CN112486286A - a big data server - Google Patents
a big data server Download PDFInfo
- Publication number
- CN112486286A CN112486286A CN202011392087.3A CN202011392087A CN112486286A CN 112486286 A CN112486286 A CN 112486286A CN 202011392087 A CN202011392087 A CN 202011392087A CN 112486286 A CN112486286 A CN 112486286A
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- installation space
- big data
- data server
- pipeline
- heat
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Theoretical Computer Science (AREA)
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- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
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- Thermal Insulation (AREA)
Abstract
本发明涉及服务器结构技术领域，具体涉及一种大数据服务器，包括：安装空间，由多块基板围合而成且封闭设置，安装空间内安装有电器元件，基板的一面安装有迂回管路，迂回管路的两端分别安装有第一连接件和第二连接件，多块基板上的第一连接件和第二连接件依次连接，以将多块基板上的迂回管路连通；隔板，设于安装空间内，与至少一块基板固定连接，隔板上至少一面安装有辅助管路，与隔板连接的至少一块基板上的迂回管路与辅助管路连通，隔板上安装有功率器件。当服务器机房内组装有大量服务器时，各个服务器的工作空间独立，在保证每个服务器均能稳定工作的同时，避免了从安装空间内散发出大量热量，避免了机房内在服务器周围的热量堆积。
The invention relates to the technical field of server structures, in particular to a big data server, comprising: an installation space, which is enclosed by a plurality of substrates and arranged in a closed manner, electrical components are installed in the installation space, and a circuitous pipeline is installed on one side of the substrate, The two ends of the circuitous pipeline are respectively installed with a first connector and a second connector, and the first connector and the second connector on the multiple substrates are connected in sequence, so as to connect the circuitous pipelines on the multiple substrates; the partition plate It is arranged in the installation space and is fixedly connected with at least one base plate. At least one side of the clapboard is installed with auxiliary pipelines, and the circuitous pipelines on at least one base plate connected to the clapboard are connected with the auxiliary pipelines, and the power supply pipeline is installed on the clapboard device. When a large number of servers are assembled in the server room, the working space of each server is independent. While ensuring that each server can work stably, a large amount of heat is avoided from the installation space, and heat accumulation around the servers in the room is avoided.
Description
Technical Field
The invention relates to the technical field of server structures, in particular to a big data server.
Background
Big data is a data set which cannot be captured, managed and processed by a conventional software tool within a certain time range, and is a massive, high-growth-rate and diversified information asset which can have stronger decision-making power, insight discovery power and flow optimization capability only by a new processing mode. Due to the fact that the configuration requirement of the server for processing the big data is high, a server manufacturer sets up a server room by arranging a large number of servers to set up a cloud server for an enterprise to use so as to meet the requirement of the enterprise for processing the big data. Hardware devices such as a processor, a hard disk, a memory and a system bus in the server release a large amount of heat during operation, and a large number of servers in a large data server room are stacked in an aligned manner, so that the heat is accumulated in the room, and the hardware devices in the server are damaged. Under the usual indoor environment, the heat accumulated in the large data server room can not be consumed by the conventional heat dissipation and cooling mode.
Disclosure of Invention
Therefore, the technical problem to be solved by the present invention is to overcome the defect of serious heat accumulation in the large data server room in the prior art, thereby providing a large data server.
In order to solve the above technical problem, the present invention provides a big data server, including:
the installation space is formed by enclosing a plurality of substrates and is sealed, an electrical element is installed in the installation space, a circuitous pipeline is installed on one surface of each substrate, a first connecting piece and a second connecting piece are respectively installed at two ends of the circuitous pipeline, and the first connecting pieces and the second connecting pieces on the plurality of substrates are sequentially connected so as to communicate the circuitous pipelines on the plurality of substrates;
the baffle is arranged in the installation space and fixedly connected with at least one substrate, an auxiliary pipeline is installed on at least one surface of the baffle, a circuitous pipeline on at least one substrate connected with the baffle is communicated with the auxiliary pipeline, and a power device is installed on the baffle.
Optionally, a plurality of heat-conducting plates are arranged in the installation space at intervals and are parallel to each other.
Optionally, a separate fan is installed in the installation space, and the separate fan is perpendicular to the heat conducting plate.
Optionally, the number of the independent fans is two, the two independent fans are respectively installed at diagonal positions in the installation space, and air outlet directions of the two independent fans are parallel.
Optionally, the connection of the adjacent substrates at the side facing the installation space is provided with a fillet.
Optionally, a heat insulation layer is installed on one surface of the substrate, the heat insulation layer is parallel to the substrate, the heat insulation layer completely covers the substrate, and the circuitous pipeline and the installation space are arranged on the same side of the heat insulation layer.
