CN112289727B - Chip position adjusting mechanism and chip transmission mechanism - Google Patents

Abstract

The invention provides a chip position adjustment mechanism and a chip transmission mechanism. The position adjustment mechanism includes a first adjustment module and a second adjustment module, and the first adjustment module includes a first adjustment plate, a second adjustment plate, a first connection The first adjustment part is used to adjust the relative position of the first adjustment plate and the second adjustment plate in the horizontal direction; the second adjustment module includes a mounting base and an adjustment assembly for supporting and adjustment. The adjusting assembly adjusts the posture of the second adjusting plate relative to the mounting base. In the present invention, the position of the chip is adjusted in multiple directions through the first adjustment module and the second adjustment module, so as to adjust the posture of the chip to reduce the alignment difficulty and alignment cost of the AA process; in addition, the first adjustment module and the second adjustment module The module plays a role in calibrating the chip jig, and regular calibration improves the position accuracy of the chip jig.

Description

Chip position adjustment mechanism and chip transfer mechanism

technical field

The invention relates to the technical field of semiconductor manufacturing precision, in particular to a chip position adjustment mechanism.

Background technique

Semiconductors are widely used in mobile phones, automobiles, sensors and other fields. As a core component of mobile phones and computers, semiconductors are increasingly technologically enhanced, social demands are gradually increasing, semiconductors tend to be miniaturized, and the number of manufacturing is huge.

With the gradual improvement of camera requirements, the requirements for semiconductor manufacturing precision also increase. Optical active alignment equipment, ie, AA (Active Alignment Machine) process, is usually required in the fabrication process of semiconductors. The AA process can adjust all six degrees of freedom of the camera to realize the alignment function, and is a commonly used adjustment process in the prior art.

When the semiconductor is transported to a designated position by a pick-up device before the AA process, the postures of the semiconductor products before the AA process are greatly different, which increases the alignment difficulty and the alignment cost of the AA process.

SUMMARY OF THE INVENTION

In view of this, the present invention provides a chip position adjustment mechanism, which reduces the alignment difficulty and alignment cost of the AA process.

In order to solve the above technical problems, the present invention provides a chip position adjustment mechanism.

The chip position adjustment mechanism according to the embodiment of the present invention includes:

A first adjustment module, the first adjustment module includes a first adjustment plate, a second adjustment plate, a first connector and a first adjustment part; a fixture for placing chips is fixedly installed on the first adjustment plate The first adjustment plate and the second adjustment plate are movably connected through the first connecting piece, and the first adjustment piece is used to adjust the relative position of the first adjustment plate and the second adjustment plate in the horizontal direction ;

The second adjustment module, the second adjustment module includes a mounting base and an adjustment assembly for supporting and adjustment; the adjustment assembly is installed between the second adjustment plate and the installation base; Adjust the posture of the second adjusting plate relative to the mounting base.

Preferably, the side of the second regulating plate extends vertically to a side plate, and the side plate is parallel to the side surface of the first regulating plate; the first connecting member and the two ends of the first regulating member are respectively connected to each other. the side plate and the side surface of the first adjusting plate.

Preferably, the first adjustment plate is provided with a plurality of fixing holes, and after the adjustment of the first adjustment member is completed, the first adjustment plate and the second adjustment plate are fixedly connected through the fixing holes.

Preferably, the adjusting assembly includes a second connecting piece and a second adjusting piece, one end of the second adjusting piece and the second connecting piece is fixedly mounted on the bottom end of the second adjusting plate, and the other end is movably mounted on the second adjusting plate the surface of the mounting base.

Preferably, the second connecting member includes a bearing steel ball and a plurality of elastic members, the bearing steel ball for bearing weight is fixedly installed on the installation base, and a plurality of the elastic members are evenly distributed and installed on the installation base superior.

Preferably, a turntable is provided on the second adjusting member, and the turntable is rotated to adjust the distance between the second adjusting plate and the installation base, so as to level the position of the second adjusting plate relative to the installation base. attitude.

