, polyarylate, acrylic resin, alicyclic hydrocarbon resin, aromatic polymers, etc.

These polymer compounds may be used alone or in combination of two or more.

Among these polymer compounds, silicon-containing polymer compounds are preferable from the viewpoint of being able to form a gas barrier layer having more excellent gas barrier properties. Examples of the silicon-containing polymer compound include polysilazane-based compounds, polycarbosilane-based compounds, polysilane-based compounds, polyorganosiloxane-based compounds, poly(silylidenephenylene)-based compounds, and polysiloxane-based compounds. (disilylideneethynylene)-based compounds and the like. Among them, polysilazane-based compounds are preferred from the viewpoint of being able to form a gas barrier layer having excellent gas barrier properties even when thin. A layer (silicon oxynitride layer) containing oxygen, nitrogen, and silicon as main constituent atoms can be formed by subjecting the layer containing the polysilazane-based compound to a reforming treatment.

The polysilazane-based compound is a polymer compound having a repeating unit containing a -Si-N- bond (silazane bond) in the molecule. Specifically, a compound having a repeating unit represented by formula (1) is preferable.

[hua 1]

In addition, the number average molecular weight of the polysilazane-based compound to be used is not particularly limited, but is preferably 100 to 50,000.

In the above formula (1), n represents an arbitrary natural number.

Rx, Ry and Rz each independently represent a hydrogen atom, an unsubstituted or substituted alkyl group, an unsubstituted or substituted cycloalkyl group, an unsubstituted or substituted alkenyl group, an unsubstituted or substituted alkenyl group A non-hydrolyzable group such as an aryl group or an alkylsilyl group.

Among them, as Rx, Ry, and Rz, a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group is preferable, and a hydrogen atom is particularly preferable.

The polysilazane-based compound having a repeating unit represented by the formula (1) is an inorganic polysilazane in which Rx, Ry, and Rz are all hydrogen atoms, and at least one of Rx, Ry, and Rz is not hydrogen. Atoms of organopolysilazane may be used.

In addition, in the present invention, as the polysilazane-based compound, a polysilazane-modified product can also be used. Examples of the modified polysilazane include JP 62-195024 A, JP 2-84437 A, JP 63-81122 A, and JP 1-138108 A. , Japanese Patent Laid-Open No. 2-175726, Japanese Patent Laid-Open No. 5-238827, Japanese Patent Laid-Open No. 6-122852, Japanese Patent Laid-Open No. 6-306329, Japanese Patent Laid-Open No. 6-299118, Japanese Patent Laid-Open No. 9 - Compounds described in Japanese Patent Laid-Open No. 31333, Japanese Patent Laid-Open No. 5-345826, Japanese Patent Laid-Open No. 4-63833, and the like.

Among them, as the polysilazane-based compound, perhydropolysilazane in which Rx, Ry, and Rz are all hydrogen atoms is preferable from the viewpoints of easy availability and formation of an ion-implanted layer having excellent gas barrier properties.

In addition, as the polysilazane-based compound, commercially available products such as glass coating materials can also be used as they are.

The polysilazane-based compound may be used alone or in combination of two or more.

In addition to the above-mentioned polymer compound, the polymer layer may contain other components within a range that does not inhibit the purpose of the present invention. As other components, additives listed as components other than the above-mentioned (A) component, (B) component, and (C) component may be contained.

The content of the polymer compound in the polymer layer is preferably 50% by mass or more, and more preferably 70% by mass or more, because a gas barrier layer with more excellent gas barrier properties can be formed.

The thickness of the polymer layer is not particularly limited, but is usually 20 nm or more and 50 μm or less, preferably 30 nm or more and 1 μm or less, and more preferably 40 nm or more and 500 nm or less.

The polymer layer can be formed, for example, by applying a liquid in which a polymer compound is dissolved or dispersed in an organic solvent on a substrate or other layers by a known coating method, and drying the resulting coating film.

As the organic solvent, those listed as components other than the above-mentioned (A) component, (B) component, and (C) component can be used.

These organic solvents may be used alone or in combination of two or more.

The coating method is not particularly limited, and the above-mentioned methods for coating the resin composition can be used.

The drying method of the coating film is not particularly limited, either, and the methods listed above as the method of drying the coating film of the resin composition can be used.

The heating temperature is usually 80 to 150°C, and the heating time is usually tens of seconds to tens of minutes.

As a method of modifying the surface of the polymer layer, ion implantation treatment, plasma treatment, ultraviolet irradiation treatment, heat treatment, and the like are exemplified.

As described below, the ion implantation treatment is a method of modifying the polymer layer by implanting accelerated ions into the polymer layer.