Optionally, a gap is reserved between the heat insulation layer and the substrate, and the edge of the heat insulation layer is fixedly connected with the edge of the substrate.
Optionally, a clamping structure is disposed on an outer surface of the substrate.
Optionally, a temperature sensor is installed in the installation space.
Optionally, the circuitous pipeline is a slot formed inside the base plate.
The technical scheme of the invention has the following advantages:
1. the big data server provided by the invention comprises: the installation space is formed by enclosing a plurality of substrates and is sealed, an electrical element is installed in the installation space, a circuitous pipeline is installed on one surface of each substrate, a first connecting piece and a second connecting piece are respectively installed at two ends of the circuitous pipeline, and the first connecting pieces and the second connecting pieces on the plurality of substrates are sequentially connected so as to communicate the circuitous pipelines on the plurality of substrates; the baffle is arranged in the installation space and fixedly connected with at least one substrate, an auxiliary pipeline is installed on at least one surface of the baffle, a circuitous pipeline on at least one substrate connected with the baffle is communicated with the auxiliary pipeline, and a power device is installed on the baffle.
The base plate with the circuitous pipeline is assembled into the shell to form an installation space, each working element of the server is installed in the installation space, when the server works, a cooling medium is introduced into the circuitous pipeline to cool the installation space where the server works, the working elements of the server are separated from the outside air by the base plate, and heat emitted into the outside air from the installation space is reduced. When a large amount of big data server are assembled in the server room, the working space of each big data server is independent, and the heat generated by the working assembly of the server can be taken away by the cooling medium in the circuitous pipeline, so that each big data server can work stably, a large amount of heat is prevented from being emitted from the installation space, the accumulation of heat around the server in the big data server room is avoided, and the requirement on the external environment when the big data server is arranged is reduced. Meanwhile, the partition plate with the auxiliary pipeline extends into the installation space, and the cooling medium is brought into the installation space through the auxiliary pipeline so as to directly cool the inside of the installation space. The power device with high heat generation is arranged on the partition plate, so that the power device is separated from other components, the influence of heat released by the power device on other devices is avoided, and the service life of the server can be prolonged. The installation space is closed, and the damage of dust entering the case to the electric device can be reduced.
2. According to the large data server provided by the invention, the plurality of heat-conducting plates are arranged in the installation space at intervals and are parallel to each other. Utilize the heat-conducting plate to cut apart into the stranded with the air in the installation space, when the temperature of the local air in the installation space changes, the air can flow rapidly along the interval between the heat-conducting plate for everywhere air temperature tends to balance in the installation space, avoids locally producing high temperature in the installation space and harms the device.
3. According to the big data server provided by the invention, two independent fans are arranged, the two independent fans are respectively arranged at the diagonal positions in the installation space, and the air outlet directions of the two independent fans are parallel. The independent fan is arranged to enable air in the installation space to flow circularly, so that the air collides with the inner wall of the substrate, and heat consumption is accelerated.
4. According to the large data server provided by the invention, the connecting part of one side of the adjacent substrates facing the installation space is provided with a round angle. The fillet is arranged, so that the air flow in the installation space is smoother, and the accumulation of heat at the joint of the substrates caused by the unsmooth air flow in the installation space is avoided.
5. According to the big data server provided by the invention, the heat insulation layer is arranged on one surface of the substrate, the heat insulation layer is parallel to the substrate, the heat insulation layer completely covers the substrate, and the circuitous pipeline and the installation space are arranged on the same side of the heat insulation layer. The heat in the installation space is isolated from the outside by the heat-insulating layer, so that heat accumulation in the machine room caused by the fact that a large amount of heat is emitted from the installation space is prevented.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a big data server provided in a first embodiment of the present invention.
Fig. 2 is a schematic structural diagram of the substrate and the insulating layer in a matching connection manner according to the first embodiment of the invention.
Fig. 3 is a schematic structural diagram of a circuitous pipeline provided in a first embodiment of the invention.
Description of reference numerals: 1. a substrate; 2. a circuitous pipeline; 3. a partition plate; 4. a power device; 5. a heat conducting plate; 6. an independent fan; 7. a heat-insulating layer; 8. a temperature sensor.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Fig. 1 to fig. 3 show a big data server provided in this embodiment, including: the mounting space that forms is enclosed by six base plates 1 and extends to baffle 3 in the mounting space from base plate 1, and six base plates 1 are connected through edge joint and are become an organic whole.
The installation space is closed, and electrical components are installed in the installation space. A bypass pipe 2 is attached to a surface of the substrate 1 facing the installation space. In this embodiment, the circuitous pipeline 2 is a groove body formed inside the substrate 1, and the circuitous pipeline 2 is circularly arranged in an "S" shape. The two ends of the circuitous pipeline 2 are respectively provided with a splicing pipe as a first connecting piece and a splicing groove as a second connecting piece, the first connecting piece and the second connecting piece on the six substrates 1 are sequentially connected to communicate the circuitous pipelines 2 on all the substrates 1, and the remaining splicing pipe and one splicing groove are communicated with an external cooling medium pipeline.