The present invention also provides a chip transmission mechanism with any of the above-mentioned chip position adjustment mechanisms, including:

the chip position adjustment mechanism;

A first displacement module, the first displacement module includes a base, a first sliding rail, a first driving component, a first sliding seat and a first bearing plate; the first sliding rail and the first driving component are fixedly installed on the base; the first sliding rail is slidably connected with the first sliding seat; the first sliding seat is fixedly connected with the first bearing plate; the first sliding seat and the first bearing plate are in the A driving force of a driving component reciprocates along the direction of the first slide rail;

The second displacement module includes a second slide rail, a second slide base, a second drive assembly, a vertical plate, a fourth slide rail, a third slide base and a third drive assembly; the second slide rail The rail is fixedly installed on the first bearing plate, the second sliding seat is slidably connected with the second sliding rail, and the second sliding seat reciprocates along the direction of the second sliding rail under the driving force of the second driving component sports;

The vertical plate is vertically and fixedly installed on the second sliding seat, the third driving component and the fourth sliding rail are fixedly installed on the side of the vertical plate, and the third sliding seat and the fourth sliding rail are slidably connected ; The third sliding seat reciprocates along the vertical direction of the second sliding rail under the driving force of the third driving assembly;

Chip fixture module;

The mounting base is fixedly mounted on the third sliding seat, and the chip fixture is fixedly mounted on the surface of the first adjustment plate; the chip fixture is mounted on the first drive assembly, the second drive assembly and the The multi-directional movement is carried out under the driving force of the third driving component.

Preferably, a magnetic spring is also included, the magnetic spring is fixedly installed on the vertical plate, and when the third driving assembly stops working, the magnetic spring slows down the third sliding seat downward under the action of gravity sports.

Preferably, the chip fixture module includes:

a chip base, which is fixedly mounted on the first adjustment board;

a chip fixing plate, the chip fixing plate for placing chips is fixedly mounted on the chip base;

a micro gas connector, the micro gas connector is installed on the chip fixing plate, and is used for inputting gas into the chip fixing plate;

a fourth drive assembly, the fourth drive assembly is fixedly mounted on the chip base;

a fourth slide rail, which is fixedly mounted on the chip base;

The sensor assembly moves along the direction of the fourth sliding rail under the driving force of the fourth driving assembly to approach or move away from the chip fixing board.

Preferably, the sensor assembly includes:

A guide rail connecting block, one end of the guide rail connecting block is slidably connected to the fourth sliding rail, and the other end of the guide rail connecting block is connected to the fourth driving assembly, and the The guide rail connecting block reciprocates along the direction of the fourth slide rail;

a sensor mounting plate, the sensor mounting plate is fixedly connected to the guide rail connecting block;

The sensor is fixedly mounted on the sensor mounting plate.

The beneficial effects of the above-mentioned technical solutions of the present invention are as follows:

According to the chip position adjustment mechanism and the chip transmission mechanism according to the embodiment of the present invention, the chip position adjustment mechanism adjusts the position of the chip in multiple directions through the first adjustment module and the second adjustment module, so as to adjust the attitude of the chip and reduce the accuracy of the AA process. Alignment difficulty and alignment cost; in addition, the first adjustment module and the second adjustment module play a role in calibrating the chip jig, and regular calibration improves the positional accuracy of the chip jig.

Description of drawings

1 is a schematic diagram of the overall structure of a chip transmission mechanism according to an embodiment of the present invention;

2 is a side view of a chip transfer mechanism according to an embodiment of the present invention;

3 is a schematic structural diagram of a first displacement module of a chip transmission mechanism according to an embodiment of the present invention;

4 is a schematic structural diagram of a second displacement module of a chip transmission mechanism according to an embodiment of the present invention;

5 is a schematic structural diagram of an angle of a chip position adjustment mechanism according to an embodiment of the present invention;

6 is a schematic structural diagram of another angle of the chip position adjustment mechanism according to an embodiment of the present invention;

FIG. 7 is a schematic structural diagram of a chip fixture of a chip position adjustment mechanism according to an embodiment of the present invention.

Reference number:

The first displacement module 31; the base 311; the first sliding seat 312; the first driving assembly 313; the first bearing plate 314; the first sliding rail 315;

The second displacement module 32; the second sliding rail 320; the second bearing plate 321; the connecting plate 322; the vertical plate 323; the magnetic spring 324; the third sliding seat 325; the fourth sliding rail 326; the second sliding seat 327; Three drive assemblies 328; second drive assemblies 329;

Adjustment mechanism 33; first adjustment plate 331; second adjustment plate 332; first adjustment piece 333; mounting base 334; elastic piece 335; first connecting piece 336; bearing steel ball 337; second adjustment piece 338; ;

Chip fixture module 34; sensor 340; sensor mounting plate 341; support connection block 342; guide rail connection block 343; chip fixing plate 344; chip base 345; chip 346; fourth drive assembly 347; Five rails 349.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are some, but not all, embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art fall within the protection scope of the present invention.

First, the chip position adjustment mechanism according to the embodiment of the present invention will be specifically described below with reference to the accompanying drawings.

As shown in FIG. 1 to FIG. 7 , the chip position adjustment mechanism 33 according to the embodiment of the present invention includes a first adjustment module and a second adjustment module; wherein,

The first adjustment module includes a first adjustment plate 331, a second adjustment plate 332, a first connecting member 336 and a first adjustment member 333; a fixture for placing chips is fixedly installed on the first adjustment plate 331; the first adjustment The plate 331 and the second adjusting plate 332 are movably connected through the first connecting piece 336 , and the first adjusting piece 333 is used to adjust the relative position of the first adjusting plate 331 and the second adjusting plate 332 in the horizontal direction.

Specifically, the first adjustment plate 331 is provided with a plurality of fixing holes. After the first adjustment member 333 is adjusted, the first adjustment plate 331 and the second adjustment plate 332 are fixedly connected through the fixing holes. Several fixing holes not only fixedly connect the first adjustment plate 331 and the second adjustment plate 332 but also fixedly install the chip fixture on the upper surface of the first adjustment plate 331 to adjust the chip through the first adjustment plate 331 and the second adjustment plate 332 Jig posture.

In one embodiment of the present invention, the side of the second adjusting plate 332 extends vertically to a side plate 339 , and the side plate 339 is parallel to the side surface of the first adjusting plate 331 ; The side plates 339 and the side surfaces of the first adjusting plate 331 are respectively connected. As shown in FIG. 5 and FIG. 6 , the first regulating plate 331 is stacked on the surface of the second regulating plate 332 and is connected by a first connecting piece 336 . The first connecting piece 336 is preferably a spring, and the spring connects the first regulating plate 331 with the Side plate 339 on the second regulating plate 332 . The first connecting member 336 is a spring, and the side plates 339 of the first adjusting plate 331 and the second adjusting plate 332 can be rigidly rubbed and damaged. The first adjusting member 333 is preferably a nut, and the horizontal distance between the first adjusting plate 331 and the second adjusting plate 332 can be adjusted by adjusting the nut.

The second adjustment module includes an installation base 334 and an adjustment assembly for support and adjustment; the adjustment assembly is installed between the second adjustment plate 332 and the installation base 334; the adjustment assembly is used to adjust the second adjustment plate 332 relative to the installation base 334 gesture. The installation base 334 is connected and installed parallel to the lower position of the second adjustment plate 332 through the adjustment assembly. The adjusting assembly adjusts the posture of the second adjusting plate 332 relative to the mounting base 334 to meet requirements.

Specifically, the adjusting assembly includes a second connecting piece and a second adjusting piece 338 . One end of the second adjusting piece 338 and the second connecting piece is fixedly mounted on the bottom end of the second adjusting plate 332 , and the other end is movably mounted on the bottom end of the mounting base 334 . surface.