Plasma treatment is a method of modifying the polymer layer by exposing the polymer layer to plasma. For example, the plasma treatment can be performed according to the method described in Japanese Patent Laid-Open No. 2012-106421.

The ultraviolet irradiation treatment is a method of modifying the polymer layer by irradiating the polymer layer with ultraviolet rays. For example, the ultraviolet modification treatment can be performed according to the method described in Japanese Patent Laid-Open No. 2013-226757.

Among these gas barrier layers, from the viewpoint of effectively modifying the inside of the polymer layer without roughening the surface of the polymer layer and forming a gas barrier layer with better gas barrier properties, it is preferable to use a silicon-containing polymer A gas barrier layer obtained by subjecting a compound layer to an ion implantation process.

Examples of ions implanted into the polymer layer include:

Ions of rare gases such as argon, helium, neon, krypton, and xenon,

Ions of fluorocarbons, hydrogen, nitrogen, oxygen, carbon dioxide, chlorine, fluorine, sulfur, etc.,

Ions of alkane-based gases such as methane and ethane,

Ions of olefin-based gases such as ethylene and propylene,

Ions of diene-based gases such as pentadiene and butadiene,

Ions of acetylene-based gases such as acetylene,

Ions of aromatic hydrocarbon-based gases such as benzene and toluene,

Ions of naphthenic gases such as cyclopropane,

Ions of cycloolefin-based gases such as cyclopentene,

Ions of metals, ions of organosilicon compounds, etc.

These ions may be used alone or in combination of two or more.

Among them, ions of rare gases such as argon, helium, neon, krypton, and xenon are preferable because ions can be implanted more simply and a gas barrier layer having more excellent gas barrier properties can be formed.

The implantation amount of ions can be appropriately determined according to the purpose of use of the gas barrier film (required gas barrier properties, colorless transparency, etc.) and the like.

As a method of implanting ions, a method of irradiating ions (ion beam) accelerated by an electric field, a method of implanting ions (plasma ions) into plasma, and the like can be mentioned. Among them, the latter method of implanting plasma ions (plasma ion implantation) is preferable from the viewpoint that the target gas barrier layer can be easily formed.

In the plasma ion implantation method, for example, plasma can be injected into the surface portion of the polymer layer by generating plasma in an atmosphere containing a plasma generating gas such as a rare gas, and applying a negative high-voltage pulse to the polymer layer. of ions (cations). More specifically, the plasma ion implantation method can be implemented by the method described in WO2010/107018 pamphlet or the like.

By ion implantation, the thickness of the region into which ions are implanted can be controlled by the type of ions, the implantation conditions such as applied voltage and treatment time, and can be determined according to the thickness of the polymer layer and the purpose of use of the gas barrier film, but is usually 10 nm or more and 400 nm or less.

The implanted ions can be confirmed by performing elemental analysis measurement in the vicinity of 10 nm from the surface of the polymer layer using X-ray photoelectron spectroscopy (XPS).

The preparation method of the sealing sheet (γ) is not particularly limited. For example, the sealing sheet (γ) can be produced by replacing one release film with a gas-barrier film in the production method of the sealing sheet (β) described earlier.

Moreover, after preparing the sealing sheet (β), one peeling film thereof is peeled off, and the exposed adhesive bond layer and the gas-barrier film are pasted together to prepare the sealing sheet (γ). In this case, when the sealing sheet (β) has two peeling films and the two peeling films have different peeling forces, it is preferable to peel off the peeling film with the smaller peeling force from the viewpoint of workability. .

As described above, the adhesive layer of the sealing sheet of the present invention is excellent in adhesive strength, colorless transparency, and water vapor barrier properties. Therefore, the sealing sheet of this invention is suitable for optical applications, such as a sealing material of light-emitting devices, such as an organic electroluminescent element.

3) Sealing body

The sealing body of the present invention is obtained by sealing a to-be-sealed object using the sealing sheet of the present invention.

"Sealed using the sealing sheet of the present invention" means that the release film constituting the sealing sheet of the present invention is removed to expose the adhesive layer, and the adhesive layer is allowed to adhere to the object to be sealed and cover the object to be sealed.

Examples of the sealing body of the present invention include a substrate, an element (object to be sealed) formed on the substrate, and a sealing material for sealing the element, wherein the sealing material is the sealing material of the present invention. adhesive layer of the sheet.

The substrate is not particularly limited, and various substrate materials can be used. In particular, it is preferable to use a substrate material having a high transmittance of visible light. In addition, a material having high barrier performance against moisture and gas that may penetrate from the outside of the element and excellent solvent resistance and weather resistance is preferable. Specifically, transparent inorganic materials such as quartz and glass, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polystyrene, polyethylene, polypropylene, polystyrene Sulfide, polyvinylidene fluoride, acetyl cellulose, brominated phenoxy resin, aramid, polyimide, polystyrene, polyarylate, polysulfone, polyolefin and other transparent plastics , the gas barrier film.

The thickness of the substrate is not particularly limited, and can be appropriately selected in consideration of the transmittance of light and the performance of blocking the inside and outside of the element.

As a to-be-sealed object, an organic EL element, an organic EL display element, a liquid crystal display element, a solar cell element, etc. are mentioned.

The preparation method of the sealing body of the present invention is not particularly limited.

For example, in the case of the structure of the sealing sheet (α) of the present invention, the sealing object is sealed with the adhesive layer of the sealing sheet by sticking the adhesive layer on the sealing object. When a release film is used for the sealing sheet (α), the release film is removed after sealing.

In the case of the structure of the sealing sheet (β) of the present invention, the release film on one side of the sealing sheet (β) is removed, the gas barrier film is bonded to the exposed adhesive layer, and then the peeling on the other side is removed. The film is sealed by the adhesive layer of the sealing sheet by sticking the adhesive layer on the object to be sealed.

In the case of the structure of the sealing sheet (γ) of the present invention, the peeling film is removed and the sealing object is sealed with the adhesive layer of the sealing sheet by sticking the adhesive layer on the sealing object.

There are no particular limitations on the bonding conditions when bonding the adhesive layer of the sealing sheet and the object to be sealed. The bonding temperature is, for example, 23 to 100°C, preferably 23 to 80°C, and more preferably 23 to 40°C. This bonding treatment can be performed under pressure.

In addition, in this invention, what has an uncured adhesive bond layer (dry coating film of the resin composition of this invention) can also be used as a sealing sheet, and the uncured adhesive of the sealing sheet is After the layer and the object to be sealed are adhered, the uncured adhesive layer is photocured.

As the curing conditions at this time, the conditions described above can be used.

The sealing body of the present invention is formed by sealing a to-be-sealed object with the sealing sheet of the present invention.

Therefore, in the sealing body of this invention, the performance of the to-be-sealed object can be maintained for a long period of time.

Example

Hereinafter, the present invention will be described in more detail with reference to Examples. However, the present invention is not limited in any way by the following examples.

Unless otherwise specified, parts and % in each example are based on mass.

In the following Examples and Comparative Examples, as the modified polyolefin resin [component (A)], the compound having a cyclic ether group [component (B)], and the photocationic polymerization initiator [component (C)], the following were used substance.

Modified polyolefin resin [(A) component]

Acid-modified α-olefin polymer [Mitsui Chemicals, trade name: Unistole H-200, number average molecular weight: 47,000]

Compounds having a cyclic ether group [component (B)]

(1) Compound (B-1) having a cyclic ether group

Dicyclopentadiene dimethanol diglycidyl ether [made by ADEKA, trade name: ADEKA RESIN EP-4088L, cyclic ether equivalent: 165 g/eq, liquid at 25°C]

(2) Compound (B-2) having a cyclic ether group

2-Ethylhexyloxetane [manufactured by Toagosei Co., Ltd., trade name: OXT-212, cyclic ether equivalent: 226 g/eq, liquid at 25°C]

(3) Compound (B-3) having a cyclic ether group

Triglycidyl isocyanurate [manufactured by Nissan Chemical Industries, Ltd., trade name: TEPIC-FL, cyclic ether equivalent: 165-185 g/eq, liquid at 25°C]

(4) Compound (B-4) having a cyclic ether group

Hydrogenated bisphenol A epoxy resin [manufactured by Mitsubishi Chemical Corporation, trade name: YX8034, cyclic ether equivalent: 270 g/eq, liquid at 25°C]

Photocationic polymerization initiator [(C)component]

(1) Photocationic polymerization initiator (C-1)

Triarylsulfonium salt [manufactured by San-Apro Ltd., trade name: CPI-200K, anion: anion having a hexafluorophosphate skeleton]

(2) Photocationic polymerization initiator (C-2)

Triarylsulfonium salt [manufactured by San-Apro Ltd., trade name: CPI-310B, anion: tetrakis(pentafluorophenyl)borate].

[Example 1]

100 parts of acid-modified α-olefin polymer (A), 25 parts of compound (B-1) having a cyclic ether group, 0.1 part of photocationic polymerization initiator (C-1), 50 parts of Binder [styrene-based monomer/aliphatic-based monomer copolymer resin (manufactured by Mitsui Chemicals, trade name: FTR6100, softening point: 95°C)] and 0.1 part of silane coupling agent [8-glycidyloxyoctane] Trimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM4803)] was dissolved in toluene to prepare a resin composition (1) having a solid content concentration of 27%.

The resin composition (1) was coated on the peeling-treated surface of a release film (manufactured by LINTEC Corporation, trade name: SP-PET382150), and the obtained coating film was dried at 100° C. for 2 minutes to form a 20 μm-thick adhesive bond. The agent layer was pasted on the peeled surface of another release film (manufactured by LINTEC Corporation, trade name: SP-PET381031). Then, using an ultraviolet irradiation device (manufactured by EYE GRAPHICS Co., Ltd., trade name: US2-0801<2>), the coating film was cured by irradiating ultraviolet rays under an illumination intensity of 200 mW/cm ² and a light intensity of 200 mJ/cm ² . A sealing sheet (1) is obtained.

[Examples 2 to 4]

Resin compositions (2) to (4) were prepared in the same manner as in Example 1, except that the compound (B-1) having a cyclic ether group in the amount shown in Table 1 was used, and a sealing sheet ( 2)~(4).

[Example 5]

A resin composition (5) was prepared in the same manner as in Example 1, except that the compound (B-2) having a cyclic ether group was used instead of the compound (B-1) having a cyclic ether group in Example 1, using The resin composition gave a sealing sheet (5).

[Example 6]

A resin composition (6) was prepared in the same manner as in Example 1, except that the compound (B-3) having a cyclic ether group was used instead of the compound (B-1) having a cyclic ether group in Example 1, using The resin composition gave a sealing sheet (6).

[Examples 7 and 8]

Resin compositions (7) and (8) were prepared in the same manner as in Example 1 except that the photocationic polymerization initiator (C-1) in the amount shown in Table 1 was used, and a sealing sheet (7) was obtained using these resin compositions. and (8).

[Example 9]

A resin composition (9) was prepared in the same manner as in Example 1 except that the photocationic polymerization initiator (C-2) was used instead of the photocationic polymerization initiator (C-1) in Example 1, and the resin composition was used A sealing sheet (9) is obtained.

[Example 10]

A resin composition (10) was prepared in the same manner as in Example 1 except that the content of the tackifier was changed to 25 parts, and a sealing sheet (10) was obtained using this resin composition.

[Comparative Example 1]

A resin composition (11) was prepared in the same manner as in Example 1, except that the acid-modified α-olefin polymer (A) was not used in Example 1.

In addition, although it tried using this resin composition, and produced the sealing sheet similarly to Example 1, the sheet workability (film-forming property) was low, and a sealing sheet could not be obtained.

[Comparative Example 2]

A resin composition (12) was prepared in the same manner as in Example 1 except that the compound (B-1) having a cyclic ether group was not used in Example 1, and a sealing sheet (12) was obtained using this resin composition.

[Comparative Example 3]

Except that the compound (B-4) having a cyclic ether group was used in Example 1 instead of the compound (B-1) having a cyclic ether group, and the photocationic polymerization initiator (C-1) was not used, the same A resin composition (13) was prepared in the same manner as in Example 1, and a sealing sheet (13) was obtained using this resin composition.

For the sealing sheets (1) to (10), (12) and (13) obtained in Examples 1 to 10 and Comparative Examples 2 and 3, the following measurements and evaluations were performed. The results are shown in Table 1.

[Measurement of Adhesion]

One piece of the release film of the sealing sheet having a width of 25 mm was peeled and removed to expose the adhesive bond layer. The exposed adhesive layer was bonded to a polyethylene terephthalate film (manufactured by LINTEC Corporation, thickness 50 μm, single-layer product). Next, the other peeling film from which the sealing sheet was removed was peeled off, and the exposed adhesive was laminated on alkali-free glass (manufactured by Corning, trade name: EAGLE XG) with a pressure-bonding roll to prepare a test piece.

The produced test piece was subjected to a 180° peel test under the conditions of a temperature of 23° C. and a relative humidity of 50%.

This peel test was performed according to the measuring method of the adhesive force described in JIS Z0237:2009 except for the above-mentioned test conditions.

[Measurement of total light transmittance]

One sheet of the release film of the sealing sheet was peeled and removed to expose the adhesive layer. This sealing sheet was placed on soda lime glass (thickness: 1 mm) so that the exposed adhesive layer was opposed to the soda lime glass, and then, using a laminator, these were bonded together at 23° C. to prepare a test. piece.