In installation space was located to baffle 3, with a base plate 1 fixed connection, the last one side of baffle 3 was installed auxiliary line, and auxiliary line is the inside cell body of shaping at baffle 3 in this embodiment, circuitous pipeline 2 and auxiliary line intercommunication on the base plate 1 of being connected with baffle 3. The partition 3 is integrally formed with the substrate 1 to which it is attached. The partition board 3 is mounted with a power device 4 having high heat generation efficiency, and the power device 4 may be a processor or a motherboard.
The interval is equipped with polylith heat-conducting plate 5 in the installation space, is parallel to each other between polylith heat-conducting plate 5. An independent fan 6 is also arranged in the mounting space, and the independent fan 6 is perpendicular to the heat-conducting plate 5. The number of the independent fans 6 is two, the two independent fans 6 are respectively arranged at the diagonal positions in the installation space, and the air outlet directions of the two independent fans 6 are parallel. In order to ensure that air in the installation space can smoothly circulate and prevent heat from accumulating at the joint of the substrates 1, the joint of one side of the adjacent substrates 1 facing the installation space is provided with a round angle.
Install heat preservation 7 on the one side that base plate 1 deviates from the installation space, heat preservation 7 is parallel with base plate 1, and heat preservation 7 covers base plate 1 completely, and circuitous pipeline 2 locates the homonymy of heat preservation 7 with the installation space. A gap is reserved between the heat-insulating layer 7 and the substrate 1, and the edge of the heat-insulating layer 7 is fixedly connected with the edge of the substrate 1. The heat of the installation space is isolated from the heat of the outside air by the heat-insulating layer 7, so that the influence of the outside air on the temperature in the installation space is reduced while the heat in the installation space is prevented from diffusing outwards. Prevent the external heat from being transmitted into the installation space when the temperature of the installation space is lower than the outside. The edge fixed connection who makes heat preservation 7 and base plate 1 reserves the clearance between heat preservation 7 and base plate 1 for form one deck air transition layer between heat preservation 7 and the base plate 1, utilize the air transition layer to keep apart the heat in the installation space, further reduce the possibility that takes place heat exchange between the installation space inside and the outside air. The heat in the installation space can not be dissipated to the outside air, and the heat in the outside air can not enter the installation space along with the air.
The outer surface of the base plate 1 is provided with a clamping ring and a clamping block which are used as clamping structures. In the big data server machine room, a plurality of big data servers are connected into a whole through a clamping structure, the arrangement density of the big data servers is increased, and the occupied space of the big data servers is reduced. In the big data server computer lab, circuitous pipeline 2 between each big data server all connects in parallel for each big data server homoenergetic independently cools down, and independent control does not influence each other. A temperature sensor 8 is installed in the installation space. Utilize temperature sensor 8 to carry out real time monitoring to the temperature of installation space, when the temperature in the installation space was too high for a long time or was low excessively, in time overhauld the big data server that corresponds, guaranteed the steady operation of each server.
The data server provided by the embodiment utilizes the substrate 1 with the circuitous pipeline 2 to assemble a shell to form an installation space, each working element of the server is installed in the installation space, when the server works, a cooling medium is introduced into the circuitous pipeline 2 to cool the installation space where the server works, the working element of the server is separated from the outside air by utilizing the substrate 1, and the heat emitted to the outside air from the installation space is reduced. Meanwhile, the independent fan 6 and the heat conducting plate 5 are arranged, so that air in the installation space which is arranged in a closed mode can flow, and the phenomenon that the operation of the server is influenced by the overhigh local temperature in the installation space is avoided. When a large amount of big data server are assembled in the server room, the working space of each big data server is independent, and the heat that the working assembly of server produced can be taken away by the coolant in circuitous pipeline 2, when guaranteeing that every big data server homoenergetic is stable work, has avoided giving out a large amount of heats from the installation space, has avoided the heat around the inherent server of big data server room to pile up, has reduced the requirement to external environment when big data server arranges.
As an alternative embodiment, a circulation pipe as the detour pipe 2 is installed on a surface of the substrate 1 facing into the installation space.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011392087.3A CN112486286A (en) | 2020-12-01 | 2020-12-01 | a big data server |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011392087.3A CN112486286A (en) | 2020-12-01 | 2020-12-01 | a big data server |
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| CN112486286A true CN112486286A (en) | 2021-03-12 |
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| CN202011392087.3A Pending CN112486286A (en) | 2020-12-01 | 2020-12-01 | a big data server |
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Application publication date: 20210312 |