The second connecting member includes a bearing steel ball 337 and a plurality of elastic members 335 . The bearing steel ball 337 for bearing weight is fixedly installed on the installation base 334 , and the plurality of elastic members 335 are evenly distributed and installed on the installation base 334 . Several elastic members 335 play a partial supporting role, and the first regulating plate 331 and the second regulating plate 332 themselves and the weights they carry are mainly distributed on the bearing steel balls 337 and the second regulating members 338 . The plurality of elastic members 335 are preferably springs, and the springs play a partial supporting role and avoid rigid contact between the second adjusting plate 332 and the mounting base 334 . The bearing steel balls 337 are respectively installed on the bottom of the second adjusting plate 332 and the surface of the mounting base 334 . The second adjusting member 338 is preferably a turntable, and the rotating turntable adjusts the distance between the second adjusting plate 332 and the installation base 334 to flatten the posture of the second adjusting plate 332 relative to the installation base. The first adjustment module and the second adjustment module respectively adjust the horizontal displacement and the angular attitude of the chip jig, so as to satisfy any attitude adjustment of the chip jig. Arbitrary attitude adjustment is performed on the chip fixture before the AA process, which reduces the alignment difficulty during the AA process and reduces the alignment cost.

The present invention also provides a chip transmission mechanism, comprising a chip position adjustment mechanism 33, a first displacement module 31, a second displacement module 32 and a chip fixture module 34; wherein,

As shown in FIG. 3 , the first displacement module 31 includes a base 311 , a first sliding rail 315 , a first driving assembly 313 , a first sliding seat 312 and a first bearing plate 314 ; the first sliding rail 315 and the first driving The assembly 313 is fixedly installed on the base 311 ; the first sliding rail 315 is slidably connected to the first sliding seat 312 ; the first sliding seat 312 is fixedly connected to the first bearing plate 314 ; The driving force of the first driving assembly 313 reciprocates along the direction of the first sliding rail 315 . The first driving assembly 313 is preferably a rod-shaped motor, and the first bearing plate 314 reciprocates along the Y-axis direction under the driving force of the rod-shaped motor.

As shown in FIG. 4 , the second transmission assembly includes a second sliding rail 320 , a second sliding seat 327 , a second driving assembly 329 , a vertical plate 323 , a fourth sliding rail 326 , a third sliding seat 325 and a third driving assembly 328 The second slide rail 320 is fixedly mounted on the first bearing plate 314, the second slide base 327 is slidably connected with the second slide rail 320, and the second slide base 327 is driven by the second drive assembly 329 along the second slide rail 320 direction reciprocating motion. The second driving assembly 329 is preferably a rod-shaped motor, and the second sliding seat 327 reciprocates along the X-axis direction under the action of the rod-shaped motor.

The vertical plate 323 is vertically fixed on the second sliding seat 327, the third driving component 328 and the fourth sliding rail 326 are fixedly installed on the side of the vertical plate 323, and the third sliding seat 325 is slidably connected with the fourth sliding rail 326; The sliding seat 325 reciprocates along the vertical direction of the second sliding rail 320 under the driving force of the third driving assembly 328 . The third driving assembly 328 is preferably a rod-shaped motor, and the third sliding seat 325 reciprocates along the Z-axis direction under the driving force of the rod-shaped motor. The second sliding seat 327 is fixedly mounted on the second bearing plate 321 , and the mounting base 334 is fixedly mounted on the second bearing plate 321 . A connecting plate 322 is fixedly connected to the upper part of the second driving assembly, and the connecting plate 322 is fixedly connected to the vertical plate 323 .

Chip fixture module 34;

The mounting base 334 is fixedly mounted on the third sliding seat 325, and the chip fixture module 34 is fixedly mounted on the surface of the first adjusting plate 331; The multi-directional movement is carried out under the driving force of the three driving components 328 . The chip jig used to place the chip moves in the X-axis, Y-axis and Z-axis directions driven by three rod motors.

In one embodiment of the present invention, it further includes a magnetic spring 324, the magnetic spring 324 is fixedly installed on the vertical plate 323, and when the third driving assembly 328 stops working, the magnetic spring 324 slows down the third sliding seat 325 under the action of gravity downward movement. The magnetic spring 324 acts as a buffer protection device to avoid damage caused by rigid contact between components.

