CN1125897A - Ic引线矫正方法和矫正装置 - Google Patents

Ic引线矫正方法和矫正装置 Download PDF

Info

Publication number
CN1125897A
CN1125897A CN95109918A CN95109918A CN1125897A CN 1125897 A CN1125897 A CN 1125897A CN 95109918 A CN95109918 A CN 95109918A CN 95109918 A CN95109918 A CN 95109918A CN 1125897 A CN1125897 A CN 1125897A
Authority
CN
China
Prior art keywords
lead
wire
mentioned
strip
plug
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN95109918A
Other languages
English (en)
Chinese (zh)
Inventor
大野利雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN1125897A publication Critical patent/CN1125897A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
CN95109918A 1994-12-28 1995-07-10 Ic引线矫正方法和矫正装置 Pending CN1125897A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP327513/94 1994-12-28
JP6327513A JPH08186222A (ja) 1994-12-28 1994-12-28 Ｉｃのリードの矯正方法及び矯正装置

Publications (1)

Publication Number Publication Date
CN1125897A true CN1125897A (zh) 1996-07-03

Family

ID=18199965

Family Applications (1)

Application Number Title Priority Date Filing Date
CN95109918A Pending CN1125897A (zh) 1994-12-28 1995-07-10 Ic引线矫正方法和矫正装置

Country Status (4)

Country Link
JP (1) JPH08186222A (2)
KR (1) KR0178082B1 (2)
CN (1) CN1125897A (2)
TW (1) TW281794B (2)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100447972C (zh) * 2004-06-25 2008-12-31 神钢电机株式会社 Ic芯片安装体的制造装置
CN102738011A (zh) * 2012-07-09 2012-10-17 上海华岭集成电路技术股份有限公司 芯片引脚调整装置
CN103182462A (zh) * 2013-02-26 2013-07-03 山东迪一电子科技有限公司 电子元件引线校直机
CN103249293A (zh) * 2012-02-08 2013-08-14 Juki株式会社 电子部件安装装置、电子部件安装系统以及电子部件安装方法
CN107204305A (zh) * 2017-04-28 2017-09-26 北京时代民芯科技有限公司 一种便携式扁平封装电路引线检查与整形装置
CN108213123A (zh) * 2017-12-29 2018-06-29 上海富驰高科技有限公司 一种医用取样钳的整形装置及使用方法
CN108376649A (zh) * 2018-04-12 2018-08-07 盐城芯丰微电子有限公司 用于qfp半导体器件的整形装置
CN110586804A (zh) * 2019-09-04 2019-12-20 珠海智新自动化科技有限公司 一种多引脚整形机构
CN111824746A (zh) * 2019-04-16 2020-10-27 松下知识产权经营株式会社 部件供给装置、部件安装装置以及部件供给方法
CN115132603A (zh) * 2022-08-31 2022-09-30 徐州领测半导体科技有限公司 一种半导体芯片检测装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120050839B (zh) * 2025-02-25 2025-08-26 李钦荣 一种电力元器件基板封装装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0412560A (ja) * 1990-05-01 1992-01-17 Futaba Corp Ｉｃリード端子の矯正方法
JPH06295968A (ja) * 1991-12-02 1994-10-21 Meiritsu Kikai Kogyo:Kk デジタル素子のリード配列修正方法および修正装置
JPH0730031A (ja) * 1993-07-09 1995-01-31 Nec Corp リード成形方法

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100447972C (zh) * 2004-06-25 2008-12-31 神钢电机株式会社 Ic芯片安装体的制造装置
CN103249293A (zh) * 2012-02-08 2013-08-14 Juki株式会社 电子部件安装装置、电子部件安装系统以及电子部件安装方法
CN102738011A (zh) * 2012-07-09 2012-10-17 上海华岭集成电路技术股份有限公司 芯片引脚调整装置
CN103182462A (zh) * 2013-02-26 2013-07-03 山东迪一电子科技有限公司 电子元件引线校直机
CN107204305A (zh) * 2017-04-28 2017-09-26 北京时代民芯科技有限公司 一种便携式扁平封装电路引线检查与整形装置
CN107204305B (zh) * 2017-04-28 2019-07-23 北京时代民芯科技有限公司 一种便携式扁平封装电路引线检查与整形装置
CN108213123B (zh) * 2017-12-29 2023-08-29 上海富驰高科技股份有限公司 一种医用取样钳的整形装置及使用方法
CN108213123A (zh) * 2017-12-29 2018-06-29 上海富驰高科技有限公司 一种医用取样钳的整形装置及使用方法
CN108376649A (zh) * 2018-04-12 2018-08-07 盐城芯丰微电子有限公司 用于qfp半导体器件的整形装置
CN108376649B (zh) * 2018-04-12 2023-10-10 盐城芯丰微电子有限公司 用于qfp半导体器件的整形装置
CN111824746A (zh) * 2019-04-16 2020-10-27 松下知识产权经营株式会社 部件供给装置、部件安装装置以及部件供给方法
CN111824746B (zh) * 2019-04-16 2023-03-31 松下知识产权经营株式会社 部件供给装置、部件安装装置以及部件供给方法
CN110586804A (zh) * 2019-09-04 2019-12-20 珠海智新自动化科技有限公司 一种多引脚整形机构
CN115132603A (zh) * 2022-08-31 2022-09-30 徐州领测半导体科技有限公司 一种半导体芯片检测装置

Also Published As

Publication number Publication date
JPH08186222A (ja) 1996-07-16
KR960026715A (ko) 1996-07-22
TW281794B (2) 1996-07-21
KR0178082B1 (ko) 1999-03-20

Similar Documents

Publication Publication Date Title
CN111785997B (zh) 一种燃料电池电堆自动堆叠装置
CN1125897A (zh) Ic引线矫正方法和矫正装置
CN115202086B (zh) 一种反射片和导光板自动组装机
CN217110805U (zh) 叠片检测装置及叠片检测设备
JPH0778852A (ja) アウターリードボンディング装置およびアウターリードボンディング方法
CN111618934B (zh) 一种板材切割夹具、切割机及其切割方法
CN111056302B (zh) 一种搬运单元
CN1369942A (zh) 火花塞的制造方法和制造装置
CN115912813B (zh) 定子组装机及其组装方法
CN1713811A (zh) 电子部件安装装置及电子部件安装方法
CN211652491U (zh) 一种基于精密视觉系统的机器人测试机
CN217200761U (zh) 一种电池片纠偏装置
CN119857800B (zh) 一种卧冲式光伏边框自动化冲铆装置
CN121324377A (zh) 一种晶圆背面及边缘检测装置及方法
CN119053058A (zh) 一种多尺寸芯片用贴装设备
CN217263218U (zh) 一种电池扫码定位一体机
CN119095367A (zh) 一种pcb板组装设备
CN1495996A (zh) 电子部件的制造方法，其制造装置和该制造装置的驱动方法
CN215342525U (zh) 一种led封装缺陷的检测设备
JPH09275115A (ja) 基板の位置決め装置
JP7417900B2 (ja) 部品装着装置
CN210045496U (zh) 一种平台式点胶机
CN121199637B (zh) 一种指纹模组扣合组装装置
CN108002029B (zh) 一种面板移动装置
CN216323430U (zh) 板材分拣机

Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication