CN112771663A - 一种焊盘、电子器件及其连接结构、阻焊层的制作方法 - Google Patents

一种焊盘、电子器件及其连接结构、阻焊层的制作方法 Download PDF

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Publication number
CN112771663A
CN112771663A CN201880098120.6A CN201880098120A CN112771663A CN 112771663 A CN112771663 A CN 112771663A CN 201880098120 A CN201880098120 A CN 201880098120A CN 112771663 A CN112771663 A CN 112771663A
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CN
China
Prior art keywords
pad
hole
pad body
solder mask
area
Prior art date
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Pending
Application number
CN201880098120.6A
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English (en)
Inventor
杨帆
史洪宾
龙浩晖
王晓岩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of CN112771663A publication Critical patent/CN112771663A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

本申请实施例提供焊盘、电子器件及其连接结构、阻焊层的制作方法，涉及电子元件连接技术领域，该焊盘包括焊盘本体以及覆盖于所述焊盘本体上方的阻焊层，沿所述阻焊层的厚度方向形成有用于焊接的通孔，所述通孔的面积小于所述焊盘本体的面积，且所述通孔的面积沿远离所述焊盘本体的方向逐渐增大。

Description

PCT国内申请，说明书已公开。

Claims (14)

  1. PCT国内申请，权利要求书已公开。
CN201880098120.6A 2018-09-29 2018-09-29 一种焊盘、电子器件及其连接结构、阻焊层的制作方法 Pending CN112771663A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/108903 WO2020062195A1 (zh) 2018-09-29 2018-09-29 一种焊盘、电子器件及其连接结构、阻焊层的制作方法

Publications (1)

Publication Number Publication Date
CN112771663A true CN112771663A (zh) 2021-05-07

Family

ID=69952711

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880098120.6A Pending CN112771663A (zh) 2018-09-29 2018-09-29 一种焊盘、电子器件及其连接结构、阻焊层的制作方法

Country Status (2)

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CN (1) CN112771663A (zh)
WO (1) WO2020062195A1 (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002171052A (ja) * 2000-12-04 2002-06-14 Kyocera Corp 配線基板およびこれを用いた電子装置
US20070114674A1 (en) * 2005-11-22 2007-05-24 Brown Matthew R Hybrid solder pad
US20130118792A1 (en) * 2011-11-10 2013-05-16 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method for manufacturing the same
CN103178043A (zh) * 2011-12-20 2013-06-26 日本特殊陶业株式会社 布线基板及其制造方法
JP2016127066A (ja) * 2014-12-26 2016-07-11 イビデン株式会社 バンプ付きプリント配線板およびその製造方法
US20170303396A1 (en) * 2016-04-14 2017-10-19 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
CN207690105U (zh) * 2017-10-13 2018-08-03 欧菲影像技术（广州）有限公司 指纹模组及设有该指纹模组的电子设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9030019B2 (en) * 2010-12-14 2015-05-12 Infineon Technologies Ag Semiconductor device and method of manufacture thereof
JP2012156257A (ja) * 2011-01-25 2012-08-16 Fujitsu Ltd 回路基板及び電子装置
US20160029486A1 (en) * 2014-07-24 2016-01-28 Samsung Electro-Mechanics Co., Ltd. Solder joint structure and electronic component module including the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002171052A (ja) * 2000-12-04 2002-06-14 Kyocera Corp 配線基板およびこれを用いた電子装置
US20070114674A1 (en) * 2005-11-22 2007-05-24 Brown Matthew R Hybrid solder pad
US20130118792A1 (en) * 2011-11-10 2013-05-16 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method for manufacturing the same
CN103178043A (zh) * 2011-12-20 2013-06-26 日本特殊陶业株式会社 布线基板及其制造方法
JP2016127066A (ja) * 2014-12-26 2016-07-11 イビデン株式会社 バンプ付きプリント配線板およびその製造方法
US20170303396A1 (en) * 2016-04-14 2017-10-19 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
CN207690105U (zh) * 2017-10-13 2018-08-03 欧菲影像技术（广州）有限公司 指纹模组及设有该指纹模组的电子设备

Also Published As

Publication number Publication date
WO2020062195A1 (zh) 2020-04-02

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