About the produced test piece, the total light transmittance was measured using the total light transmittance measuring apparatus (made by Nippon Denshoku Kogyo Co., Ltd., product name: NDH-5000).

[Color measurement]

The same test piece as the test piece used for the total light transmittance was produced.

About the produced test piece, in accordance with JIS Z 8781-4 (2013), the color specified by the CIE1976L*a*b* colorimetric system was measured using a spectrophotometer (manufactured by Shimadzu Corporation, product name: UV-3600). value.

[Evaluation of the yellow index]

One sheet of the release film of the sealing sheet was peeled and removed to expose the adhesive layer. This sealing sheet was placed on soda lime glass (thickness: 1 mm) so that the exposed adhesive layer was opposed to the soda lime glass, and then, using a laminator, these were bonded together at 23° C. to prepare a test. piece.

The produced test piece was measured using a spectrophotometer (manufactured by Shimadzu Corporation, product name: UV-3600) in accordance with JIS K 7373:2006.

[Measurement of Water Vapor Transmission Rate]

Using a water vapor transmission rate meter (manufactured by SYSTECH INSTRUMENTS Ltd., product name: LYSSY L80-5000), the water vapor transmission rate of the sealing sheet in an environment with a temperature of 40° C. and a relative humidity of 90% was measured.

[Table 1]

From Table 1, the following conditions can be seen.

Sealing sheets (1) to (10) formed using resin compositions (1) to (10) containing (A) component, (B) component and (C) component at a temperature of 23°C and a relative humidity of 50% The adhesive strength under the conditions was excellent (Examples 1 to 10).

In addition, the total light transmittance of the sealing sheets (1) to (10) is high, the absolute values of the a* value and the b* value, and the yellowness index YI are small, and are excellent in colorless transparency.

In addition, the sealing sheets (1) to (10) are also excellent in water vapor barrier properties.

On the other hand, the resin composition (11) which does not contain (A) component has low sheet workability (film-forming property), and cannot obtain a sealing sheet (Comparative Example 1).

In addition, the sealing sheets (12) and (13) formed using the resin composition (12) not containing the (B) component and the resin composition (13) not containing the (C) component had a temperature of 23°C and a relative humidity of Adhesive strength at 50% was poor (Comparative Examples 2 and 3).

Claims (16)

1. A resin composition comprising the following component (A), component (B) and component (C):

(A) the components: a modified polyolefin-based resin, which is obtained by modifying a polyolefin-based resin,

(B) the components: a compound having a cyclic ether group,

(C) the components: a photo cationic polymerization initiator.

2. The resin composition according to claim 1, wherein the component (A) is an acid-modified polyolefin resin.

3. The resin composition according to claim 1 or 2, wherein the cyclic ether group of the component (B) is an ethylene oxide group or an oxetane group.

4. The resin composition according to any one of claims 1 to 3, wherein the content of the component (B) is 5 to 50 parts by mass with respect to 100 parts by mass of the component (A).

5. The resin composition according to any one of claims 1 to 4, wherein the component (C) is an aromatic sulfonium salt compound.

6. The resin composition according to any one of claims 1 to 5, wherein the content of the component (C) is 0.04 to 2 parts by mass relative to 100 parts by mass of the component (B).

7. The resin composition according to any one of claims 1 to 6, further comprising a tackifier.

8. The resin composition according to claim 7, wherein the tackifier is contained in an amount of 1 to 200 parts by mass based on 100 parts by mass of the component (A).

9. The resin composition according to any one of claims 1 to 8, further comprising a silane coupling agent.

10. The resin composition according to claim 9, wherein the silane coupling agent is contained in an amount of 0.01 to 10 parts by mass per 100 parts by mass of the component (A).

11. A sealing sheet comprising a base material or a release film and an adhesive layer formed on the base material or the release film,

the adhesive layer is formed by using the resin composition according to any one of claims 1 to 10.

12. A sealing sheet comprising 2 peeling films and an adhesive layer sandwiched between the 2 peeling films, wherein,

the adhesive layer is formed by using the resin composition according to any one of claims 1 to 10.

13. A sealing sheet comprising a release film, a gas barrier film, and an adhesive layer sandwiched between the release film and the gas barrier film,

the adhesive layer is formed by using the resin composition according to any one of claims 1 to 10.

14. The sealing sheet according to claim 13, wherein the gas barrier film is a metal foil, a resin film, or a thin film glass.

15. A sealed article obtained by sealing an object to be sealed with the sealing sheet according to any one of claims 11 to 14.

16. The seal of claim 15, wherein said object to be sealed is an electronic device.