As shown in FIG. 7 , the chip fixture module 34 includes a chip base 345, a chip fixing plate 344, a micro air connector 348, a fourth drive assembly 347, a fifth slide rail 349 and a sensor assembly; wherein,

The chip base 345 is fixedly installed on the first adjusting plate 331; the chip fixing plate 344 for placing the chip is fixedly installed on the chip base 345; the micro air connector 348 is installed on the chip fixing plate 344, and is used to send the chip to the chip fixing plate. Gas is input into 344; the fourth drive assembly 347 is fixedly installed on the chip base 345; the fifth slide rail 349 is fixedly installed on the chip base 345; the sensor assembly moves along the fifth slide rail under the driving force of the fourth drive assembly 347 349 to move toward or away from the chip fixing plate 344 .

Further, the sensor assembly includes a rail connecting block 343, a sensor mounting plate 341, and a sensor; wherein,

One end of the guide rail connecting block 343 is slidably connected to the fifth slide rail 349 , and the other end of the guide rail connecting block 343 is connected to the fourth driving assembly 347 . Reciprocating motion; the sensor mounting plate 341 is fixedly connected to the guide rail connecting block 343 ; the sensor is fixedly mounted on the sensor mounting plate 341 . The fourth driving assembly 347 is preferably an air cylinder, and the guide rail connecting block 343 reciprocates along the Z-axis direction under the driving of the air cylinder. The sensor installation plate 341 is connected to the support connection plate 342 , and the support connection plate 342 is located below the sensor installation plate 341 .

Unless otherwise defined, technical or scientific terms used in the present invention should have the ordinary meaning as understood by those of ordinary skill in the art to which the present invention belongs. The terms "first," "second," and similar terms used herein do not denote any order, quantity, or importance, but are merely used to distinguish different components. Words like "connected" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "Down", "Left", "Right", etc. are only used to represent the relative positional relationship, and when the absolute position of the described object changes, the relative positional relationship also changes accordingly.

The above are the preferred embodiments of the present invention. It should be pointed out that for those skilled in the art, without departing from the principles of the present invention, several improvements and modifications can be made. It should be regarded as the protection scope of the present invention.

Claims (10)

1. A chip position adjustment mechanism, comprising an adjustment mechanism, the adjustment mechanism comprising:

a first adjusting module comprising a first adjusting plate (331), a second adjusting plate (332), a first connecting member (336) and a first adjusting member (333); a jig for placing a chip is fixedly arranged on the first adjusting plate (331); the first adjusting plate (331) and the second adjusting plate (332) are movably connected through the first connecting piece (336), and the relative position of the first adjusting plate (331) and the second adjusting plate (332) in the horizontal direction is adjusted through the first adjusting piece (333);

a second adjustment module comprising a mounting base (334), an adjustment assembly for support and adjustment; the adjusting component is installed between the second adjusting plate (332) and the installation base (334); adjusting a posture of the second adjustment plate (332) with respect to the mounting base (334) by the adjustment assembly.

2. The chip position adjustment mechanism according to claim 1, wherein a side edge of the second adjustment plate (332) vertically extends a side plate (339), the side plate (339) being parallel to a side surface of the first adjustment plate (331); the two ends of the first connecting piece (336) and the first adjusting piece (333) are respectively connected with the side surfaces of the side plate (339) and the first adjusting plate (331).

3. The chip position adjusting mechanism according to claim 2, wherein the first adjusting plate (331) is provided with a plurality of fixing holes, and when the first adjusting member (333) is adjusted, the first adjusting plate (331) and the second adjusting plate (332) are fixedly connected through the fixing holes.

4. The chip position adjusting mechanism according to claim 1, wherein the adjusting assembly comprises a second connecting member and a second adjusting member (338), one end of the second adjusting member (338) and the second connecting member is fixedly mounted on the bottom end of the second adjusting plate (332), and the other end is movably mounted on the surface of the mounting base (334).

5. The chip position adjusting mechanism according to claim 4, wherein the second connecting member comprises a bearing steel ball (337) and a plurality of elastic members (335), the bearing steel ball (337) for bearing weight is fixedly mounted on the mounting base (334), and the plurality of elastic members (335) are uniformly distributed and mounted on the mounting base (334).

6. The chip position adjustment mechanism according to claim 4, wherein a turntable is provided on the second adjustment member (338), and the turntable is rotated to adjust a distance between the second adjustment plate (332) and the mounting base (334) to level the posture of the second adjustment plate (332) with respect to the mounting base (334).

7. A chip transfer mechanism, comprising:

the chip position adjustment mechanism according to any one of claims 1 to 6;

the first displacement module (31), the first displacement module (31) comprises a base (311), a first slide rail (315), a first driving component (313), a first sliding seat (312) and a first bearing plate (314); the first sliding rail (315) and the first driving component (313) are fixedly arranged on the base (311); the first sliding rail (315) is connected with the first sliding seat (312) in a sliding manner; the first sliding seat (312) is fixedly connected with the first bearing plate (314); the first sliding seat (312) and the first bearing plate (314) reciprocate along the direction of the first sliding rail (315) under the driving force of the first driving assembly (313);

a second displacement module (32), wherein the second displacement module (32) comprises a second slide rail (320), a second slide carriage (327), a second driving component (329), a vertical plate (323), a fourth slide rail (326), a third slide carriage (325) and a third driving component (328); the second sliding rail (320) is fixedly arranged on the first bearing plate (314), the second sliding seat (327) is connected with the second sliding rail (320) in a sliding manner, and the second sliding seat (327) reciprocates along the direction of the second sliding rail (320) under the driving force of the second driving assembly (329);

the vertical plate (323) is vertically and fixedly arranged on the second sliding seat (327), the third driving component (328) and the fourth sliding rail (326) are fixedly arranged on the side surface of the vertical plate (323), and the third sliding seat (325) is in sliding connection with the fourth sliding rail (326); the third sliding seat (325) reciprocates along the vertical direction of the second sliding rail (320) under the driving force of the third driving assembly (328);

a chip jig module (34);

the mounting base (334) is fixedly mounted on the third sliding seat (325), and the chip jig module (34) is fixedly mounted on the surface of the first adjusting plate (331); the chip jig module (34) moves in multiple directions under the driving force of the first driving assembly (313), the second driving assembly (329) and the third driving assembly (328).

8. The chip transport mechanism according to claim 7, further comprising a magnetic spring (324), wherein the magnetic spring (324) is fixedly mounted on the vertical plate (323), and when the third driving assembly (328) stops working, the magnetic spring (324) slows down the downward movement of the third slide (325) under the action of gravity.

9. The chip transport mechanism according to claim 7, wherein the chip jig module (34) comprises:

a chip base (345), the chip base (324) is fixedly installed on the first adjusting plate (331);

a chip fixing plate (344), wherein the chip fixing plate (344) for placing a chip is fixedly arranged on the chip base (345);

a micro gas connector (348), the micro gas connector (348) being mounted on the chip fixing plate (344) for inputting gas into the chip fixing plate (344);

a fourth drive assembly (347), said fourth drive assembly (347) being fixedly mounted to said die pad (345);

a fifth slide rail (349), the fifth slide rail (349) being fixedly mounted on the chip base (345);

a sensor assembly moving in a direction of the fifth slide rail (349) to approach or separate from the chip fixing plate (344) by a driving force of the fourth driving assembly (347).

10. The chip transport mechanism as claimed in claim 9, wherein the sensor assembly comprises:

one end of the guide rail connecting block (343) is slidably connected with the fifth sliding rail (349), the other end of the guide rail connecting block (343) is connected with the fourth driving assembly (347), and the guide rail connecting block (343) reciprocates along the direction of the fifth sliding rail (349) under the driving force of the fourth driving assembly (347);

the sensor mounting plate (341) is fixedly connected with the guide rail connecting block (343);

the sensor (340), the sensor (340) is fixedly installed on the sensor installation plate (341).

Images